JPH01112535U - - Google Patents
Info
- Publication number
- JPH01112535U JPH01112535U JP755488U JP755488U JPH01112535U JP H01112535 U JPH01112535 U JP H01112535U JP 755488 U JP755488 U JP 755488U JP 755488 U JP755488 U JP 755488U JP H01112535 U JPH01112535 U JP H01112535U
- Authority
- JP
- Japan
- Prior art keywords
- movable contact
- lead wires
- insulating substrate
- insulating
- insulating cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims 1
- 229910000743 fusible alloy Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
Landscapes
- Thermally Actuated Switches (AREA)
Description
第１図はこの考案に係る温度ヒユーズの一実施
例を示す縦断面図、第２図は第１図の温度ヒユー
ズの動作後の縦断面図である。第３図及び第４図
は第１図の温度ヒユーズの可動接点を示す平面図
及び縦断面図である。第５図及び第６図は従来の
可溶合金型及び感温ペレツト型の温度ヒユーズを
示す縦断面図である。
２１……絶縁基板、２２，２２……リード線、
２３……絶縁キヤツプ、２４……可動接点、２５
……バネ。
FIG. 1 is a longitudinal sectional view showing an embodiment of the temperature fuse according to this invention, and FIG. 2 is a longitudinal sectional view of the temperature fuse of FIG. 1 after operation. 3 and 4 are a plan view and a longitudinal sectional view showing the movable contacts of the temperature fuse shown in FIG. 1. 5 and 6 are vertical sectional views showing conventional fusible alloy type and thermosensitive pellet type temperature fuses. 21... Insulating board, 22, 22... Lead wire,
23... Insulating cap, 24... Movable contact, 25
……Spring.
Claims (1)
縁基板を気密に封止し、この絶縁基板に適当な間
隔を有して２本のリード線を貫通して気密に封止
すると共に、上記絶縁キヤツプ内に上記両リード
線上に載架する可動接点をその周縁部を絶縁キヤ
ツプの内周面に摩擦係合して摺動自在に配置し、
更に、この可動接点と絶縁基板との間に形状復元
力によつて可動接点を両リード線から開離させる
形状記憶合金からなるバネを変形して配置したこ
とを特徴とする温度ヒユーズ。 An insulating substrate is hermetically sealed in the open end of an insulating cap with an open bottom at one end, and two lead wires are passed through the insulating substrate at an appropriate interval and hermetically sealed. A movable contact mounted on both lead wires is slidably disposed in the insulating cap with its peripheral edge frictionally engaged with the inner circumferential surface of the insulating cap,
The temperature fuse further comprises a deformed spring made of a shape memory alloy that separates the movable contact from both lead wires by a shape restoring force between the movable contact and the insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP755488U JPH01112535U (en) | 1988-01-22 | 1988-01-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP755488U JPH01112535U (en) | 1988-01-22 | 1988-01-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01112535U true JPH01112535U (en) | 1989-07-28 |
Family
ID=31212657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP755488U Pending JPH01112535U (en) | 1988-01-22 | 1988-01-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01112535U (en) |
-
1988
- 1988-01-22 JP JP755488U patent/JPH01112535U/ja active Pending
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