JPH01184193A - Thin semiconductor card - Google Patents
Thin semiconductor cardInfo
- Publication number
- JPH01184193A JPH01184193A JP63009973A JP997388A JPH01184193A JP H01184193 A JPH01184193 A JP H01184193A JP 63009973 A JP63009973 A JP 63009973A JP 997388 A JP997388 A JP 997388A JP H01184193 A JPH01184193 A JP H01184193A
- Authority
- JP
- Japan
- Prior art keywords
- card
- module
- semiconductor
- base material
- strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 32
- 239000011347 resin Substances 0.000 abstract description 10
- 229920005989 resin Polymers 0.000 abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 9
- 238000007789 sealing Methods 0.000 abstract description 8
- 239000011889 copper foil Substances 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 238000005530 etching Methods 0.000 abstract description 3
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 241000208195 Buxaceae Species 0.000 description 3
- 238000005253 cladding Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明に薄型半導体カードのモジュール基板の構造に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of a module substrate for a thin semiconductor card.
この種の薄型半導体カードに磁気カードに比較して記憶
容量が大きい利点があることなどから、近年、例えばＩ
Ｃカード型のものなど種々の形式のものが開発されるよ
うになってきた。第４図および４Ｍ５図は従来のＩＣカ
ード型の薄型半導体カードを示す平面図および１ｇ４図
の１−１線断面図であり、薄型半導体カード（１）ハ、
薄板状に形成されたカード本体（２）に半導体モジュー
ル（３）を搭載して構成されている。（４）ハ半導体モ
ジュール（３）の−面に外部に露呈させた状態に設けら
れた電極で、この電極（４）によって外部装置との情報
のやり取りが行われる。This type of thin semiconductor card has the advantage of a larger storage capacity than magnetic cards, so in recent years, for example,
Various formats such as C card type ones have been developed. FIGS. 4 and 4M5 are a plan view and a sectional view taken along the line 1-1 of FIG. 1g4 showing a conventional IC card type thin semiconductor card.
It is constructed by mounting a semiconductor module (3) on a card body (2) formed into a thin plate shape. (4) C. An electrode provided on the - side of the semiconductor module (3) in a state exposed to the outside, and this electrode (4) is used to exchange information with an external device.
前記半導体モジュール（３１［、複数枚のプリント配線
基板を積層して形成した凹陥部に半導体素子が搭載され
ており、前記電極（４）はプリント配線基板の凹陥部が
開放されない側の面に設けられている。薄型半導体カー
ドｉｌ＋の主たる機能に、この半導体素子に記憶された
情報および半導体素子の演算によシ行われる。そして、
薄型半導体カード（１）を外部装置に挿入し、半導体モ
ジュール（３）上の電極（４）と外部装置とを電気的に
接続することによって、前記半導体素子を動作させるよ
うに構成されている。The semiconductor module (31) has a semiconductor element mounted in a recess formed by laminating a plurality of printed wiring boards, and the electrode (4) is provided on the surface of the printed wiring board on the side where the recess is not opened. The main function of the thin semiconductor card il+ is performed by the information stored in this semiconductor element and the calculation of the semiconductor element.
The thin semiconductor card (1) is inserted into an external device and the semiconductor element is operated by electrically connecting the electrode (4) on the semiconductor module (3) to the external device.
半導体モジュールに関しては、第６図に示すように、は
め込み用と、第７図の飛び出し防止のだめのつば材用の
２タイプが使用されている。Regarding semiconductor modules, two types are used: one for fitting, as shown in FIG. 6, and one for a collar material to prevent popping out, as shown in FIG.
従来の薄型半導体カードは、以上のように構成されてい
るので、第４図、第５図のように曲げを受けた場合、カ
ード裏面が割れたＤ （Ｂ）、モジュールのつばが割れ
る（Ａ）という問題があった。また、つば付でにつげ部
とカードとの接着も悪いという問題があった。Conventional thin semiconductor cards are constructed as described above, so when they are bent as shown in Figs. ) There was a problem. In addition, there was a problem in that the adhesive between the brim and the boxwood part and the card was poor.
この発明に上記のような問題点を解消するためになされ
たもので、つば付モジュールのつげ強度を上げるととも
に、カードとの接着力を上げ、しかも封止樹脂と基板と
の接着も良くなることを目的とする。This invention was made to solve the above-mentioned problems, and it aims to increase the boxwood strength of the flange module, increase the adhesive strength with the card, and improve the adhesiveness between the sealing resin and the substrate. With the goal.
この発明に係る薄型半導体カードに、モジュールのつば
部に銅張積層板を使用したものである。In the thin semiconductor card according to the present invention, a copper-clad laminate is used for the module collar.
この発明におけるモジュールのつば部に、銅張積層板を
使用し、パターンを施したものを使用する。In this invention, a patterned copper-clad laminate is used for the flange of the module.
以下、この発明の一実施例を図について説明する。第１
図において、（５）は樹脂封止部、１６１１ｊ基材、（
７）は銅箔、（８）は基材（６）と銅箔（７）で構成さ
れており、同一基板上で樹脂封止部（６）以外のエリア
であるつば部である。An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, (5) is the resin sealing part, 1611j base material, (
7) is a copper foil, and (8) is a flange portion that is composed of a base material (6) and a copper foil (7), and is an area other than the resin sealing portion (6) on the same substrate.
また、樹脂封止部（６）の裏面にニ（４）の電極が位置
している。Further, a second electrode (4) is located on the back surface of the resin sealing part (6).
次に作用について説明する。Next, the effect will be explained.
第１図、＠２図で示された半導体カードモジュール（３
）は第３図のように、樹脂封止部（６）をカードの内部
に設けるようにカード化される。本生導体カードモジュ
ール第１図、第２図の場合、つば部として使用している
基材１６）ハ銅張板であるため、この基材上の銅箔（７
）ヲエッチングすることによって、凹凸を設け、カード
本体（２）と半導体モジュール（３）の特につば部（８
）の接着力を上げるとともに、強度も上げる効果がある
。Semiconductor card module (3
) is made into a card by providing a resin sealing part (6) inside the card as shown in FIG. In the case of this raw conductor card module in Figures 1 and 2, the base material 16) used as the collar is a copper-clad board, so the copper foil (7
) by etching to create unevenness, especially the collar part (8) of the card body (2) and semiconductor module (3).
) has the effect of increasing the adhesive strength and strength.
なお、上記実施例では片面銅張の場合について示したが
、つば部（８）の強度を上げ、カード本体（２）との接
着力を上げるために、両面鋼張板を使用してもよい。Although the above example shows the case of single-sided copper cladding, double-sided steel cladding may be used in order to increase the strength of the brim (8) and increase the adhesive strength with the card body (2). .
また、銅箔（７）のエツチング形状については、特に指
定はない。ただし、最もよいエツチング形状としては、
つげ強度を持ち、しかも接着強度を大きく保つことがで
きるような形状がよい。Further, there is no particular specification regarding the etched shape of the copper foil (7). However, the best etching shape is
It is best to have a shape that has boxwood strength and can maintain high adhesive strength.
以上のようにこの発明によれば、薄型半導体カードのモ
ジュールのつば部に、銅張積層板を使用したので、基材
単体に比べて、つば部の強度がアップし、しかもカード
とモジュール及び基板と封止樹脂の接着強度が上がると
いう効果がある。As described above, according to the present invention, since the copper-clad laminate is used for the flange of the module of a thin semiconductor card, the strength of the flange is increased compared to the base material alone. This has the effect of increasing the adhesive strength of the sealing resin.
第１図、第２図はこの発明の一実施例による薄型半導体
カードの半導体モジュールを示す図で、ｇＳ１図に上面
図°、第２図に側面図である。第３図はこのモジュール
をカード化した実装図、＠４図からＩＦ！；７図に、従
来の薄型半導体カードの図であり、第４図は平面図、第
５図は１−１断面図、第６図は半導体モジュールの側面
図、下品図、第７図はっは材中導体モジュールの側面図
、下面図を示す。
１１１１；ｊ薄型半導体カード、ｆ２１Ｈカード本体、
１３１ｆｌ半導体モジュール、（４１＃Ｓｒ電極、（５
）に樹脂封止部、（６１ニ基材、（７）は銅箔、（８）
はっは部を示す。
なお、図中、同一符号は同一、又は相当部分を示す。FIGS. 1 and 2 are diagrams showing a semiconductor module of a thin semiconductor card according to an embodiment of the present invention, with FIG. S1 being a top view and FIG. 2 being a side view. Figure 3 is an implementation diagram of this module as a card, @ Figure 4 shows the IF! Figure 7 shows a conventional thin semiconductor card; Figure 4 is a plan view, Figure 5 is a 1-1 sectional view, Figure 6 is a side view and rough view of a semiconductor module, and Figure 7 is a cross-sectional view. shows a side view and a bottom view of the conductor module. 1111;j thin semiconductor card, f21H card body,
131fl semiconductor module, (41#Sr electrode, (5
) with resin sealing part, (61 base material, (7) with copper foil, (8)
Indicates the part. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
出した状態で搭載した薄型半導体カードにおいて、半導
体モジュールをつば付とし、このつば部に銅張積層板を
用いたことを特徴とする薄型半導体カード。A thin semiconductor card having a semiconductor module mounted on a card body with its electrodes exposed to the outside, characterized in that the semiconductor module has a flange and a copper-clad laminate is used for the flange.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63009973A JPH01184193A (en) | 1988-01-19 | 1988-01-19 | Thin semiconductor card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63009973A JPH01184193A (en) | 1988-01-19 | 1988-01-19 | Thin semiconductor card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01184193A true JPH01184193A (en) | 1989-07-21 |
Family
ID=11734862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63009973A Pending JPH01184193A (en) | 1988-01-19 | 1988-01-19 | Thin semiconductor card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01184193A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999021132A1 (en) * | 1997-10-16 | 1999-04-29 | Citizen Watch Co., Ltd. | Ic card |
-
1988
- 1988-01-19 JP JP63009973A patent/JPH01184193A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999021132A1 (en) * | 1997-10-16 | 1999-04-29 | Citizen Watch Co., Ltd. | Ic card |
| US6166914A (en) * | 1997-10-16 | 2000-12-26 | Citizen Watch Co., Ltd. | IC card having a reinforcing member for reinforcing a sealing member |
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