JPH01155667U - - Google Patents
Info
- Publication number
- JPH01155667U JPH01155667U JP5335188U JP5335188U JPH01155667U JP H01155667 U JPH01155667 U JP H01155667U JP 5335188 U JP5335188 U JP 5335188U JP 5335188 U JP5335188 U JP 5335188U JP H01155667 U JPH01155667 U JP H01155667U
- Authority
- JP
- Japan
- Prior art keywords
- lead array
- leads
- substrate
- insulating holder
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 3
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図及び第２図は本考案リード配列体の一つ
の実施例を説明するためのもので、第１図はリー
ド配列体の斜視図、第２図はリード配列体が取り
付けられた回路基板を示す断面図、第３図は本考
案リード配列体の別の実施例を示す斜視図、第４
図は従来例の斜視図、第５図は問題点を示す断面
図である。
符号の説明、１，１ａ……リード配列体、２，
２ａ……リード、３……絶縁性保持体、４……抜
け止め用係止部、５……基板、９……抜け止め用
係止部。
Figures 1 and 2 are for explaining one embodiment of the lead array of the present invention. Figure 1 is a perspective view of the lead array, and Figure 2 is a circuit board to which the lead array is attached. FIG. 3 is a perspective view showing another embodiment of the lead array of the present invention; FIG.
The figure is a perspective view of a conventional example, and FIG. 5 is a sectional view showing a problem. Explanation of symbols, 1, 1a...read array, 2,
2a... Lead, 3... Insulating holder, 4... Locking part for preventing slipping off, 5... Board, 9... Locking part for preventing slipping off.
Claims (1)
平行に保持したリード配列体において、 一部のリード若しくは絶縁性保持体に、リード
配列体を他の基板に取り付けたとき該基板に係止
する係止部を設けてなる ことを特徴とするリード配列体。[Scope of claim for utility model registration] In a lead array in which a plurality of leads are held substantially in parallel by one insulating holder, the lead array is attached to some of the leads or the insulating holder and to other substrates. 1. A lead array body comprising a locking portion that locks onto the substrate when the lead array is connected to the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5335188U JPH01155667U (en) | 1988-04-19 | 1988-04-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5335188U JPH01155667U (en) | 1988-04-19 | 1988-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01155667U true JPH01155667U (en) | 1989-10-25 |
Family
ID=31279334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5335188U Pending JPH01155667U (en) | 1988-04-19 | 1988-04-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01155667U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06188035A (en) * | 1992-12-15 | 1994-07-08 | Tokai Rika Co Ltd | Connector for printed circuit board |
-
1988
- 1988-04-19 JP JP5335188U patent/JPH01155667U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06188035A (en) * | 1992-12-15 | 1994-07-08 | Tokai Rika Co Ltd | Connector for printed circuit board |