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JPH01115508A - Numerically controlled borer - Google Patents

Numerically controlled borer

Info

Publication number
JPH01115508A
JPH01115508A JP27495687A JP27495687A JPH01115508A JP H01115508 A JPH01115508 A JP H01115508A JP 27495687 A JP27495687 A JP 27495687A JP 27495687 A JP27495687 A JP 27495687A JP H01115508 A JPH01115508 A JP H01115508A
Authority
JP
Japan
Prior art keywords
pattern
reference pin
holes
patterns
pin holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27495687A
Other languages
Japanese (ja)
Other versions
JP2550615B2 (en
Inventor
Kiyoshi Nakagawa
淨 中川
Norio Hagiwara
萩原 宣男
Masahisa Hosoi
正久 細井
Masayuki Osawa
大沢 雅之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP62274956A priority Critical patent/JP2550615B2/en
Publication of JPH01115508A publication Critical patent/JPH01115508A/en
Application granted granted Critical
Publication of JP2550615B2 publication Critical patent/JP2550615B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching

Landscapes

  • Details Of Cutting Devices (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Drilling And Boring (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

PURPOSE:To form reference holes in a borer for boring the reference pin holes for pressing a printed board by determining positions separated from a midpoint between target patterns by a distance equivalent to 1/2 of a specified interval value so as to bore the patterns thereat, and distributing pattern error, if any, to the whole. CONSTITUTION:The borer in the caption determines a midpoint 0 between the respective central coordinates X1, X2 of target patterns 33, 34, and then, it determines positions Q1, Q2 separated from the midpoint 0 by a distance equivalent to 1/2 of a specified interval (l) on a line for connecting together the respective central coordinates X1, X2, thereby boring work is carried out in these positions. These reference pin holes 38, 39 serve as reference holes in the next process. Therefore, without any misalignment of a pair of the target patterns 33, 34, the reference pin holes 38, 39 may be formed on the central coordinate points of the target patterns 33, 34, respectively. Meanwhile, with any misalignment in the target patterns 33, 34 the reference pin holes 38, 39 are formed in the positions Q1, Q2 deviated by 1/2 of the error quantity of the pattern misalignment, respectively, with the specified interval (l) kept precise ly.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、例えばプリント・基板材料へのプレス用基準
ピン穴を形成する等に使用される数値制御式穴あけ装置
に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a numerically controlled drilling device used, for example, to form reference pin holes for pressing into printed circuit board materials.

〔発明の概要〕[Summary of the invention]

本発明は、所要パターンを形成した基板に対して対の基
準用の穴を形成する数値制御式穴あけ装置において、基
板に形成した1対の目標/(ターン夫々の座標を検出し
、その検出された座標間の中点を求め、この中点を基準
に上記検出パターン対を結ぶ線上に規定間隔値の172
に相当する位置を夫々求め、この位置を穴あけ手段の位
置へ移動して穴あけを行うことによって、パターン形成
時のパターンずれの誤差を全体に振分けて高精度に基準
用の対の穴を加工できるようにしたものである。
The present invention is a numerically controlled drilling device that forms a pair of reference holes in a substrate on which a desired pattern is formed, in which the coordinates of each of a pair of targets/(turns) formed on the substrate are detected, and the coordinates of each target/(turn) are detected. Find the midpoint between the coordinates of
By finding the positions corresponding to each, moving these positions to the position of the hole-drilling means, and drilling holes, it is possible to distribute the errors caused by pattern deviation during pattern formation to the entire pattern, and to machine a pair of reference holes with high precision. This is how it was done.

〔従来の技術〕[Conventional technology]

例えば回路パターンを形成したプリント基板は次のよう
にして製造される。第5図はその一例を示すもので、先
ず用意した銅張り基板(1)に1対のプレス用の基準ピ
ン穴(2)及び(3)を加工する(第5図A)。次にス
クリーン印刷によって銅層上に回路パターンに対応した
レジストパターンを形成した後、レジストパターンをマ
スクに銅層を選択エツチングして回路パターン(4)を
形成する(第5図B)。次にこの回路パターン(4)が
形成されたプリント基板材料(5)を図示せざるも大型
プレス装置にその基準eン穴(2)及び(3)を基準ピ
ンに挿入して位置決めし、しかる後、所要の輪郭形状に
プレス打抜きして目的のプリント基板を製造する。
For example, a printed circuit board with a circuit pattern formed thereon is manufactured as follows. FIG. 5 shows an example of this. First, a pair of reference pin holes (2) and (3) for pressing are formed in a prepared copper-clad board (1) (FIG. 5A). Next, a resist pattern corresponding to the circuit pattern is formed on the copper layer by screen printing, and then the copper layer is selectively etched using the resist pattern as a mask to form a circuit pattern (4) (FIG. 5B). Next, the printed circuit board material (5) on which the circuit pattern (4) has been formed is placed in a large press device (not shown) by inserting its reference holes (2) and (3) into the reference pins, and then positioning it. Thereafter, the desired printed circuit board is manufactured by press punching into the desired contour shape.

第6図は他の例であり、この場合は銅張り基板(1)上
に回路パターンに対応するレジストパターンを形成する
と共に基準ピン穴を形成すべき位置の目標となる1対の
目標パターンに対応したレジストパターンを形成した後
、レジストパターンをマスクに銅層を選択エツチングし
て回路パターン(4)と共に目標パターン(6) (7
)を形成しく第6図A)、次に夫々の目標パターン(6
) (7)の中心に基準ピン穴(2) (3)を形成す
る(第6図B)。次いでこのプリント基板材料(5)を
基準ピン穴(2) (3)を介してプレス装置に位置決
めし、プレス打抜きしてプリント基板を製造する。
FIG. 6 shows another example, in which a resist pattern corresponding to the circuit pattern is formed on the copper-clad board (1), and a pair of target patterns are formed as targets for the positions where the reference pin holes are to be formed. After forming a corresponding resist pattern, the copper layer is selectively etched using the resist pattern as a mask to form the target pattern (6) (7) along with the circuit pattern (4).
) to form the target pattern (Figure 6A), then each target pattern (6
) Form the reference pin holes (2) and (3) in the center of (7) (Fig. 6B). Next, this printed circuit board material (5) is positioned in a press device through the reference pin holes (2) and (3), and press punched to produce a printed circuit board.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ところで、上述のレジストパターンをスクリーン印刷す
る際には第7図に示すように基板(1)上に印刷スクリ
ーン(8)を対向させ、スキージ(9)を移動すること
によってレジストパターンを印刷形成している。このと
き、スクリーン(8)の伸びなどによってレジストパタ
ーンに伸びが生じ、この伸び量がそのまま回路パターン
のずれ量として残ることになる。
By the way, when screen printing the above-mentioned resist pattern, as shown in FIG. 7, the printing screen (8) is placed opposite the substrate (1), and the resist pattern is printed by moving the squeegee (9). ing. At this time, the resist pattern is elongated due to elongation of the screen (8), and this amount of elongation remains as the amount of deviation of the circuit pattern.

従って、上述の前者の例では、その後プリント基板材料
(5)をプレス装置に基準ピン穴(2) (3)を介し
て位置決めしプレス打抜きした場合、回路パターンが片
寄るなどパターンずれが生ずる。又、後者の例では、間
隔が伸びた目標パターン(6) (7)に基準ピン穴(
2) (3)を形成したときには、基準ピン穴(2) 
(3)の位置がずれてプリント基板材料(5)をプレス
装置に配したとき装置側の基準ピンに基準ピン穴(2)
 (3)が挿入されないことになる。
Therefore, in the former example described above, when the printed circuit board material (5) is then positioned in a press machine through the reference pin holes (2) and (3) and press punched, pattern deviations such as the circuit pattern being lopsided will occur. In addition, in the latter example, reference pin holes (
2) When (3) is formed, the reference pin hole (2)
When the position of (3) is misaligned and the printed circuit board material (5) is placed on the press machine, the reference pin hole (2) is inserted into the reference pin on the machine side.
(3) will not be inserted.

近年、高密度実装の要求からプリント基板の回路パター
ンも微細化しており、高精度な基板が求められている。
In recent years, circuit patterns on printed circuit boards have become finer due to the demand for high-density packaging, and high-precision circuit boards are required.

本発明は、上述の点に鑑み、パターン誤差を全体に振分
けて規定間隔の対の基準ピン穴等を形成できるようにし
た数値制御式穴あけ装置を提供するものである。
In view of the above-mentioned points, the present invention provides a numerically controlled drilling device that can form a pair of reference pin holes or the like at a specified interval by distributing pattern errors throughout the hole.

〔問題点を解決するための手段〕[Means for solving problems]

本発明の数値制御式穴あけ装置は、1対の目標パターン
(33) (34)を形成した基板(13)の目標パタ
ーンそれぞれの座標を検出する手段と、検出された座標
の中点(0)を求め、その中点(0)を基準に検出パタ
ーン対(33) (34)を結ぶ線上に規定間隔値βの
1/2に相当する位置(Ql)(Q2)をそれぞれ求め
る手段と、この位[(Ql)(Q2)を穴あけ手段(1
8)の位置へ移動し穴あけ加工する手段を有して成るも
のである。
The numerically controlled drilling device of the present invention includes means for detecting the coordinates of each target pattern of a substrate (13) on which a pair of target patterns (33) (34) are formed, and a midpoint (0) of the detected coordinates. means for finding positions (Ql) and (Q2) corresponding to 1/2 of the specified interval value β on a line connecting the detection pattern pair (33) and (34) with the midpoint (0) as a reference; position [(Ql) (Q2) by drilling means (1
8) and means for drilling the hole.

〔作用〕[Effect]

1対の目標パターンの各中心座標(X、)(L)間の中
点(0)が求められ、中点(0)を基準に中心座標(X
I)及び(X2)を結ぶ線上に規定間隔値(2)の17
2に相当する位@ (Ql)(Q2)が求められて、こ
の位W (Q、)(Q2)に穴あけ加工が施される。こ
の穴(3g) (39)が次工程での基準用穴となる。
The midpoint (0) between each center coordinate (X, )(L) of a pair of target patterns is found, and the center coordinate (X
17 of the specified interval value (2) on the line connecting I) and (X2)
The position @ (Ql) (Q2) corresponding to 2 is determined, and a hole is drilled at this position W (Q,) (Q2). This hole (3g) (39) will be the reference hole in the next step.

従って、1対の目標パターン(33) (34)が位置
ずれしていなければ基準用穴(38) (39)は夫々
の目標パターン(33) (34)の中心座標点に形成
され、又、目標パターン(33) (34)が位置ずれ
(間隔が伸びる等)していればパターンずれの誤差量が
172ずつに振分けられた位置(Ql>(Q2)に基準
用穴(38) (39)が形成されることになる。しか
も、両基準用穴(38) (39)間の間隔は正確に規
定の間隔βに保たれる。従って、次工程でこの基準用穴
(38)(39)を基準として基板(13)をプレス打
抜きした場合に高精度の加工ができる。
Therefore, if the pair of target patterns (33) (34) are not misaligned, the reference holes (38) (39) are formed at the center coordinate points of the respective target patterns (33) (34), and If the target pattern (33) (34) is misaligned (e.g., the interval is extended), the reference holes (38) (39) are placed at positions where the pattern misalignment error amount is divided into 172 increments (Ql>(Q2)). Moreover, the distance between the two reference holes (38) (39) is maintained at exactly the specified distance β.Therefore, in the next process, the reference holes (38) (39) When the substrate (13) is press punched based on the above, highly accurate processing can be achieved.

〔実施例〕〔Example〕

以下、図面を参照して本発明による数値制御式穴あけ装
置の実施例を説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a numerically controlled drilling device according to the present invention will be described with reference to the drawings.

第1図は、プリント基板材料に対してプレス用基準ピン
穴を加工するための数値制御式パンチプレス装置の概略
的構成図である。
FIG. 1 is a schematic diagram of a numerically controlled punch press device for forming press reference pin holes in printed circuit board material.

同図中、(11)はパンチプレス部、(12)はプリン
ト基板材料(13)を所要位置に移動せしめる移動部を
示す。パンチプレス部(11)は上部フレーム(14)
及び下部フレーム(15)を有し、上部フレーム(14
)に取付けた駆動部(16)によってパンチプレス数値
制御部り17)からの指令に応じてパンチ部(18〉が
作動するようになされる。(19)は上部フレーム(1
4)に取付けられパンチ部(18)を上下動するときに
案内するアームである。下部フレーム(15)には固定
ヘッド(20)及びダイ固定用プレス(21)を介して
ダイ(22)が取付けられる。移動部(12)は横方向
(X方向)に移動可能なXテーブル(23)及び縦方向
(Y方向)に移動可能なYテーブル(24)からなる所
謂X−Yテーブル部(25)を有して成り、Xテーブル
(23)にクランプ(26) (27)を介してプリン
ト基板材料(13)が保持される。パンチプレス数値制
御部(17)はこれよりの指令によってX−Yテーブル
1m(25)を作動させてプリント基板材料(13)を
所要位置に移動させ、駆動部(16)を作動してパンチ
部(18)及びダイ(22)の共働によりプリント基板
材料(13)に基準ビン穴の穴あけ加工を行う。一方、
パンチ部(18)に並ぶように後述するプリント基板材
It(13)の目標パターンを検出するための例えばC
CDカメラ(28)が配され、このカメラ(28)はこ
れよりの画像(コントラスト)ヂークに基づいて目標パ
ターンの中心位置を求める画像処理ユニット(29)に
接続され、さらに画像処理ユニッ) (29)は後述で
明らかとなる演算機能を備えたパンチプレス数値制御部
(17)に接続される。なお、X−Yテーブル部(25
)を作動するときの座標値の取り込みはロータリーエン
コータ、マグネスケール等が使用される。
In the figure, (11) indicates a punch press section, and (12) indicates a moving section that moves the printed circuit board material (13) to a desired position. The punch press part (11) is attached to the upper frame (14)
and a lower frame (15), and an upper frame (14).
The punch section (18) is operated by the drive section (16) attached to the upper frame (16) in response to commands from the punch press numerical control section (17).
4) is an arm that guides the punch portion (18) when it moves up and down. A die (22) is attached to the lower frame (15) via a fixed head (20) and a die fixing press (21). The moving unit (12) has a so-called X-Y table unit (25) consisting of an X table (23) that is movable in the horizontal direction (X direction) and a Y table (24) that is movable in the vertical direction (Y direction). The printed circuit board material (13) is held on the X table (23) via clamps (26) and (27). Based on this command, the punch press numerical control section (17) operates the X-Y table 1m (25) to move the printed circuit board material (13) to the required position, and operates the drive section (16) to move the punch section. (18) and the die (22) cooperate to form a reference bottle hole in the printed circuit board material (13). on the other hand,
For example, C for detecting a target pattern of a printed circuit board material It (13), which will be described later, so as to line up with the punch part (18).
A CD camera (28) is arranged, and this camera (28) is connected to an image processing unit (29) which determines the center position of the target pattern based on the image (contrast) dike from this camera (28). ) is connected to a punch press numerical control section (17) equipped with arithmetic functions that will become clear later. In addition, the X-Y table part (25
) A rotary encoder, Magnescale, etc. are used to capture the coordinate values when operating.

そして、本例においては、先ず、第2図Aに示すように
プリント基板を作成するための銅張り基板(31)を用
意し銅層上にスクリーン印刷によって回路パターンに対
応したレジストパターン及び基準ピン穴を加工すべき位
置の目標となる目標パターンに対応したレジストパター
ンを形成した後、このレジストパターンをマスクに銅層
を選択エツチングして第2図已に示すように回路パター
ン(32)と共に目標パターン(33) (34)を形
成する。この目標パターン(33) (34)は1組の
回路パターン(32)に対して1対(2ケ)としく第4
図C参照)1枚の基板上に2紐の回路パターン即ち2面
付であれば合計2対(4ケ)の目標パターン(第4図C
参照)、1枚の基板上に3組の回路パターン即ち3面付
であれば合計3対(6ケ)の目標パターン(第4図C参
照〉が必要となる。この回路パターンク32)及び基準
ビン穴を加工するための目標パターン(33) (34
)が形成されたプリント基板材料(13)を第1図のパ
ンチプレス装置(30)のクランプ(26)(27)に
保持する。パンチプレス数値制御部(17)には予め目
標パターン(33) (34)の慨略座標及び1対の基
準ピン穴間の規定間隔値βが入力されている。
In this example, first, as shown in FIG. 2A, a copper-clad board (31) for making a printed circuit board is prepared, and a resist pattern corresponding to the circuit pattern and reference pins are formed by screen printing on the copper layer. After forming a resist pattern corresponding to the target pattern at the position where the hole is to be formed, the copper layer is selectively etched using this resist pattern as a mask to form the target along with the circuit pattern (32) as shown in Figure 2. Patterns (33) (34) are formed. These target patterns (33) and (34) are arranged in pairs (two pieces) for one set of circuit patterns (32), and the fourth
(See Figure C) If there are two circuit patterns on one board, that is, two sides, there will be a total of 2 pairs (4 pieces) of target patterns (Figure 4C).
If there are three sets of circuit patterns on one board, that is, three sides, a total of three pairs (six pieces) of target patterns (see Fig. 4C) are required.This circuit pattern pattern 32) and Target pattern for machining standard bottle holes (33) (34
) is held in the clamps (26) and (27) of the punch press device (30) of FIG. The approximate coordinates of the target patterns (33) (34) and the specified interval value β between the pair of reference pin holes are inputted in advance to the punch press numerical control unit (17).

そして、X−Yテーブル部(25)を作動して、1対の
目標パターンのうちの一方の目標パターン(33)・が
カメラ(28)の視野に入る位置にプリント基板材料(
13)を移動し、カメラ(28)で一方の目標パターン
(33〉を検出し、画像処理ユニッ) (29)におい
てその目標パターン(33)の中心位置の座標(Xl)
を検出してメモリーする(第3図参照)。次にX−Yテ
ーブル部(25)を作動して同様に他方の目標パターン
(34)がカメラ(28)の視野に入る位置にプリント
基板材料(13)を移動し、他方の目標パターン(34
)をカメラ(28)で検出し、画像処理ユニット(29
)でその目標パターン(34)の中心位置の座標(X2
)を検出してメモリーする。そして、制御部(17)の
演算部においてこの検出された目標パターン(33)及
び(34)の中心を結ぶ線(36)上における2点(X
I)(L)間の中点座標(0)を算出する。
Then, by operating the X-Y table section (25), the printed circuit board material (
13), the camera (28) detects one target pattern (33), and the image processing unit (29) calculates the coordinates (Xl) of the center position of the target pattern (33).
is detected and stored in memory (see Figure 3). Next, the X-Y table section (25) is operated to similarly move the printed circuit board material (13) to a position where the other target pattern (34) is within the field of view of the camera (28).
) is detected by the camera (28), and the image processing unit (29
), the coordinates (X2) of the center position of the target pattern (34)
) is detected and stored in memory. Then, in the calculation unit of the control unit (17), two points (X
I) Calculate the midpoint coordinates (0) between (L).

そして、両目標パターン(33) (34)の中心を結
ぶ線(36)上においてこの中点(○)を基準に規定間
隔値βの172に相当する位置座標(Q I)及び(Q
7)を算出する。すなわち、2点(X、)(X2)間の
距離りと規定間隔値βとの誤差の1/2を中心振分けし
た位置座標(Q、)(Ql)が算出される。この夫々の
位置座標(Ql)(Ql)が基準ビン穴を加工すべき位
置となる。そして、このようにして求めた加工すべき座
標値(Ql)(Ql)に基づく制御部(17)よりの指
令によりX−Yテーブル部(25)を作動させ、プリン
ト基板材料(13)の加工すべき座標点(Ql)(Ql
)を夫々パンチ部(18)下に移動し、パンチ部(18
)及びダイ(22)の共働で穴加工して基準ビン穴(3
8) (39)を形成する(第2図C)。
Then, on the line (36) connecting the centers of both target patterns (33) and (34), position coordinates (Q I) and (Q
7) Calculate. That is, position coordinates (Q, ) (Ql) are calculated by centering 1/2 of the error between the distance between the two points (X, ) (X2) and the specified interval value β. These respective position coordinates (Ql) (Ql) become the positions at which the reference bottle holes are to be machined. Then, the X-Y table section (25) is operated according to a command from the control section (17) based on the coordinate values (Ql) to be processed (Ql) obtained in this way, and the printed circuit board material (13) is processed. coordinate point (Ql) (Ql
) below the punch section (18), and
) and die (22) work together to drill the hole and make the reference bottle hole (3
8) Form (39) (Fig. 2C).

その後、この様にして基準ピン穴(38) (39)を
形成したプリント基板材料(13)は大型プレス装置に
配され、基準ピン穴(38) (39)を装置側の基準
ピンに係合してプリント基板材料(13)の位置決めを
行って後、輪郭形状のプレス打抜きを行って目的のプリ
ント基板を得る。
Thereafter, the printed circuit board material (13) with the reference pin holes (38) and (39) formed in this way is placed in a large press device, and the reference pin holes (38) and (39) are engaged with the reference pins on the device side. After positioning the printed circuit board material (13), press punching of the contour shape is performed to obtain the desired printed circuit board.

斯る構成によれば、レジストパターンをスクリー印刷に
より形成する際にパターンずれが生じても、パターンの
中心から周囲に向かってパターンずれの誤差が均等に配
分されることになる。即ち第4図への1面付であれば誤
差を1/2にすることができ、第4図Bの2面付であれ
ば誤差を1/4にすることができ、第4図Cの3面付で
あれば誤差を176にすることができる。従って、その
後のプレス打抜きにおいて精度の高いプリント基板が製
造される。
According to such a configuration, even if a pattern shift occurs when a resist pattern is formed by screen printing, the pattern shift error is evenly distributed from the center of the pattern to the periphery. In other words, the error can be reduced to 1/2 by adding one page to Figure 4, the error can be reduced to 1/4 by adding 2 pages to Figure 4B, and the error can be reduced to 1/4 by attaching 2 pages to Figure 4C. If there are three pages, the error can be reduced to 176. Therefore, a highly accurate printed circuit board can be manufactured in the subsequent press punching process.

尚上側においてはパンチ部を用いたが、パンチ部の代わ
りにドリルを用いる穴あけ装置にも適用することもでき
る。
Although a punch portion is used in the upper case, the present invention may also be applied to a drilling device that uses a drill instead of the punch portion.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、両目標パターンの中心を結ぶ線上にお
いて、その間の中点を求め、この中点を基準に規定間隔
値の172に相当する位置を求めて、その位置を穴あけ
することにより、基板に形成した目標パターンを含む所
要パターンにずれが生じても、その誤差を均等に配分し
た状態で規定間隔値を持つ1対の基準用穴を形成するこ
とができる。
According to the present invention, on a line connecting the centers of both target patterns, find the midpoint between them, find a position corresponding to the specified interval value of 172 based on this midpoint, and drill a hole at that position. Even if a deviation occurs in the required patterns including the target pattern formed on the substrate, a pair of reference holes having a specified interval value can be formed with the error evenly distributed.

従って、例えばその後基準用穴を用いて位置決めし基板
をプレス打抜きした場合高精度の加工ができる。従って
、本発明の数値制御式穴あけ装置は特に高密度実装用の
微細パターンのプリント基板の製造に際しての基準ピン
穴の形成に適用して好適ならしめるものである。
Therefore, for example, when the substrate is subsequently positioned using a reference hole and press punched, highly accurate processing can be achieved. Therefore, the numerically controlled hole punching apparatus of the present invention is particularly suitable for forming reference pin holes in the production of finely patterned printed circuit boards for high-density packaging.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明による数値制御式穴あけ装置の一例を示
す構成図、第2図A−Cは本発明装置を用いてプリント
基板材料に基準ピン穴をあける工程図、第3図は本発明
の説明に供する線図、第4図A−Cは夫々本発明に適用
されるプリント基板材料の例を示す平面図、第5図A及
びBは従来の基準ピン穴の形成の一例を示す工程図、第
6図A及びBは従来の基準ピン穴の形成の池の例を示す
工程図、第7図はプリント基板の製造に際してのレジス
トパターンのスクリーン印刷の例を示す構成図である。 (11)はパンチプレス部、(12)は移動部、(13
)はプリント基板材料、(1B)はパンチ部、(22)
はグイ、(25)ハX−Yf−プル部、(28) It
 力y’ ラ、(33)(34)は目標パターン、(3
g) (39)の基準ピン穴である。 代  理  人     伊  藤     真岡  
      松  隈  秀  腐木実施例、n +1
底図 第1図 賞方笹イ列の1主星図 第2図 第3図
Fig. 1 is a block diagram showing an example of a numerically controlled drilling device according to the present invention, Fig. 2 A-C is a process diagram of drilling a reference pin hole in a printed circuit board material using the inventive device, and Fig. 3 is a diagram showing the process of drilling a reference pin hole in a printed circuit board material using the device according to the present invention. 4A to 4C are plan views showing examples of printed circuit board materials applied to the present invention, and FIGS. 5A and 5B are diagrams showing an example of the conventional process of forming reference pin holes. 6A and 6B are process diagrams showing an example of conventional reference pin hole formation, and FIG. 7 is a configuration diagram showing an example of screen printing of a resist pattern in manufacturing a printed circuit board. (11) is the punch press part, (12) is the moving part, (13)
) is the printed circuit board material, (1B) is the punch part, (22)
is Gui, (25) HaX-Yf-pull part, (28) It
Force y' la, (33) (34) are the target pattern, (3
g) This is the reference pin hole in (39). Agent Moka Ito
Hide Matsukuma Example of rotten wood, n +1
Bottom map Figure 1 1 main star map of Sasa A row Figure 2 Figure 3

Claims (1)

【特許請求の範囲】 1対の目標パターンを形成した基板の目標パターンそれ
ぞれの座標を検出する手段、 検出された座標の中点を求め、その中点を基準に上記検
出パターン対を結ぶ線上に規定間隔値の1/2に相当す
る位置をそれぞれ求める手段、上記の位置を穴あけ手段
の位置へ移動し穴あけ加工をする手段より成る数値制御
式穴あけ装置。
[Scope of Claims] Means for detecting the coordinates of each target pattern on a substrate on which a pair of target patterns is formed, means for determining the midpoint of the detected coordinates, and using the midpoint as a reference on a line connecting the pair of detected patterns. A numerically controlled drilling device comprising means for respectively determining positions corresponding to 1/2 of the specified interval value, and means for moving the above-mentioned positions to the position of the drilling means and drilling the holes.
JP62274956A 1987-10-30 1987-10-30 Numerically controlled drilling device Expired - Fee Related JP2550615B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62274956A JP2550615B2 (en) 1987-10-30 1987-10-30 Numerically controlled drilling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62274956A JP2550615B2 (en) 1987-10-30 1987-10-30 Numerically controlled drilling device

Publications (2)

Publication Number Publication Date
JPH01115508A true JPH01115508A (en) 1989-05-08
JP2550615B2 JP2550615B2 (en) 1996-11-06

Family

ID=17548905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62274956A Expired - Fee Related JP2550615B2 (en) 1987-10-30 1987-10-30 Numerically controlled drilling device

Country Status (1)

Country Link
JP (1) JP2550615B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0231612U (en) * 1988-08-19 1990-02-28
JPH03277411A (en) * 1990-03-26 1991-12-09 Seikosha Co Ltd Drilling method for printed board and device therefor
JPH07266198A (en) * 1994-03-31 1995-10-17 Seikosha Co Ltd Punching method for printed circuit board and device therefor
JP2002144289A (en) * 2000-11-07 2002-05-21 Sumitomo Metal Mining Co Ltd Method of continuous punching on long thin strip material

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0231612U (en) * 1988-08-19 1990-02-28
JPH03277411A (en) * 1990-03-26 1991-12-09 Seikosha Co Ltd Drilling method for printed board and device therefor
JPH07266198A (en) * 1994-03-31 1995-10-17 Seikosha Co Ltd Punching method for printed circuit board and device therefor
JP2002144289A (en) * 2000-11-07 2002-05-21 Sumitomo Metal Mining Co Ltd Method of continuous punching on long thin strip material
JP4686847B2 (en) * 2000-11-07 2011-05-25 住友金属鉱山株式会社 Continuous drilling method for long sheet material

Also Published As

Publication number Publication date
JP2550615B2 (en) 1996-11-06

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