JPH01140081A - Testing method and apparatus - Google Patents

Abstract

PURPOSE:To automate the insertion and withdrawal of an IC with respect to a burn-in apparatus, by arranging the socket brought into contact with the IC on a rail in a movable manner and applying voltage and a signal to the IC. CONSTITUTION:The power supply line provided to the inside 3 of a rail 1 is electrically connected to the contact brush 10 of a socket board 4 continuously and an IC 12 is connected to each line. Therefore, the IC 12 is fed through a high temp. tank 19 to receive the supply of a power supply. That is, the power supply and a signal are inputted to the IC 12 and the output from the IC 12 is performed corresponding to the socket number signals from the first and second pattern generators 22, 24 to be displayed on the first and second monitor parts 26, 27. By this method, the IC 12 is monitored while successively fed to pass through a U-turn part 20 and subjected to a burn-in test to be cooled by a cooler 21. After feed-out, the IC 12 is taken out from the socket of the board 4, and a good product and an inferior product are sorted on the basis of the monitor result.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a test technique for electronic components, and particularly to a technique effective for use in burn-in tests of semiconductor devices.

[Conventional technology]

Regarding the burn-in test, please refer to the July issue of Sem1condu.
ctorWorld August 1987 issue'' (published July 20, 1987).

The outline of the test is to insert a test board into which a semiconductor device (hereinafter referred to as an IC) is inserted into a burn-in test equipment, create an atmosphere at a predetermined temperature, apply voltage and clock to the IC through the test board, and perform an initial failure. This eliminates good products.

[Problem that the invention seeks to solve]

This is described in the above-mentioned literature as a problem for FA.

The problem is that dozens of test boards are inserted each time a test is performed, and the mechanical strength of the connector is not very high. It points out problems such as early damage to the connector.

-) The problem is that it is a process that is difficult to automate.

An object of the present invention is to automate the insertion and removal of an IC into a burn-in device during a burn-in test.

Another object of the present invention is to simplify the work of inserting and removing a test board into a burn-in device.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means for solving problems]

A brief overview of typical inventions disclosed in this application is as follows.

Y Narichi, install a rail inside the heating part of the burn-in device,
A socket in contact with the IC is movably arranged on the rail and provided within the rail. It is used to apply voltages and signals to the socket (IC) from a signal line for applying voltages and signals.

[Effect]

According to the above-described means, when the IC is inserted into the socket on the rail, the socket itself is automatically transported into the heating section of the burn-in device and subjected to a burn-in test. Thereafter, the IC is removed from the burn-in device and taken out from the socket. Therefore, the insertion and removal of ICs into the burn-in device can be automated.

Also, insert the IC into the socket or remove the IC from the socket.
This simplifies the work of inserting and removing the test board into and out of the burn-in device, since it is only necessary to remove the test board and there is no need to insert or remove the test board into or out of the burn-in device.

〔Example〕

FIG. 1 shows the I of a burn-in device which is an embodiment of the present invention.
It shows the rail for C transportation and the socket that contacts the IC.
It is a partially fragmented side view.

FIG. 2 is a schematic perspective view showing the appearance of a burn-in device that is an embodiment of the present invention.

In FIG. 1, reference numeral 1 denotes a rail, which has a substantially concave cross section and is used to guide and convey a socket that comes into contact with an IC, which will be described later. A recess 2 is formed in the side surface of the rail 1 in the longitudinal direction (thickness direction in the drawing), and is used to guide the movement of a bearing that is indirectly attached to a socket, which will be described later. Also,
This rail 1 has a signal input line and a power supply line to an IC, which will be described later, on the inside 3 (an open part different from the recess 2).

A ground line for the IC and an output line from the IC are formed along its length (not shown).

A plurality of these rails 1 are arranged in an endless manner in a burn-in device to be described later. 4 is a socket board, which is a plate-shaped object that is slightly larger than the size on which one IC (to be described later) can be mounted, and is formed from a printed circuit board base material;
5 is for placing a socket to be described later and ensuring electrical continuity between the inside 30 portion of the rail 1 and the socket.
These bearings are attached to both sides of the socket board 4 (both sides in the longitudinal direction of the rail 1) so as to be rotatable in the longitudinal direction of the rail 1 via a shaft 6, and enter the recess 2 of the rail 1 to prevent the movement of the socket board 4. It is intended to guide you. A plurality of the first bearings 5 are attached to the socket board 4 depending on the size of the socket placed on the socket board 4. 7 is a second bearing, which is attached to the lower surface of the socket board 4 (the part facing the inner side 3 of Ray/l/1);
This is to support the socket board 4 at a predetermined height with respect to the rail l, and to guide the movement of the socket board 4. A shaft 8 is used to rotatably support the second bearing 7 with respect to the longitudinal direction of the rail 1, and is attached to the lower surface of the socket board 4 by a stay 9. A plurality of contact brushes 10 are attached to the lower surface of the socket board 4, and are electrically connected to a signal input line, a power supply line, a ground line, an output line, etc. (not shown) provided on the inner side 3 of the rail 1. It is for. Reference numeral 11 denotes a socket, which has contact pins (not shown) that electrically contact the IC, corresponding to individual leads of the IC, which will be described later.
The contact pin is covered with an insulating resin so that contact between the contact pin and the contact pin can be made reliably and smoothly. This socket 11 is attached to the main surface of the socket board 4 (on the side opposite to the surface on which the first and second bearings 5 and 7 are attached), and the contact pins (not shown) and the contact brush 10 are attached to the socket board 4. It is electrically connected via a wiring pattern (not shown) or the like. Therefore, the IC inserted into the socket 11 is electrically connected to the signal line of the rail 1, etc. 12 is an IC, and in this embodiment, it is a DI with leads protruding from two sides of the package, which will be described later.
It shows an L (dual in line) type IC. A package 13 is a rectangular parallelepiped-shaped package in which the main part of the ICI 2 (around the element mounting part) is covered with an insulating resin. 14 is a lead, which is used to ensure continuity between the inside (element) of the IC 12 and the outside.
It protrudes from two sides of the package 13. 15 is an electronic component that constitutes the protection circuit of ICI 2,
It is attached to the socket 11 mounting surface side of the socket board 4. 16 is a stay.

This is for supporting the rail 1. In this embodiment, a large number of socket boards 4 shown in FIG. 1 are prepared with two types of sockets 12 mounted thereon.

In FIG. 2, reference numeral 17 indicates a burn-in device which is an embodiment of the present invention. 18 is a preheating section as part of the heating section, which heats the IC to a predetermined temperature (once during the burn-in test).
A hot air heater, a nichrome wire heater, etc. (not shown) are incorporated in the heating part. Reference numeral 19 denotes a high-temperature bath as part of the heating section, which maintains the IC at a predetermined temperature, and incorporates a nichrome wire heater (not shown) and the like. Reference numeral 20 denotes a U-turn section, where the IC is conveyed by making a U-turn. Reference numeral 21 denotes a cooling section, which is used to gradually cool down the IC after the burn-in test, and is provided with a cooling fan, etc. (not shown). Here, the purpose of gradually cooling the IC is because if the IC is cooled rapidly, the element may be destroyed due to thermal shock, and the same can be said when heating. By the way, the rail l shown in FIG. 1 has a preheating section 18. High temperature tank 19, tJ turn part 2
Two of them are hung in the 0° cooling section 21 in an endless manner.

For these two rails 1, there are two types of sockets 12.
The socket board 4 on which is mounted is placed separately on the outer and inner rails. That is, different types of ICs are burn-in tested on the outer and inner rails. By the way, the RENO-1 has a preheating section 18.
．． High temperature bath19. In the cooling part 21, the arrangement is meandering in the horizontal direction. This is to reduce the length of the burn-in device 17 as much as possible, and to pack a large number of ICs into the burn-in device 17. 22 is a first pattern generator, which generates a signal that can be imaged for ICK. The output from here is the two rails l.
Among them, the outer rail 10 is sent to a signal input line (not shown). In other words, the first pattern generator 22 generates a signal to be applied to the IC that is passed along the outer rail 1. A first power supply 23 is a power supply for the first pattern generator 22. 24 is the second
This is a pattern generator of the two rails 1, which generates a signal to be given to the IC flowing through the inner rail 1, and the output from this is sent to the signal input line (not shown) of the inner rail 10. This is a second power source, and is a power source for the second pattern generator 24. Reference numeral 26 denotes a first monitor section, which is electrically connected to an output line (not shown) of the outer rail 1 of the two rails 1, and monitors the output from each IC (IC's) flowing through the outer rail 1. The output indicating whether the function is normal or not is monitored by a light emitting diode (not shown) or the like. 27 is a second monitor section, which is electrically connected to an output line (not shown) of the inner rail 10 of the two rails 1, and outputs from individual ICs (not shown) flowing through the inner rail 1. With light emitting diodes, etc.
It will be monitored.

Here, per K to monitor the output from each individual IC,
First, each socket board 4K and socket number are encoded. Furthermore, the socket board is provided with a circuit (not shown) that sends out the output of the IC when it matches the socket number signal from the pattern generator, and otherwise becomes high impedance. On the other hand, from the pattern generator side, a signal for sequentially generating socket numbers is repeatedly sent.

That is, according to the above-mentioned configuration, it is possible to take out the output of the IC mounted on the socket board that corresponds to the socket number signal from the pattern generator, and even on one rail, it is possible to extract the output of the IC mounted on the socket board. The output can be extracted separately, and this is the first monitor section 2.
6 and the second monitor unit 27. Reference numeral 28 denotes a temperature adjustment section, which is a section that adjusts the temperature of the preheating section 18, the high temperature tank 19, and the like.

By the way, in this embodiment, the IC is aged without being moved along with the socket board on the rail 1.
To move the socket board, use a motor board (not shown) similar to the socket board with a built-in motor.
The power for the motor is taken from the power line provided on the rail.

Here, the setting of the burn-in test time depends on the moving speed of the socket board, but is adjusted by the gear ratio of the motor of the motor board (not shown), etc.

In the burn-in device 17 of this embodiment, the IC before the burn-in test is inserted into the socket of the socket board from the preheating section 18 side, passes through the preheating section 18, enters the high temperature tank 19, and the burn-in test is completed. The IC is transported along with the socket board from the cooling section 21 side, and after being transported, the IC is taken out from the socket.

Hereinafter, the operation of one embodiment of the present invention having the above-described structure will be explained.

First, in FIG. 1, the ICIs 2 before the burn-in test are inserted into the sockets 11 of the socket board 4, which has been set in advance on the rail l. This is shown in FIG. Of the two rails 1, the socket of the socket board set on the outer rail (not shown) and the socket of the socket board set on the inner rail (not shown)
(not shown), different types of ICs will be inserted, and the socket board will be transported at a transport speed corresponding to the type (speed to obtain a burn-in test time corresponding to the AT type). In the following explanation, the types of special ICs will not be distinguished because the transport route passes through the same portion.

The IC inserted into the socket of the socket board is pushed together with the socket board by a motor board (not shown).
One by one or a plurality of pieces are transported into the preheating section 18 and gradually heated to a predetermined temperature by a hot air heater or a nichrome wire heater (not shown). At this time, the IC (socket board) is heated while being transported.
The ICs before the burn-in test are sequentially inserted into the sockets of the socket board and transported under the internal pressure of the preheating section 18. Thereafter, the IC is transported into a high temperature bath 19 and continuously transported while being maintained at a predetermined temperature. During this transportation, the power supply line, ground line, signal input line, and output line (not shown) provided on the inside 3 of the rail 1 in FIG. 1 continue to be electrically connected to the contact brush 10 of the socket board 4, and the I
CI 2 will be electrically connected to each of the lines mentioned above.

Therefore, while the IC is being transported within the high temperature bath 19, power is supplied and signals are input. That is, while the IC is being transported in the high temperature bath 19, power and signals are input, and in response to the socket number signals from the first and second pattern generators 22 and 24, the output from the IC corresponding to that number is and is displayed on the first and second monitor sections 26 and 27. Like this K, the first and second
A socket number signal is sequentially output from the putter y generator, and the output of each IC is monitored.

In this way, the ICs are monitored while being transported one by one.
It passes through the U-turn section, undergoes a burn-in test for a predetermined period of time, is gradually cooled down by the cooling section 21, and is transported out. After unloading,
The IC is taken out from the socket of the socket board, and based on the monitoring results, good products and defective products are sorted out.

By the way, in this example, the structure was designed to allow two types of ICs to flow, but it is also possible to have more than two types of ICs (three or more rails). By simply replacing the burn-in device, a single burn-in device can be used for a wide variety of products.

Furthermore, in this embodiment, the socket board is transported by pushing a motor board similar to the socket board, but it may also be carried by pushing a claw attached to a chain or the like, and various transport methods are possible. .

Furthermore, to ensure continuity between the socket board and the rail,
Although a contact brush was used in this embodiment, other brushes may be used.

Regarding the IC, in this embodiment, the case where a DIL type IC was applied was explained, but it is also possible to use a QF (quad flat) type IC or an LCc (leadless chip).
The present invention can also be applied to ICs of different shapes, such as carrier type ICs, by simply replacing the socket board (including the socket).

(1) A rail is provided inside the heating section of the burn-in device, and the IC
By placing the socket in contact with the socket so that it can move on the rail, and applying voltage and signals to the socket (work C) from the signal line provided on the rail for applying voltage and signals, the IC is The burn-in test can be performed while moving, and the insertion and removal of ICs into and from the burn-in device can be automated.

(2) Provide a rail inside the heating section of the burn-in device, and
A burn-in test can be performed while moving the IC by arranging a socket in contact with the IC so as to be movable on a rail and applying voltages and signals to the socket (IC) from a signal line provided on the rail. Therefore, the burn-in test can be performed continuously and the burn-in test can be performed efficiently.

(3) Provide a rail inside the heating section of the burn-in device, and
A burn-in test can be performed while moving the IC by arranging the socket in contact with the IC so that it can be moved on the rail, and applying voltage and signals to the socket (IC) from the signal line provided on the rail. Since the insertion and removal of ICs into and from the burn-in device can be automated, the effect of simplifying the burn-in work is lost.

(4) A plurality of rails are provided in the heating section of the burn-in device, a plurality of types of sockets in contact with the IC are movably arranged on the individual rails, and the conveyance speed is adjusted to obtain a desired burn-in time. Furthermore, by applying voltages and signals to the socket (IC) from the signal line provided on the rail, it is possible to perform burn-in tests on a plurality of types of ICs at the same time using the same device.

(5) Provide a rail inside the heating section of the burn-in device, and
A socket in contact with the rail is arranged so as to be movable on the rail, and a part of the rail is pressurized so that it can be removed. Furthermore, by applying voltages and signals to the socket (IC) from the signal line provided on the rail, it is possible to perform burn-in tests on various types of IC by replacing the socket.

Although the invention made by the present inventor has been specifically explained based on Examples above, the present invention is not limited to the above-mentioned Examples, and it is understood that various changes can be made without departing from the gist of the invention. Needless to say.

In the above description, the invention made by the present inventor is mainly applied to the burn-in technology of semiconductor devices, which is the background field of application, but the invention is not limited thereto.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this w1 is as follows.

That is, a rail is provided in the heating section of the burn-in device,
A socket in contact with an IC is movably arranged on a rail, and a signal line provided on the rail is connected to a socket) (IC).
), it is possible to automate the insertion and removal of ICs into and from the burn-in equipment and perform continuous burn-in tests.

[Brief explanation of the drawing]

FIG. 1 shows an IC of a burn-in device which is an embodiment of the present invention.
FIG. 2 is a partially exploded side view showing a rail for transporting the IC and a socket in contact with the IC. FIG. 2 is a schematic perspective view showing the appearance of an aging device that is an embodiment of the present invention. 1...Rail, 2...Recess, 3...Inside, 4...
・Socket board, 5...first bearing, 6.8
...Shaft, 7...Second bearing, 9.16
... Stay, 10... Contact glove, 11...
・Socket, 12...IC113...Package,
14... Lead, 15... Electronic component, 17... Burn-in device, 18... Preheating section, 19... High temperature tank, 20... U-turn section, 21... Cooling section, 22・
...First pattern generator. 23... First power supply, 24... Second pattern generator, 25... Second power supply, 26... First monitor section, 27... Second monitor section % 28. ...Temperature adjustment section. Agent Masu Burial Officer Katsuo Ogawa

Claims (1)

[Scope of Claims] 1. A test method for testing electronic components, characterized in that the test is carried out while moving a socket electrically connected to the electronic component on a rail. 2. The testing method according to claim 1, wherein the electronic component is a semiconductor device. 3. The test method according to claim 1, wherein the test is a burn-in test for eliminating initial defective products. 4. A testing device for testing electronic components, characterized in that it is provided with a socket for transporting the electronic component and a rail for moving the socket electrically connected to the electronic component. 5. The test device according to claim 4, wherein the electronic component is a semiconductor device. 6. The testing apparatus according to claim 4, wherein the test is a burn-in test for eliminating initial defective products.