JPH01216831A - Laminated board - Google Patents
Laminated boardInfo
- Publication number
- JPH01216831A JPH01216831A JP4344488A JP4344488A JPH01216831A JP H01216831 A JPH01216831 A JP H01216831A JP 4344488 A JP4344488 A JP 4344488A JP 4344488 A JP4344488 A JP 4344488A JP H01216831 A JPH01216831 A JP H01216831A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sheet
- bending
- stress
- laminated board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 26
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000003365 glass fiber Substances 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims description 16
- 239000011888 foil Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims 1
- 238000005452 bending Methods 0.000 abstract description 13
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 239000004745 nonwoven fabric Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 239000002759 woven fabric Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、プリント配線板用として適した折り曲げ可能
な積層板に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a bendable laminate suitable for use in printed wiring boards.
従来の技術
従来、電子機器において、これに組込まれた複数枚の硬
質プリント配線板を接続するために、フレキシブル配線
板やコネクター付きリード線が用いられてきた。しかし
ながら、それらを接続配線する際、作業工数が多くかか
り、誤配線も生じ易い。2. Description of the Related Art Conventionally, flexible wiring boards and lead wires with connectors have been used in electronic equipment to connect a plurality of rigid printed wiring boards incorporated therein. However, connecting and wiring them requires a large number of man-hours, and wiring errors are likely to occur.
この問題を解決するため、ガラス繊維含有ポリエステル
不織布基材にエポキシ樹脂を含浸させたフレキシブル積
層板が知られている(特開昭59−184587号)。In order to solve this problem, a flexible laminate in which a glass fiber-containing polyester nonwoven fabric base material is impregnated with an epoxy resin is known (Japanese Patent Laid-Open No. 184587/1987).
しかし、このものは、基材中にポリエステル繊維を含有
していることから、寸法安定性が十分でなく、特に高密
度プリント配線板用としては適さない。また、エポキシ
樹脂は、通常硬化すると硬くなり折シ曲げには適さず、
どのようなエポキシ樹脂を用いることにより折り曲げ可
能としたのか、具体的な開示はないO
尚、ガラス繊維織布を基材とし、これに樹脂を含浸して
積層成形した積層板は、ガラス繊維の伸び率が小さいた
め寸法安定性は良好であるが、折り曲げには適さない。However, since this material contains polyester fibers in the base material, it does not have sufficient dimensional stability and is not particularly suitable for use in high-density printed wiring boards. In addition, epoxy resin usually becomes hard when cured and is not suitable for bending.
There is no specific disclosure as to what kind of epoxy resin was used to make it bendable. Although it has good dimensional stability due to its low elongation rate, it is not suitable for bending.
また、樹脂のみからなるシート式はフィルムを使用した
ものは、折り曲げは良好であるが、寸法安定性が悪く、
曲げ弾性率が小さいので部品を搭載するとたわみが大き
く、実用上問題がある。In addition, sheet types made only of resin and those using film are good at bending, but have poor dimensional stability.
Since the bending modulus is small, when parts are mounted on it, it deflects greatly, which is a practical problem.
発明が解決しようとする課題
上記の点に鑑み、本発明は、寸法安定性、折り曲げ性が
良好で、部品搭載に対して十分な曲げ弾性率を有する積
層板を提供することを目的とする。Problems to be Solved by the Invention In view of the above points, an object of the present invention is to provide a laminate having good dimensional stability and bendability, and a sufficient bending elastic modulus for mounting components.
課題を解決するための手段
上記目的を達成するために、本発明は、シート状のガラ
ス繊維基材1に樹脂を含浸させた層の両表面に、樹脂の
みからなるシート2を一体化した構成を採用したもので
ある。Means for Solving the Problems In order to achieve the above object, the present invention has a structure in which sheets 2 made only of resin are integrated on both surfaces of a layer of a sheet-shaped glass fiber base material 1 impregnated with resin. was adopted.
作用 積層板が折り曲げられる際の応力分布を第1図に示す。action Figure 1 shows the stress distribution when the laminate is bent.
積層板が折シ曲げられる際の応力分布は、中心線5を境
に、折り1曲げの凸側と凹側で、引張9応力3と圧縮応
力4に分かれ、積層板の表面になるほど各応力は大きく
なる。従って、樹脂を含浸した、折シ曲げに対しては適
していないガラス繊維基材1を前記応力の小さい中央部
に配置し、その両表面に折り曲げに対して適した樹脂シ
ート2を配置した構成は、本発明の目的である折り曲げ
性に対して理想的な構成となっている。The stress distribution when the laminate is bent is divided into tensile stress 9 and compressive stress 4 on the convex and concave sides of the first bend, with the center line 5 as the border, and each stress increases as the surface of the laminate increases. becomes larger. Therefore, a resin-impregnated glass fiber base material 1, which is not suitable for bending, is arranged in the central part where the stress is small, and resin sheets 2, which are suitable for bending, are arranged on both surfaces thereof. has an ideal configuration for bendability, which is the objective of the present invention.
そして、ガラス繊維基材1の存在にょ夛寸法安定性は良
好であシ、部品搭載に対応できる曲げ弾性率を有するも
のである。Further, due to the presence of the glass fiber base material 1, the dimensional stability is good and it has a bending elastic modulus that can accommodate parts mounting.
実施例
本発明に使用されるシート状のガラス繊維基材は、電気
絶縁用に通常使用されているもので、織布、不織布のい
ずれでもよい。EXAMPLE The sheet-like glass fiber base material used in the present invention is one commonly used for electrical insulation, and may be either a woven fabric or a non-woven fabric.
本発明におけるガラス繊維基材に含浸させる樹脂および
樹脂シートに使用される樹脂は、エポキシ樹脂、ポリエ
ステル樹脂、ポリイミド樹脂等の熱硬化性樹脂のほか、
熱硬化性樹脂であってもよい。また、ガラス繊維基材に
含浸される樹脂と樹脂シートに使用される樹脂は、同じ
であっても異なっていてもよい。樹脂シートについても
、異種のものを複数枚使用してもさしつかえない。In the present invention, the resin impregnated into the glass fiber base material and the resin used in the resin sheet include thermosetting resins such as epoxy resin, polyester resin, and polyimide resin.
It may also be a thermosetting resin. Further, the resin impregnated into the glass fiber base material and the resin used for the resin sheet may be the same or different. As for the resin sheets, there is no problem even if a plurality of resin sheets of different types are used.
実施例1
エポキシ樹脂(商品名:エピコート1001、油化シェ
ル製)100重量部、ジシアンジアミド3重量部、ベン
ジルジメチルアミン0.5重量部を配合して、これをガ
ラス繊維織布基材に含浸、乾燥して樹脂量40%のプリ
プレグ(A)を得た。該プI77’L/り(A)の上下
面に、ポリイミド樹脂よシなる厚さ0.2mmのシート
、さらに接着剤付き銅箔(厚さ2352m)を配置し、
加熱、加圧して1厚み0.6mmの両面鋼張積層板を得
た。Example 1 100 parts by weight of epoxy resin (trade name: Epicoat 1001, manufactured by Yuka Shell), 3 parts by weight of dicyandiamide, and 0.5 parts by weight of benzyldimethylamine were blended, and this was impregnated into a glass fiber woven fabric base material. After drying, a prepreg (A) having a resin content of 40% was obtained. A sheet of polyimide resin with a thickness of 0.2 mm and a copper foil with adhesive (thickness of 2352 m) were placed on the upper and lower surfaces of the plastic plate (A),
A double-sided steel-clad laminate with a thickness of 0.6 mm was obtained by heating and pressurizing.
実施例2
実施例1のガラス繊維織布基材のかわりに、ガラス繊維
不織布基材を使用して、樹脂量75%のプリプレグ(B
)を得た。該プリプレグ但)を使用し、他は実施例1と
同様にして、 0.6mm厚みの両面鋼張積層板を得た
。Example 2 A glass fiber non-woven fabric base material was used instead of the glass fiber woven fabric base material of Example 1, and a prepreg (B
) was obtained. A double-sided steel-clad laminate with a thickness of 0.6 mm was obtained using the prepreg (provided) and in the same manner as in Example 1 except for the above prepreg.
比較例1
プリプレグ囚を3枚積層し、両表面に接着剤付き鋼箔(
厚さ2352m)を配置し、加熱、加圧して厚み0.6
mmの両面銅張積層板を得た。Comparative Example 1 Three sheets of prepreg were laminated, and steel foil with adhesive (
2352 m thick), heated and pressurized to a thickness of 0.6 m.
A double-sided copper-clad laminate of mm was obtained.
比較例2
プリプレグ(B)を3枚積層し、両表面に接着剤付き鋼
箔(厚さ2352m)を配置し、加熱、加圧して厚み0
.6mmの両面鋼張積層板を得た。Comparative Example 2 Three sheets of prepreg (B) were laminated, steel foil with adhesive (thickness 2352 m) was placed on both surfaces, and the thickness was reduced to 0 by heating and pressurizing.
.. A 6 mm double-sided steel clad laminate was obtained.
従来例1
ポリイミド樹脂よりなる厚さ0.6皿のシートの両表面
に接着剤付き鋼箔(厚さ=35μm)を配置し、加熱、
加圧して厚み0.6柵の両面銅張積層板を得た。Conventional Example 1 Adhesive-coated steel foil (thickness = 35 μm) was placed on both surfaces of a 0.6 plate sheet made of polyimide resin, heated,
Pressure was applied to obtain a double-sided copper-clad laminate having a thickness of 0.6.
従来例2
難燃エポキシ化ダイマー酸(エポキシ当量:400、大
日本インキ製)100重量部にアジピン酸60重量部を
配合し、これをガラス繊維含有ポリエステル繊維不織布
基材(重さ35ハ)に含浸、乾燥して、プリプレグ(c
)を得た。該プリプレグ(C)を3枚積層し、両表面に
接着剤付き鋼箔(厚さ2352m)を配置し、加熱、加
圧して、厚み0.6価の両面鋼張積層板を得た。Conventional Example 2 60 parts by weight of adipic acid was blended with 100 parts by weight of flame-retardant epoxidized dimer acid (epoxy equivalent: 400, manufactured by Dainippon Ink), and this was added to a glass fiber-containing polyester fiber nonwoven fabric base material (weight 35 cm). Impregnated, dried, prepreg (c
) was obtained. Three sheets of the prepreg (C) were laminated, adhesive-coated steel foil (thickness: 2352 m) was placed on both surfaces, and heating and pressure were applied to obtain a double-sided steel-clad laminate having a thickness of 0.6.
実施例1〜2、比較例1〜2、従来例1〜2試験方法
寸法安定性:積層板の銅箔を全面エツチングし、E−0
,5/150処理した後、処理前の常態との寸法変化を
測定した。Examples 1-2, Comparative Examples 1-2, Conventional Examples 1-2 Test method Dimensional stability: Etching the entire surface of the copper foil of the laminate, E-0
, 5/150, the dimensional change from the normal state before the treatment was measured.
曲げ弾性率: JIS−G−6481に準拠した。Flexural modulus: Based on JIS-G-6481.
折り曲げ性:積層板を円柱棒(積層板に亀裂ができない
範囲で十分に径の小さいものを選択する)の局面に沿っ
て折9曲げ、折9曲げの力を解除したときに保持してい
る折9曲げの半径を測定した。Bendability: The laminate is bent 9 times along the curve of a cylindrical rod (choose one with a sufficiently small diameter so that no cracks occur in the laminate), and the laminate is held when the bending force is released. The radius of nine bends was measured.
発明の効果
上述のように本発明は、シート状のガラス繊維基材に樹
脂を含浸させた層の両表面に樹脂のみからなるシートを
一体化した構成としたことによシ、寸法安定性に優れる
と共に′Frシ曲げ可能な曲げ弾性率の大きい積層板を
得られる点、その工業的価値は極めて大である。Effects of the Invention As described above, the present invention has a structure in which sheets made only of resin are integrated on both surfaces of a layer of a sheet-like glass fiber base material impregnated with resin, which improves dimensional stability. The industrial value of this method is extremely great in that it is possible to obtain a laminate with a high flexural modulus that is both excellent and bendable.
第1図は積層板を折シ曲げた・ときの曲げ応力の分布を
、本発明における積層板の構成と共に示した説明図であ
る。
lはガラス繊維基材、2は樹脂シート。FIG. 1 is an explanatory diagram showing the distribution of bending stress when the laminate is bent, together with the structure of the laminate according to the present invention. 1 is a glass fiber base material, and 2 is a resin sheet.
Claims (1)
両表面に樹脂のみからなるシートを一体化してなる積層
板。 2、少なくとも一方の表面に金属箔を一体化した特許請
求の範囲第1項記載の積層板。[Claims] 1. A laminate made by integrating sheets made only of resin on both surfaces of a layer made of a sheet-like glass fiber base material impregnated with resin. 2. The laminate according to claim 1, which has a metal foil integrated on at least one surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4344488A JPH01216831A (en) | 1988-02-26 | 1988-02-26 | Laminated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4344488A JPH01216831A (en) | 1988-02-26 | 1988-02-26 | Laminated board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01216831A true JPH01216831A (en) | 1989-08-30 |
Family
ID=12663873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4344488A Pending JPH01216831A (en) | 1988-02-26 | 1988-02-26 | Laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01216831A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4839952A (en) * | 1986-07-03 | 1989-06-20 | Kabushiki Kaisha Yokoyama Seisakusho | Process for manufacturing toothed parts |
US20120263882A1 (en) * | 2005-10-26 | 2012-10-18 | Sumitomo Chemical Company, Limited | Resin-impregnated base substrate and method for producing the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5643636A (en) * | 1979-09-19 | 1981-04-22 | Fuji Photo Film Co Ltd | Silver halide photographic material |
JPS61286129A (en) * | 1985-06-13 | 1986-12-16 | 松下電工株式会社 | Glass cloth base material resin laminated board |
-
1988
- 1988-02-26 JP JP4344488A patent/JPH01216831A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5643636A (en) * | 1979-09-19 | 1981-04-22 | Fuji Photo Film Co Ltd | Silver halide photographic material |
JPS61286129A (en) * | 1985-06-13 | 1986-12-16 | 松下電工株式会社 | Glass cloth base material resin laminated board |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4839952A (en) * | 1986-07-03 | 1989-06-20 | Kabushiki Kaisha Yokoyama Seisakusho | Process for manufacturing toothed parts |
US20120263882A1 (en) * | 2005-10-26 | 2012-10-18 | Sumitomo Chemical Company, Limited | Resin-impregnated base substrate and method for producing the same |
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