JPH01173696A - Laminated circuit board - Google Patents
Laminated circuit boardInfo
- Publication number
- JPH01173696A JPH01173696A JP33057087A JP33057087A JPH01173696A JP H01173696 A JPH01173696 A JP H01173696A JP 33057087 A JP33057087 A JP 33057087A JP 33057087 A JP33057087 A JP 33057087A JP H01173696 A JPH01173696 A JP H01173696A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- adhesive
- hole
- circuit
- evaporating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 39
- 230000001070 adhesive effect Effects 0.000 claims abstract description 39
- 238000001035 drying Methods 0.000 claims abstract description 11
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 238000000034 method Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 3
- 239000002904 solvent Substances 0.000 abstract description 3
- 239000011810 insulating material Substances 0.000 abstract description 2
- 238000001704 evaporation Methods 0.000 abstract 6
- 239000004819 Drying adhesive Substances 0.000 abstract 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 18
- 229910052709 silver Inorganic materials 0.000 description 15
- 239000004332 silver Substances 0.000 description 15
- 239000011521 glass Substances 0.000 description 14
- 239000000758 substrate Substances 0.000 description 10
- 239000000203 mixture Substances 0.000 description 6
- 239000006227 byproduct Substances 0.000 description 5
- 229920006267 polyester film Polymers 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
また、蒸発乾燥型導電ペーストや熱硬化型導電ペースト
は、本来導通を確保するものであって、一般の接着剤の
ような強固な接着力を有しないものである。したがって
、電気的特性・機械的強度を確保するため、いっそう十
分な乾燥や硬化を要求される。
この発明は、このような問題点を解消し、異なる回路基
板間に挟み込まれた電気的接続材料および／または絶縁
材料の含有溶剤や硬化反応副生成物を、確実に揮散除去
可能な積層回路基板を提供することを目的とする。Further, the evaporative drying type conductive paste and the thermosetting type conductive paste are originally intended to ensure continuity, but do not have strong adhesive strength like general adhesives. Therefore, more sufficient drying and curing are required to ensure electrical properties and mechanical strength. The present invention solves these problems and provides a laminated circuit board that can reliably volatilize and remove solvents and curing reaction byproducts contained in electrical connection materials and/or insulating materials sandwiched between different circuit boards. The purpose is to provide
この発明は、以上の目的を達成するために、次のように
構成した。すなわち、この発明の積層回路基板は、２つ
の回路基板間に介在して異なる回路基板間を電気的に接
続する導電ペーストまたは異なる回路基板間を接合する
接着剤の少なくとも一方が蒸発乾燥型または熱硬化型で
ある積層回路基板において、導電ペーストまたは接名削
が接する少なくとも一方の回路基板に貫通孔が設けられ
ているように構成したものである。
積層する回路基板としては、銅張回路基板やコンポジッ
ト回路基板、フレキシブル印刷回路基板（ＦＰＣ）、酸
化インジウム−スズ透明導電膜（ＩＴｏ）回路基板など
を用いることができる。
積層される回路基板の隣合う２枚の回路基板の少なくと
も一方の回路基板に貫通孔が形成される。
したがって、積層回路基板の積層数は２層に限定される
ものではなく、３層以上積層されたものであってもよい
。回路基板が積層される際に前記導電ペーストが用いら
れる場合は、貫通孔は回路基板の接続を行ないたい回路
内あるいは回路近傍に設けられる。また、回路基板が積
層される際に前記接着剤が接着剤として、あるいは絶縁
を兼ねる接着剤として用いられる場合は、貫通孔は回路
以外の部分に設けられる。貫通孔は、ドリリング・打ち
抜きなどの方法にて形成される。貫通孔が回路上に設け
られる場合、その大きさ・形状・数は回路間の電気的接
続の機能を妨げるものであってはならない。貫通孔の大
きさ 数は、回路の細密度によって異なるが、たとえば
回路上の電気的接続部の寸法が直径３ｍｍの端子である
場合は、その端子内に直径０゜１〜０．５ｍｍ程度の貫
通孔を数個設けるとよい０貫通孔の形状としては、円形
または角状などがある。また、切込みのような形状であ
れば、回路基板がＦＰＣなとの熱による寸法変化の大き
いものであっても、熱収縮または熱膨張によって発生す
る歪を緩和させることもできる。
導電ペーストや接着剤が、スクリーン印刷やデイスペン
サーにより貫通孔が設けられた回路基板上に塗布あるい
は充填され、貼り合わされる。また、絶縁を兼ねる接着
層としてシート状接着剤や両面粘着シートを用いること
もできる。回路基板が耐える範囲の温度で加熱すること
により、蒸発乾燥型導電ペーストや蒸発乾燥型接着剤に
含有する溶剤を貫通孔より揮散させ乾燥する。
また、熱硬化型導電ペーストや接着剤を用いる場合は、
基板に塗布し、乾燥させた後、所定部に貫通孔を形成し
、積層して加熱加圧することに上り熱硬化して電気的接
続および接着することができる。その際、硬化反応副生
成物を貫通孔より揮散除去する。
また、積層回路基板の使用条件などにより、貫通孔より
水などが浸入して電気的接続部が侵される恐れのある場
合は、導電ペーストや接着剤の乾燥後、貫通孔を樹脂や
ゴムで封止するか、回路基板の表面に保護層を形成する
か、保護フィルムを貼り合わせばよい。
また、導電ペーストが貫通孔内部を満たし、回路基板の
電気的接続面′−反対面へ貫通孔を通して連なり貫通孔
開一部近傍を被覆する場合、本来の作用と同時に回路基
板分リベットのように両側か・＼挟み込むことになる。
したがって、導電ペーストの乾燥時や熱ゆ化時の体積収
縮によって電気的接続部を加圧するため、接続抵抗を減
少させるとともに、接続部の機械的強度を増強すること
となる。また、接着剤の場合も同様に、貫通孔内部を満
たし、回路基板の接着面と反対面へ貫通孔を通して連な
り貫通４−１−豐・１部近傍を被覆する場合には、回路
基板をリベ・・）・のように両側から挟み込むことにな
る。したがって、接着剤の乾燥時の体積収縮によって接
続部の接着強度を増強することとなる。In order to achieve the above object, the present invention is configured as follows. That is, in the laminated circuit board of the present invention, at least one of the conductive paste that is interposed between two circuit boards and electrically connects different circuit boards, or the adhesive that connects different circuit boards is evaporative drying type or heat-dried type. In a hardening type laminated circuit board, at least one circuit board that is in contact with a conductive paste or a contact cutter is provided with a through hole. As the circuit board to be laminated, a copper-clad circuit board, a composite circuit board, a flexible printed circuit board (FPC), an indium-tin oxide transparent conductive film (ITo) circuit board, etc. can be used. A through hole is formed in at least one of two adjacent circuit boards to be stacked. Therefore, the number of laminated layers of the laminated circuit board is not limited to two, but may be three or more layers. When the conductive paste is used when circuit boards are stacked, the through holes are provided in or near the circuit to which the circuit boards are to be connected. Furthermore, when the adhesive is used as an adhesive or as an adhesive that also serves as an insulator when circuit boards are stacked, the through holes are provided in a portion other than the circuit. The through hole is formed by a method such as drilling or punching. When through-holes are provided on a circuit, their size, shape, and number must not interfere with the function of electrical connection between circuits. The size and number of through holes varies depending on the density of the circuit, but for example, if the electrical connection on the circuit is a terminal with a diameter of 3 mm, there is a hole in the terminal with a diameter of about 0°1 to 0.5 mm. It is preferable to provide several through holes. Examples of the shape of the through holes include circular or angular shapes. Moreover, if the shape is like a notch, even if the circuit board is one that undergoes large dimensional changes due to heat, such as an FPC, it is possible to alleviate distortion caused by thermal contraction or thermal expansion. A conductive paste or adhesive is applied or filled onto a circuit board provided with through holes by screen printing or a dispenser, and then bonded together. Moreover, a sheet adhesive or a double-sided adhesive sheet can also be used as an adhesive layer that also serves as insulation. By heating at a temperature within a range that the circuit board can withstand, the solvent contained in the evaporative conductive paste or the evaporative adhesive is volatilized through the through holes and dried. In addition, when using thermosetting conductive paste or adhesive,
After being applied to a substrate and dried, through-holes are formed in predetermined portions, the layers are laminated, heated and pressed, and then thermally cured for electrical connection and adhesion. At that time, curing reaction byproducts are volatilized and removed from the through holes. In addition, if there is a risk that water, etc. may enter through the through-holes and damage the electrical connections due to the usage conditions of the laminated circuit board, after the conductive paste or adhesive has dried, seal the through-holes with resin or rubber. The circuit board may be stopped, a protective layer may be formed on the surface of the circuit board, or a protective film may be attached. In addition, when the conductive paste fills the inside of the through-hole and extends through the through-hole to the opposite side of the circuit board's electrical connection surface and covers the vicinity of the opening of the through-hole, it acts like a rivet on the circuit board at the same time. It will get caught on both sides. Therefore, since the electrical connection part is pressurized by the volumetric contraction when the conductive paste dries or heats, the connection resistance is reduced and the mechanical strength of the connection part is increased. Similarly, in the case of adhesive, if the adhesive is used to fill the inside of the through hole and pass through the through hole to the surface opposite to the adhesive surface of the circuit board and cover the vicinity of the through hole 4-1, the circuit board may be liberated. It will be pinched from both sides like...). Therefore, the volumetric shrinkage of the adhesive upon drying increases the adhesive strength of the connection portion.
積層回路基板の蒸発乾燥型導電ペーストおよび／または
蒸発乾燥型接着剤が挟まれる部分に該回路基板を貫通す
る貫通孔が設けられているので、蒸発乾燥型導電ペース
トおよび／または蒸発乾燥型接着剤に含まれる揮発分が
該貫通孔を通して効率的に揮散し、蒸発乾燥型導電ペー
ストおよび、／または蒸発乾燥型接着剤が十分乾燥する
。
特に、接続部の面積が大きい場合や基板サイズが大きい
場合でも十分に乾燥するものである。
積層回路基板の熱硬化型導電ペーストおよび／または熱
硬化型接着剤が挟まれる部分に該回路基板を貫通する貫
通孔が設けられているので、硬化反応副生成物が該貫通
孔を通して効率的に揮散し、熱硬化型導電ペーストおよ
び／または熱硬化型接着剤が十分乾燥する。
また、回路と蒸発乾燥型導電ペーストおよび／または蒸
発乾燥型接着剤との接触面積を大きく設定できるので、
電気的接続部や回路基板間の接着強度が向上し、電気的
特性や接着強度に優れた積層回路基板となる。A through hole is provided through the circuit board at the portion of the laminated circuit board where the evaporative conductive paste and/or the evaporative adhesive is sandwiched, so that the evaporative conductive paste and/or the evaporative adhesive are sandwiched. The volatile components contained in the conductive paste and/or the evaporative adhesive are efficiently volatilized through the through holes, and the evaporative conductive paste and/or the evaporative adhesive are sufficiently dried. Particularly, even when the area of the connection part is large or the size of the board is large, it can be sufficiently dried. Since a through hole is provided through the laminated circuit board at the portion where the thermosetting conductive paste and/or thermosetting adhesive is sandwiched, the curing reaction by-products can efficiently pass through the through hole. After volatilization, the thermosetting conductive paste and/or thermosetting adhesive are sufficiently dried. In addition, since the contact area between the circuit and the evaporative conductive paste and/or the evaporative adhesive can be set large,
The adhesive strength between electrical connections and circuit boards is improved, resulting in a laminated circuit board with excellent electrical properties and adhesive strength.
え１九Ｆ
ＦＰＣとＩＴＯ回路ガラス基板を積層し、電気的に接続
した例を、図面を参照しながら次に示す。
第１図は、この発明の積層回路基板の一実施例を示す断
面図である。１はＦＰＣ１２はＩＴＯ回路ガラス基板、
３は回路接続用の銀ペースト、４は両面粘着シート、１
１はポリエステルフィルム、１２は銀ペースト回路およ
び接続端子、１３は貫通孔、２１はガラス、２２はＩＴ
Ｏ回路および接続端子をそれぞれ示す。
まず、５０μｍ厚のポリエステルフィルム１１をＦＰＣ
基材とし、組成１の銀ペーストを用いて所定の回路およ
び接続端子１２をスクリーン印刷法により形成し、加熱
乾燥後、Ｆ’ＰＣＩを作製した。
また、１．１ｍｍｍｍ−ダガラス２１上に蒸着法によっ
て成膜されたＩＴＯ上に所定の回路のエツチングレジス
トをスクリーン印刷法にて形成し、エツチング法により
ＩＴＯ回路ガラス基板２を作製した。
次に、ＦＰＣＩとＩＴＯ回路ガラス基板２との回路の絶
縁させたい部分の形状に打ち抜いた１２μｍ厚のポリエ
ステル両面粘着シート４の片面をＦＰＣＩの回路形成面
に接着した。次に、ＦＰＣＩの銀ペースト回路内に形成
された直径３ｍｍのＩＴＯ回路ガラス基板２との接続端
子１２内の中央部に直径１．０ｍｍの貫通孔１３をＦＰ
ＣＩが貫通されるまで回路側から開けた。
次いで、ＩＴＯ回路ガラス基板２の回路上に形成された
直径３ｍｍのＦ ）） Ｃ１との接続端子２２上に組成
２の回路接続用の銀ペースト３を直径４ｍｍの円状にス
クリーン法にて塗布した。このとき、銀ペースト３の乾
燥時膜厚が両面粘着シート４の厚みと同じか少し厚くな
るよう、スクリーン版のメツシュ数をテトロン１５０メ
ツシ１、乳剤層の厚さを３０μｍとした。
次に、ＦＰＣＩと接着された両面粘着シート４のもう一
方の離型紙を剥し、銀ペースト３が未乾燥の状態でＩＴ
Ｏ回路ガラス基板２の所定の位置に接着した。
次に、積層された回路基板を８０℃・３０分間の加熱に
より銀ペースト３中の揮発分を揮散させ、接続端子１２
と接続端子２２が電気的に接続された積層回路基板を得
た。
組成１ （重量部〉リン片
状銀粉 ６５ポリエステル樹脂
１０エチルカルピトールアセテート
２５組成２ （重量部
）球状銀粉 ６５ポリエステ
ル樹脂 １０ブチルカルピトールアセ
テート ２５及１眞乏
実施例１のポリエステルフィルム１１に代えてポリイミ
ドフィルムを用い、回路接続用銀ペースト３に代えて組
成３の銀ペーストを用いて、他は実施例１と同様にして
ＦＰＣ１とＩＴＯ回路ガラス基板２とを接着した。次に
、積層された回路基板を１５０°Ｃ・６０分間加熱する
ことにより前記銀ベーストを硬化させた。この際、硬化
反応により生じた副生成物を貫通孔から揮散させ、接続
端子１２と接続端子２２が電気的に接続された積層回路
基板を得た。
組成３ （重量部）銀粉
８０エポキシ樹脂
１０ブチルカルピトールアセテート１
０An example in which FPC and ITO circuit glass substrates are laminated and electrically connected will be described below with reference to the drawings. FIG. 1 is a cross-sectional view showing an embodiment of the laminated circuit board of the present invention. 1 is FPC12 is ITO circuit glass substrate,
3 is silver paste for circuit connection, 4 is double-sided adhesive sheet, 1
1 is a polyester film, 12 is a silver paste circuit and connection terminal, 13 is a through hole, 21 is glass, 22 is IT
The O circuit and connection terminals are shown respectively. First, a polyester film 11 with a thickness of 50 μm is printed on an FPC.
A predetermined circuit and connection terminals 12 were formed by screen printing using a silver paste of Composition 1 as a base material, and after heating and drying, F'PCI was produced. Further, an etching resist of a predetermined circuit was formed by a screen printing method on an ITO film formed on a 1.1 mm mm glass 21 by a vapor deposition method, and an ITO circuit glass substrate 2 was produced by the etching method. Next, one side of a 12 μm thick polyester double-sided adhesive sheet 4 punched in the shape of a portion of the circuit between the FPCI and the ITO circuit glass substrate 2 to be insulated was adhered to the circuit-forming surface of the FPCI. Next, a through hole 13 with a diameter of 1.0 mm is made in the center of the connection terminal 12 with the ITO circuit glass substrate 2 with a diameter of 3 mm formed in the silver paste circuit of the FPCI.
It was opened from the circuit side until the CI was penetrated. Next, a silver paste 3 for circuit connection having composition 2 was applied in a circular shape of 4 mm in diameter on the connection terminal 22 with F)) C1 formed on the circuit of the ITO circuit glass substrate 2 with a diameter of 4 mm using a screen method. did. At this time, the number of meshes of the screen plate was set to 150 meshes and 1 mesh, and the thickness of the emulsion layer was set to 30 μm so that the dry film thickness of the silver paste 3 was the same as or slightly thicker than the thickness of the double-sided pressure-sensitive adhesive sheet 4. Next, remove the other release paper of the double-sided adhesive sheet 4 adhered to the FPCI, and leave the silver paste 3 in an undried state.
It was adhered to a predetermined position on the O-circuit glass substrate 2. Next, the laminated circuit boards are heated at 80°C for 30 minutes to volatilize the volatile content in the silver paste 3, and the connecting terminals 12
A laminated circuit board was obtained in which the and connecting terminals 22 were electrically connected. Composition 1 (parts by weight) flaky silver powder 65 polyester resin
10 Ethyl carpitol acetate
25 Composition 2 (Parts by weight) Spherical silver powder 65 Polyester resin 10 Butyl carpitol acetate 25 and 1 In place of polyester film 11 in Example 1, a polyimide film was used, and in place of silver paste 3 for circuit connection, silver of composition 3 was used. The FPC 1 and the ITO circuit glass substrate 2 were bonded together using a paste in the same manner as in Example 1 except that the paste was used. Next, the silver base plate was cured by heating the laminated circuit board at 150° C. for 60 minutes. At this time, by-products produced by the curing reaction were volatilized from the through holes to obtain a laminated circuit board in which the connecting terminals 12 and 22 were electrically connected. Composition 3 (parts by weight) Silver powder
80 epoxy resin
10 Butyl carpitol acetate 1
0
この発明は、積層回路基板の少なくとも一方の回路基板
に貫通孔が設けられたものであるので、蒸発乾燥型導電
ペーストおよび／または蒸発乾燥型接着剤中に含まれる
揮発分や熟硬化型導社ペーストおよび／または熱硬化型
接着剤の硬化反応副生成物が効率的に揮散し、十分な電
気的特性や接着強度が得られる。In this invention, at least one circuit board of the laminated circuit board is provided with a through hole, so that the volatile matter contained in the evaporative drying type conductive paste and/or the evaporative drying type adhesive and the ripe hardening type conductive paste are removed. The curing reaction by-products of the paste and/or thermosetting adhesive are efficiently volatilized, and sufficient electrical properties and adhesive strength can be obtained.
第１図は、この発明の積層回路基板の−実施Ｐ’ｌｉを
示す断面図である。
１・・・ＦＰＣ２２・・・ＩＴＯ回路ガラス基板、３・
・・回路接続用の銀ペースト、４・・・両面粘着シート
、１１・・・ポリエステルフィルム、１２・・・銀ペー
スト回路および接続端子、１３・・貫通孔、２１・・・
ガラス、２２・・・１７０回路および接続端子。
特許出願人 日本写真印刷株式会社
１・・・ＦＰＣ
２・・・ＩＴＯ回路力゛ラス基板
３・・・回路接続用の銀ベースト
１１・・・両面粘着シート
１１・・ポリエステルフィルム
１２・・・銀ペースト回路および接続端子１３・・・貫
通孔
２１・・ガラス
２２ ・１７０回路および接続端子FIG. 1 is a sectional view showing the implementation P'li of the laminated circuit board of the present invention. 1...FPC22...ITO circuit glass substrate, 3.
...Silver paste for circuit connection, 4...Double-sided adhesive sheet, 11...Polyester film, 12...Silver paste circuit and connection terminal, 13...Through hole, 21...
Glass, 22...170 circuits and connection terminals. Patent applicant Nissha Printing Co., Ltd. 1...FPC 2...ITO circuit strength glass board 3...Silver base for circuit connection 11...Double-sided adhesive sheet 11...Polyester film 12...Silver Paste circuit and connection terminal 13...Through hole 21...Glass 22 ・170 circuit and connection terminal
Claims (3)
電気的に接続する導電ペーストまたは異なる回路基板間
を接合する接着剤の少なくとも一方が蒸発乾燥型または
熱硬化型である積層回路基板において、導電ペーストま
たは接着剤が接する少なくとも一方の回路基板に貫通孔
が設けられていることを特徴とする積層回路基板。(1) A laminated circuit board in which at least one of the conductive paste that is interposed between two circuit boards and electrically connects different circuit boards or the adhesive that connects different circuit boards is evaporative drying type or thermosetting type. 1. A laminated circuit board according to claim 1, wherein at least one of the circuit boards in contact with the conductive paste or adhesive is provided with a through hole.
間の電気的接続面と反対面へ貫通孔を通して連なり貫通
孔開口部近傍を被覆する特許請求の範囲第１項に記載の
積層回路基板。(2) The laminated circuit board according to claim 1, wherein the conductive paste fills the inside of the through hole, extends through the through hole to a surface opposite to the electrical connection surface between the circuit boards, and covers the vicinity of the opening of the through hole. .
着面と反対面へ貫通孔を通して連なり貫通孔開口部近傍
を被覆する特許請求の範囲第１項に記載の積層回路基板
。(3) The laminated circuit board according to claim 1, wherein the adhesive fills the inside of the through hole, extends through the through hole to the surface opposite to the adhesive surface between the circuit boards, and covers the vicinity of the opening of the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33057087A JPH01173696A (en) | 1987-12-26 | 1987-12-26 | Laminated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33057087A JPH01173696A (en) | 1987-12-26 | 1987-12-26 | Laminated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01173696A true JPH01173696A (en) | 1989-07-10 |
Family
ID=18234128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33057087A Pending JPH01173696A (en) | 1987-12-26 | 1987-12-26 | Laminated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01173696A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6276055B1 (en) * | 1998-09-02 | 2001-08-21 | Hadco Santa Clara, Inc. | Method and apparatus for forming plugs in vias of a circuit board layer |
| US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
| US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
| US6793852B2 (en) | 2000-05-31 | 2004-09-21 | Ttm Advanced Circuits, Inc. | Scavenging method |
| US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
| US6832714B2 (en) | 2000-05-31 | 2004-12-21 | Ttm Advanced Circuits, Inc. | Heated filling device |
| US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
| JP2006285958A (en) * | 2005-03-08 | 2006-10-19 | Semiconductor Energy Lab Co Ltd | Wireless chip and electronic apparatus having it |
| US8455954B2 (en) | 2005-03-08 | 2013-06-04 | Semiconductor Energy Laboratory Co., Ltd. | Wireless chip and electronic appliance having the same |
-
1987
- 1987-12-26 JP JP33057087A patent/JPH01173696A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6276055B1 (en) * | 1998-09-02 | 2001-08-21 | Hadco Santa Clara, Inc. | Method and apparatus for forming plugs in vias of a circuit board layer |
| US6282782B1 (en) | 1998-09-02 | 2001-09-04 | Hadco Santa Clara, Inc. | Forming plugs in vias of circuit board layers and subassemblies |
| US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
| US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
| US6793852B2 (en) | 2000-05-31 | 2004-09-21 | Ttm Advanced Circuits, Inc. | Scavenging method |
| US6797224B2 (en) | 2000-05-31 | 2004-09-28 | Ttm Advanced Technologies, Inc. | Heated filling method |
| US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
| US6832714B2 (en) | 2000-05-31 | 2004-12-21 | Ttm Advanced Circuits, Inc. | Heated filling device |
| US6840425B2 (en) | 2000-05-31 | 2005-01-11 | Ttm Advanced Circuits, Inc. | Scavenging system |
| US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
| US6921505B2 (en) | 2000-05-31 | 2005-07-26 | Ttm Advanced Circuits, Inc. | Hole filling using an etched hole-fill stand-off |
| US6995321B2 (en) | 2000-05-31 | 2006-02-07 | Honeywell Advanced Circuits | Etched hole-fill stand-off |
| US7066378B2 (en) | 2000-05-31 | 2006-06-27 | Ttm Advanced Circuits, Inc. | Filling device |
| JP2006285958A (en) * | 2005-03-08 | 2006-10-19 | Semiconductor Energy Lab Co Ltd | Wireless chip and electronic apparatus having it |
| US8455954B2 (en) | 2005-03-08 | 2013-06-04 | Semiconductor Energy Laboratory Co., Ltd. | Wireless chip and electronic appliance having the same |
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