JPH09512567A - 高温耐性を有する帯電防止性感圧接着テープ - Google Patents
高温耐性を有する帯電防止性感圧接着テープInfo
- Publication number
- JPH09512567A JPH09512567A JP7526345A JP52634595A JPH09512567A JP H09512567 A JPH09512567 A JP H09512567A JP 7526345 A JP7526345 A JP 7526345A JP 52634595 A JP52634595 A JP 52634595A JP H09512567 A JPH09512567 A JP H09512567A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive tape
- sensitive adhesive
- acrylate
- polymer
- meth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 21
- 230000001070 adhesive effect Effects 0.000 claims abstract description 52
- 239000000853 adhesive Substances 0.000 claims abstract description 50
- -1 alkali metal salt Chemical class 0.000 claims abstract description 35
- 229920000642 polymer Polymers 0.000 claims abstract description 29
- 239000000203 mixture Substances 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 229910000679 solder Inorganic materials 0.000 claims abstract description 17
- 150000003839 salts Chemical class 0.000 claims abstract description 12
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 9
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 8
- 150000001875 compounds Chemical class 0.000 claims abstract description 8
- 239000004020 conductor Substances 0.000 claims abstract description 8
- 239000005011 phenolic resin Substances 0.000 claims abstract description 7
- 229910052783 alkali metal Inorganic materials 0.000 claims abstract description 5
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims abstract description 5
- 239000003792 electrolyte Substances 0.000 claims abstract description 4
- 238000007654 immersion Methods 0.000 claims abstract 2
- 239000000178 monomer Substances 0.000 claims description 35
- 239000002987 primer (paints) Substances 0.000 claims description 25
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 18
- 239000005518 polymer electrolyte Substances 0.000 claims description 17
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 12
- 239000002390 adhesive tape Substances 0.000 claims description 11
- 125000000217 alkyl group Chemical group 0.000 claims description 9
- 229920001567 vinyl ester resin Polymers 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 239000011859 microparticle Substances 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 5
- 229920001748 polybutylene Polymers 0.000 claims description 5
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 4
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 4
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 4
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 4
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 4
- LZWYWAIOTBEZFN-UHFFFAOYSA-N ethenyl hexanoate Chemical compound CCCCCC(=O)OC=C LZWYWAIOTBEZFN-UHFFFAOYSA-N 0.000 claims description 4
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 claims description 4
- 229920001084 poly(chloroprene) Polymers 0.000 claims description 4
- 229920006254 polymer film Polymers 0.000 claims description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 3
- 239000005062 Polybutadiene Substances 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 150000003926 acrylamides Chemical class 0.000 claims description 3
- 150000001340 alkali metals Chemical class 0.000 claims description 3
- 239000002585 base Substances 0.000 claims description 3
- 229920005549 butyl rubber Polymers 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 229920002857 polybutadiene Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920001195 polyisoprene Polymers 0.000 claims description 3
- 229920001451 polypropylene glycol Polymers 0.000 claims description 3
- VSKJLJHPAFKHBX-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 VSKJLJHPAFKHBX-UHFFFAOYSA-N 0.000 claims description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 claims description 2
- 229920002873 Polyethylenimine Polymers 0.000 claims description 2
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 2
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 claims description 2
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- IGBZOHMCHDADGY-UHFFFAOYSA-N ethenyl 2-ethylhexanoate Chemical compound CCCCC(CC)C(=O)OC=C IGBZOHMCHDADGY-UHFFFAOYSA-N 0.000 claims description 2
- CMDXMIHZUJPRHG-UHFFFAOYSA-N ethenyl decanoate Chemical compound CCCCCCCCCC(=O)OC=C CMDXMIHZUJPRHG-UHFFFAOYSA-N 0.000 claims description 2
- QBDADGJLZNIRFQ-UHFFFAOYSA-N ethenyl octanoate Chemical compound CCCCCCCC(=O)OC=C QBDADGJLZNIRFQ-UHFFFAOYSA-N 0.000 claims description 2
- BLCTWBJQROOONQ-UHFFFAOYSA-N ethenyl prop-2-enoate Chemical compound C=COC(=O)C=C BLCTWBJQROOONQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000011152 fibreglass Substances 0.000 claims description 2
- 150000002466 imines Chemical class 0.000 claims description 2
- 150000002500 ions Chemical class 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000004745 nonwoven fabric Substances 0.000 claims description 2
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 2
- VGTPCRGMBIAPIM-UHFFFAOYSA-M sodium thiocyanate Chemical compound [Na+].[S-]C#N VGTPCRGMBIAPIM-UHFFFAOYSA-M 0.000 claims description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims description 2
- YCJYNBLLJHFIIW-MBABXGOBSA-N validoxylamine A Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)C[C@@H]1N[C@@H]1[C@H](O)[C@@H](O)[C@H](O)C(CO)=C1 YCJYNBLLJHFIIW-MBABXGOBSA-N 0.000 claims description 2
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 claims 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 claims 1
- 239000004641 Diallyl-phthalate Substances 0.000 claims 1
- 229910013553 LiNO Inorganic materials 0.000 claims 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 claims 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- GLVVKKSPKXTQRB-UHFFFAOYSA-N ethenyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OC=C GLVVKKSPKXTQRB-UHFFFAOYSA-N 0.000 claims 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 claims 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims 1
- 230000003449 preventive effect Effects 0.000 claims 1
- 239000002245 particle Substances 0.000 description 32
- 239000003995 emulsifying agent Substances 0.000 description 18
- 239000010419 fine particle Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 239000012071 phase Substances 0.000 description 11
- 239000000243 solution Substances 0.000 description 10
- 229910000831 Steel Inorganic materials 0.000 description 9
- 239000007900 aqueous suspension Substances 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 239000010959 steel Substances 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000007788 liquid Substances 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 238000004945 emulsification Methods 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- 239000000725 suspension Substances 0.000 description 7
- 230000000873 masking effect Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 5
- BTBJBAZGXNKLQC-UHFFFAOYSA-N ammonium lauryl sulfate Chemical compound [NH4+].CCCCCCCCCCCCOS([O-])(=O)=O BTBJBAZGXNKLQC-UHFFFAOYSA-N 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 239000003999 initiator Substances 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 239000000839 emulsion Substances 0.000 description 4
- 239000004816 latex Substances 0.000 description 4
- 229920000126 latex Polymers 0.000 description 4
- IIPYXGDZVMZOAP-UHFFFAOYSA-N lithium nitrate Chemical compound [Li+].[O-][N+]([O-])=O IIPYXGDZVMZOAP-UHFFFAOYSA-N 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- 239000011800 void material Substances 0.000 description 4
- 239000007762 w/o emulsion Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000004342 Benzoyl peroxide Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000005250 alkyl acrylate group Chemical group 0.000 description 3
- 229940063953 ammonium lauryl sulfate Drugs 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 239000008346 aqueous phase Substances 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 3
- 239000012964 benzotriazole Substances 0.000 description 3
- 235000019400 benzoyl peroxide Nutrition 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 238000011068 loading method Methods 0.000 description 3
- 239000000693 micelle Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910021653 sulphate ion Inorganic materials 0.000 description 3
- 238000010557 suspension polymerization reaction Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000002562 thickening agent Substances 0.000 description 3
- ALSTYHKOOCGGFT-KTKRTIGZSA-N (9Z)-octadecen-1-ol Chemical compound CCCCCCCC\C=C/CCCCCCCCO ALSTYHKOOCGGFT-KTKRTIGZSA-N 0.000 description 2
- ZORQXIQZAOLNGE-UHFFFAOYSA-N 1,1-difluorocyclohexane Chemical compound FC1(F)CCCCC1 ZORQXIQZAOLNGE-UHFFFAOYSA-N 0.000 description 2
- LMAUULKNZLEMGN-UHFFFAOYSA-N 1-ethyl-3,5-dimethylbenzene Chemical compound CCC1=CC(C)=CC(C)=C1 LMAUULKNZLEMGN-UHFFFAOYSA-N 0.000 description 2
- ZVYGIPWYVVJFRW-UHFFFAOYSA-N 3-methylbutyl prop-2-enoate Chemical compound CC(C)CCOC(=O)C=C ZVYGIPWYVVJFRW-UHFFFAOYSA-N 0.000 description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
- CUXGDKOCSSIRKK-UHFFFAOYSA-N 7-methyloctyl prop-2-enoate Chemical compound CC(C)CCCCCCOC(=O)C=C CUXGDKOCSSIRKK-UHFFFAOYSA-N 0.000 description 2
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004971 Cross linker Substances 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 150000001346 alkyl aryl ethers Chemical class 0.000 description 2
- 125000002877 alkyl aryl group Chemical group 0.000 description 2
- 150000008051 alkyl sulfates Chemical class 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002609 medium Substances 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 239000008267 milk Substances 0.000 description 2
- 210000004080 milk Anatomy 0.000 description 2
- 235000013336 milk Nutrition 0.000 description 2
- 238000005065 mining Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000007764 o/w emulsion Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920000867 polyelectrolyte Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 239000013464 silicone adhesive Substances 0.000 description 2
- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 description 2
- 241000894007 species Species 0.000 description 2
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- GPRLSGONYQIRFK-MNYXATJNSA-N triton Chemical compound [3H+] GPRLSGONYQIRFK-MNYXATJNSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- VOBUAPTXJKMNCT-UHFFFAOYSA-N 1-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound CCCCCC(OC(=O)C=C)OC(=O)C=C VOBUAPTXJKMNCT-UHFFFAOYSA-N 0.000 description 1
- DSCFFEYYQKSRSV-UHFFFAOYSA-N 1L-O1-methyl-muco-inositol Natural products COC1C(O)C(O)C(O)C(O)C1O DSCFFEYYQKSRSV-UHFFFAOYSA-N 0.000 description 1
- GPMCZKILFBRNNY-UHFFFAOYSA-N 2,3-bis(2-methylbutan-2-yl)benzene-1,4-diol Chemical compound CCC(C)(C)C1=C(O)C=CC(O)=C1C(C)(C)CC GPMCZKILFBRNNY-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- LJKDOMVGKKPJBH-UHFFFAOYSA-N 2-ethylhexyl dihydrogen phosphate Chemical compound CCCCC(CC)COP(O)(O)=O LJKDOMVGKKPJBH-UHFFFAOYSA-N 0.000 description 1
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 description 1
- NCTBYWFEJFTVEL-UHFFFAOYSA-N 2-methylbutyl prop-2-enoate Chemical compound CCC(C)COC(=O)C=C NCTBYWFEJFTVEL-UHFFFAOYSA-N 0.000 description 1
- DXIJHCSGLOHNES-UHFFFAOYSA-N 3,3-dimethylbut-1-enylbenzene Chemical compound CC(C)(C)C=CC1=CC=CC=C1 DXIJHCSGLOHNES-UHFFFAOYSA-N 0.000 description 1
- BVDBXCXQMHBGQM-UHFFFAOYSA-N 4-methylpentan-2-yl prop-2-enoate Chemical compound CC(C)CC(C)OC(=O)C=C BVDBXCXQMHBGQM-UHFFFAOYSA-N 0.000 description 1
- LIFHMKCDDVTICL-UHFFFAOYSA-N 6-(chloromethyl)phenanthridine Chemical compound C1=CC=C2C(CCl)=NC3=CC=CC=C3C2=C1 LIFHMKCDDVTICL-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 244000147568 Laurus nobilis Species 0.000 description 1
- 235000017858 Laurus nobilis Nutrition 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
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- 239000003344 environmental pollutant Substances 0.000 description 1
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- 159000000002 lithium salts Chemical class 0.000 description 1
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- XMLQWXUVTXCDDL-UHFFFAOYSA-N oleyl alcohol Natural products CCCCCCC=CCCCCCCCCCCO XMLQWXUVTXCDDL-UHFFFAOYSA-N 0.000 description 1
- ZDHCZVWCTKTBRY-UHFFFAOYSA-N omega-Hydroxydodecanoic acid Natural products OCCCCCCCCCCCC(O)=O ZDHCZVWCTKTBRY-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- GSWAOPJLTADLTN-UHFFFAOYSA-N oxidanimine Chemical compound [O-][NH3+] GSWAOPJLTADLTN-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- VLTOSDJJTWPWLS-UHFFFAOYSA-N pent-2-ynal Chemical compound CCC#CC=O VLTOSDJJTWPWLS-UHFFFAOYSA-N 0.000 description 1
- BNIXVQGCZULYKV-UHFFFAOYSA-N pentachloroethane Chemical compound ClC(Cl)C(Cl)(Cl)Cl BNIXVQGCZULYKV-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- FTDXCHCAMNRNNY-UHFFFAOYSA-N phenol Chemical compound OC1=CC=CC=C1.OC1=CC=CC=C1 FTDXCHCAMNRNNY-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920001983 poloxamer Polymers 0.000 description 1
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- 229920002432 poly(vinyl methyl ether) polymer Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920005596 polymer binder Polymers 0.000 description 1
- 239000002491 polymer binding agent Substances 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
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- 229920000098 polyolefin Polymers 0.000 description 1
- 150000003097 polyterpenes Chemical class 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 1
- SONHXMAHPHADTF-UHFFFAOYSA-M sodium;2-methylprop-2-enoate Chemical compound [Na+].CC(=C)C([O-])=O SONHXMAHPHADTF-UHFFFAOYSA-M 0.000 description 1
- GGHPAKFFUZUEKL-UHFFFAOYSA-M sodium;hexadecyl sulfate Chemical compound [Na+].CCCCCCCCCCCCCCCCOS([O-])(=O)=O GGHPAKFFUZUEKL-UHFFFAOYSA-M 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000001593 sorbitan monooleate Substances 0.000 description 1
- 235000011069 sorbitan monooleate Nutrition 0.000 description 1
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- 230000003068 static effect Effects 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- MXODCLTZTIFYDV-UHFFFAOYSA-L zinc;1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylate Chemical compound [Zn+2].C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C([O-])=O.C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C([O-])=O MXODCLTZTIFYDV-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/125—Inorganic compounds, e.g. silver salt
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/254—Polymeric or resinous material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2843—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including a primer layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2998—Coated including synthetic resin or polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31859—Next to an aldehyde or ketone condensation product
- Y10T428/31877—Phenol-aldehyde
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31909—Next to second addition polymer from unsaturated monomers
- Y10T428/31928—Ester, halide or nitrile of addition polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.2つの表面を有する基材を含んで成り、前記表面の少なくとも一方の上に 平均直径が少なくとも1μmの微粒子接着剤を有し、該微粒子の表面上に、ポリ マー電解質をベースとするポリマー、並びにアルカリ金属の塩およびアルカリ土 類金属の塩からなる群より選ばれる少なくとも1種のイオン性塩から形成された イオン的導電性材料を有し、前記接着剤がプライマーを用いて基材に接着してお り、プライマーが少なくとも1つのフェノール性樹脂および少なくとも1つのゴ ム状化合物を含んで成る帯電防止性感圧接着テープであり、該接着テープが26 0℃の溶融はんだ中で少なくとも5秒間の浸漬に耐えることのできる耐熱性を有 する感圧接着テープ。 2.フェノール性樹脂がフェノール−ホルムアルデヒド樹脂である請求項1に 記載の耐熱性を有する帯電防止性感圧接着テープ。 3.プライマーコーティングが、ブチルゴム、アクリロニトリル−ブタジエン 、アクリロニトリル−ブタジエン−スチレンコポリマー、スチレン−ブタジエン −スチレン、スチレン−エチレンブチレン−スチレンコポリマー、ポリクロロプ レン、ポリブタジエン、ポリイソプレン、スチレン−イソプレン−スチレン、お よびそれらの混合物からなる群より選ばれるゴム状化合物を含んで成る請求項1 に記載の耐熱性を有する帯電防止性感圧接着テープ。 4.プライマーコーティングが、アクリロニトリル−ブタジエン−スチレンコ ポリマーとポリクロロプレンの混合物を含んで成る請求項1に記載の耐熱性を有 する帯電防止性感圧接着テープ。 5.微粒子接着剤が a)少なくとも1つのアルキル(メタ)アクリレートまたはビニルエステル少な くとも70部、 b)それと対応して、100部のモノマーを作製するために、少なくとも1つの 極性モノマー30部まで から構成されるモノマーのポリマーを含んで成り、イオン導電性材料がポリエチ レンオキサイド、ポリフェニレンオキサイド、ポリフェニレンスルフィド、ポリ エチレンスルフィド、ポリエチレンイミン、ポリプロピレンオキサイド、ポリブ チレンオキサイド、ポリブチレンスルフィド、およびポリブチレンイミンからな る群より選ばれるポリマー電解質をベースとするポリマーから形成されたポリマ ー電解質を含んで成り、該ポリマー電解質をベースとするポリマーが、0.1〜 10部の量で添加される請求項1に記載の耐熱性を有する帯電防止性感圧接着テ ープ。 6.イオン導電性材料が、ポリマー電解質をベースとする単位1モルにつき、 アルカリ金属またはアルカリ土類金属の少なくとも1つの塩0.01〜10モル を含んで成る請求項1に記載の耐熱性を有する帯電防止性感圧接着テープ。 7.塩が、LiCl、LiNO3、LiCF3SO3、LiSO4、LiOH、K OH、NaSCN、NaI、BaSO3CF3、およびNH4OHからなる群より 選ばれる請求項6に記載の耐熱性を有する帯電防止性感圧接着テープ。 8.アルキル(メタ)アクリレートが、イソオクチル(メタ)アクリレート、 2−エチルヘキシル(メタ)アクリレート、イソノニル(メタ)アクリレート、 イソアミル(メタ)アクリレート、イソデシル(メタ)アクリレート、およびブ チル(メタ)アクリレートからなる群より選ばれ、ビニルエステルが、ビニル− 2−エチルヘキサノエート、ビニルカプロエート、ビニルラウレート、ビニルペ ラルゴネート、ビニルヘキサノエート、ビニルプロピオネート、ビニルデカノエ ート、およびビニルオクタノエートからなる群より選ばれ、並びに極性モノマー が、N−ビニル−2−ピロリドン、N−ビニルカプロラクタム、アクリロニトリ ル、ビニルアクリレート、ジアリルフタレート、アクリル酸、メタクリル酸、イ タコン酸、ヒドロキシアルキルアクリレート、シアノアルキルアクリレート、ア クリルアミド、および置換アクリルアミドからなる群より選ばれる請求項5に記 載の耐熱性を有する帯電防止性感圧接着テープ。 9.基材が、ポリイミド、ポリフェニレンスルフィド、熱処理した不織布、フ ァイバーガラス、金属化ポリマーフィルム、セラミックシート材料、および金属 箔からなる群より選ばれる請求項1に記載の耐熱性を有する帯電防止性感圧接着 テ ープ。 10.基材がポリイミドである請求項9に記載の耐熱性を有する帯電防止性感 圧接着テープ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US23930994A | 1994-05-06 | 1994-05-06 | |
US08/239,309 | 1994-05-06 | ||
PCT/US1995/003381 WO1995030720A1 (en) | 1994-05-06 | 1995-03-16 | High temperature resistant antistatic pressure-sensitive adhesive tape |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09512567A true JPH09512567A (ja) | 1997-12-16 |
JP3473701B2 JP3473701B2 (ja) | 2003-12-08 |
Family
ID=22901605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52634595A Expired - Fee Related JP3473701B2 (ja) | 1994-05-06 | 1995-03-16 | 高温耐性を有する帯電防止性感圧接着テープ |
Country Status (9)
Country | Link |
---|---|
US (1) | US5631079A (ja) |
EP (1) | EP0758366B1 (ja) |
JP (1) | JP3473701B2 (ja) |
KR (1) | KR970702906A (ja) |
CN (1) | CN1147268A (ja) |
DE (1) | DE69507609T2 (ja) |
MX (1) | MX9605243A (ja) |
MY (1) | MY113845A (ja) |
WO (1) | WO1995030720A1 (ja) |
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US5914186A (en) * | 1994-05-06 | 1999-06-22 | Minnesota Mining And Manufacturing Company | High temperature resistant antistatic pressure-sensitive adhesive tape |
US5759431A (en) * | 1994-12-15 | 1998-06-02 | Minnesota Mining And Manufacturing Company | Stain resistant composition containing sulphonated surfactant |
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JP2002319316A (ja) * | 2001-02-15 | 2002-10-31 | Sumitomo Chem Co Ltd | 絶縁フィルム類 |
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JP2005314579A (ja) * | 2004-04-30 | 2005-11-10 | Nitto Denko Corp | 粘着剤組成物、および粘着シート類 |
TW200617124A (en) | 2004-06-01 | 2006-06-01 | Nitto Denko Corp | Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet and surface protecting film |
US20080166523A1 (en) * | 2007-01-04 | 2008-07-10 | Asahi Kasei Chemicals Corporation | Tab leader tape made of polyphenylene ether-based resin |
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KR100694445B1 (ko) * | 2004-08-24 | 2007-03-12 | 주식회사 엘지화학 | 대전 방지 성능을 갖는 아크릴계 점착제 조성물 |
JP4917267B2 (ja) * | 2004-09-16 | 2012-04-18 | 日東電工株式会社 | 粘着剤組成物、粘着シート類、および表面保護フィルム |
JP4531628B2 (ja) | 2004-09-16 | 2010-08-25 | 日東電工株式会社 | 粘着剤組成物、粘着シート類、および表面保護フィルム |
JP4358190B2 (ja) * | 2005-03-16 | 2009-11-04 | 日東電工株式会社 | 粘着剤組成物、粘着シート類および表面保護フィルム |
US8404344B2 (en) * | 2005-05-20 | 2013-03-26 | Nitto Denko Corporation | Pressure sensitive adhesive composition, pressure sensitive adhesive sheet and surface protective film |
JP5259940B2 (ja) * | 2005-09-05 | 2013-08-07 | 日東電工株式会社 | 粘着剤組成物、粘着シートおよび表面保護フィルム |
WO2007029681A1 (ja) * | 2005-09-05 | 2007-03-15 | Nitto Denko Corporation | 粘着剤組成物、粘着シート、および表面保護フィルム |
MXPA06010596A (es) * | 2005-12-23 | 2007-06-22 | 3M Innovative Properties Co | Pelicula adhesiva con resistencia a altas temperaturas y baja generacion de electrostatica, construida con un polimero de polieterimida. |
JP4636183B2 (ja) * | 2006-09-26 | 2011-02-23 | 日立化成工業株式会社 | 異方導電性接着剤組成物、異方導電性フィルム、回路部材の接続構造、及び、被覆粒子の製造方法 |
CN101775259A (zh) | 2009-01-09 | 2010-07-14 | 3M创新有限公司 | 一种防静电的耐高温聚酰亚胺胶带 |
JP5623020B2 (ja) | 2009-02-27 | 2014-11-12 | 日東電工株式会社 | 粘着剤組成物、粘着剤層、及び、粘着シート |
US8986831B2 (en) | 2011-05-24 | 2015-03-24 | H. B. Fuller Company | Pressure sensitive adhesive tear tape |
CN102497170A (zh) * | 2011-12-06 | 2012-06-13 | 爱普科斯科技(无锡)有限公司 | 一种用于层压板表面图贴装和回流焊的载具 |
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EP3368020B1 (en) * | 2015-10-26 | 2021-07-28 | University of Wyoming | Methods of generating microparticles and porous hydrogels using microfluidics |
CN106281201A (zh) * | 2016-08-29 | 2017-01-04 | 无锡万能胶粘剂有限公司 | 一种厌氧胶 |
US11642642B2 (en) | 2017-10-17 | 2023-05-09 | University Of Wyoming | Exploiting oxygen inhibited photopolymerization within emulsion droplets for the fabrication of microparticles with customizable properties |
CN108130003A (zh) * | 2017-12-19 | 2018-06-08 | 江苏斯瑞达新材料科技有限公司 | 电子元器件用防水耐热保护膜 |
CN110240875B (zh) * | 2019-06-11 | 2021-06-01 | 恩平市盈嘉丰胶粘制品有限公司 | 一种耐高温石棉纸胶带及其制备方法 |
CN113801601A (zh) * | 2021-09-27 | 2021-12-17 | 浙江福莱新材料股份有限公司 | 一种抗静电弹性防滑胶带及其制备方法 |
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US3104985A (en) * | 1959-01-06 | 1963-09-24 | Cabot Corp | Conducting polymer compositions |
US3691140A (en) * | 1970-03-09 | 1972-09-12 | Spencer Ferguson Silver | Acrylate copolymer microspheres |
US3832598A (en) * | 1972-10-02 | 1974-08-27 | Minnesota Mining & Mfg | Electrically conductive tape device |
US4166152B1 (en) * | 1977-08-17 | 1999-05-18 | Minnesota Mining & Mfg | Tacky polymeric microspheres |
DE8434291U1 (de) * | 1984-11-23 | 1986-03-27 | Beiersdorf Ag, 2000 Hamburg | Klebeband |
GB2170427B (en) * | 1985-02-01 | 1989-06-07 | Sanyo Kokusaku Pulp Co | Pressure-sensitive adhesive tapes or sheets |
US4656218A (en) * | 1985-02-08 | 1987-04-07 | Sanyo Kokusaku Pulp Co., Ltd. | Adhesive copolymer microspheres-containing aqueous suspension and method for producing the same |
JPS6312681A (ja) * | 1986-07-02 | 1988-01-20 | Sekisui Chem Co Ltd | 帯電防止粘着テ−プもしくはシ−ト |
US5045569A (en) * | 1988-11-30 | 1991-09-03 | Minnesota Mining And Manufacturing Company | Hollow acrylate polymer microspheres |
IE67319B1 (en) * | 1989-10-11 | 1996-03-20 | Waterford Res & Dev Ltd | Antistatic adhesive tape |
US5378405A (en) * | 1993-07-28 | 1995-01-03 | Minnesota Mining And Manufacturing Company | Conductive microparticles and pressure-sensitive adhesive tapes made therefrom |
-
1995
- 1995-03-16 DE DE69507609T patent/DE69507609T2/de not_active Expired - Lifetime
- 1995-03-16 CN CN95192921A patent/CN1147268A/zh active Pending
- 1995-03-16 WO PCT/US1995/003381 patent/WO1995030720A1/en active IP Right Grant
- 1995-03-16 JP JP52634595A patent/JP3473701B2/ja not_active Expired - Fee Related
- 1995-03-16 EP EP95913753A patent/EP0758366B1/en not_active Expired - Lifetime
- 1995-03-16 MX MX9605243A patent/MX9605243A/es not_active IP Right Cessation
- 1995-04-27 MY MYPI95001104A patent/MY113845A/en unknown
- 1995-06-29 US US08/496,533 patent/US5631079A/en not_active Expired - Lifetime
-
1996
- 1996-11-04 KR KR1019960706208A patent/KR970702906A/ko not_active Application Discontinuation
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009530470A (ja) * | 2006-03-23 | 2009-08-27 | エルジー・ケム・リミテッド | フレキシブル基板搬送用粘着剤組成物 |
US8436122B2 (en) | 2006-03-23 | 2013-05-07 | Lg Chem, Ltd. | Pressure sensitive adhesive composition for transporting flexible substrate |
JP2010525098A (ja) * | 2007-04-19 | 2010-07-22 | エルジー・ケム・リミテッド | アクリル系粘着剤組成物 |
JP2015014011A (ja) * | 2007-04-19 | 2015-01-22 | エルジー・ケム・リミテッド | アクリル系粘着剤組成物 |
US9499725B2 (en) | 2007-04-19 | 2016-11-22 | Lg Chem, Ltd. | Acrylic pressure-sensitive adhesive compositions |
Also Published As
Publication number | Publication date |
---|---|
JP3473701B2 (ja) | 2003-12-08 |
WO1995030720A1 (en) | 1995-11-16 |
US5631079A (en) | 1997-05-20 |
DE69507609T2 (de) | 1999-09-30 |
CN1147268A (zh) | 1997-04-09 |
EP0758366B1 (en) | 1999-01-27 |
KR970702906A (ko) | 1997-06-10 |
EP0758366A1 (en) | 1997-02-19 |
DE69507609D1 (de) | 1999-03-11 |
MY113845A (en) | 2002-06-29 |
MX9605243A (es) | 1997-10-31 |
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