JPH01170013A - Wafer transfer method - Google Patents
Wafer transfer methodInfo
- Publication number
- JPH01170013A JPH01170013A JP62328921A JP32892187A JPH01170013A JP H01170013 A JPH01170013 A JP H01170013A JP 62328921 A JP62328921 A JP 62328921A JP 32892187 A JP32892187 A JP 32892187A JP H01170013 A JPH01170013 A JP H01170013A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- cassette
- wafers
- processing
- recognized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 32
- 235000012431 wafers Nutrition 0.000 claims abstract description 97
- 230000007246 mechanism Effects 0.000 claims description 17
- 238000007781 pre-processing Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 abstract description 11
- 230000010365 information processing Effects 0.000 abstract description 10
- 238000003860 storage Methods 0.000 description 26
- 230000032258 transport Effects 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000005070 sampling Methods 0.000 description 3
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
Landscapes
- Conveyance By Endless Belt Conveyors (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
Abstract
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は処理体の搬送方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method for transporting a processing object.
［従来の技術及び発明が解決しようとする問題点］半導
体製造工程において、一般にウェハはレジストコート、
エツチング、イオン注入、拡散、酸化、金属膜蒸着、ホ
トリソグラフィー等の各工程を経て製造、処理されてい
る。[Prior art and problems to be solved by the invention] In the semiconductor manufacturing process, wafers are generally coated with resist,
It is manufactured and processed through various steps such as etching, ion implantation, diffusion, oxidation, metal film deposition, and photolithography.
″これらの一連の製造工程において、ウェハは内壁に多
段に形成された収納溝等を有するカセットに複数枚収納
されて順次各工程に搬送されている。``In these series of manufacturing steps, a plurality of wafers are stored in a cassette having storage grooves formed in multiple stages on the inner wall, and are sequentially transported to each step.
ウェハを収納したカセットは多数使用され、遂次前記の
ような前処理工程階段を経て製造されるため、処理順を
正しく行い、ウェハの経歴を知る事ができるようにして
おく必要がある。多数のカセットを使用する場合、カセ
ットが認識手段を持たないと、カセットの処理順が狂っ
てしまい、従ってウェハの処理順も正しくなされなくな
ってしまうという欠点があった。また、−処理工程中に
おいてはカセットをカセット収納部に収納し、カセット
を上下移動させて、カセットの下方に装備されたベルト
コンベア等の搬送手段で、ウェハの搬送を行っている。Since a large number of cassettes containing wafers are used and manufactured through the pre-processing steps described above, it is necessary to perform the processing in the correct order and to be able to know the history of the wafers. When using a large number of cassettes, if the cassettes do not have recognition means, the processing order of the cassettes will be out of order, and therefore the wafers will not be processed in the correct order. Furthermore, during the processing step, the cassette is stored in a cassette storage section, the cassette is moved up and down, and the wafers are transported by a transport means such as a belt conveyor installed below the cassette.
しかし、この方法ではウェハはカセットの下方から順次
取り出され、収納される時はカセットの上方から順次収
納されるため処理順番が狂ってしまうという欠点があっ
た。また、他の手段としてカセット内壁の収納溝に収納
されたウェハを取り出し機構で取り出す方法もあるが、
ウェハの収納位置及び収納間隔を一定値としてめくら操
作で取り出し、挿入を行っていたので、ウェハの破損や
抜きとり検査等で欠番があった場合等、ウェハの適正な
位置の取り出し挿入が行われないという欠点があった。However, in this method, the wafers are sequentially taken out from the bottom of the cassette, and when stored, they are sequentially stored from the top of the cassette, which has the disadvantage that the processing order is out of order. Another method is to use a take-out mechanism to take out the wafer stored in the storage groove on the inner wall of the cassette.
The wafer storage position and storage interval were set to a fixed value and the wafers were taken out and inserted using a blind operation, so if a wafer was damaged or there was a missing number during a sampling inspection, etc., the wafer could be taken out and inserted at the correct position. There was a drawback that there was no
特に、ＡＳＩＣ対応で少量多品種になると製造ラインで
の無人搬送車による搬送エラーや製造装置のトラブルに
よる搬送エラーなどが多々発生する。このような場合に
おいても処理は常に同一種は同一条件処理が望ましいた
め、処理の再配列が望まれる。In particular, when ASIC-compatible products are manufactured in small quantities and with a wide variety of products, transportation errors often occur due to automatic guided vehicles on the production line or troubles with manufacturing equipment. Even in such a case, it is desirable to always process the same type under the same conditions, so it is desirable to rearrange the processes.
本発明の目的は上記欠点を解消し、ウェハの各処理工程
において予め定めた処理順に搬送可能なウェハ搬送方法
を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned drawbacks and provide a wafer transport method capable of transporting wafers in a predetermined processing order in each processing step.
［問題点を解決するための手段］
本発明は以上のような目的を達成するため、複数のカセ
ット内にそれぞれ収納される複数のウェハを順次前処理
する工程において、各処理工程において所定の順番によ
って処理することを特徴とする
特に前記カセット及びウェハは認識される識別部を有し
、該識別部を各処理工程内に設けた認識手段により認識
することを特徴とする。[Means for Solving the Problems] In order to achieve the above-mentioned objects, the present invention provides a method for sequentially preprocessing a plurality of wafers stored in a plurality of cassettes in a predetermined order in each processing step. In particular, the cassettes and wafers are characterized in that they have an identification part that is recognized, and the identification part is recognized by a recognition means provided in each processing step.
このような方法を実現する方法として２本の支柱の各々
からさん状に並設された複数の棒状体から成り、且つ相
異なる支柱の前記棒状体はそれぞれ対を成し、ウェハを
載置可能としたカセットと、垂直機構及び回転機構を備
え且つ先端部に吸着口を有する２本の搬送アームであっ
て、回転時に前記支柱に接触しない位置に配置された前
記アームにより所望の位置のウェハを取り出し且つ所望
の位置にウェハを収納することを特徴とする。As a method for realizing such a method, each of two pillars is made up of a plurality of rod-like bodies arranged side by side in a sandwich shape, and the rod-like bodies of different pillars each form a pair, and the wafer can be placed thereon. The cassette is equipped with a vertical mechanism, a rotation mechanism, and two transfer arms each having a suction port at its tip. It is characterized by taking out the wafer and storing it in a desired position.
［実施例］ 以下本発明方法の実施例を図面を参照して説明する。[Example] Examples of the method of the present invention will be described below with reference to the drawings.
カセット及びウェハの識別部として、バーコードやアナ
ログ数値など複数小孔を穿孔し、これらの位置の組合せ
あるいは単に番号や記号を付す等の方法を用いることに
よりウェハの品種、ロット番号などを表示した識別部を
形成することができる。第１図にカセット１及びウェハ
２にバーコードａを貼着した例を示す。ウェハ２におい
てはオリエンテーションフラット部に沿って形成しても
よい。As an identification part for cassettes and wafers, multiple small holes such as barcodes and analog numerical values are punched, and the wafer type, lot number, etc. are displayed by combining these positions or simply adding numbers and symbols. An identification part can be formed. FIG. 1 shows an example in which a barcode a is attached to a cassette 1 and a wafer 2. In the wafer 2, it may be formed along the orientation flat portion.
これらの識別部を認識する認識手段として光情報処理装
置等を用いる。光情報処理装置を用いたカセット認識方
法を第２図を用いて説明する。An optical information processing device or the like is used as a recognition means for recognizing these identification parts. A cassette recognition method using an optical information processing device will be explained with reference to FIG.
第２図において、ウェハの処理工程装置であるＡ及びＢ
で処理済例えばレジスト塗布工程、露光工程済のウェハ
Ｗが収納されているカセット１１は上面に識別部である
小孔を穿孔された板状体ａ′が貼着され、搬送ベルトｂ
によりカセット１１は搬送され、識別部である板状体ａ
′を認識する認識手段である光情報処理装置４及び反射
板５により認識され、予めＣＰＵで組まれたカセット別
工程順の辞書からの命令に基づき、各カセットにつき搬
送先が決定され、ウェハＷの次の処理が行われるＣＶ＆
置へ搬送される。In FIG. 2, A and B are wafer processing equipment.
A cassette 11 containing wafers W which have been processed, for example, subjected to a resist coating process and an exposure process, has a plate-like body a' with a small hole as an identification part attached to the top surface, and is attached to a conveyor belt b.
The cassette 11 is conveyed by
' is recognized by the optical information processing device 4 and the reflection plate 5, which are recognition means for recognizing wafers W. CV &
transported to the location.
光情報処理装置４はレーザ光射光口６よりレーザ光線を
射光し、カセット１１上の板状体ａ″を照射して反射光
を反射板５に反射させ反射光により穿孔位置をＩＴＶカ
メラ（図示せず）などにより光電的に検出するものであ
る。検出出力信号と予め記憶された認識辞書と比較照合
し、−Ｍする辞書内容を認識情報として出力する。さら
に光情報処理装！！４の出力はカセットの処理順が記憶
された記憶装置（図示せず）に接続され、カセットの処
理順を出力することができる。これらの認識手段により
１次の処理の行われる装置ｃ例えばＵＶ硬化処理工程で
処理後、次の現像工程（図示せず）へ搬送されるかある
いは直接法の現像工程（図示せず）へ搬送する場合、搬
送されるべきカセットを探索し、正しい順番のカセット
が認識されればそのまま搬送し、誤った順番のカセット
が認識されれば、例えばブザー等の手段（図示せず）で
表示させる。このようにしてカセット処理順に正しく認
識処理することができる。The optical information processing device 4 emits a laser beam from the laser beam emitting port 6, irradiates the plate-shaped body a'' on the cassette 11, reflects the reflected light on the reflector plate 5, and uses the reflected light to locate the perforation position with the ITV camera (Fig. The detection output signal is compared with a pre-stored recognition dictionary, and the contents of the -M dictionary are output as recognition information.Furthermore, an optical information processing device!!4 is used. The output is connected to a storage device (not shown) in which the processing order of the cassettes is stored, and the processing order of the cassettes can be output.These recognition means identify the device c where the primary processing is performed, such as UV curing processing. After processing in the process, when the cassettes are transported to the next developing step (not shown) or directly to the developing step (not shown), the cassettes to be transported are searched and the cassettes in the correct order are recognized. If the wrong order of cassettes is recognized, the cassettes are conveyed as is, and if a cassette is recognized in the wrong order, it is displayed by a means such as a buzzer (not shown).In this way, the cassettes can be correctly recognized in the order of processing.
カセット認識方法の他の実施例として、バッファリング
機構であるカセットステーションを用いる方法がある。Another example of a cassette recognition method is a method using a cassette station, which is a buffering mechanism.
第３図に図示のカセットステーションの斜視図を参照し
てカセットステーションを説明する。カセットステーシ
ョン２０上にカセット載置位置２２〜２７を設け、ここ
に識別部である例えばバーコードａが貼着されたカセッ
ト１１が載置される。ウェハ処理袋ｆａＤで処理済のウ
ェハを収納したカセットステーション２０上のカセット
載置位置２２〜２７にロボットアーム２１により載置さ
れる。載置されたカセットは次工程の行われる処理袋ｆ
ｉＥにロボットアーム２１の先端に設けられた光情報処
理装置４１によりレーザ光をバーコードａ−１に照射し
、その反射光により読み取りを行い、正しい順番のカセ
ットが搬送されるようになっている。The cassette station will be described with reference to the perspective view of the cassette station shown in FIG. Cassette mounting positions 22 to 27 are provided on the cassette station 20, and the cassette 11 to which an identification portion, for example, a barcode a is pasted, is placed there. The robot arm 21 places the cassettes at the cassette placement positions 22 to 27 on the cassette station 20 in which processed wafers are stored in the wafer processing bag faD. The placed cassette is placed in the processing bag f where the next process will be carried out.
An optical information processing device 41 installed at the tip of the robot arm 21 of the iE irradiates the barcode a-1 with laser light, reads the barcode a-1 using the reflected light, and transports cassettes in the correct order. .
バーコードａ（の読み取りは、レーザー光がバーコード
の位置に照射されるようにロボットアーム２１の移動に
より行ってもよいし、又カセットステーション２０を回
転機構に接続し、カセットステーション２０の回転で行
ってもよい。又、バーコードの読み取りはロボットアー
ムの先端に設置したものでなく他に設置した光情報処理
装置４２を使用して、カセットのａ−２の位置に貼着し
たバーコードを読み取るようにしてもよい。光情報処理
装置４２はカセットの処理順を記憶させた記憶装置（図
示せず）に接続され、カセットの処理順を認識すること
ができる。Barcode a may be read by moving the robot arm 21 so that the barcode position is irradiated with laser light, or by connecting the cassette station 20 to a rotating mechanism and rotating the cassette station 20. Alternatively, the barcode can be read by using an optical information processing device 42 installed not at the tip of the robot arm, but by reading the barcode pasted at position a-2 on the cassette. The optical information processing device 42 is connected to a storage device (not shown) that stores the processing order of the cassettes, and can recognize the processing order of the cassettes.
また、上記の実施例はカセットに貼着したバーコード等
の識別部により処理順を認識したが第２図に示すような
一処理工程をそれぞれ装置り、 Ｅのように１台の装置
で行う場合は、カセットステーション２０の＃！装位置
２２〜２７により処理順を認識してもよい。In addition, in the above embodiment, the processing order was recognized by the identification part such as a bar code attached to the cassette, but one processing step as shown in FIG. If so, # of cassette station 20! The processing order may be recognized by the mounting positions 22 to 27.
以上のカセットの認識手段を有した搬送方法の実施例の
他に予めカセットの処理順を記録しておいたものにカセ
ットの処理順を照合し１人の判断によって搬送してもよ
い事は言うまでもない。In addition to the above-mentioned embodiment of the transport method having a cassette recognition means, it goes without saying that the processing order of the cassettes may be checked against a record of the processing order of the cassettes in advance and the transport may be carried out at the discretion of one person. stomach.
また、ウェハの認識手段を有する搬送方法の実施例とし
て、ウェハの収納位置によりウェハの処理順を認識する
手段を有する搬送方法を実現する搬送装置の一実施例を
第４図（ａ）正面図、第４図（ｂ）断面図、第４図（Ｃ
）側面図を用いて説明する。即ち、ＡＳＩＣ対応で１カ
セツト内に複数品種のウェハが不順に設けられている場
合、同一品種を整理して取出す場合の実施例を説明する
。Further, as an embodiment of a transfer method having a wafer recognition means, an embodiment of a transfer apparatus that realizes a transfer method having a means to recognize the processing order of wafers based on the storage position of the wafer is shown in FIG. 4(a), a front view. , Fig. 4(b) sectional view, Fig. 4(C)
) Explain using a side view. That is, an embodiment will be described in which, when wafers of a plurality of types are arranged in a random order in one cassette in correspondence with ASIC, the same types of wafers are sorted and taken out.
第４図（ａ）、（ｂ）及び（Ｃ）においてカセット３０
は２本の支柱３２及び３２ （ａ）が底抜３１及び上板
３１（ａ）により固定され、２本の支柱３２及び３２
（ａ）にさん状に並設された棒状体３３から形成され、
棒状体３３で決定する１平面上にウェハＷが１枚収納さ
れる。支柱３２の後方先端に吸引装置（図示せず）に接
続された吸着口（図示せず）を設けたウェハ収納アーム
３４が上下駆動及び回転駆動機構３４ （ａ）に接続さ
れ、受は取りベルト３６により搬送されるウェハをウェ
ハ収納アーム３４で吸着できるようになっている。又、
支柱３２ （ａ）の前方にウェハ収納アーム３４と同様
に先端に吸引装置（図示せず）に接続された吸着口（図
示せず）を設けたウェハ取り出しアーム３５が上下駆動
及び回転駆動機構３５ （ａ）に接続され、吸着したウ
ェハを送り出しベルト３７上に搬送することができる。In FIGS. 4(a), (b) and (C), the cassette 30
The two columns 32 and 32 (a) are fixed by the bottom plate 31 and the upper plate 31 (a), and the two columns 32 and 32 (a) are fixed by the bottom plate 31 and the upper plate 31 (a).
(a) It is formed from rod-shaped bodies 33 arranged side by side in a sandwich shape,
One wafer W is stored on one plane determined by the rod-shaped body 33. A wafer storage arm 34, which has a suction port (not shown) connected to a suction device (not shown) at the rear end of the support column 32, is connected to the vertical drive and rotation drive mechanism 34 (a), and the receiving belt The wafer storage arm 34 can adsorb the wafer conveyed by the wafer 36. or,
In front of the support column 32 (a), a wafer take-out arm 35 having a suction port (not shown) connected to a suction device (not shown) at its tip, similar to the wafer storage arm 34, is driven vertically and rotated by a mechanism 35. (a), and can transport the attracted wafer onto the delivery belt 37.
前記のウェハ搬送装置は記憶装置に接続され、ウェハＷ
の収納場所であるカセット３０の収納段３３を記憶する
ことができ、それにより所望のウェハの収納場所からの
取り出し可能になっている。The wafer transport device is connected to a storage device, and the wafer W
The storage stage 33 of the cassette 30, which is the storage location of the wafer, can be memorized, thereby making it possible to take out a desired wafer from the storage location.
以北のような構成のウェハ搬送装置におけるつエバの搬
送方法を説明する。前処理の一工程におけるカセット納
収部にウェハが収納されたカセット３０を収納するとウ
ェハ取り出しアーム３５が上下駆動機構３５ （ａ）に
より上昇され、第１に処理すべきウェハＷが収納されて
いる目的の収納段に達すると、回転駆動機構３５ （ａ
）により軌道３５ （ｃ）を描いて取り出しアーム３５
がウェハＷの位置に達するように回転され、ウェハＷを
吸着した後再び軌道３５ （ｃ）を描いて逆に回転させ
、上下駆動機構３５ （ａ）により、送り出しベルト３
７の位置まで下降させる。取り出しアーム３５が送り出
しベルト３７に接触すると吸引を停止させ、ウェハＷは
送り出しベルト３７上に載置され、送り出しベルト３７
により処理装置に搬送される１以上のような動作を繰返
すことによりウェハの処理順を正しく処理を行う事がで
きる。A method of transporting a wafer in a wafer transport apparatus having the above configuration will be explained. When the cassette 30 containing wafers is stored in the cassette storage section in one of the pre-processing steps, the wafer take-out arm 35 is raised by the vertical drive mechanism 35 (a), and the wafer W to be processed first is stored. When the target storage stage is reached, the rotational drive mechanism 35 (a
) to draw the trajectory 35 (c) and remove the arm 35.
is rotated so as to reach the position of the wafer W, and after adsorbing the wafer W, it is rotated in the opposite direction again while drawing a trajectory 35 (c), and the feed belt 3 is rotated by the vertical drive mechanism 35 (a).
Lower it to position 7. When the take-out arm 35 contacts the delivery belt 37, the suction is stopped, the wafer W is placed on the delivery belt 37, and the delivery belt 37
By repeating one or more operations such as transporting the wafers to the processing apparatus, it is possible to process the wafers in the correct processing order.
処理装置で処理済のウェハは受は取りベルト３６により
搬送され収納アーム３４に吸着され、上下駆動機構３４
（ａ）により収納アーム３４を任意の空設まで上昇さ
せ、目的の段に達すると回転駆動機構３４ （ａ）によ
り軌道３４ （ｃ）を描くように回転させ、ウェハが収
納位置上に来た時、吸引を停止させ収納する。ウェハ収
納後回転駆動機構３４ （ａ）により軌道３４ （ｃ）
を描くよう逆に回転させ上下駆動機構３４ （ａ）によ
り収納アーム３４が受は取りベルト３６に接するまで下
降させる０以上のような動作を反復することによりウェ
ハを順次所定の順番になるよう収納することができる。The wafers that have been processed in the processing device are conveyed by a pick-up belt 36 and attracted to the storage arm 34, and then moved to the vertical drive mechanism 34.
The storage arm 34 is raised to an arbitrary empty position by (a), and when it reaches the target stage, the rotational drive mechanism 34 (a) is rotated to trace the trajectory 34 (c), and the wafer is placed above the storage position. At this time, stop suction and store. After storing the wafer, the rotational drive mechanism 34 (a) moves the orbit 34 (c)
The wafers are sequentially stored in a predetermined order by repeating 0 or more operations in which the storage arm 34 is rotated in the opposite direction as shown in FIG. can do.
以上ウェハの処理順が狂わないように順次カセット収納
段からの取り出し収納について説明したが抜き取り検査
等任意の収納段へのウェハの収納及び取り出し操作が出
来ることは言うまでもない。Although the explanation has been given above about sequentially taking out and storing wafers from the cassette storage stages so as not to disturb the processing order of the wafers, it goes without saying that wafers can be stored and taken out from any storage stage, such as for sampling inspection.
以上説明したウェハ収納位置による処理順認識手段を用
いた搬送方法の他に、各処理装置において、バーコード
や複数の小孔を穿孔し、その位置の組合せ等のウェハ上
の識別部に光情報処理装置等を用いてレーザ光を照射し
、ウェハの識別を行いウェハの搬送を行ってもよい。In addition to the transport method using the processing order recognition means based on the wafer storage position described above, in each processing device, a bar code or multiple small holes are punched, and optical information is sent to the identification part on the wafer such as the combination of the positions. A processing device or the like may be used to irradiate the wafer with laser light, identify the wafer, and transport the wafer.
［発明の効果］
本発明によればカセット及びウェハに認識される識別部
を設けたため、ウェハの順次なされる処理工程において
ウェハの処理順を狂わせることなく正しい順番で処理す
ることができる。そのため処理装置中でのウェハの破損
が起った時、抜き取り検査で順番が欠番した場合等でも
カセットの収納段に重複して収納したり抜けがあったり
することなく順次搬送できる。又、製造中不都合があっ
た場合でもウェハの経歴がわかるので好適な処理を行う
ことができる。[Effects of the Invention] According to the present invention, since the cassette and the wafer are provided with an identification portion that can be recognized, it is possible to process the wafers in the correct order without disrupting the processing order in the sequential processing steps of the wafers. Therefore, even if wafers are damaged in the processing equipment, or if a number is missing in a sampling inspection, the wafers can be sequentially transported without being duplicated or missing in the storage stage of the cassette. Further, even if there is a problem during manufacturing, the history of the wafer can be known, so appropriate processing can be carried out.
又、ウェハの処理順を知ると同時にウェハの処理順を変
更したい時あるいはカセットの所望の位置に収納したい
時でも自由に変更することができる。Further, even if the wafer processing order is known and the wafer processing order is desired to be changed, or when the wafers are stored in a desired position in the cassette, the wafer processing order can be changed freely.
第１図（ａ）及び（ｂ）は本発明に係るウェハ及びカセ
ットの一実施例を示す図、第２図及び第３図はそれぞれ
カセット搬送方法の一実施例を示す図、第４図（ａ）、
（ｂ）及び（ｃ）はそれぞれ本発明のウェハ搬送方法に
用いられる一実施例を示す図である。
１．１１．３０・・・・・カセット
２０■・ｅ１１１１ウェハ
４．４１．４２・・・・・光情報処理装置５・・・・・
反射板
２０・・・・・カセットステーション
２１・・・・・ロボットアーム
２２〜２７・・・・・カセット載置位置３２．３２ （
ａ）・・・・・支柱
３３・・・・・棒状体
３４・・・・・収納アーム
３５・・・・・取り出しアーム
３４ （ａ ）、３５（ａ）・・・・上下及び回転慄動
機構３４（ｃ）、３５（ｃ）・・・・・軌道３６・・・
・・受は取りベルト
３７・・・・・送り出しベルト
ａ、ａ−１、ａ＋２■■ｅ・嶋・バーコ、ドａ′・・・
・・小孔穿孔板
Ａ、Ｂ、Ｃ，Ｄ、Ｅ・・・・・・処理装置代理人 弁理
士 守 谷 −雄
第 １ 図
ｆａ） （ｂ
ｌ第 ２ 図
弓
第３図1(a) and (b) are diagrams showing an embodiment of the wafer and cassette according to the present invention, FIGS. 2 and 3 are diagrams each showing an embodiment of the cassette transport method, and FIG. a),
(b) and (c) are diagrams each showing an embodiment used in the wafer transport method of the present invention. 1.11.30... Cassette 20 ■ e1111 wafer 4.41.42... Optical information processing device 5...
Reflector plate 20...Cassette station 21...Robot arms 22-27...Cassette mounting position 32,32 (
a)...Strut 33...Bar-shaped body 34...Storage arm 35...Takeout arm 34 (a), 35(a)...Vertical and rotational movement Mechanisms 34(c), 35(c)...Trajectory 36...
...Receiver belt 37...Feeding belt a, a-1, a+2■■e, Shima, barco, door a'...
・・Small hole perforated plates A, B, C, D, E・・・Processing device agent Patent attorney Yu Moritani 1 Figure fa) (b
lFigure 2 Bow figure 3
Claims (1)
ハを順次前処理する工程において、所定の順番によって
処理することを特徴とするウェハ搬送方法。 ２、前記カセットは認識される識別部を有し、該識別部
を各処理工程内に設けた認識手段により認識することを
特徴とする特許請求の範囲第１項記載のウェハ搬送方法
。 ３、前記ウェハは認識される識別部を有し、各処理工程
内に設けた認識手段によって認識することを特徴とする
特許請求の範囲第１項記載のウェハ搬送方法。 ４、２本の支柱の各々からさん状に並設された複数の棒
状体から成り、且つ相異なる支柱の前記棒状体はそれぞ
れ対をなしウェハを載置可能としたカセットと、垂直機
構及び回転機構を備え且つ先端部に吸着口を有する２本
の搬送アームであって、回転時に前記支柱に接触しない
位置に配置された前記アームにより所望の位置のウェハ
を取り出し且つ所望の位置にウェハを収納することを特
徴とする特許請求の範囲第１項記載のウェハ搬送方法。[Scope of Claims] 1. A wafer transport method, characterized in that in the step of sequentially preprocessing a plurality of wafers stored in a plurality of cassettes, the wafers are processed in a predetermined order. 2. The wafer transport method according to claim 1, wherein the cassette has an identification section that is recognized, and the identification section is recognized by recognition means provided in each processing step. 3. The wafer transport method according to claim 1, wherein the wafer has an identification part that is recognized and is recognized by recognition means provided in each processing step. 4. It consists of a plurality of rod-like bodies arranged side by side in a sandwich shape from each of two pillars, and each of the rod-like bodies of different pillars is paired with a cassette on which a wafer can be placed, a vertical mechanism, and a rotating mechanism. Two transfer arms equipped with a mechanism and having a suction port at the tip, which are arranged in a position that does not contact the support when rotating, take out a wafer at a desired position and store the wafer at a desired position. A wafer transport method according to claim 1, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32892187A JP2610918B2 (en) | 1987-12-25 | 1987-12-25 | Method and apparatus for treating object |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32892187A JP2610918B2 (en) | 1987-12-25 | 1987-12-25 | Method and apparatus for treating object |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01170013A true JPH01170013A (en) | 1989-07-05 |
| JP2610918B2 JP2610918B2 (en) | 1997-05-14 |
Family
ID=18215579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32892187A Expired - Lifetime JP2610918B2 (en) | 1987-12-25 | 1987-12-25 | Method and apparatus for treating object |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2610918B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0410089A (en) * | 1990-04-27 | 1992-01-14 | Hitachi Ltd | Method and device for identifying id code |
| US6467186B2 (en) | 1990-08-29 | 2002-10-22 | Hitachi, Ltd. | Transferring device for a vacuum processing apparatus and operating method therefor |
| JP2007139763A (en) * | 2005-11-18 | 2007-06-07 | Paikomu Corp | Inspection system for display panel |
| USRE39756E1 (en) | 1990-08-29 | 2007-08-07 | Hitachi, Ltd. | Vacuum processing operating method with wafers, substrates and/or semiconductors |
| USRE39776E1 (en) | 1990-08-29 | 2007-08-21 | Hitachi, Ltd. | Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors |
| JP2013229412A (en) * | 2012-04-25 | 2013-11-07 | Fuji Mach Mfg Co Ltd | Wafer management system of die feeding device and attachment and magazine rack |
| JP2021509881A (en) * | 2018-01-04 | 2021-04-08 | 北京京▲東▼尚科信息技▲術▼有限公司Ｂｅｉｊｉｎｇ Ｊｉｎｇｄｏｎｇ Ｓｈａｎｇｋｅ Ｉｎｆｏｒｍａｔｉｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．， Ｌｔｄ． | Parcel identification device and parcel sorting device |
| CN114408452A (en) * | 2022-01-27 | 2022-04-29 | 苏州赛美特科技有限公司 | Wafer conveying method and device, electronic equipment and storage medium |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5228274A (en) * | 1975-08-29 | 1977-03-03 | Hitachi Ltd | Containing method of wafer to magazine |
| JPS5437471A (en) * | 1977-08-29 | 1979-03-19 | Toshiba Corp | Code reading device for wafer |
| JPS5812938U (en) * | 1981-07-20 | 1983-01-27 | 日本電気ホームエレクトロニクス株式会社 | semiconductor wafer |
| JPS58133935U (en) * | 1982-03-02 | 1983-09-09 | 三菱電機株式会社 | Magazine for semiconductor wafer storage |
-
1987
- 1987-12-25 JP JP32892187A patent/JP2610918B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5228274A (en) * | 1975-08-29 | 1977-03-03 | Hitachi Ltd | Containing method of wafer to magazine |
| JPS5437471A (en) * | 1977-08-29 | 1979-03-19 | Toshiba Corp | Code reading device for wafer |
| JPS5812938U (en) * | 1981-07-20 | 1983-01-27 | 日本電気ホームエレクトロニクス株式会社 | semiconductor wafer |
| JPS58133935U (en) * | 1982-03-02 | 1983-09-09 | 三菱電機株式会社 | Magazine for semiconductor wafer storage |
Cited By (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0410089A (en) * | 1990-04-27 | 1992-01-14 | Hitachi Ltd | Method and device for identifying id code |
| US6634116B2 (en) | 1990-08-09 | 2003-10-21 | Hitachi, Ltd. | Vacuum processing apparatus |
| US6662465B2 (en) | 1990-08-29 | 2003-12-16 | Hitachi, Ltd. | Vacuum processing apparatus |
| USRE39776E1 (en) | 1990-08-29 | 2007-08-21 | Hitachi, Ltd. | Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors |
| US6487793B2 (en) | 1990-08-29 | 2002-12-03 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
| US6487794B2 (en) | 1990-08-29 | 2002-12-03 | Hitachi, Ltd. | Substrate changing-over mechanism in vacuum tank |
| US6487791B2 (en) | 1990-08-29 | 2002-12-03 | Hitachi, Ltd. | Vacuum processing apparatus |
| US6490810B2 (en) | 1990-08-29 | 2002-12-10 | Hitachi, Ltd. | Vacuum processing apparatus |
| US6499229B2 (en) | 1990-08-29 | 2002-12-31 | Hitachi, Ltd. | Vacuum processing apparatus |
| US6505415B2 (en) | 1990-08-29 | 2003-01-14 | Hitachi, Ltd. | Vacuum processing apparatus |
| US6588121B2 (en) | 1990-08-29 | 2003-07-08 | Hitachi, Ltd. | Vacuum processing apparatus |
| US6625899B2 (en) | 1990-08-29 | 2003-09-30 | Hitachi, Ltd. | Vacuum processing apparatus |
| US6473989B2 (en) | 1990-08-29 | 2002-11-05 | Hitachi, Ltd. | Conveying system for a vacuum processing apparatus |
| US6655044B2 (en) | 1990-08-29 | 2003-12-02 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
| US6467186B2 (en) | 1990-08-29 | 2002-10-22 | Hitachi, Ltd. | Transferring device for a vacuum processing apparatus and operating method therefor |
| US6880264B2 (en) | 1990-08-29 | 2005-04-19 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
| USRE39756E1 (en) | 1990-08-29 | 2007-08-07 | Hitachi, Ltd. | Vacuum processing operating method with wafers, substrates and/or semiconductors |
| US6904699B2 (en) | 1990-08-29 | 2005-06-14 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
| US6968630B2 (en) | 1990-08-29 | 2005-11-29 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
| US7367135B2 (en) | 1990-08-29 | 2008-05-06 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
| US6886272B2 (en) | 1990-08-29 | 2005-05-03 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
| US6484414B2 (en) | 1990-08-29 | 2002-11-26 | Hitachi, Ltd. | Vacuum processing apparatus |
| USRE39775E1 (en) | 1990-08-29 | 2007-08-21 | Hitachi, Ltd. | Vacuum processing operating method with wafers, substrates and/or semiconductors |
| USRE39824E1 (en) | 1990-08-29 | 2007-09-11 | Hitachi, Ltd. | Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors |
| USRE39823E1 (en) | 1990-08-29 | 2007-09-11 | Hitachi, Ltd. | Vacuum processing operating method with wafers, substrates and/or semiconductors |
| JP2007139763A (en) * | 2005-11-18 | 2007-06-07 | Paikomu Corp | Inspection system for display panel |
| JP2013229412A (en) * | 2012-04-25 | 2013-11-07 | Fuji Mach Mfg Co Ltd | Wafer management system of die feeding device and attachment and magazine rack |
| JP2021509881A (en) * | 2018-01-04 | 2021-04-08 | 北京京▲東▼尚科信息技▲術▼有限公司Ｂｅｉｊｉｎｇ Ｊｉｎｇｄｏｎｇ Ｓｈａｎｇｋｅ Ｉｎｆｏｒｍａｔｉｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．， Ｌｔｄ． | Parcel identification device and parcel sorting device |
| CN114408452A (en) * | 2022-01-27 | 2022-04-29 | 苏州赛美特科技有限公司 | Wafer conveying method and device, electronic equipment and storage medium |
| CN114408452B (en) * | 2022-01-27 | 2023-08-04 | 赛美特科技有限公司 | Wafer conveying method and device, electronic equipment and storage medium |
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| Publication number | Publication date |
|---|---|
| JP2610918B2 (en) | 1997-05-14 |
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