JPH0938858A - Vacuum chuck device for polishing thin piece member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vacuum chuck device for polishing a thin piece member which can optionally vary curvature of a chuck surface of a sucking plate. SOLUTION: A sucking plate 4 is fit in an opening 2a of a substrate holder 2 and a shielding plate 8 is bonded on a top surface of the sucking plate 4 and a pressure chamber 9 is formed above the shielding plate 8 and a fluid supplying means 9a is provided in the pressure chamber 9 to supply fluid to the pressure chamber 9 and bend the sucking plate 4 to give predetermined curvature to its chuck surface 4a. As the chuck surface 4a of the sucking plate 4 can be bent in optional curvature according to any polishing condition and polished, a smooth and plane polishing surface of a substrate to be polished can be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum chuck device for polishing flaky members.

[0002]

2. Description of the Related Art A conventional vacuum chuck device for polishing the surface of a flaky member such as a semiconductor substrate is shown in FIG. That is, the cylindrical substrate holder 2 is provided with an opening 2a at the bottom, and the inner bottom of the opening is provided with a drain-like portion 3 composed of ventilation grooves 3b communicating with each other by a plurality of concentric circular protrusions 3a. Further, a vacuum suction plate 4 made of porous ceramic is fitted in the opening 2a, and a rotary shaft 2c provided with a vacuum suction path 2b is provided in the upper part so that a vacuum is sucked from the vacuum path 2b. As a result, the upper surface of the suction plate 4 has a negative pressure, and the atmosphere is sucked through the fine holes of the suction plate 4. Then, when the thin piece-shaped member 5 as the substrate to be polished is brought into contact with the lower surface of the suction plate 4, it is suction-fixed. The vacuum chuck device 1 is configured with the above configuration.

On the other hand, a disk-shaped polishing platen 6 is provided below the vacuum chuck device 1 so as to be rotatable about a shaft 6a, and a polishing cloth 7 is attached to the surface thereof. Further, an abrasive supply nozzle (not shown) for supplying an abrasive onto the polishing cloth 7 is provided outside the polishing platen 6.

In polishing, the polishing platen 6 is rotated and the substrate 5 to be polished is sucked onto the lower surface of the suction plate 4 by vacuum. Next, the abrasive is supplied from the abrasive supply nozzle to the abrasive cloth 7
While being supplied above, the substrate holder 2 is rotated to pressurize the polishing cloth 7 to perform polishing.

Conventionally, in order to uniformly polish the surface of the substrate, the substrate 5 to be polished depends on the warp of the substrate, the curvature of the polishing platen, the structure and compressibility of the polishing cloth, the type of polishing agent and the polishing conditions. It has been necessary to change the curvature of the chuck surface 4a of the suction plate 4 that sucks into a concave or convex spherical shape. Therefore, in order to satisfy this requirement, conventionally, it was necessary to prepare a plurality of vacuum chuck devices having chuck surfaces having different curvatures.

[0006]

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an improved chuck device for polishing flaky members in order to solve the problem that chucks having a large number of curvatures must be prepared. Is.

[0007]

In order to solve the above-mentioned problems, a vacuum chuck device for polishing flaky members according to the invention of claim 1 has a substrate holder having a rotary shaft having a vacuum path in an upper part and an opening in a lower part. And a suction plate fitted in the opening, a shield plate adhered to the suction plate, a pressure chamber formed on the shield plate, and a fluid supply means provided in the pressure chamber. A fluid is supplied to the chuck plate to bend the chuck surface of the suction plate so as to have a predetermined curvature.

According to a second aspect of the present invention, there is provided a vacuum chuck device for polishing thin piece-shaped members, wherein the fluid supply means includes a seal valve. The vacuum chuck device for polishing thin piece-shaped members is configured to press the fluid through the seal valve. It is supplied to the chamber and the chuck surface of the suction plate is curved to have a predetermined curvature.

According to a third aspect of the present invention, there is provided a fluid supply means including a fluid supply path provided on a rotary shaft and a rotary joint as described in the first aspect of the present invention. The pressure is supplied to the pressure chamber, and the chuck surface of the suction plate is curved so as to have a predetermined curvature.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The structure and operation of a vacuum chuck device for polishing flaky members according to an embodiment of the present invention will be described below with reference to FIGS. In the following embodiments, the same components as those of FIG. 3 referred to in the description of the conventional technique are designated by the same reference numerals.

First Embodiment FIG. 1 is a side sectional view showing a first embodiment of a vacuum chuck device for polishing thin piece-shaped members according to the present invention.

The cylindrical substrate holder 2 has an opening 2a composed of two openings having different diameters below, and a step 2d formed therein has a shield plate 8 and a vacuum suction plate 4 made of porous ceramic. The pressure chamber 9 is formed by fitting.
The shielding plate 8 is made of an airtight material and is attached to the upper surface of the suction plate 4 to keep the pressure chamber 9 airtight. Further, a seal valve (fluid supply means) 9a is provided between the pressure chamber 9 and the outside of the substrate holder 2 so that pressurized air (fluid) can be supplied through the seal valve 9a.

A suction port 10 is provided in the flange portion 2e of the substrate holder 2 at a position in contact with the side surface of the suction plate 4. A vacuum path 2b communicating with the suction port 10 is provided in the rotary shaft 2c provided on the substrate holder 2, and the vacuum path 2b is connected to a vacuum suction device (not shown) via a rotary joint 11. ing. By vacuum suction from the vacuum path 2b by the vacuum suction device,
The atmosphere is sucked through the fine holes of the vacuum suction plate 4. Then, when the thin piece-shaped member 5 which is the substrate to be polished is brought into contact with the lower surface of the vacuum suction plate 4, it is sucked and fixed. The vacuum chuck device 12 is configured with the above configuration.

On the other hand, in the lower part of the vacuum chuck device 12,
Although illustration is omitted, a disk-shaped polishing platen is provided in a rotatable state like the conventional example, a polishing cloth is attached to the surface thereof, and a polishing cloth is ground on the outside of the polishing platen. A polishing agent supply nozzle for supplying a polishing agent is provided.

In polishing, compressed air is filled from the outside through the seal valve 9a to bend the adsorption plate 4 appropriately. The seal valve 9a also serves to confine the compressed air filled in the pressure chamber 9. The curvature of the curved chuck surface 4a can be determined by the air pressure in the pressure chamber. Next, the polishing platen is rotated, and the substrate 3 to be polished is sucked onto the chuck surface 4a of the suction plate 2b by vacuum. Then, while the polishing agent is supplied onto the polishing cloth from the polishing agent supply nozzle, the substrate holder 2 is rotated to pressurize the polishing cloth to perform polishing.

As described above, the chuck surface 4a of the suction plate 4 can be polished with an appropriate curvature depending on the polishing conditions.
The polished surface of the polished substrate 3 is smooth and flat.

Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIG. The vacuum chuck 13 shown in FIG. 2 is provided with a rotary joint 11 in the upper part of the rotary shaft 2c instead of the seal valve 8 shown in the first embodiment, and compressed air (fluid) is supplied from there through a vacuum path (fluid supply means) 2b. Through the pressure chamber 9. At the time of polishing, compressed air having an appropriate pressure can be supplied to the pressure chamber 9 from the outside through the rotary joint 11 to give the chuck surface 4a of the suction plate 4 a desired curvature. Further, there is an advantage that the curvature of the chuck surface can be arbitrarily changed even during polishing.

In the first and second embodiments of the present invention described above, the compressed air is supplied to the pressure chamber, but other fluid such as nitrogen or oil may be used instead of the compressed air.

[0019]

As is clear from the above description, according to the vacuum chuck device for polishing flaky members of the present invention, a vacuum chuck device capable of varying the curvature of the chuck surface of the suction plate according to the polishing conditions can be realized. It is possible to obtain a smooth and flat polishing surface of a thin piece-shaped member polished by using this vacuum chuck device.

[Brief description of drawings]

FIG. 1 is a side sectional view of a vacuum chuck device for polishing a flaky member according to a first embodiment of the present invention.

FIG. 2 is a side sectional view of a vacuum chuck device for polishing flaky members according to a second embodiment of the present invention.

FIG. 3 is a side sectional view of a polishing device using a conventional vacuum chuck device for polishing a flaky member.

[Explanation of symbols]

 1 Conventional Vacuum Chuck Device 2 Substrate Holder 2a Opening 2b Vacuum Path 2c Rotating Shaft 2d Stepped Part 2e Flange Part 2f Pressure Supply Path (Fluid Supply Means) 3 Saw-Shaped Part 4 Adsorption Plate 4a Chuck Surface 5 Substrate to be Polished (Slice-shaped) Member) 6 Polishing surface plate 6a Shaft 7 Polishing cloth 8 Shielding plate 9 Pressure chamber 9a Seal valve (fluid supply means) 10 Suction port 11 Rotary joint 12, 13 Vacuum chuck device of the present invention

Claims (3)

[Claims] 1. A substrate holder having a rotary shaft having a vacuum path in an upper portion and an opening in a lower portion, a suction plate fitted in the opening, a shielding plate attached on the suction plate, A pressure chamber formed on the shield plate; and a fluid supply means provided in the pressure chamber, the fluid supply means supplies a fluid to the pressure chamber to cause the adsorption plate to have a predetermined curvature. A vacuum chuck device for polishing a thin piece-shaped member, which is curved in a vertical direction. 2. The vacuum chuck device for polishing flaky members according to claim 1, wherein the fluid supply means includes a seal valve. 3. The vacuum chuck device for polishing a thin piece member according to claim 1, wherein the fluid supply means includes a fluid supply path provided on the rotary shaft and a rotary joint.