JPH0983848A - Camera monitor, printed circuit board inspection device with camera monitor and inspection device with camera monitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily recognize visually an image pickup position in the case of focusing by irradiating an observed position of a printed circuit board being an object with a red visual layer beam. SOLUTION: A printed circuit board inspection device 25 supports a camera 2 with a support section 26 slidably in the vertical direction with an operation knob 27 and a magnified video image of the printed circuit board 50 being an inspection object placed on an inspection object placing base 24 is displayed on a display section 5 consisting of a CRT. A fluorescent light 11 is fitted to a tip of a camera 2 to light an observed position. An optical pointer 3 provides an output of the red visual layer beam, which penetrates a throughhole 12 of the fluorescent light 11 to irradiate an observed position of the printed circuit board 50 to indicate a marker indicating the image picked up position. The laser beam is in crossing obliquely with an optical axis of the camera 2 to be adjusted at a desired cross angle. For example, a magnification is set low to the camera 2 and at the camera position to focus the image pickup position, the marker is matched with the center of the image pickup range.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a camera monitor capable of clearly grasping an image pickup position of a camera, a printed circuit board inspection device with the camera monitor, and an inspection device with the camera monitor.

[0002]

2. Description of the Related Art Conventionally, a camera and a monitor display device are used to confirm a desired portion with a camera in order to confirm a difficult-to-see portion such as a small character such as a newspaper or a finely processed portion such as a printed circuit board. Imaging is performed and enlarged and displayed on a monitor.

This makes it easier to read newspapers that are difficult to read with small characters, and it is also possible to easily find defective points (solder defects, foil breaks, etc.) on the printed circuit board. .

[0004]

However, which part of the newspaper or the printed circuit board the camera is picking up must be confirmed by looking at the monitor. Especially, in the printed circuit board, similar circuit patterns are densely packed. As a result, it is difficult to confirm the location of the image captured by the camera. In other words, it was not possible to easily align the camera with the desired location.

The camera monitor of the present invention has been made in view of the above circumstances, and it is possible to easily grasp the image pickup portion of the camera and easily position the camera at a desired position. An object is to provide a printed circuit board inspection device with a monitor.

[0006]

A camera monitor of the present invention comprises a camera for picking up an image of a subject, a monitor for displaying an image from the camera, and an optical pointer for indicating an image pickup position of the camera.

A printed circuit board inspection apparatus with a camera monitor according to the present invention includes a camera for picking up an image of a printed circuit board, a monitor for displaying an image from the camera, an optical pointer indicating an image pickup position of the camera, and a printed circuit. The inspection board mounting table on which the board is mounted, and at least the camera and the holding means for holding the optical pointer at a position on the inspection board mounting table for picking up an image of the printed circuit board are provided.

[0008]

1 is a block diagram showing the overall configuration of a camera monitor of the present invention.

Reference numeral 1 is a camera monitor, 2 is a camera for picking up an image of a subject, and 3 is an optical pointer (point marker).
As a light source such as a red laser irradiator as a camera,
The image pickup position of is indicated by the irradiation point of the laser light so that the desired place can be seen immediately.

The irradiation of the laser light source 3 is, as shown in FIG. 2A, the image pickup range x of the camera 2 (the range indicated by the dotted line).
A mode of irradiating a point (as indicated by a point a) to the substantially center of the inside, and an imaging range x of the camera 2 as shown in FIG. 2B.
It is possible to select a mode in which the laser beam is irradiated (as indicated by the solid line b) so as to be overlapped with (the range indicated by the dotted line).

An image processing unit 4 for an image picked up by the camera 2 is used for brightness adjustment, contrast adjustment, color adjustment, enlargement /
Perform reduction processing and the like.

Reference numeral 5 denotes a display unit composed of a CRT, LCD or the like, which displays an image of the camera 2.

Reference numeral 6 is a control unit for controlling the above-mentioned respective units. 7 is a power supply unit, 8 is an I / F for outputting or inputting image information to the outside, 9 is an operation unit including various switches,
Reference numeral 10 is a recording unit for recording the captured image for one screen or several screens.

The I / F includes a video output terminal function,
Further enlargement can be achieved by connecting a separate large monitor, and images taken at several locations can be displayed. Also, by connecting a video printer or a VTR, the captured image can be printed or recorded.

FIG. 3 is an overall perspective view when the camera monitor of the present invention is applied to a printed circuit board inspection device 25 for finding a defective solder spot or a broken foil spot by enlarging and displaying a printed circuit board.

Reference numeral 20 is a printed circuit board, 21 is an inspection board mounting base on which the printed circuit board 20 to be inspected is mounted, and 22 is a camera monitor holding for holding the camera monitor 1 at an arbitrary position on the inspection board mounting base 21. A flexible arm, 23 is a connection cable for connecting the camera 2 and the display unit 5.

In the embodiment shown in FIG. 3A, the display unit 5 is installed on the camera monitor holding arm 22.
As shown in B, if the camera 2 and the display unit 5 are separated and connected by the connection cable 23, it is possible to easily adopt a display unit 5 having a large screen size.

As shown in FIG. 3, if the camera monitor of the present invention is used in a printed circuit board inspection apparatus, it is possible to easily confirm the image pickup location of the camera 2 by the irradiation light from the laser light source 3, and at the same time, the camera Since the position can be easily adjusted to the place you want to see, you can improve the inspection work efficiency.

FIG. 4 is an overall perspective view showing another embodiment of the printed circuit board inspection device with a camera monitor according to the present invention.

In the figure, reference numeral 11 is a fluorescent lamp attached to the front end of the camera 2 for illuminating an inspection object (subject), and the laser light source 3 provided above the fluorescent lamp 11.
From the inspection object table 24 via mirrors 46 and 47 described later.
A through hole through which the laser beam A radiated upward passes, 28 is a sliding portion for moving the camera monitor 1 in the upward direction a and the downward direction b, 27 is an operation knob of the sliding portion 28, By rotating the operating knob 27, the camera monitor 1
Can be moved up and down.

Reference numeral 13a is a mark marked on the camera 2 side of the sliding part 28, and 13b is a mark marked on the holding part 24 side of the sliding part 28. The mark 13a and the mark 13b are aligned with each other at the camera position. By adjusting the irradiation portion a of the laser light A so as to be positioned substantially at the center of the imaging range of No. 2, if the imaging position of the camera 2 is aimed at the position where the mark 13a and the mark 13b match during inspection. , It is possible to easily set the imaging position.

Reference numeral 26 denotes a holding unit for holding the camera monitor 1 on the inspection table 24.

The inspection object stage 24 is provided with a first sliding table 24a that slides in the front-rear direction D and a second sliding table 24b that slides in the left-right direction C. The inspection object can be moved in all directions by moving in the directions D and C, and the camera 2 can capture and display images.

Reference numerals 44 and 45 are stopper knobs for inhibiting the sliding of the first slide table 24a and the second slide table 24b, respectively. By loosening the knobs 44 and 45, the slide table 24a is formed. , 24b can be slid. Numerals 54 and 55 are sliding grooves provided on the slide tables 24a and 24b, respectively.

Reference numeral 40 denotes a main switch of the camera monitor 1,
Reference numeral 41 is a lighting switch of the fluorescent lamp 11, 42 is a lighting switch for lighting the laser light source 3, and 43 is a still switch for recording an image captured by the camera 2 and displayed on the display unit 5.

FIG. 5 shows a usage state diagram of the printed circuit board device 25 'with a camera monitor shown in FIG. 50
Is a printed circuit board to be inspected (subject), and 56 is a second
It is a rail for moving the sliding base 24b of (1) in the left-right direction, and is fitted into the sliding groove 55.

A printed circuit board is placed on the slides 24a and 24b of the inspection object stand 24, the slides 24a and 24b are moved in desired directions C and D to perform image pickup alignment, and the camera 2 is moved. A detailed inspection can be performed by displaying an enlarged image of the inspection site on the display unit 5 by moving the inspection area downward.

FIG. 6 is a view showing a detailed configuration of the camera 2 and the laser light source 3 of the printed circuit board device 25 'with a camera monitor shown in FIGS. 4 and 5, and in FIG.
FIG. 6B is a side view of the imaging direction X of the camera 2 and the irradiation state of the laser light A of the laser light source 3, and FIG.
FIG. 6 is a diagram showing an irradiation portion a of a laser beam A on an object 50 and an imaging range x of the camera 2.

In the figure, the laser light A emitted from the laser light source 3 is emitted obliquely from above onto the inspection object (subject) 50 via the first mirror 46 and the second mirror 47. That is, the laser beam A and the optical axis of the camera 2 intersect each other.

The second mirror 47 is constructed so that the mounting angle can be adjusted about the axis 48, and as shown in FIG. 6B, the camera monitor 1 is moved in the upward direction a to a low magnification position. Then, the laser light A and the optical axis of the camera 2 are made to intersect with each other, and the irradiated portion a of the laser light A is changed to the camera 2
Is adjusted so as to come to the center of the image pickup range x, and in order to easily aim the image pickup site by the camera 2,
The marks 13a and 13b are marked so that the mark 13a and the mark 13b match at this position.

In this way, the mark 13a and the mark 13b are
By aiming the imaged region at a position where is coincident with each other, the portion a irradiated with the laser light A is displayed on the display unit 5. Then, the magnification of the camera 2 at the time of aiming the imaged part is at a low magnification position. However, depending on the type of the inspection object, it is easier to aim the sight by making the magnification higher or lower. So, for example, even if it is the same printed circuit board, a fine one like a film board,
Set the magnification of camera 2 at the time of aiming to a high level,
At that position, the irradiation portion a of the laser light A is adjusted so as to come to the center of the imaging range x of the camera 2, and the mark 13a
The mark may be engraved so that the mark and the mark 13b match.

In order to easily align the mark 13a with the mark 13b, a click is provided at a position where the marks 13a and 13b coincide with each other, and a click feeling caused by the click causes the operation knob 27 to rotate.
By making it possible for the operator to know that 3b and 3b match, it is not necessary to visually check the matching between the mark 13a and the mark 13b, so that the working efficiency can be improved.

FIG. 7 is a diagram showing a state in which the camera monitor 1 is moved downward in FIG. 6 and is positioned at a high magnification position of the camera 2. The camera 2 is moved downward in FIG. Thus, the relationship between the mark 13a and the mark 13b becomes as shown in the figure.

FIG. 7A is a side view of the image pickup direction X of the camera 2 and the irradiation state of the laser light A of the laser light source 3, and FIG. 7B is the irradiation state of the laser light A on the subject 50. FIG. 6 is a diagram showing a part a and an image pickup range x of the camera 2.

As shown in FIG. 6, the camera 2 is adjusted so that the irradiation portion a of the laser light A is located at the center of the image pickup range x at the low magnification position, as shown in FIG. When the camera 2 is moved at a high magnification position,
Since the laser light source 2 and the mirrors 46 and 47 move together, the irradiation portion a of the laser light A is out of the imaging range x.

Therefore, when the image pickup portion of the subject 50 is aimed (the camera 2 is at the low magnification position), the irradiated portion a of the laser light A is displayed together with the subject 50 in the approximate center of the display unit 5. Therefore, aiming of the imaged region can be easily performed. On the other hand, when the subject is enlarged and displayed and the inspection is performed in detail, the irradiation portion a of the laser light A deviates from the image pickup range x and is displayed on the display unit 5. Since it is not displayed, it does not hinder the detailed inspection even when the laser light A is constantly turned on.

Further, in this embodiment, since the laser light A is radiated to the subject 50 obliquely from the front side of the camera monitor 1, the camera monitor 1 is moved downward to the high magnification position. When positioned, the irradiation part a of the laser light A is irradiated slightly before the imaging range x of the camera 2 displayed on the display unit 5, so that the inspector grasps the rough position of the imaging part of the subject. It is possible to

In the above embodiment, the case where the camera monitor is used for the printed circuit board inspection apparatus is described. However, if the subject to be inspected is a photograph or a printed matter,
It can also be used as an inspection device to check the finish of photographs and prints, to print on various printers and copiers, and to check copy performance. In addition, it can also be used as a visual inspection (inspection for cracks, cracks, scratches, adhered substances, etc.) of manufactured parts, molded parts, various materials and the like.

FIG. 8 is for making the characters easy to see when the type of a book or newspaper is small and difficult to read.
FIG. 9 is a perspective view when the camera monitor 1 of the present invention is formed in a palm size that is small and has excellent portability so that anyone can use it anywhere, and FIG. 9 is a usage state diagram of the camera monitor of FIG. Yes, the book 32 is captured by a camera and enlarged and displayed.

The camera 2 has a CCD image pickup device, and the display unit 5 has L
If a CD panel is adopted, it can be constructed in a size and weight that can be held by hand as shown in FIG. Also,
By irradiating and showing the imaged region of the camera 2 with the laser light source 3, it is possible to easily catch and display the portion to be displayed on the display unit 5.

FIG. 10 is an overall perspective view showing another embodiment of the camera monitor, and FIG. 11 is a bottom view of the camera 2'shown in FIG. In the figure, reference numeral 2'denotes a camera, which includes a transparent portion 51 made of transparent plastic or the like. As shown in the bottom view of FIG. 11, the transparent portion 51 has a rectangular opening 52 in a portion that contacts a subject. It is provided.

The opening 52 is formed so as to match the display range of the display unit 5, and the inside of the opening 52 is displayed on the display unit 5. Reference numeral 53 is a lens of the camera 2.

In the example shown in FIG. 11, an optical pointer is not provided, but an opening 52 matching the display range of the display unit 5 is provided instead, and the inside of the opening 52 visible through the transparent portion 51 is seen. By visually observing, the imaging region can be easily specified.

[0044]

As described above, according to the camera monitor of the present invention, it is possible to easily grasp the image pickup portion of the camera and easily capture and display the portion to be displayed.

[Brief description of drawings]

FIG. 1 is a block diagram showing an overall configuration of a camera monitor of the present invention.

FIG. 2 is a diagram showing an example of irradiation of laser light from a light source 3.

FIG. 3 is an overall perspective view when the camera monitor of the present invention is adopted in a printed circuit board inspection device.

FIG. 4 is an overall perspective view showing another embodiment of the printed circuit board inspection device with a camera monitor of the present invention.

FIG. 5 is a diagram showing a usage state of a printed circuit board inspection device 25 ′ with a camera monitor of the present invention.

FIG. 6 is a diagram showing a detailed configuration of a camera 2 and a laser light source 3 of a printed circuit board device 25 ′ with a camera monitor.

FIG. 7 is a diagram showing a state in which the camera monitor 1 is moved downward in FIG. 5 and is positioned at a high magnification position of the camera 2.

FIG. 8 is a perspective view of the camera monitor of the present invention in the size of a palm.

FIG. 9 is a diagram showing the state of use of the palm-sized camera monitor of the present invention.

FIG. 10 is an overall perspective view showing another embodiment of the camera monitor of the present invention.

11 is a bottom view of the camera 2'shown in FIG. 9. FIG.

[Explanation of symbols]

 1 Camera Monitor 2 Camera 3 Light Source 4 Image Processing Section 5 Display Section 6 Control Section 7 Power Supply Section 8 I / F Section 9 Operating Section 10 Recording Section 11 Fluorescent Light 12 Through Hole 13a Mark 13b Mark 20 Printed Circuit Board 21 Inspection Board Stand 22 Camera Monitor Holding Flexible Arm 23 Connection Cable 24 Inspection Object Table 24a First Sliding Table 24b Second Sliding Table 25 Printed Circuit Board Inspection Device 26 Holding Section 27 Actuating Pick 28 Sliding Section 30 Newspaper 31 Hand 32 Books 40 Main switch 41 Lighting switch 42 Lighting switch 43 Still switch 44 Stopper knob 45 Stopper knob 46 First mirror 47 Second mirror 48 Axis 50 Subject 51 Transparent part 52 Opening 53 Lens 54 Sliding groove 55 Sliding groove 56 Rail

Claims (6)

[Claims] 1. A camera monitor comprising a camera for picking up an image of a subject, a monitor for displaying an image from the camera, and an optical pointer for indicating an image pickup position of the camera. 2. The camera monitor according to claim 1, wherein the optical pointer is a red laser. 3. A camera for picking up an image of a printed circuit board,
A monitor that displays an image from the camera, an optical pointer that indicates an imaging position of the camera, an inspection board mount on which a printed circuit board is mounted, and at least the camera and the optical pointer that are printed on the inspection board mount. A printed circuit board inspection device with a camera monitor, comprising: holding means for holding the board at a position where an image is taken. 4. A camera for picking up an image of an inspection object, a monitor for displaying an image from the camera, an optical pointer indicating an image pickup position of the camera, an inspection object table on which the inspection object is placed, and at least An inspection device with a camera monitor, comprising: the camera; and a holding unit that holds the optical pointer at a position where an image of an inspection object is picked up on the inspection table. 5. A camera for picking up an image of a printed circuit board,
A monitor that displays an image from the camera, an optical pointer that indicates an imaging position of the camera, an inspection board mount on which a printed circuit board is mounted, and at least the camera and the optical pointer that are printed on the inspection board mount. A printed circuit board inspection device with a camera monitor, comprising: a holding means for holding the substrate at a position for imaging, wherein the optical axis of the optical pointer and the optical axis of the camera intersect each other. When the image pickup range is widened and the magnification is low at a wide distance from the printed circuit board, the position on the printed circuit board pointed by the optical pointer is located substantially in the center of the image pickup range of the camera. Print with camera monitor, characterized in that the position on the printed circuit board pointed by the pointer is located outside the imaging range of the camera Substrate inspection device. 6. The printed circuit board inspection apparatus according to claim 5, further comprising a mark indicating a position where the optical pointer points at substantially the center of the image pickup range of the camera.