JPH0967420A - Production of resole-type phenolic resin composition - Google Patents
Production of resole-type phenolic resin compositionInfo
- Publication number
- JPH0967420A JPH0967420A JP22243995A JP22243995A JPH0967420A JP H0967420 A JPH0967420 A JP H0967420A JP 22243995 A JP22243995 A JP 22243995A JP 22243995 A JP22243995 A JP 22243995A JP H0967420 A JPH0967420 A JP H0967420A
- Authority
- JP
- Japan
- Prior art keywords
- mol
- phenol
- resin composition
- reaction
- resol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Phenolic Resins Or Amino Resins (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、例えば電気用積層
板に有用なレゾール型フェノール樹脂組成物の製法に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a resol type phenolic resin composition which is useful, for example, for electrical laminates.
【0002】[0002]
【従来の技術】レゾール型フェノール樹脂は、電気用積
層板に用いられる。すなわち、クラフト紙等の基材にレ
ゾール型フェノール樹脂を含むレゾール型フェノール樹
脂組成物(ワニス)を一旦含浸させて後に乾燥してプリ
プレグとし、このプリプレグを熱圧成形することにより
電気用積層板が製造される。Resol-type phenolic resins are used in electrical laminates. That is, a resol-type phenolic resin composition (varnish) containing a resol-type phenolic resin is once impregnated into a base material such as kraft paper and then dried to form a prepreg, and the prepreg is thermocompressed to form an electrical laminate. Manufactured.
【0003】このプリプレグの製造に要する乾燥時間
は、レゾール型フェノール樹脂の生成反応速度に依存す
る。そこで、反応速度を速めるためには、触媒量の増量
が有効であるが、レゾール型フェノール樹脂組成物中の
Bステージにある樹脂の分子量が増大し、その結果基材
への含浸が困難となり、電気用積層板としての性能から
観ると耐熱性や絶縁抵抗に悪影響を与える。The drying time required for the production of this prepreg depends on the reaction rate of formation of the resol type phenol resin. Therefore, in order to accelerate the reaction rate, it is effective to increase the amount of the catalyst, but the molecular weight of the resin in the B stage in the resol-type phenol resin composition increases, and as a result, impregnation of the base material becomes difficult, From the viewpoint of performance as an electrical laminate, it has a bad influence on heat resistance and insulation resistance.
【0004】[0004]
【発明が解決しようとする課題】本発明の目的は、上述
の如き実情に鑑み、基材への含浸性が良好で、且つ絶縁
抵抗の高い電気用積層板を与えるレゾール型フェノール
樹脂組成物の製法を提供するものである。SUMMARY OF THE INVENTION In view of the above-mentioned circumstances, an object of the present invention is to provide a resol type phenolic resin composition which has good impregnating ability for a base material and gives an electric laminate having high insulation resistance. It provides a manufacturing method.
【0005】[0005]
【課題を解決するための手段】本発明の請求項1に係る
レゾール型フェノール樹脂組成物の製法は、フェノール
類とホルムアルデヒドとを触媒の存在下で反応させるレ
ゾール型フェノール樹脂組成物の製法において、上記触
媒として3級アミンをフェノール1モルに対して0.0
3モル以下用いてフェノール類とホルムアルデヒドとを
反応させ、その後アンモニアをフェノール1モルに対し
て0.09モル以下用いて反応させることを特徴とする
もので、3級アミンの存在下での反応とこの反応後のア
ンモニアの存在下での反応を含む二段反応のうち、0.
03モル以下の3級アミンでの反応はレゾール型フェノ
ール樹脂の高分子化反応を抑制して、基材への含浸性を
改善し、結果として、絶縁抵抗の高い電気用積層板を与
えることができるものである。The method for producing a resol-type phenolic resin composition according to claim 1 of the present invention is the method for producing a resol-type phenolic resin composition in which phenols and formaldehyde are reacted in the presence of a catalyst. As the above catalyst, a tertiary amine is used in an amount of 0.0 to 1 mol of phenol.
It is characterized by reacting phenols with formaldehyde in an amount of 3 mol or less, and then reacting ammonia in an amount of 0.09 mol or less with respect to 1 mol of phenol, in the presence of a tertiary amine. Of the two-step reaction including the reaction in the presence of ammonia after this reaction, 0.
The reaction with a tertiary amine in an amount of 03 mol or less suppresses the polymerizing reaction of the resol-type phenol resin and improves the impregnating property of the base material, and as a result, an electrical laminate having high insulation resistance can be provided. It is possible.
【0006】[0006]
【発明の実施の形態】以下、この発明の実施形態につい
て具体的に説明する。Embodiments of the present invention will be specifically described below.
【0007】本発明のレゾール型フェノール樹脂組成物
の製法は、フェノール類とホルムアルデヒドとを触媒の
存在下で反応させるもので、フェノール類として一例を
挙げるとフェノール、クレゾール、これらの誘導体、さ
らに具体的には桐油で変性したフェノールを用いること
ができ、レゾール型フェノール樹脂を製造する公知の原
料組成を適用することができる。The method for producing the resol type phenolic resin composition of the present invention comprises reacting phenols with formaldehyde in the presence of a catalyst. Phenols, cresols, derivatives thereof, and more specifically A phenol modified with tung oil can be used for the material, and a known raw material composition for producing a resol-type phenol resin can be applied.
【0008】本発明は、二段反応でレゾール型フェノー
ル樹脂組成物わ製造する点に特徴があって、最初の反応
は3級アミンを触媒としてフェノール類とホルムアルデ
ヒドとを反応させ、この反応生成物に対して次の反応は
アンモニアを触媒として加えて反応を促進するものであ
る。すなわち、最初の反応はフェノール類1モルに対し
て3級アミン0.03モル以下の存在下で反応促進す
る。この反応では主としてメチロール化が進行するが、
3級アミンを0.03モルを越えて反応させると過度に
メチロール化が進行し、架橋反応に寄与する未反応のフ
ェノールが不足する。なお、3級アミンとしては、トリ
メチルアミン、トリエチルアミン、ベンジル治メチルア
ミン等が用いられる。The present invention is characterized in that a resol-type phenol resin composition is produced by a two-step reaction. In the first reaction, phenols and formaldehyde are reacted with a tertiary amine as a catalyst, and the reaction product On the other hand, in the next reaction, ammonia is added as a catalyst to promote the reaction. That is, the first reaction is accelerated in the presence of 0.03 mol or less of the tertiary amine with respect to 1 mol of the phenol. In this reaction, mainly methylation proceeds,
When the tertiary amine is reacted in excess of 0.03 mol, methylolation proceeds excessively, and unreacted phenol contributing to the crosslinking reaction becomes insufficient. As the tertiary amine, trimethylamine, triethylamine, benzyl-cured methylamine and the like are used.
【0009】3級アミンの存在下で反応させた後のアン
モニアの存在下での反応は、フェノール1モルに対して
アンモニア0.09モル以下でなされる。すなわち、ア
ンモニアが0.09モルを越えると、高分子量のレゾー
ル型フェノール樹脂が生成し、ワニスとして要求され
る、基材への含浸性が向上せず、結果として電気用積層
板の絶縁抵抗が増大しないからである。The reaction in the presence of ammonia after the reaction in the presence of a tertiary amine is carried out with 0.09 mol or less of ammonia per mol of phenol. That is, when the amount of ammonia exceeds 0.09 mol, a high-molecular-weight resol-type phenol resin is generated, and the impregnability into the base material required as a varnish is not improved, resulting in the insulation resistance of the electrical laminate. Because it does not increase.
【0010】以下に、実施例に係るレゾール型フェノー
ル樹脂組成物の製法とレゾール型フェノールを用いた電
気用積層板の特性について述べる。The method for producing the resol-type phenolic resin composition according to the examples and the characteristics of the electrical laminate using the resol-type phenol will be described below.
【0011】[0011]
(実施例1)フェノール100重量部(以下、単に部と
記す)、ホルマリン(ホルムアルデヒド37重量%(以
下、単に%と記す))70部を反応させてレゾール型フ
ェノール反応生成物Aを得た。また、メラミン100
部、ホルマリン(ホルムアルデヒド37%)100部を
反応させてメラミン反応生成物を得た。これらのレゾー
ル型フェノール反応生成物Aを50部、メラミン反応生
成物Bを50部混ぜた混合物とメタノール水溶液100
部混合して一次ワニスとした。この一次ワニスを126
g/m2 のクラフト紙に一次含浸した後135℃の乾燥
機で30秒乾燥して一次プリプレグAとした。Example 1 100 parts by weight of phenol (hereinafter simply referred to as “part”) and 70 parts of formalin (37% by weight of formaldehyde (hereinafter simply referred to as “%”)) were reacted to obtain a resol-type phenol reaction product A. Also, melamine 100
And 100 parts of formalin (37% formaldehyde) were reacted to obtain a melamine reaction product. A mixture of 50 parts of these resol-type phenol reaction products A and 50 parts of melamine reaction products B and an aqueous methanol solution 100
Parts were mixed to form a primary varnish. 126 this primary varnish
Primary prepreg A was obtained by first impregnating g / m 2 of kraft paper and then drying in a dryer at 135 ° C. for 30 seconds.
【0012】次にフェノール60部と桐油40部とをパ
ラトルエンスルホン酸0.5部の存在下で付加反応さ
せ、桐油−フェノール反応物を得た。この桐油−フェノ
ール反応物をトリエタノールアミンで中和した後ホルマ
リン(ホルムアルデヒド37%)32部添加し、さらに
トリエチルアミンをフェノールとホルムアルデヒドとの
反応触媒として0.9部(フェノール1モルに対して
0.014モル)添加し、反応温度80℃で60分反応
させた。この反応生成物にアンモニア水(アンモニア2
5%)を1.8部(フェノール1モルに対して0.04
2モル)を添加し、80℃で30分反応させ、その後減
圧脱水して得た生成物をメタノールで希釈し、本発明の
レゾール型フェノール樹脂組成物から成る二次ワニスと
した。Next, 60 parts of phenol and 40 parts of tung oil were subjected to an addition reaction in the presence of 0.5 part of paratoluenesulfonic acid to obtain a tung oil-phenol reaction product. After neutralizing the tung oil-phenol reaction product with triethanolamine, 32 parts of formalin (formaldehyde 37%) was added, and further 0.9 parts of triethylamine as a reaction catalyst of phenol and formaldehyde (0. 014 mol) was added, and the mixture was reacted at a reaction temperature of 80 ° C. for 60 minutes. Ammonia water (ammonia 2
5%) 1.8 parts (0.04 per mol of phenol)
(2 mol) was added, and the mixture was reacted at 80 ° C. for 30 minutes, and then dehydrated under reduced pressure, and the obtained product was diluted with methanol to obtain a secondary varnish consisting of the resole-type phenol resin composition of the present invention.
【0013】この二次ワニスを一次プリプレグAに含浸
後155℃の乾燥機で120秒間乾燥し二次プリプレグ
Bとした。After impregnating the primary prepreg A with this secondary varnish, it was dried in a dryer at 155 ° C. for 120 seconds to obtain a secondary prepreg B.
【0014】次にこの二次プリプレグBを8枚重ね、最
上層に厚さ0.35mmの銅箔を接着剤を介して圧力1
00kg/cm2 、温度160℃で60分熱圧成形し、
電気用積層板を得た。この積層板の沿層絶縁抵抗(JI
S1302)と曲げ強度を測定した。Next, eight sheets of this secondary prepreg B were stacked, and a copper foil having a thickness of 0.35 mm was placed on the uppermost layer through an adhesive to give a pressure of 1.
Thermocompression molding at 00 kg / cm 2 at a temperature of 160 ° C. for 60 minutes,
An electrical laminate was obtained. Insulation resistance (JI
S1302) and bending strength were measured.
【0015】(実施例2)実施例1における二次ワニス
に換えて、トリエチルアミン1.8部(フェノール1モ
ルに対して0.02モル)、アンモニア水3.6部(フ
ェノール1モルに対して0.08モル)を用い、70℃
で30分反応させて得た二次ワニスを用いた点、及びこ
の二次ワニスを一次プリプレグAに含浸後155℃の乾
燥機で70秒間乾燥し二次プリプレグBとした点を除く
と、実施例1と同一の条件で行った。(Example 2) In place of the secondary varnish in Example 1, 1.8 parts of triethylamine (0.02 mol per mol of phenol) and 3.6 parts of aqueous ammonia (based on 1 mol of phenol) were used. 0.08 mol) at 70 ° C
Except that a secondary varnish obtained by reacting for 30 minutes with the secondary varnish was used, and that the secondary varnish was impregnated with the primary prepreg A and then dried for 70 seconds in a dryer at 155 ° C. to obtain a secondary prepreg B. It carried out on the same conditions as Example 1.
【0016】(実施例3)実施例1における二次ワニス
に換えて、トリエチルアミン1.8部(フェノール1モ
ルに対して0.02モル)を加えて反応温度80℃で6
0分反応させた後、アンモニア水1.8部(フェノール
1モルに対して0.042モル)を添加して80℃で3
0分反応させて得た二次ワニスを用いた点、及びこの二
次ワニスを一次プリプレグAに含浸後155℃の乾燥機
で100秒間乾燥し二次プリプレグBとした点を除く
と、実施例1と同一の条件で行った。(Example 3) In place of the secondary varnish in Example 1, 1.8 parts of triethylamine (0.02 mol per mol of phenol) was added, and the reaction temperature was 80 ° C.
After reacting for 0 minutes, 1.8 parts of ammonia water (0.042 mol per 1 mol of phenol) was added and the mixture was stirred at 80 ° C. for 3 minutes.
Except that a secondary varnish obtained by reacting for 0 minutes was used, and that the secondary varnish was impregnated into the primary prepreg A and then dried for 100 seconds in a dryer at 155 ° C. to obtain a secondary prepreg B. It carried out on the same conditions as 1.
【0017】(比較例1)実施例1における二次ワニス
に換えて、トリエチルアミン2.7部(フェノール1モ
ルに対して0.04モル)を加えて反応温度80℃で6
0分反応させた後、アンモニア水5.4部(フェノール
1モルに対して0.12モル)を添加して80℃で30
分反応させて得た二次ワニスを用いた点、及びこの二次
ワニスを一次プリプレグAに含浸後155℃の乾燥機で
60秒間乾燥し二次プリプレグとした点を除くと、実施
例1と同一である。COMPARATIVE EXAMPLE 1 In place of the secondary varnish of Example 1, 2.7 parts of triethylamine (0.04 mol per mol of phenol) was added, and the reaction temperature was 80 ° C.
After reacting for 0 minutes, 5.4 parts of ammonia water (0.12 mol per mol of phenol) was added and the mixture was heated at 80 ° C. for 30 minutes.
Except that the secondary varnish obtained by the partial reaction was used and that the secondary varnish was impregnated with the primary prepreg A and then dried for 60 seconds in a dryer at 155 ° C. to obtain a secondary prepreg. It is the same.
【0018】(比較例2)実施例1における二次ワニス
に換えて、トリエチルアミン0.9部(フェノール1モ
ルに対して0.014モル)を加えて反応温度80℃で
60分反応させた後、アンモニア水4.8部(フェノー
ル1モルに対して0.11モル)を添加して80℃で3
0分反応させて得た二次ワニスを用いた点、及びこの二
次ワニスを一次プリプレグAに含浸後155℃の乾燥機
で60秒間乾燥し二次プリプレグとした点を除くと、実
施例1と同一条件で行った。(Comparative Example 2) In place of the secondary varnish in Example 1, 0.9 parts of triethylamine (0.014 mol per 1 mol of phenol) was added and reacted at a reaction temperature of 80 ° C. for 60 minutes. Add 4.8 parts of ammonia water (0.11 mol to 1 mol of phenol), and add 3 at 80 ° C.
Example 1 except that a secondary varnish obtained by reacting for 0 minutes was used, and that the secondary varnish was impregnated with the primary prepreg A and then dried for 60 seconds in a dryer at 155 ° C. to obtain a secondary prepreg. The same conditions were used.
【0019】(比較例3)実施例1における二次ワニス
に換えて、トリエチルアミン0.9部(フェノール1モ
ルに対して0.014モル)とアンモニア水1.8部
(フェノール1モルに対して0.042モル)を同時に
添加して80℃で60分反応させて得たワニスを用スを
用いた点、及びこのワニスを一次プリプレグAに含浸後
155℃の乾燥機で120秒間乾燥し二次プリプレグと
した点を除くと、実施例1と同一条件で行った。(Comparative Example 3) In place of the secondary varnish in Example 1, 0.9 parts of triethylamine (0.014 mol per 1 mol of phenol) and 1.8 parts of ammonia water (based on 1 mol of phenol) were used. 0.042 mol) was added at the same time and reacted at 80 ° C. for 60 minutes, using a varnish, and after the primary prepreg A was impregnated with this varnish, it was dried for 120 seconds in a dryer at 155 ° C. The conditions were the same as in Example 1 except that the next prepreg was used.
【0020】以上の実施例と比較例において、一次プリ
プレグAに含浸したレゾール型フェノール樹脂組成物
(ワニス)の粘度、及びこのレゾール型フェノール樹脂
組成物を一次プリプレグAに含浸後乾燥にのみ要した乾
燥時間と二次プリプレグを用いて製造した電気用積層板
の沿層絶縁抵抗と曲げ強度の測定値を(表1)に示す。In the above Examples and Comparative Examples, the viscosity of the resol type phenolic resin composition (varnish) impregnated into the primary prepreg A and the impregnation of the resol type phenolic resin composition into the primary prepreg A were required only for drying. Table 1 shows the measured values of the creeping insulation resistance and bending strength of the electrical laminate produced using the drying time and the secondary prepreg.
【0021】[0021]
【表1】 [Table 1]
【0022】(表1)に示す如く、実施例と比較例を対
比すると、本発明の実施例にあっては、ワニス粘度が小
さいことから、高分子のフェノール樹脂の生成はなく、
従って基材への含浸性が良好で、且つ乾燥時間は僅か6
0秒程度ながく要してはいるものの、電気用積層板とし
ての絶縁抵抗が大幅に向上していることが明白である。As shown in (Table 1), when the examples and the comparative examples are compared, in the examples of the present invention, since the viscosity of the varnish is small, no high-molecular phenol resin is produced,
Therefore, the substrate has good impregnation property and the drying time is only 6
Although it takes about 0 seconds, it is clear that the insulation resistance of the electrical laminate is significantly improved.
【0023】[0023]
【発明の効果】本発明の製法によって得られたレゾール
型フェノール樹脂組成物によると、基材への含浸性が良
好で、且つ絶縁抵抗の高い電気用積層板を与えるもので
ある。According to the resol type phenolic resin composition obtained by the production method of the present invention, it is possible to provide a laminate for electrical use which has a good impregnation property into a substrate and a high insulation resistance.
Claims (1)
媒の存在下で反応させるレゾール型フェノール樹脂組成
物の製法において、上記触媒として3級アミンをフェノ
ール1モルに対して0.03モル以下用いてフェノール
類とホルムアルデヒドとを反応させ、その後アンモニア
をフェノール1モルに対して0.09モル以下用いて反
応させることを特徴とするレゾール型フェノール樹脂組
成物の製法。1. A method for producing a resol-type phenolic resin composition, which comprises reacting phenols with formaldehyde in the presence of a catalyst, wherein a tertiary amine is used as the catalyst in an amount of 0.03 mol or less relative to 1 mol of phenol. And a formaldehyde are reacted with each other, and then ammonia is used in an amount of 0.09 mol or less with respect to 1 mol of phenol to react, and a method for producing a resol-type phenol resin composition is characterized.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22243995A JPH0967420A (en) | 1995-08-31 | 1995-08-31 | Production of resole-type phenolic resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22243995A JPH0967420A (en) | 1995-08-31 | 1995-08-31 | Production of resole-type phenolic resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0967420A true JPH0967420A (en) | 1997-03-11 |
Family
ID=16782424
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22243995A Pending JPH0967420A (en) | 1995-08-31 | 1995-08-31 | Production of resole-type phenolic resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0967420A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009538943A (en) * | 2006-06-02 | 2009-11-12 | ディーエスエム アイピー アセッツ ビー.ブイ. | Method for preparing hydroxy aromatic resin, hydroxy aromatic resin, and modification thereof |
-
1995
- 1995-08-31 JP JP22243995A patent/JPH0967420A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009538943A (en) * | 2006-06-02 | 2009-11-12 | ディーエスエム アイピー アセッツ ビー.ブイ. | Method for preparing hydroxy aromatic resin, hydroxy aromatic resin, and modification thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0967420A (en) | Production of resole-type phenolic resin composition | |
JP3298369B2 (en) | Method for producing phenolic resin composition | |
JPH11279514A (en) | Resin varnish, resin paper and laminate | |
JP3065383B2 (en) | Manufacturing method of phenolic resin laminate | |
JPH0574609B2 (en) | ||
JP3252730B2 (en) | Method for producing phenolic resin composition | |
JP2001181417A (en) | Prepreg and copper-clad laminate | |
KR820001054B1 (en) | Process for producing phenolic resins | |
JP3302176B2 (en) | Resin composition for laminated board and laminated board using the same | |
JPS58118813A (en) | Production of oil-modified phenolic resin | |
JPH05138793A (en) | Manufacture of phenol ic resin laminate | |
JPS58164613A (en) | Production of oil-modified phenolic resin for laminate | |
JPH0680859A (en) | Phenolic resin composition | |
JPH05230231A (en) | Production of phenolic resin laminate | |
JPH0912686A (en) | Phenolic resin composition, prepreg using the phenolic resin composition, and laminated board wherein that prepreg is used | |
JPH09157414A (en) | Production of phenol resin | |
JPS61246220A (en) | Production of oiticica oil-modified phenolic resin | |
JPS6172029A (en) | Production of laminate | |
JPS61296037A (en) | Production of paper-based phenolic resin laminated sheet | |
JPH05220882A (en) | Production of phenol resin laminated sheet | |
JPH05320298A (en) | Production of oil-modified phenolic resin for use in laminate | |
JPH05154955A (en) | Production of phenol resin laminated sheet | |
JP2002145975A (en) | Phenol resin composition for laminate and method for producing phenol resin copper-clad laminate using the same phenol resin composition | |
JPS60177033A (en) | Production of laminated board | |
JPS6172028A (en) | Production of laminate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20010605 |