JPH0997971A - Manufacture of circuit module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method, for a circuit module, whose tact time is short and in which the circuit module can be manufactured with good accuracy. SOLUTION: A manufacturing method comprises a process wherein a carrier 1 which comprises a plurality of holding parts 2 used to hold a work 5 and which is provided with adhesive tapes on the holding parts 2 is prepared, a process wherein the work 5 is aligned with the carrier 1 and the work 5 is pasted on the adhesive tapes, a process wherein a treatment is executed to the work 5 held by the carrier 1 while the position of the carrier 1 is used as a reference and a process wherein the adhesive force of the adhesive tape is lowered after the treatment has been finished and the work 5 is removed from the carrier 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a circuit module.

[0002]

2. Description of the Related Art Conventionally, it has been practiced to hold a plurality of works such as electronic parts and substrates collectively on one carrier and manufacture a circuit module while carrying the carriers.

[0003]

However, in the conventional manufacturing method for collectively manufacturing a plurality of circuit modules using a carrier, there is a large amount of backlash between the work and the carrier, and the position at which the processing is performed is large. Due to the lack of accuracy,
There is a problem that it is not possible to collectively process a plurality of works, such as cream solder and flux printing. For this reason, under the present circumstances, in order to obtain sufficient accuracy, when the circuit module is manufactured, the recognition processing for aligning the works one by one is performed. However, in such a case, the recognition process has to be repeated for each stage of the manufacturing process by the number of workpieces, which increases the recognition processing time and prolongs the takt time of the entire manufacturing process. There was a problem.

Therefore, an object of the present invention is to provide a method of manufacturing a circuit module which has a short tact time and which can be manufactured with high accuracy.

[0005]

A method of manufacturing a circuit module according to the present invention has a plurality of holding portions for holding a work,
And a step of preparing a carrier provided with an adhesive tape in the holding part, a step of aligning the work with respect to the carrier, and affixing the work to the adhesive tape of the holding part; The method includes a step of subjecting each held work to a treatment, and a step of removing the work from each carrier by reducing the adhesive force of the adhesive tape of the adhesive tape after the treatment is completed.

[0006]

With the above structure, the work is aligned with the carrier and then attached to the adhesive tape of the holding portion.

Therefore, in the subsequent processing steps,
By simply using the position of the carrier as a reference, it is possible to collectively process a plurality of works held by the carrier.

Therefore, while maintaining high positional accuracy,
Not only can it be processed for each work, there is no need to perform position recognition in the processing process for each work individually
The recognition time can be shortened by that much, and the takt time of the entire manufacturing process can be shortened.

[0009]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of a carrier according to an embodiment of the present invention. In FIG. 1, reference numeral 1 is a carrier, and 2 is a holding portion for a work, which is recessed on one surface of the carrier 1. As shown in FIG. 2, which is a sectional view taken along line XX of FIG. 1, an adhesive tape 3 is attached to the bottom of each holding portion 2. As the adhesive tape 3, it is desirable to use an adhesive tape whose adhesive force decreases when heated. Reference numeral 4 is a mark that is referred to when the carrier 1 is aligned. The mark 4 is provided at a predetermined position in the corner of the carrier 1. Incidentally, even if the mark 4 is not specially provided, a certain position of the carrier 1 may be substituted for the mark 4.

Next, referring to FIG. 3, each step of the method of manufacturing the circuit module of this embodiment will be described. In this embodiment, the work 5 is a BGA (Ball Gli).
The process of processing dArray) will be described. Reference numeral 6 is an electrode formed on one surface of the work 5.

First, as shown on the left side of FIG. 3A, the mark 4 of the carrier 1 is observed by the first camera 7 to position the carrier 1. Next, the work 5 is attracted to the nozzle 8 and the electrode 6 of the work 5 is observed by the second camera 9 to position the work 5. As a result, the work 5 is aligned with the carrier 1. The second camera 9 may observe not the electrode 6 but a mark specially provided on the work 5 for positioning. In any case, position the carrier 1 and position the work 5,
As shown by an arrow N1, the work 5 that has been positioned is transferred to the holding portion 2 of the carrier 1, and the bottom of the work 5 is moved to the position shown in FIG.
As shown in (b), it is attached to the adhesive tape 3.

Thereafter, the work 5 is positioned with respect to the carrier 1, and the position is held by the adhesive tape 3. Then, the transfer operation of the work 5 as shown in FIG. 3A is repeated by the number of the holding portions 2 provided on the carrier 1.

After that, as shown in FIG. 3C, a mask 10 is overlaid on the side of the work 5 on which the electrode 6 is placed, and a pattern hole is formed in the mask 10 so as to correspond to the electrode 6. The cream solder 12 is printed on the electrode 6 via the screen printing method 11.

Alternatively, in the step of FIG. 3C, the flux may be applied to the electrode 6 by the screen printing method instead of printing the cream solder 12. When the flux is applied, as shown in FIG.
The solder balls 13 are mounted on the electrodes 6 as shown in FIG.

After the cream solder 12 is printed or the solder balls 13 are mounted, either the carrier 1 is placed in a heating device, and the cream solder 12 or the solder balls 13 is once melted and then solidified. By
As shown in FIG. 3E, bumps 14 are formed on the electrodes 6.

After that, the adhesive force of the adhesive tape 3 is reduced and the work 5 is peeled off from the adhesive tape 3,
The work 5 is removed from the carrier 1 and discharged to the next step.

Next, a circuit module manufacturing method in the second embodiment for manufacturing a circuit module including a substrate having low rigidity will be described.

In FIG. 4, reference numeral 15 is a substrate and 16 is a substrate 1.
Reference numeral 17 denotes an electrode formed on the upper surface of 5, and 17 is a positioning mark formed at a predetermined position on the substrate 15. Also in the second embodiment, after observing the mark 4 of the carrier 1 with the first camera 7 and positioning the carrier 1, the substrate 15 is adsorbed to the nozzle 8 and the mark 17 of the substrate 15 is taken to the second camera 9. Then, the substrate 15 is positioned.

Then, as indicated by an arrow N2, the substrate 15 is attached to the adhesive tape 3 attached to the holding portion 2 of the carrier 1 (FIG. 4 (b)). After that, the substrate 15
The mask 18 is overlaid on the mask 18 and the electrode 16
Through the pattern hole 19 opened at the position corresponding to
The cream solder 20 is printed on the electrode 16 by a screen printing method. Then, after removing the mask 18, the chip 22 is adsorbed by the nozzle 21 on the substrate 15 as a circuit module, and the chip 22 is mounted on the printed cream solder 20.

Then, the carrier 1 is put into a reflow apparatus, and the cream solder 20 is once melted and then solidified to fix the chip 22 to the substrate 15. When the adhesive force of the adhesive tape 3 is weakened, the substrate 15 is peeled off from the adhesive tape 3 to remove the substrate 15 from the carrier 1.

[0022]

The circuit module manufacturing method of the present invention is
A step of preparing a carrier having a plurality of holding parts for holding a work and having an adhesive tape on the holding part, and positioning the carrier, and positioning the work with respect to the carrier to hold the work The step of attaching the work to the adhesive tape of, the step of performing a process for each work held on the carrier with the position of the carrier as a reference, and after the completion of the process, reduce the adhesive force of the adhesive tape of the adhesive tape, Since it includes the step of removing the work from the carrier, it is not necessary to recognize each work at the stage of processing, and accurate positioning can be performed by positioning only the carrier. . That is, the recognition time in the processing stage can be shortened, and the takt time of the entire processing can be shortened. Note that the cameras 7 and 9 may not be separately observed, but may be observed by the same camera.

[Brief description of drawings]

FIG. 1 is a perspective view of a carrier according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along line XX of FIG.

FIG. 3A is a process explanatory diagram of a method for manufacturing a circuit module according to an embodiment of the present invention. FIG. 3B is a process explanatory diagram of a method for manufacturing a circuit module according to an embodiment of the present invention. Process explanatory drawing of the circuit module manufacturing method in an example (d) Process explanatory drawing of the circuit module manufacturing method in one Example of this invention (e) Process explanatory drawing of the circuit module manufacturing method in one Example of this invention

FIG. 4A is a process explanatory diagram of a method for manufacturing a circuit module according to an embodiment of the present invention. FIG. 4B is a process explanatory diagram of a method for manufacturing a circuit module according to an embodiment of the present invention. Process explanatory drawing of the circuit module manufacturing method in an example (d) Process explanatory drawing of the circuit module manufacturing method in one Example of this invention (e) Process explanatory drawing of the circuit module manufacturing method in one Example of this invention

[Explanation of symbols]

 1 carrier 2 holding part 3 adhesive tape 5 work

Claims (5)

[Claims] 1. A step of preparing a carrier having a plurality of holding parts for holding a work, the holding part being provided with an adhesive tape, the work being aligned with the carrier, and the holding part. A step of attaching a work to the adhesive tape, a step of treating each work held by the carrier with reference to the position of the carrier, and a step of reducing the adhesive force of the adhesive tape of the adhesive tape after the processing is completed. And a step of removing each work from the carrier, the method for manufacturing a circuit module. 2. The method of manufacturing a circuit module according to claim 1, wherein the processing includes applying a flux by a screen printing method. 3. The method of manufacturing a circuit module according to claim 1, wherein the processing includes applying cream solder by a screen printing method. 4. The method of manufacturing a circuit module according to claim 1, wherein the processing includes mounting a solder ball. 5. The method of manufacturing a circuit module according to claim 1, wherein the processing includes mounting a chip.