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JPH01100472A - Autonomous clip for sopic - Google Patents

Autonomous clip for sopic

Info

Publication number
JPH01100472A
JPH01100472A JP62257830A JP25783087A JPH01100472A JP H01100472 A JPH01100472 A JP H01100472A JP 62257830 A JP62257830 A JP 62257830A JP 25783087 A JP25783087 A JP 25783087A JP H01100472 A JPH01100472 A JP H01100472A
Authority
JP
Japan
Prior art keywords
clip
sopic
base
pin
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62257830A
Other languages
Japanese (ja)
Inventor
Naotaka Kimura
木村 直隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62257830A priority Critical patent/JPH01100472A/en
Publication of JPH01100472A publication Critical patent/JPH01100472A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To achieve an elimination of labor and a prevention of a disturbance caused by a poor contact, by arranging an IC grasping section for holding an IC by pinching and an IC signal fetching section for fetching a signal from the IC to eliminate the need for pressing an IC clip from above in application. CONSTITUTION:Grip plates 5 on both sides are pressed inward to open a lower end rubber 6 outward and a contact pin 10 is pressed from right above so as to contact a lead 13 of an IC 19 to be tested from above. Then, when the IC 9 is fitted into a cut of a guide 15 provided under a base 3, the grip plate 5 is released. At this point, as a recess is formed in the rubber 6 to match the shape of the side of the IC 9, the recess and a force of a spring 8 are combined to fix the rubbers 6 and 6 securely on the side of the IC 9. Then, an external equipment is connected to a relay pin 11 to fetch an input/output signal of the IC 9 through the lead 13 of the IC 9, the contact pin 10 and a wiring 14.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明はSOP型のICを搭載したカードの試験に使用
するSOPIC用自立式クリップに関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a free-standing clip for SOPIC used for testing cards equipped with SOP type ICs.

[従来の技術] 従来、この種のSOPIC用自立式クリップは、試験者
がICクリップを持ち、このICクリップを被試験用の
SOPIC上に押付けて使用する構造となっていた。 
 ″ [発明が解決しようとする問題点] 上述した従来のSOPIC用自立式クリップは、試験者
がICクリップを持ち、このICクリップを被試験用の
SOPIC上に押付けて使用する構造となっていたため
、常に人手を必要とし、また押付ける力、バランス等に
よって接触不良が生じ易いという欠点があった。
[Prior Art] Conventionally, this type of free-standing clip for SOPIC has a structure in which a tester holds the IC clip and presses the IC clip onto the SOPIC to be tested.
[Problems to be Solved by the Invention] The conventional free-standing clip for SOPIC described above has a structure in which the tester holds the IC clip and presses the IC clip onto the SOPIC to be tested. However, it always requires manual labor and has the disadvantage that poor contact is likely to occur due to pressing force, balance, etc.

[問題点を解決するための手段] 本発明は、上記従来の問題点を解決するためになされた
もので、そのための解決手段として、ICを挟んで保持
するIC挟持部と、該挟持部のICから信号を取出すI
C信号取出部とを備え、上記IC挟持部は、水平に配さ
れた板状のベースと、該ベースの両側に対向軸支され、
スプリングの付勢力によって両下端部で上記ICを挟む
一対の複板とよりなり、上記IC信号取出部は、上記ベ
ースと垂直に配されベースに設けたスプリングにより下
方に付勢されるICリード接触用のコンタクトピンと、
ベース上に設けられコンタクトピンと電気的に接続する
外部機器接続用の中車ピンとよりなることを特徴とする
5opic用自立式クリップを提供するものである。
[Means for Solving the Problems] The present invention has been made to solve the above-mentioned conventional problems, and as a means for solving the problem, it includes an IC holding part that holds an IC between the two sides, and an IC holding part of the holding part. I take out the signal from the IC
the IC holding part includes a horizontally disposed plate-shaped base, and is supported with opposing shafts on both sides of the base;
It consists of a pair of double plates that sandwich the IC at both lower ends by the biasing force of a spring, and the IC signal extraction part is arranged perpendicularly to the base and is biased downward by a spring provided on the base. contact pin for
The present invention provides a self-supporting clip for 5opic, which is characterized by comprising an intermediate wheel pin for external device connection provided on a base and electrically connected to a contact pin.

[実施例] 次に、本発明の実施例について図面を参照して説明する
[Example] Next, an example of the present invention will be described with reference to the drawings.

第1図は本発明の一実施例に係るSOPIC用自立式ク
リップの一部断面正面図、第2図は第1図のSOPIC
用自立式クリップの一部断面側面図、第3図及び第4図
は第1図のSOPIC用自立式クリップの使用状態を示
す正面図及び側面図、第5図は14ビンの場合の平面図
である。
FIG. 1 is a partially sectional front view of a free-standing clip for SOPIC according to an embodiment of the present invention, and FIG. 2 is a front view of the SOPIC of FIG. 1.
Figures 3 and 4 are front and side views showing the state of use of the free-standing clip for SOPIC shown in Figure 1, and Figure 5 is a plan view of the free-standing clip for 14 bins. It is.

SOPIC用自立式クリップは、IC挟持部lと、IC
信号取出部2とを備えてなる。
The free-standing clip for SOPIC has an IC holding part l and an IC
A signal extraction section 2 is provided.

IC挟持部lは、水平に配した板状のベース3と、ベー
ス3の両側にビン4により軸支された複板5,5とより
なる。複板5,5は、下端部にゴム6.6を有し、上端
部がベース3上のスプリングホルダ7に保持されたスプ
リング8により外側に付勢され、下端部のゴム7.7間
でIC9を挟持する機能を有する。
The IC holding part 1 consists of a horizontally arranged plate-shaped base 3 and multiple plates 5, 5 which are pivotally supported by bins 4 on both sides of the base 3. The double plates 5, 5 have a rubber 6.6 at the lower end, the upper end is biased outward by a spring 8 held by a spring holder 7 on the base 3, and the rubber 7.7 at the lower end is biased outwardly. It has the function of holding IC9.

IC信号取出部2は、コンタクトピンlOと、中継ビン
11とよりなる。コンタクトピン10は、ベース3の下
方に垂直にかつ複板5,5のゴム6.6の間に位置する
ように配されている。またコンタクトピン10はスプリ
ング12により下方に付勢されている。これによりIC
9のリード13との接触が維持される。中継ピン11は
ベース3上に立設され、配線14を介してコンタクトピ
ン10と接続している。これにより中継ピン11からI
C9の入出力信号を取出すことができる。
The IC signal extraction section 2 includes a contact pin lO and a relay bin 11. The contact pin 10 is disposed vertically below the base 3 and between the rubber plates 6.6 of the double plates 5, 5. Further, the contact pin 10 is urged downward by a spring 12. This allows the IC
9 is maintained in contact with lead 13. Relay pin 11 is erected on base 3 and connected to contact pin 10 via wiring 14. As a result, from relay pin 11 to I
C9 input/output signals can be taken out.

次に1本実施例のSOPIC用自立式クリップが示す作
用について説明する。
Next, the function exhibited by the free-standing clip for SOPIC of this embodiment will be explained.

先ず両側の複板5,5を内側に押さえて下端のゴム6.
6を外側に開き、コンタクトピン10が上から被試験I
C9のリード13に当たるように真上から押さえつける
。そしてベース3の下側に設けたガイド15の切込みに
IC9が納まったら複板5,5を離す、このとき、ゴム
6.6にスプリング8によって内側への力がかかるため
、ゴム6.6がIC9の側面を押える。またゴム6.6
にはIC9の側面の形状に合わせてくぼみを形成しであ
るため、そのくぼみと、スプリング8の力によってゴム
6.6がIC9の側面を確固に固定する。
First, press the double plates 5, 5 on both sides inward and tighten the rubber 6 on the lower end.
6 to the outside, and the contact pin 10 is inserted into the test object I from above.
Press down from directly above so that it hits lead 13 of C9. Then, when the IC 9 is seated in the notch of the guide 15 provided on the lower side of the base 3, the double plates 5, 5 are released. At this time, the rubber 6.6 is forced inward by the spring 8, so Press down on the side of IC9. Also rubber 6.6
Since a recess is formed to match the shape of the side surface of the IC 9, the rubber 6.6 firmly fixes the side surface of the IC 9 by the recess and the force of the spring 8.

次に、中継ビンllに外部機器を接続しIC9のリード
13.コンタクトピン11.配置1114を介してIC
9の入出力信号を取出す。
Next, connect the external device to the relay bin ll, and connect the lead 13 of the IC9. Contact pin 11. IC via placement 1114
Take out the input/output signals of 9.

[発明の効果] 以上説明したように本発明は、ICを挟んで保持するI
C挟持部と、該挟持部のICから信号を取出すIC信号
取出部とを備えたSOPIC用自立式クリップとしたた
め、被試験SOPICに対して自立して使用でき、この
結果人手によってICクリップを上から押付けて使用す
る必要がなく、人手の消滅及び接触不良障害の防止を図
ることができる効果がある。
[Effects of the Invention] As explained above, the present invention provides an I
The free-standing clip for SOPIC is equipped with a C holding part and an IC signal extraction part that extracts signals from the IC in the holding part, so it can be used independently for the SOPIC under test, and as a result, it is not necessary to manually lift the IC clip. There is no need to press it down when using it, which has the effect of eliminating the need for manpower and preventing problems due to poor contact.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例に係るSOPIC用自立式ク
リップの一部断面正面図、第2図は第1図のSOPIC
用自立式クリップの一部断面側面図、第3図及び第4図
は第1図のSOPIC用自立式クリップの使用状態を示
す正面図及び側面図、第5図は14ピンの場合の平面図
である。 1:Ic挟持部   2:IC信号取出部3:ベース 
    4:ピン 5:塀板      6:ゴム 7:スプリングホルダ 8.12ニスプリング 9:IC10:コンタクトピン ll:中継ピン   13:リード 14:配線     15ニガイド
FIG. 1 is a partially sectional front view of a free-standing clip for SOPIC according to an embodiment of the present invention, and FIG. 2 is a front view of the SOPIC of FIG. 1.
Figures 3 and 4 are front and side views showing how the free-standing clip for SOPIC shown in Figure 1 is used, and Figure 5 is a plan view of the free-standing clip for 14 pins. It is. 1: Ic holding part 2: IC signal extraction part 3: Base
4: Pin 5: Fence plate 6: Rubber 7: Spring holder 8.12 spring 9: IC10: Contact pin 11: Relay pin 13: Lead 14: Wiring 15 Ni guide

Claims (1)

【特許請求の範囲】  ICを挟んで保持するIC挟持部と、該挟持部のIC
から信号を取出すIC信号取出部とを備え、 上記IC挟持部は、水平に配された板状のベースと、該
ベースの両側に対向軸支され、スプリングの付勢力によ
って両下端部で上記ICを挟む一対の握板とよりなり、 上記IC信号取出部は、上記ベースと垂直に配されベー
スに設けたスプリングにより下方に付勢されるICリー
ド接触用のコンタクトピンと、ベース上に設けられコン
タクトピンと電気的に接続する外部機器接続用の中継ピ
ンとよりなることを特徴とするSOPIC用自立式クリ
ップ。
[Claims] An IC holding part that holds an IC between the two, and an IC held in the holding part.
and an IC signal extraction section for extracting a signal from the IC. The IC signal take-out section includes a contact pin for contacting an IC lead which is arranged perpendicular to the base and is urged downward by a spring provided on the base, and a contact pin provided on the base. A free-standing clip for SOPIC characterized by consisting of a relay pin for connecting an external device electrically to the pin.
JP62257830A 1987-10-13 1987-10-13 Autonomous clip for sopic Pending JPH01100472A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62257830A JPH01100472A (en) 1987-10-13 1987-10-13 Autonomous clip for sopic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62257830A JPH01100472A (en) 1987-10-13 1987-10-13 Autonomous clip for sopic

Publications (1)

Publication Number Publication Date
JPH01100472A true JPH01100472A (en) 1989-04-18

Family

ID=17311724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62257830A Pending JPH01100472A (en) 1987-10-13 1987-10-13 Autonomous clip for sopic

Country Status (1)

Country Link
JP (1) JPH01100472A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003023427A2 (en) * 2001-09-12 2003-03-20 Formfactor, Inc. Method of assembling and testing an electronics module

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003023427A2 (en) * 2001-09-12 2003-03-20 Formfactor, Inc. Method of assembling and testing an electronics module
WO2003023427A3 (en) * 2001-09-12 2003-11-06 Formfactor Inc Method of assembling and testing an electronics module
US6764869B2 (en) 2001-09-12 2004-07-20 Formfactor, Inc. Method of assembling and testing an electronics module
US7204008B2 (en) 2001-09-12 2007-04-17 Formfactor, Inc. Method of making an electronics module
KR100915928B1 (en) * 2001-09-12 2009-09-07 폼팩터, 인크. Method of making an electronics module
US7634849B2 (en) 2001-09-12 2009-12-22 Formfactor, Inc. Method of assembling and testing an electronics module

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