JPH09296155A - Bonding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bonding device capable of preventing misregister caused by the curing of an adhesive to enhance the accuracy of the adhesion. SOLUTION: This bonding device is used for inserting the projection 19 of a main body having the projection 19 having a smaller diameter than that of the second opening into the hole 18 of a solid imaging element-holding member 6 having the hole 18 provided with the first opening and the second opening having a smaller diameter than that of the first opening, filling an ultraviolet- curing adhesive 24 into the holes and subsequently irradiating the filled adhesive with ultraviolet light to bond the projection 19 to the member 6. The bonding device is provided with the first irradiation part for irradiating the UV-curing adhesive 24 with light for curing it from the first opening, the second irradiation part for irradiating the adhesive with light from the second opening, and an irradiation-controlling part for uniforming a stress generated on the curing of the ultraviolet-curing adhesive with the ultraviolet light UV irradiated from the first and second irradiation parts.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding device for aligning and bonding a pair of works.

[0002]

2. Description of the Related Art As shown in FIG. 11, an apparatus for reading an optical image using a solid-state image pickup device forms an image of an object 2 on a solid-state image pickup device 1 through an imaging lens 3 and reads the object. In addition, the solid-state image pickup device 1 includes a one-line solid-state image pickup device in which a plurality of minute photoelectric conversion elements (hereinafter, simply referred to as pixels, each having a size of several μm × several μm) are arranged in a line. It is used.

In such an image reading apparatus, in order to position the line image formed by the image forming lens 3 on the solid-state image pickup device 1 and read the optical characteristics (focus, magnification) with a predetermined required accuracy. , The image forming lens 3 and the pixel line 4 of the solid-state image sensor 1 of one line are shown in FIG.
It is necessary to finely move in the directions of the five axes of z, β and γ to adjust the position. In addition, 26 in the figure is an optical axis.

More recently, in order to read a color image, Red (hereinafter, simply referred to as R), Green (hereinafter, simply referred to as G), and Blu as shown in FIG. 13 are used.
e (hereinafter simply referred to as B), three lines 4a, 4 in which pixels having a spectral sensitivity peak are arranged in three rows for R, G, and B, respectively.
b, 4c solid-state imaging device 1a may be used.

In this case, in addition to the adjustment in the five-axis directions described above, in order to correct the chromatic aberration by the imaging lens 3, the adjustment of the 3-line solid-state image pickup device 1a in the α direction shown in FIG. A total of 6 axis adjustments are required.

Normally, the position adjustment accuracy of such a solid-state imaging device 1a is required to be several μm in each of the six axial directions, and in particular, it is indispensable to achieve this requirement.
This is a technique for preventing the position of the solid-state imaging device 1a from shifting when fixing the solid-state imaging device 1a after adjusting the position as described above.

This is because even if the position is adjusted with a high degree of accuracy, if the position shifts during fixing, the position must be adjusted again.
This is because there is no choice but to dispose of it, resulting in a longer position adjustment time and a higher cost.

For this fixing, fixing with a screw has conventionally been used in many cases, but the displacement amount is several hundred μm or less.
Attempts at fixing with an adhesive, which is considered to have a small amount of displacement compared to fixing with a screw due to being too large, being several tens of μm, have been attempted at present.

Therefore, as shown in FIG. 6, first, the solid-state image pickup lens 3 is fixed in the hole 18 provided in the solid-state image pickup element holding member 6 (see FIG. 1) to which the solid-state image pickup element 1 is fixed. Protrusions 1 provided on the image sensor fixing member 10 (see FIG. 1)
In a state where 9 is loosely inserted, the solid-state image sensor holding member 6 on the hole 18 side is moved to perform precise alignment adjustment. Next, the inner circumferences 18a and 18b of the hole 18 and the protrusion 1
By discharging the adhesive 24 into the annular gap formed by the outer peripheries 19a and 19b of the solid state image sensor 9, the solid state image sensor holding member 6 to which the solid state image sensor 1 is fixed and the solid state image sensor to which the imaging lens 3 is fixed. The fixing member 10 was fixed by adhesion.

At the time of this adhesive fixing, an ultraviolet curing adhesive 24 which is cured by irradiation of ultraviolet rays is used. After the ultraviolet curing adhesive 24 is discharged into the annular gap, ultraviolet rays are irradiated from above (one side). It was hardened.

[0011]

However, even if the solid-state image sensor and the imaging lens are precisely aligned before the ultraviolet curing, the relative positions of these works are fixed after the ultraviolet irradiation. There was a problem that it was off.

As a result of research and study, the present inventors have found that the cause is as follows. That is, the ultraviolet curable adhesive becomes harder to cure as the layer becomes thicker, and it takes time even if it can be cured. This is because the curing time does not take proportionately to the thickness but the energy efficiency becomes worse as the film becomes thicker. Further, the ultraviolet curable adhesive has oxygen inhibition due to surface curing.

From the above, in the case of thick film type adhesion such as a 3-line CCD lens block, high energy UV irradiation must be performed in order to prevent the cured state of the surface opposite to the irradiation surface from being deteriorated. . When the irradiation time is long, the productivity is poor. In addition, there is a side effect that heat is generated.

In the case of irradiation from one direction as in the prior art, the curing is accelerated from the irradiation surface side. Therefore, in the case of a thick film in particular, internal stress is applied, but in the direction connecting the irradiation surface and the opposite surface. In, it becomes a particular orientation and becomes larger. As a result, changes over time (positional shift) after UV curing
Is easy to occur.

To explain this in detail, as shown in FIG. 6A, when ultraviolet rays UV are first irradiated from above, curing starts from the surface portion of the adhesive 24. If the layer near the surface is the first layer 24a and the layer following the first layer 24a is the second layer 24b, the first layer 24a hardens and shrinks as shown in FIG. 6B. Further, since the surface tension acts on the side surface (the contact portion with the solid-state image sensor holding member 6 and the contact portion with the protrusion 19) 24s, the position of the adhesive near the side surface is held in a fixed state by this surface tension. . Therefore, the adhesive 2
When 4 contracts, the upper surface 24u and the interface between the first layers 24a become concave.

For convenience of explanation, FIG. 6B shows the shape change of only the first layer 24a.
There is a gap between 4a and the second layer 24b. However, in reality, since the second layer 24b is attracted to the first layer 24a by the intermolecular force, no gap can be formed (this state is shown in FIG. 6C).

As shown in FIG. 6C, the uncured portion of the second layer 24b and below is deformed by being attracted to the first layer 24a by the intermolecular force. Then, following the first layer 24a, the second layer
The curing and shrinkage of the layer 24b begins (this state is shown in FIG.
(Shown in (a)).

As shown in FIG. 7A, when the second layer 24b is hardened, stress F ₂ is generated at the interface. Also in this case,
Similar to FIG. 6B, since the surface tension acts on the side surface 24, the surface tension keeps the position of the adhesive 24 near the side surface 24s fixed. Therefore, the adhesive 24
Contracts, the change in the vicinity of the center between the hole 18 (see FIG. 1) of the solid-state image sensor holding member 6 and the protrusion 19 of the solid-state image sensor fixing member 10 is larger, that is, the radius of curvature is smaller. Shrink a curved surface.

Also in this figure, for convenience of explanation, there is a gap between the second layer 24b and the third layer 24c, but in reality, the third layer 24c is attracted to the second layer 24b by intermolecular force. Therefore, there is no gap (this state is shown in FIG. 7B). As shown in FIG. 7B, the fourth layer 2 is similarly formed in the following.
4d, 5th layer 24e, and 6th layer 24f, and hardening progresses subsequently.

The positional deviation caused by the above curing will be described below based on a model. FIG.
In (a), a leaf spring 124 (an adhesive is modeled) whose one end is fixed to a wall and an object B fixed to the open end of the leaf spring 124 are shown. As shown in the left diagram of FIG. 10A, the leaf spring 12 is pressed by pushing the object toward the wall with a hand or the like.
When the urging force is released from the state in which 4 is urged as shown in the right diagram of FIG. 10A, there is no restriction on the outward movement in FIG. The deviation is in the outward direction.

However, as shown in FIG. 10B, when the outward movement is restricted (in this case, the adhesive is modeled by the leaf spring 124, and the adherend is modeled by the ring W and the column E). However, the object position (the relative position between the wheel W and the cylinder E) is displaced upward (or downward) and displaced.

FIG. 9B is a perspective view of FIG.
It becomes as shown in. FIG. 9 is a diagram showing a positional displacement of a conventional coupling portion by a model, (a) is a perspective view of the model,
(B) is a figure which simplifies and shows the principal part of (a). 9 (a) and 9 (b), the drawing before the arrow indicates the leaf spring 124.
Shows the bent state. The drawing after the arrow shows the leaf spring 12
4 shows the extended state. In this model, the leaf spring 124
Since the outward extension of the wheel is restricted, the wheel W and the column E are displaced relative to each other by expanding as described above. That is, as shown in FIG. 8A, the stress F ₂
F ₃ and F ₄ remain, and therefore, as is clear from the model of FIG. 9, as shown in FIG.
After the solid-state image sensor holding member 6 to which is fixed and the solid-state image sensor fixing member 10 to which the imaging lens 3 is fixed are precisely aligned and adjusted, the solid-state image sensor holding member 6 and the solid-state image sensor fixing member 10 are fixed. Even when the adhesive was fixed, the positional deviation Δs was caused by the stress due to the curing shrinkage of the adhesive.

Therefore, an object of the present invention is to provide a bonding apparatus capable of preventing positional displacement due to curing of an adhesive and performing highly accurate bonding, and further improving productivity and preventing adverse effects due to heat generation. To provide.

[0024]

A bonding apparatus according to the present invention comprises a first work having a through hole having a first opening and a second opening having a diameter smaller than the first opening, and a protrusion having a diameter smaller than the second opening. And a second work having a protrusion, the protrusion is inserted through the second opening, the photocurable adhesive is filled through the first opening, and the two workpieces are bonded to each other. A first irradiation part for irradiating light that cures the light, a second irradiation part for irradiating the light from the second opening, and a curing of the photocurable adhesive by the light irradiated from the first and second irradiation parts. And an irradiation control unit for uniformizing the stress generated in the.

In this configuration, the irradiation control unit controls the first irradiation unit that irradiates the light for curing the photo-curable adhesive from the first opening and the second irradiation unit that irradiates the light from the second opening. The stress generated when the photo-curable adhesive is cured by the light emitted from the first and second irradiation portions can be made uniform.

In this case, the second work may be an imaging lens side block, and the first work may be a solid-state image sensor side block.

[0027]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.
This will be described with reference to FIG. FIG. 1 is an exploded perspective view showing an image reading device bonded by a bonding device according to an embodiment of the present invention.

As shown in the figure, a solid-state image sensor (hereinafter, C
It is called CD. 1) is soldered to a substrate 5, and the substrate 5 is fixed to a solid-state image sensor holding member 6 by screws 7. At this time, a spring washer 8 and a flat washer 9 are fitted to the screw 7 to secure the fixing. A hole 21 is provided in the substrate 5, and the bonding between a protrusion 19 of the main body 10 and a hole 18 of the solid-state image sensor holding member 6 described later is performed.
Since the process is performed through the hole 21, the adhesive can be easily filled and the adjustment of six axes can be easily performed. Thus, the CCD side block as the first work is configured.

An imaging lens 3 for forming a document image on the CCD 1 of the CCD block at a predetermined magnification is attached to the main body 10. The main body 10 has a V-block portion 11, on which the imaging lens 3 is placed, a leaf spring 12 for holding the lens is arranged from above, and the imaging lens 3 is fixed by tightening the screw 13. doing.

The main body 10 has a flat washer 14 and a spring washer 15, and a screw 16 for fixing a lens with a screw 16.
Is fixed to the main body mounting member 17 through the main body. The main body mounting member 17 is used when fixed to an image reading apparatus main body (not shown). Thus, the imaging lens side block as the second work is configured.

After the position of the imaging lens 3 is adjusted on the CCD 1 of the CCD side block so that the original image is formed at a predetermined magnification, the CCD side block and the imaging lens side block are fixed. The outline of the position adjustment is as follows. First, the imaging lens side block is moved to adjust the magnification of the imaging lens 3, and the image position of the imaging lens 3 after the magnification adjustment is moved to CC.
The D-side block is moved so that the document image is formed on the CCD 1 at a predetermined magnification.

After the position adjustment is completed in this way,
The CCD side block and the imaging lens side block are CCD
The solid-state imaging device holding member 6 of the side block is fixed to the main body 10 with an adhesive, thereby being integrally fixed. Specifically, the hole 18 provided in the solid-state image sensor holding member 6 and the projection 19 provided in the main body 10 constitute a coupling portion, and the projection 19 of the main body 10 is inserted into the hole 18 of the coupling portion, 4 (b),
As shown in FIG. 5, the adhesive 24 is applied and fixed.

Next, the alignment / fixing device of the image reading device including the bonding device of this embodiment will be described along with the procedure for adjusting the position of the CCD 1 and the imaging lens 3 and the fixing procedure. First, the imaging lens 3 is attached to the main body 10 by a leaf spring 12 for holding the lens.
And is fixed with a screw 13. Further, in this state, the main body 10 is attached to the main body mounting member 17 by the flat washer 14 and the spring washer 15.
And is fixed by screws 16.

Next, in this assembled state, it is mounted on the position adjusting device of the position adjusting / fixing device shown in FIG. In the position adjusting device 61, a position adjusting device support member 27 and a light source chart support member 31 are disposed on a surface plate 32A.
0, a light source 29 and a light source reflector 28 are provided.

On the surface of the chart glass 30, there is formed a chart capable of detecting optical characteristics, such as focus, magnification, and deflection of the optical axis.
Is turned on, and the light reflected by the light source reflecting plate 28 is applied to the chart glass 30 with the present adjusting device.

Therefore, by mounting the assembly member on the position adjusting device 61, a chart image is formed on the image forming lens 3.
, An image is formed at a magnification corresponding to the distance from the chart glass 30 to the imaging lens 3.

The substrate 5 to which the CCD 1 is soldered and fixed is fixed to the solid-state image pickup device holding member 6 with screws 7, and the solid-state image pickup device holding member 6 is held by the CCD chuck portion 64 which is a vacuum chuck. Has been done.

Further, the CCD chuck 64 has
A moving stage 62, which is a first moving means that can move in six axial directions of x, y, z, α, β, and γ, is attached via a chuck 63 that holds the CCD chuck 64.

Since the solid-state image pickup device holding member 6 is formed of a member having a higher rigidity than the substrate 5, distortion is unlikely to occur even if it is gripped by the CCD chuck portion 64, and compared with the case where the substrate 5 is directly gripped. The influence on the substrate 5 is extremely small.

Further, the main body 1 in which the imaging lens 3 is fixed
Reference numeral 0 denotes a main body chuck (not shown) having moving means in the direction of the optical axis 26. And the chart image is CC
The above-mentioned CCD chuck unit is subjected to photoelectric conversion by D1 and using the data to calculate optical characteristics such as focus, magnification, tilt of the optical axis, and the like, so that the optical characteristics have a predetermined required value. The position is adjusted by moving the chuck 64 and the main body chuck portion.

After the completion of the position adjustment, the positioning / fixing device is fixed by using the bonding / fixing device 41. The bonding / fixing device 41 is provided with an ultraviolet curable adhesive 2
4, an adhesive applicator 42 having a nozzle 45 for discharging
An upper light guide 47A and a lower light guide 47B, which are ultraviolet ray irradiating sections for irradiating the adhesive section with ultraviolet rays, an ultraviolet ray source 44 for supplying ultraviolet rays to these light guides 47A, 47B, and an applicator irradiation section switching section 46 are provided. Prepared as a unit. The light guides 47A and 47B are, for example, optical fiber bundles. Then, in order to focus the ultraviolet light emitted from the optical fiber bundle or the like into the hole portion 18, a converging optical system such as a convex lens system or a concave mirror can be used. It is desirable that the condensing optical system is made of a material having a high ultraviolet transmittance, such as artificial fluorite or artificial quartz. Further, as the ultraviolet light source 44, for example, a mercury discharge lamp can be used.

The nozzle 45 of the bonding / fixing device 41 is
The bonding / fixing device support base 48 is attached to a bonding / fixing device support base 48 via a discharge unit moving mechanism 43A serving as a discharging unit moving unit, and the bonding / fixing device support base 48 is fixed on the surface plate 32B. Also, the light guides 47A and 47B of the adhesion / fixing device 41
The light emitting end side of the adhesive / fixing device support base 48 is provided via an ultraviolet irradiation unit moving mechanism 43B which is an ultraviolet irradiation unit moving unit.
Attached to.

The bonding / fixing device 41 applies a UV curable adhesive 24, which is a photo curable adhesive, to the joint formed by the hole 18 of the solid-state image sensor holding member 6 and the projection 19 of the main body 10. After that, the applicator irradiation unit switching unit 46 is operated to move the light emitted from the light guides 47A and 47B so as to enter the coupling unit, and thereafter, the ultraviolet rays are irradiated to cure the adhesive 24. The adhesive 24 may be applied before position adjustment, and then the position may be adjusted and the adhesive 24 may be cured.

Next, the functional block portion of the positioning / fixing device according to this embodiment will be described with reference to FIG. The position adjusting and fixing device includes a moving stage driving unit 72 for driving the moving stage 62 and a C for driving the CCD 1.
A CCD driving section 73 for outputting a CD driving signal;
A CCD output data calculation unit 74 for calculating data output from the unit, a bonding unit driving unit 75 for driving a bonding unit including the bonding / fixing device 41, and a CCD chuck unit 6
A CCD chuck unit holding and opening control unit 76 for controlling the opening and closing of the chuck unit 63 holding 4 and temperature measuring means (not shown) for measuring the temperature in the annular gap compared with the preset temperature. , An adhesive discharge controller 77 for controlling the discharge position of the adhesive 24, and a light guide 47.
A UV irradiation control unit 78 for controlling the UV irradiation positions of A and 47B, a UV irradiation control unit 78, and an adhesive discharge control unit 7
7 and an operation sequence control unit 79 for controlling the operation sequence of the CCD chuck control unit 76, and an operation sequence control unit 79 based on the operation result of the CCD output data operation unit 74.
A movement amount control unit 71 that sends a control signal to the bonding unit drive unit 75 and the movement stage drive unit 72 to control the movement amount.
With. As the temperature measuring means, for example, a non-contact temperature sensor is preferably used. As the non-contact temperature sensor, specifically, a pyroelectric infrared sensor may be used. Further, as the ultraviolet curable adhesive, for example,
A photosensitizer added to a base such as acrylate, polyene / polythiol, or epoxy is used.

The movement amount control section 71 sends a control signal for moving the pixel line 4 of the CCD 1 of the CCD side block to the image forming position of the imaging lens 3 of the image formation lens side block, to the moving stage drive section 72. The moving stage 62 is driven. In addition, the adhesive discharge controller 77
The discharge unit moving mechanism 43A is controlled so that the tip of the nozzle 45 is moved in accordance with the movement amount of the D1 side block.

Further, by the UV light irradiation control unit 78, C
The light guide 47 according to the movement amount of the CD side block
The ultraviolet irradiation unit moving mechanism 43B is controlled so as to move A and 47B.

Next, the structure of the joint portion, which is also the adhesive portion, will be described. 4A and 4B show cross-sectional views of the joint portion. The solid-state image sensor holding member 6 is formed with a hole portion 18 which is an adhered portion, and the protrusion portion 19 provided on the main body 10 is inserted into the hole portion 18.

The shape of the annular gap at the adhered portion formed by both of these is an annular shape with a non-uniform width, the side on which the adhesive 24 is discharged and applied is wide, and the side on which the adhesive 24 flows down. The width of is narrowing.

That is, as shown in FIG. 4A, the hole portion 18 having the tapered portion 18a and the straight portion 18b.
And a rod-shaped protrusion 19 having a tapered portion 19a and a straight portion 19b, and portions 18b and 19b each having a constant diameter are provided at opposing positions.

As shown in FIG. 2, the nozzle 45 mounted on the adhesive applicator 42 from above the annular gap formed by the hole 18 of the solid-state image sensor holding member 6 and the projection 19 of the main body 10. Apply by bringing the tip of to close.

Next, the position adjusting / fixing method according to this embodiment will be described based on the control flow of FIG. Step S
In 1, the CCD chuck 64 holding the CCD 1 side block is held by the chuck 63.

In step S2, the origin of the moving stage 62 and the bonding unit (such as the adhesive applicator 42) is set. In the search for the origin of the moving stage 62, before adjusting the position of the CCD 1, the work is held at a second reference position in the equipment, the distance of which from the predetermined first reference position is known in advance. The CCD chuck 64 is moved.
In addition, when the origin of the bonding unit is determined, before the position of the CCD 1 is adjusted, the CCD 1 is moved to a third reference position in the equipment, the distance from the predetermined first reference position being known in advance.

In step S3, the CCD 1 is adjusted based on an adjustment algorithm so that the CCD 1 is aligned with the image forming position of the image forming lens 3. Then, the adjustment is completed in a state where the projection 19 of the main body 10 is inserted into the hole 18 of the solid-state imaging device holding member 6.

In step S4, it is stored in advance which direction and how much the hole portion 18 on the CCD 1 side, which has been adjusted in step S3, has moved. That is, from the CCD output data calculation unit 74 to the movement amount control unit 71
To send the adjustment amount data corresponding to the movement amount.

In step S5, the bonding unit is moved to the bonding position based on the adjustment amount data stored in step S4. That is, based on the adjustment amount data, it is calculated to which position the adhesive unit should be moved from the origin position to bond the portion to be bonded, and the adhesive unit is moved by the calculated amount. Therefore, the tip of the nozzle 45 of the bonding unit can be adjusted to the ejection position, which is the hole contour position based on the hole 18 of the CCD side block. Since the tip of the nozzle 45 is aligned with the hole 18 as a reference in this manner, the adhesive 2 at the time of injection is used.
4 can be prevented from protruding outside the hole 18 and uneven injection is eliminated. Therefore, the uniformity of the application state of the adhesive 24 in the annular gap can be improved.

In step S6, the nozzle 45 attached to the bonding / fixing device 41 is brought close to the tip end of the annular gap formed by the hole 18 of the solid-state image sensor holding member 6 and the protrusion 19 of the main body 10 so as to approach the tip. The adhesive 24 is discharged all at once from the portion to fill the annular gap.

In step S7, after the discharge in step S6 is completed, the adhesive unit is retracted upward for a predetermined time. Here, the predetermined time refers to a time until the adhesive 24 which is continuous from the tip of the nozzle 45 into the annular gap by surface tension immediately after the ejection is separated from the tip of the nozzle 45. In this way, since the nozzle tip portion 45A of the adhesive unit is retracted upward for a predetermined time after the discharge of the adhesive agent 24 is completed, the adhesive agent 24 in the annular gap continues from the tip portion of the nozzle 45 due to surface tension. It is possible to prevent the applied adhesive portion from being pulled in the horizontal withdrawal direction and the coating state being nonuniform.

In step S8, the UV light irradiation controller 78
Thus, the tip of the nozzle 45 of the adhesive unit is retracted, and the light emitting ends of the light guides 47A and 47B are moved to the ultraviolet irradiation position. Light guide 4 at this time
As the amount of movement of 7A and 47B from the origin position, the amount of movement of the hole portion 18 obtained and stored in step S4 is used. In this way, the amount of movement of the light emitting ends of the light guides 47A and 47B is controlled based on the amount of movement of the hole portion 18 on the workpiece side, so that the light emitting ends of the light guides 47A and 47B are the ejection ends of the nozzles 45. Is replaced exactly with the position.
Therefore, the converging ultraviolet light flux emitted from the light guides 47A and 47B can be accurately overlapped on the hole portion 18 at the portion where the cross-sectional shape orthogonal to the optical axis is the same as the hole portion 18.

In step S9, the light guide 47A,
Ultraviolet rays are radiated from 47B toward the adhesive 24 in the annular gap.

In step S10, the adhesive 24 is cooled after being irradiated with ultraviolet rays. This cooling is performed by, for example, natural air cooling by leaving it for a predetermined time or forced air cooling by a cooling fan or the like.

In step S11, the temperature of the adhesive in the annular gap is measured by the temperature measuring means. Step S12
Then, the temperature measured in step S11 is compared with a preset temperature. If the temperature is not lower than the preset temperature, the process returns to step S10 and the cooling after the ultraviolet irradiation is performed again. Then, whether or not the temperature falls below the set temperature is monitored based on the measurement value of the temperature measuring means T. If the temperature is below the set temperature, the process proceeds to step S13. This set temperature is set to a temperature at which the ultraviolet curable adhesive can maintain the rigidity sufficiently to prevent the work from being displaced, and is set to, for example, several degrees above room temperature. In step S13, the holding of the CCD chuck portion 64 by the chuck portion 63 is released.

Next, the behavior of the adhesive 24 when the adhesive 24 is applied to the annular gap in step 9 will be described. As shown in FIG. 4A, the applied adhesive 24
Is the frictional force D with respect to the surface tension T peculiar to the adhesive and the weight P of the adhesive 24, and the adhesive 24 not shown.
The adhesive 24 does not flow downward due to a mechanical balance due to the internal pressure, the lowermost widths A and A ′ of the annular gap, the density of the adhesive 24, and the like.

Next, the curing of the adhesive will be described. Since the adhesive 24 used here is an ultraviolet curable adhesive, as described above, the light guides 47A and 47B shown in FIG. The agent 24 is cured.

As shown in FIG. 4B, the curing of the adhesive 24 proceeds from the surfaces on both sides which are irradiated with the ultraviolet rays UV. That is, in this case, since the irradiation is performed from the central axis direction of the annular gap for applying the adhesive, the hardening of the adhesive 24 proceeds from both sides in this direction. When the adhesive 24 is cured, it contracts to generate stress. Here, in the figure, U indicates an upper hardened portion, L indicates a lower hardened portion, and C indicates a central uncured portion. That is, U, L and C correspond to the coating amount. The exposed area of the upper adhesive U from the first opening is S ₁ , the exposed area of the lower adhesive L from the second opening is S ₂ , the upper irradiation intensity is P ₁ , and the lower irradiation intensity is S ₁ . Where P ₂ is P ₂ , the illuminance ratio of ultraviolet rays is such that S ₁ to S ₂ is P ₂ to P ₁ .
That is, it is calculated in advance so that the area ratio between the UV-curable adhesive exposed downward and the UV-curable adhesive exposed upward is equal to the illuminance ratio between the UV from above and the UV from below. Irradiate at the same ratio. This allows
Since the stress is cured from both sides, the stress is canceled and the solid-state image sensor holding member 6 to which the solid-state image sensor 1 is fixed and the protrusion 19 provided on the main body 10 are displaced as shown in FIG. There is no.

In FIG. 4B, K ₁ is the first layer 24
The interface between a and the second layer 24b, K ₂ is the second layer 24b and the third
The interface with the layer 24c, K ₃ is the third layer 24c and the fourth layer 24d
, K ₄ is an interface between the fourth layer 24 d and the fifth layer 24 e, K ₅ is an interface between the fifth layer 24 e and the sixth layer 24 f, K ₆
Indicates the interface between the sixth layer 24f and the seventh layer 24g. Therefore, the upper cured portion U is in the range from the upper surface 24u to the interface K ₃ , the lower cured portion L is in the range from the interface K ₄ to the lower surface 24l, and the central uncured portion C is from the interface K ₃ to the interface K _3.
The range is up to ₄ .

In this embodiment, since ultraviolet rays are radiated from above and below, it is practically necessary to cure only half the thickness of the ultraviolet curable adhesive, and since the energy efficiency is high, the curing time can be shortened. it can. Further, since there is no need to perform high-energy ultraviolet irradiation, a low-power ultraviolet lamp can be used. Further, the lamp life can be extended. Further, the influence of oxygen inhibition due to surface hardening is less than in the case of irradiation from one side as in the conventional case. Therefore, since curing can be performed with low energy, the generation of heat is small, and adverse effects due to heat can be prevented.

Further, since the adhesive is irradiated from both sides, the curing is promoted from both sides, so that the internal stress can be canceled and the temporal change (positional shift) after the ultraviolet curing can be prevented. it can.

In the above embodiment, the movement amount control unit 71, the operation sequence control unit 79, the ultraviolet irradiation control unit 7 are used.
8. The case has been described in which the adhesive discharge control unit 77 and the CCD chuck unit holding / opening control unit 76 are configured by individual circuits, but may be configured by one CPU.

In the above embodiments, the case where the first work is the CCD side block and the second work is the imaging lens side block has been described. But it can be easily applied. Further, an electron beam curable adhesive may be used as the photocurable adhesive so that the electron beam is irradiated instead of the ultraviolet ray when curing.

[0070]

As is apparent from the above description, according to the present invention, since irradiation is performed from both sides, even if each is cured to a half thickness, the irradiation energy required for curing is less than half. Total energy can also be reduced more than only from one side, improving productivity. Further, since the irradiation energy required for curing is small, there is no problem of heat generation. Since the directions of the internal stresses are symmetrical and they cancel each other, it is possible to prevent positional displacement due to a change with time, and it is possible to perform highly accurate bonding.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an image reading device fixed by an adhesive device according to an embodiment of the present invention.

FIG. 2 is a functional block diagram of a positioning / fixing device including an adhesive device according to an embodiment of the present invention.

FIG. 3 is a diagram showing a control flow of a position adjusting / fixing method according to the present embodiment.

FIG. 4 is a cross-sectional view of a joint portion that is adhered by the adhering device according to the present embodiment, FIG.
(B) shows that it is being cured.

FIG. 5 is a cross-sectional view after curing of a joint portion bonded by the bonding device according to the present embodiment.

FIG. 6 is a cross-sectional view showing conventional hardening of a joint portion in the order of progress of hardening, where (a) is immediately after irradiation of ultraviolet rays, (b), (c).
Indicates curing of the first layer.

7A and 7B are cross-sectional views showing conventional hardening of a joint portion in the order of hardening progress, in which FIG. 7A shows hardening up to the second layer, and FIG. 7B shows hardening up to the sixth layer.

FIG. 8 is a cross-sectional view showing a displacement of a conventional coupling portion,
(A) shows a state after curing, and (b) shows a state of misalignment.

9A and 9B are diagrams showing a positional displacement of a conventional coupling portion by a model, FIG. 9A is a perspective view of the model, and FIG. 9B is a diagram showing a simplified main portion of FIG. 9A.

10A and 10B are cross-sectional views showing a displacement of a conventional coupling portion by a model, FIG. 10A shows movement of an object at a spring tip due to expansion of a spring, and FIG. 10B is a ring and a cylinder due to expansion of a spring. And shows the movement.

FIG. 11 is a schematic diagram of an apparatus that performs image reading using a solid-state image sensor.

12 is an explanatory diagram showing a position adjustment direction of the solid-state imaging device in FIG.

FIG. 13 is a diagram showing a relationship between a solid-state image sensor and pixel lines.

[Explanation of symbols]

 1 CCD (Solid-State Image Sensor) 3 Imaging Lens 18 Hole 19 Protrusion 24 Adhesive 42 Adhesive Applicator 44 Ultraviolet Source 45 Nozzle 47A Light Guide 47B Light Guide

Claims (2)

[Claims] 1. A first work having a through hole having a first opening and a second opening having a diameter smaller than the first opening, and a second work having a projection having a diameter smaller than the second opening. In the second opening, the filling device filling the photo-curable adhesive from the first opening and adhering them to each other, the first irradiation unit irradiating light for curing the photo-curable adhesive from the first opening. And a second irradiation unit that irradiates the light from the second opening, and an irradiation control unit that uniformizes the stress generated when the photocurable adhesive is cured by the light emitted from the first and second irradiation units. An adhesive device comprising: 2. The bonding apparatus according to claim 1, wherein the first work is an imaging lens side block, and the second work is a solid-state image sensor side block.