JPH01118352U - - Google Patents
Info
- Publication number
- JPH01118352U JPH01118352U JP1140688U JP1140688U JPH01118352U JP H01118352 U JPH01118352 U JP H01118352U JP 1140688 U JP1140688 U JP 1140688U JP 1140688 U JP1140688 U JP 1140688U JP H01118352 U JPH01118352 U JP H01118352U
- Authority
- JP
- Japan
- Prior art keywords
- dew condensation
- comb
- condensation sensor
- shaped electrodes
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005494 condensation Effects 0.000 claims description 5
- 238000009833 condensation Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
Landscapes
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Description
第１図は、本考案の実施例を示す結露センサを
シヤーシから取り外した状態の斜視図、第２図は
、同実施例を示す結露センサをシヤーシに取り付
けた状態の一部縦断側面図、第３図は、従来例を
示す結露センサをシヤーシから取り外した状態の
斜視図、第４図は、同従来例を示す結露センサを
シヤーシに取り付けた状態の一部縦断側面図であ
る。
１……基板、３……クシ形電極、４……感湿膜
、８……金属板。
FIG. 1 is a perspective view of a dew condensation sensor according to an embodiment of the present invention removed from a chassis, and FIG. FIG. 3 is a perspective view of the conventional dew condensation sensor removed from the chassis, and FIG. 4 is a partially longitudinal side view of the conventional dew condensation sensor attached to the chassis. 1...Substrate, 3...Comb-shaped electrode, 4...Moisture sensitive film, 8...Metal plate.
Claims (1)
電極３が形成され、該クシ形電極３を覆うように
感湿膜４が設けられた結露サンサにおいて、前記
基板１の他方の主面に、該基板１とほぼ同じ形状
の金属板８が張りつけられていることを特徴とす
る結露センサ。 In a dew condensation sensor, a pair of comb-shaped electrodes 3 are formed on one main surface of an insulating substrate 1, and a moisture-sensitive film 4 is provided to cover the comb-shaped electrodes 3. A dew condensation sensor characterized in that a metal plate 8 having substantially the same shape as the substrate 1 is attached to a surface thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1140688U JPH01118352U (en) | 1988-01-30 | 1988-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1140688U JPH01118352U (en) | 1988-01-30 | 1988-01-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01118352U true JPH01118352U (en) | 1989-08-10 |
Family
ID=31219930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1140688U Pending JPH01118352U (en) | 1988-01-30 | 1988-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01118352U (en) |
-
1988
- 1988-01-30 JP JP1140688U patent/JPH01118352U/ja active Pending
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