JPH0944100A - Display device and ic chip used for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To diminish the area of peripheral parts where images are not displayed. SOLUTION: Driving ICs 20, 21 for driving the electrode substrate of a display panel have bypass input terminals 22, bypass output terminals 23 and bypass wirings 24 in ICs for shorting both terminals. The bypass wiring output terminal 23 of the one driving IC is connected to the input terminal 22 of the other adjacent driving IC via the inter-driving IC connecting wirings, by which the plural driving ICs 20, 21 disposed in one row are connected to each other.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a matrix type display device and an IC chip used for the same, and more particularly to a wiring and mounting structure when a plurality of IC chips are arranged in a line at an edge of the display device.

[0002]

2. Description of the Related Art The wiring and mounting structure of a conventional liquid crystal display device will be described with reference to FIGS.

The first wiring and mounting structure will be described with reference to FIGS.

The matrix type liquid crystal display device 100 includes a liquid crystal cell 111 and a driving IC chip 1 for driving the liquid crystal cell.
20, 121, a printed wiring board 130 that supplies a control signal to the drive IC chip, and a wiring structure that connects them. The liquid crystal cell 111 is formed by combining two transparent substrates 112 and 113, which are usually made of glass, and sandwiching a liquid crystal substance 117 in a sandwich shape, and a sealant 118 is arranged on four sides of the liquid crystal substance. On the transparent substrate 113 (array substrate) below (on the back side as viewed from the display side), pixels and switching elements such as TFT transistors for turning the pixels on and off are formed in a matrix. A plurality of driving IC chips 120 and 121 for driving the switching elements are arranged at each of the one end sides on at least two end sides of the liquid crystal cell 111.

In such a structure common to matrix type liquid crystal display devices, the driving IC chips 120 and 12 are
1 is mounted on the TAB 140, 141, and the driving I
Connections from the C chips 120 and 121 to the matrix-shaped wirings in the liquid crystal cell 111 are made by the wirings 145 and the connection terminals gathered in the TABs 140 and 141. The connection between the TABs 140 and 141 and the liquid crystal cell 111 is performed on a shelf 115, which is a transparent substrate 113 below the liquid crystal cell 111 and protrudes from the liquid crystal cell 111.

Input from the printed wiring board 130 to the driving ICs 120 and 121 is carried out by the printed wiring board 1.
A plurality of bypass wirings 131 embedded inside 30, contact holes 132 for branching out from each of them and leading to the surface of the printed wiring board 130, and an output terminal 13 provided on the surface of the printed wiring board 130.
3, and the input terminals 142 and T of the TABs 140 and 141
This is done via the wiring 147 in AB.

From the printed wiring board 130 to the driving IC 1
The above connection to 20, 121 is called a cascade connection from the bypass wiring.

In such a structure, not only the wiring becomes complicated, but also the connecting terminal 142 portion to the TAB 140, 141,
And the bypass wiring 13 in the printed wiring board 130.
Driving IC chips 120, 1 viewed from the liquid crystal cell
Since it is provided outside 21, the TABs 140 and 141 and the printed wiring board 130 are correspondingly large.

The second wiring and mounting structure will be described with reference to FIG.

In the structure common to the matrix type liquid crystal display device as described above, the shelf 115 from which the lower transparent substrate 113 projects from the liquid crystal cell 111 is formed to be quite large, and the driving IC chips 120 and 121 are the shelf. It is placed directly on the portion 115, and the connection wiring from the driving IC chips 120 and 121 to the liquid crystal cell 110 is directly formed on the shelf 115 as a metal thin film. Further, all bypass wirings 151 for transmitting a control current or the like from the printed wiring board 130 to the IC chips 120 and 121 are
The lower transparent substrate is formed on the protruding shelf 115. A plurality of bypass wirings 151 on the transparent substrate shelf 115
Are the IC chips 120 and 121 viewed from the liquid crystal cell 111.
However, it does not have a branch, and forms a detour path in which the drive IC chips 120 and 121 once sneak under and make a U-turn. Here, the connection between the bypass wiring 151 and the driving IC chips 120 and 121 is performed by the output terminal 153 provided at a place where the bypass of the bypass wiring 151 sunk into the lower side of the driving IC chip, and the driving IC chips 120 and 121. Of the IC input terminal 127 provided on the lower side of the outer side edge of the liquid crystal cell 111 of FIG.
Done by

With the above structure, the wiring structure is simpler than that of the wiring using the cascade connection in the first wiring, and the TABs 140 and 141 protruding to the outside when viewed from the liquid crystal cell 111 are eliminated.

However, in the second wiring and mounting structure, since the area of the shelf portion 115 protruding from the liquid crystal cell 111 becomes large, the area of the image non-display area in the liquid crystal display panel cannot be made sufficiently small, and Since the bypass wiring 151 having a long line length is entirely formed of the metal thin film on the transparent substrate, there is a problem that wiring resistance increases.

[0013]

According to the conventional techniques as described above, in the matrix type display device, it is difficult to sufficiently reduce the area of the portion of the display panel where the image is not displayed. Also, the area can be made relatively small C
In the OG method, since the bypass wiring for the driving IC is formed as a metal thin film on the transparent substrate, the functional resistance of the driving IC due to the increased wiring resistance and further the display defect are caused, which is a problem. .

Therefore, in view of the above problems, the present invention can reduce the area of the non-display portion in the display panel and facilitate the wiring and mounting work. Is provided.

[0015]

A display device according to a first aspect of the present invention includes a pair of electrode substrates, and a plurality of driving IC chips are arranged in a line along one edge of at least one of the electrode substrates. In the display device, the drive IC includes a bypass input terminal, a bypass output terminal, and an IC internal bypass wiring that short-circuits both terminals.
The bypass wiring output terminal is connected to the input terminal of the other driving IC via the driving IC connecting wiring, whereby the plurality of driving ICs are connected to each other and supplied to the one driving IC. Control signal, or one or both of a power supply current and a ground current together with the control signal are input to the bypass input terminal of the one driving IC, and the power is supplied to the bypass input terminal of the one driving IC via the bypass output terminal. It is supplied to another drive IC.

With the above structure, the wiring for transmitting the control signal from the outside to the plurality of drive ICs is housed between the drive ICs in a form of penetrating and connecting the plurality of drive ICs. Depending on the case, one or both of the power supply current and the ground current are similarly stored, so that the area where the image is not displayed in the liquid crystal display device can be reduced. Further, since the wiring is simple, the manufacturing process can be simplified and wiring defects can be reduced.

A display device according to a second aspect is the display device according to the first aspect, wherein the IC bypass wiring is provided from an input terminal provided on one short side of the planar rectangular drive IC to an output terminal provided on another short side. Are connected by.

With such a structure, the wiring distance between ICs can be minimized.

According to a third aspect of the present invention, in the display apparatus according to the first aspect, one of the two electrode substrates forming the display panel protrudes outward and the electrode substrate is placed on a shelf formed on the upper surface thereof. Drive IC chip to drive is directly mounted,
The drive IC connection wiring is directly provided on the shelf of the electrode substrate, and the plurality of drive ICs are connected to each other via the IC connection wiring on the shelf of the electrode substrate.

According to the above structure, in addition to the effect of reducing the area of the non-display region as in the first aspect, the ratio of the thin film wiring on the transparent substrate can be reduced, which causes a problem in the COG method. It is possible to reduce the functional failure of the drive IC due to

According to a fourth aspect of the present invention, in the display apparatus according to the first aspect, the drive IC chip is mounted on a TAB, the drive IC connection wiring is provided in the TAB, and the plurality of drive ICs are the TAB. They are connected to each other through the inter-IC connection wiring inside.

A display device according to a fifth aspect is the display device according to the third aspect, wherein a main bypass wiring is provided on the shelf of the electrode substrate,
A plurality of lead lines branching from the main bypass line and connected to the respective drive ICs are provided, and at least one of the power supply current and the ground current is the plurality of lead lines via the main bypass line and the lead line. The control signal is supplied to each of the drive IC chips, and is supplied to all of the plurality of drive ICs via the bypass input terminal of one drive IC, the intra-IC bypass wiring, and the inter-IC wiring.

According to a sixth aspect of the present invention, in the display device according to the third aspect, a main bypass wiring is provided on the other substrate which is paired with the electrode substrate on which the drive IC is mounted, and is branched from the main bypass wiring. A plurality of lead-in wires respectively connected to the respective drive ICs are provided, and either or both of the power supply current and the ground current are supplied to the plurality of drive IC chips via the main bypass wiring and the lead-in wire. The control signal is supplied to all of the plurality of drive ICs via a bypass input terminal of one drive IC, the intra-IC bypass wiring, and the inter-IC wiring.

An IC chip for driving a display device according to claim 7 is
The IC body is provided with a bypass input terminal and a bypass output terminal, and is provided with an intra-IC bypass wiring that short-circuits the bypass input terminal and the bypass output terminal.

The IC chip according to claim 8 is the IC according to claim 7.
In the chip, the bypass input terminal is provided on one short side of the planar rectangular IC chip body, and the bypass output terminal is provided on another short side opposite to the short side.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION A first embodiment of the present invention will be described below with reference to FIGS.

Reference numeral 1 indicates the TAB method or OLB (Ou
3 shows a liquid crystal display device having a structure called a ter lead bonding method. Two glass substrates 12, 1 with liquid crystal substance
The liquid crystal cell 11 is sandwiched between the liquid crystal cell 3 and the liquid crystal cell 11, and the image display region 16 of the liquid crystal display device 1 is almost entirely above (on the front side of) the liquid crystal cell 11. Here, the size of the lower glass substrate 13 is slightly larger than that of the glass substrate 12, and a shelf 15 from which the lower glass substrate projects is formed on one long side and one short side of the liquid crystal cell 11.

Reference numeral 20 is an IC chip for driving a signal line (hereinafter referred to as an X-side IC chip), and three IC chips are arranged close to the long side shelf 15a of the liquid crystal cell 11 at predetermined intervals. It

Reference numeral 21 denotes a scanning line driving unit side IC chip (hereinafter referred to as a Y side IC chip), two of which are arranged close to the short side shelf 15b of the liquid crystal cell 11. Both the X-side and Y-side IC chips have a substantially rectangular shape. Further, both the X-side and Y-side IC chips have internally provided bypass wirings 24 from one short side to another short side, and input / output terminals 22 and 23 of these wirings are provided below both short sides. ing.

Reference numeral 30 denotes a printed wiring board, which is connected from the external input signal line and the driving IC chips 20 and 21.
It is a connection wiring board for connecting each other. This printed wiring board has a shape obtained by cutting a substantially square shape into a substantially square shape at one corner, that is, a thick L-shape,
A corner of the shelf 15 protruding from the liquid crystal cell 11, that is, a long side (X side) shelf 15a and a short side (Y side) of the liquid crystal cell.
The portion that joins with the shelf 15b and forms an angle is arranged so as to be substantially in contact with the inside of the L-shape of the printed wiring board 30.

Reference numerals 40 and 41 are TAB laminated flexible films having a wiring structure inside, which are called TABs, and each have one drive IC 20 or 21 mounted thereon. The TABs 40 and 41 are connected areas 4 on the shelf 15 formed by the glass substrate 13 below.
6, the driving ICs 20 and 2 are connected to the glass substrate 13 by the TAB wiring 45 connected to the liquid crystal cell 11.
The connection from 1 to the liquid crystal cell 11 is made. The in-TAB wiring 45 is connected to the output terminal bump 25 provided on the long side of the drive ICs 20 and 21 on the liquid crystal cell side. Liquid crystal cell 11
The connection terminals 4 are provided on the left and right ends of the TABs 40 and 41 as seen from
2 and 43 are provided, and the bypass wiring 44 in the TAB is provided.
Connection terminals 2 on both short sides of the drive ICs 20 and 21
2 and 23 are connected respectively. In addition, one TAB 40 and 41 on each of the X side and the Y side, which are arranged adjacent to the printed wiring board 30, partially cover the upper surface of the printed wiring board 30 and output provided on the upper surface of the printed wiring board 30. TAB40, from terminals 31 and 32, respectively
It is connected to 41.

In this embodiment, all drive ICs 20,
21 may be provided with bypass wiring, but it is necessary that the drive ICs 20 and 21 at the end of the inter-IC connection row, that is, the drive ICs 20 and 21 farthest from the printed wiring board 30, are provided with bypass wiring. Absent.

With the above configuration, the wiring 44 in one TAB 40, the wiring 24 in one driving IC 20, the wiring 44 in the same TAB 40, and the wiring 44 in another adjacent TAB 40 are arranged in this order from the printed wiring board 30. , And is connected to another drive IC 20 on the other TAB 40. Second TAB 40 and drive I seen from the printed wiring board
The third TAB 40 and the driving IC 20 from C20 are similarly connected.

With the above structure, in the TAB type liquid crystal display device, it is not necessary to provide the bypass wiring and the cascade connection in the printed wiring board, so that the wiring becomes easy. The drive ICs 20 and 21 viewed from the liquid crystal cell 11
That protruded to the outside of the TAB 40, 41
The input terminal portion and the bypass wiring portion of the drive IC2
Since it falls within the range of 0 and 21, the area of the non-display portion of the liquid crystal display device panel can be reduced accordingly.

Next, a second embodiment of the present invention will be described with reference to FIGS.

Reference numeral 2 indicates a liquid crystal display device having a COG (Chip On Glass) system mechanism. The structure of the liquid crystal cell 11 is similar to that of the first embodiment, but the area of the shelf 15 from which the lower substrate 13 projects is formed to be considerably larger than that of the first embodiment.

Reference numeral 20 is an IC chip for driving a signal line (hereinafter referred to as an X-side IC chip), and three IC chips are directly placed on the shelf 15a on the long side of the liquid crystal cell 11 at a predetermined interval. . Reference numeral 21 denotes an IC chip on the scanning line driving unit side (hereinafter,
(Y-side IC chips), and two of them are directly mounted on the shelf 15b on the short side of the liquid crystal cell 11. X side and Y side IC
Both chips have a substantially rectangular shape, and the length of the long side is three times or more the length of the short side. Also, the X-side and Y-side IC chips 2
Both 0 and 21 internally have a bypass wiring 24 from one short side to another short side, and input / output terminals 22 and 23 of these wirings are provided below both short sides.

FIG. 4 is a plan view showing the connection of wirings to the drive ICs 20 and 21 as seen from above (display side) of the liquid crystal cell 11. Output bumps 25 to the liquid crystal cell 11 are provided below the long sides of the drive ICs 20 and 21 on the liquid crystal cell side, and control signals from the connection wiring board 30 and drive power supply currents and grounds are provided below both short sides. Terminals 22 and 23 for inputting and outputting a current are provided as bumps. The length of the bypass wiring 24 in the drive ICs 20 and 21 is
Inter-IC wiring 5 provided as metal wiring on the glass substrate
It is more than 3 times the length of 1.

No connection terminal is provided below the long side outside the driving ICs 20 and 21 as viewed from the liquid crystal cell.
Dummy bumps 26 for stably disposing the driving IC are provided. The connection from the printed wiring board 30 to the first driving IC is made through the terminal 33 connecting the printed wiring board to the shelf 15 of the glass substrate and the wiring 51 on the shelf 15.

Also in this embodiment, the printed wiring board 3 is used.
The drive IC placed at the end of the IC connection row when viewed from 0
20 and 21 may not be provided with the IC bypass wiring.

With the above configuration, in the COG type liquid crystal display device, the area of the shelf 15 from which the glass substrate 13 below the liquid crystal cell 11 projects can be significantly reduced as compared with the prior art, so that the non-display area of the liquid crystal display device can be reduced. The area can be greatly reduced. Further, most of the bypass wiring provided for transmitting the control signal to the plurality of drive ICs 20 and 21 is I
Not only becomes the bypass wiring 24 in the C20 and C21,
Since the bypass wiring can be formed in a straight line, the length of the wiring can be minimized. Therefore, the wiring resistance can be reduced as compared with the conventional technique in which almost all of the bypass wiring is formed on the glass substrate 13 with a metal thin film portion having a high electric resistance, and the wiring is long because it is bent in several steps.

Next, a third embodiment of the present invention will be described with reference to FIGS.

In the third embodiment, in the structure of the second embodiment, only the control signal current is passed through the internal bypass wiring of the drive IC 20 on the X side, and the drive power supply current and the ground current are the glass substrates 12 and 13. Is supplied to each drive IC 20 from a separately provided bypass wiring.

Reference numeral 54 denotes a drive power supply current main bypass wiring, which is a single comparatively parallel line to the drive IC 20 outside the drive IC 20 when viewed from the liquid crystal cell 11 on the shelf portion 15 of the glass substrate. It is provided as a wide metal thin film wiring. As shown in the plan view of FIG. 5, a plurality of drive power supply current lead-in lines 58 branch and extend from the drive power supply current main bypass wiring 54, and the long sides of each drive IC 20 outside the liquid crystal cell 11 are viewed. It is connected to the input terminal provided in.

Reference numeral 55 is a ground current main bypass wiring, which is provided in an end portion of the lower surface of the upper glass substrate 12, that is, in a region for sandwiching the sealant 18 together with the lower glass substrate 13. The sealant 18 seals the liquid crystal substance 17 on the four sides of the liquid crystal cell 11. The ground current main bypass wiring 55 is formed as a relatively thin metal thin film wiring, is covered with the overcoat layer 19, and is insulated from other electric wirings and electrodes of the upper glass substrate 12. The ground current main bypass wiring 55
Is connected to each drive IC 20 via a substantially cylindrical transfer 56 vertically penetrating the sealant 18 region and a ground current lead-in wire 57 provided as a metal thin film wiring on the lower glass substrate 13.

In the case where it is not always appropriate to pass the bypass wiring in the IC because the drive power supply line or the ground current line has a large current capacity by the above structure, the second
The effect of the embodiment can be easily achieved. Further, the drive power supply line 54 and the ground current line 55 are arranged outside the drive IC 20 or the liquid crystal cell 11, and thus contribute to some extent in electrically shielding them from the outside.

[0047]

According to the structure of the display device of the present invention, the wiring for transmitting a current such as a control signal from the outside to the plurality of drive ICs is housed inside the drive ICs and between the drive ICs. The area where an image is not displayed on the display device can be reduced. Further, since the wiring is simple, the manufacturing process can be simplified and wiring defects can be reduced.

[Brief description of drawings]

FIG. 1 is a perspective view of a liquid crystal display device showing a first embodiment of the present invention.

FIG. 2 is a TAB and a drive IC according to the first embodiment.
3 is a plan view showing the wiring of FIG.

FIG. 3 is a perspective view of a liquid crystal display device showing a second embodiment.

FIG. 4 is a plan view showing a drive IC and wiring around the drive IC according to a second embodiment.

FIG. 5 is a plan view showing wiring of a drive power supply line and a ground current line to a drive IC according to a third embodiment.

FIG. 6 is a vertical sectional view of a liquid crystal display device according to a third embodiment.

FIG. 7 is a perspective view of a first conventional liquid crystal display device.

FIG. 8 is a vertical cross-sectional view showing a configuration of a liquid crystal cell of a liquid crystal display device and a shelf from which a lower substrate projects.

FIG. 9 is a perspective view showing a TAB internal wiring and a connection wiring to the TAB in the first conventional liquid crystal display device.

FIG. 10 is a perspective view of a second conventional liquid crystal display device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Liquid crystal display device 2 Liquid crystal display device 11 Liquid crystal cell 12 Glass substrate 13 Glass substrate 14 Polarizing film 15 Shelf formed by protruding lower glass substrate 16 Image display area 20, 21 Driving IC 22 Bypass wiring input terminal 23 Bypass wiring output Terminal 24 Bypass wiring in IC 30 Printed wiring board 40, 41 TAB

Claims (8)

[Claims] 1. A display device including a pair of electrode substrates, wherein a plurality of drive IC chips are arranged in a line along one side of at least one of the electrode substrates, wherein the drive ICs are bypass input terminals and bypass output terminals. ,
And an internal IC bypass wiring for short-circuiting both terminals, wherein the bypass wiring output terminal of the one driving IC is
A control signal supplied to the one drive IC, or the control signal, by connecting the plurality of drive ICs to each other by being connected to an input terminal of another drive IC via a drive IC connection wiring. At the same time, one or both of the power supply current and the ground current is input to the bypass input terminal of the one drive IC, and is supplied to the other drive IC from the bypass wiring in the IC via the bypass output terminal. A display device characterized by the above. 2. The drive IC, wherein a bypass input terminal is provided on one side in a direction intersecting the alignment direction, and a bypass output terminal is provided on another side opposite to the one side. 1. The display device according to 1. 3. One of the two electrode substrates forming the display panel projects outward to form a shelf, the drive IC chip is directly mounted on the shelf of the electrode substrate, and the drive IC connection wiring is provided. Is provided directly on the shelf of the electrode substrate, and the plurality of drive ICs are the ICs on the shelf of the electrode substrate.
The display device according to claim 1, wherein the display devices are mutually connected through inter-connection wiring. 4. The drive IC chip is mounted on a TAB, the drive IC connection wiring is provided in the TAB, and the plurality of drive ICs are mutually connected via the IC connection wiring in the TAB. Claim 1 characterized in that
The display device according to the above. 5. A main bypass wiring is provided on a shelf of the electrode substrate, and a plurality of lead-in wires branching from the main bypass wiring and respectively connected to the respective drive ICs are provided, and both the power supply current and the ground current are provided. Alternatively, one of them is supplied to each of the plurality of drive IC chips via the main bypass line and the lead-in line, and the control signal is a bypass input terminal of one drive IC, the intra-IC bypass line, and the inter-IC line. The display device according to claim 3, wherein the display device is supplied to all of the plurality of drive ICs via a. 6. A main bypass wiring is provided on the other substrate forming a pair with the electrode substrate on which the drive IC is mounted, and a plurality of lead-in wires branched from the main bypass wiring and connected to the respective drive ICs are provided. Provided, one or both of the power supply current and the ground current are respectively supplied to the plurality of drive IC chips via the main bypass line and the lead-in line, and the control signal is a bypass input terminal of one drive IC, The display device according to claim 3, wherein the display device is supplied to all of the plurality of drive ICs through the intra-IC bypass wiring and the inter-IC wiring. 7. An IC chip for driving an electrode substrate of a display panel, wherein an IC main body is provided with a bypass input terminal and a bypass output terminal, and an IC internal bypass wiring for short-circuiting the bypass input terminal and the bypass output terminal is provided. I characterized by
C chip. 8. The bypass input terminal is provided on one short side of the planar rectangular IC chip body, and the bypass output terminal is provided on another short side opposite to the short side. The described IC chip.