JPH09283702A - Electronic component assembly, manufacturing method thereof and electronic component connecting member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To laminate, irrespective of the mounting height, and eliminate the need of provisional bonding by using a connecting member having lead holders according to leads and conductive couplers for coupling the lead holder with specified spacings. SOLUTION: Clip leads 10 are composed of lead holders 11 and couplers. The lead holder 11 is to bond the leads 10 to LSI memories 22-22. When leads 30-32 are inserted, the holders 11 hold the leads and are provided according to the number of the LSI memories to be laminated. The coupler 12 couples the holders 11 with each other and are made of the same conductive material as that of the leads 10. The length of the coupler 12 is set so that the leads need not be shaped when the memories 20-22 are laminated. This eliminates the need of the lead shaping of electronic parts according to the lamination height and hence the need of provisionally fixing the leads.

Description

Detailed Description of the Invention

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component assembly, a method of manufacturing the same, and a connecting member for electronic components,
In particular, the present invention relates to an electronic component assembly using a connecting member for connecting leads of an electronic component, a method for manufacturing the same, and a connecting member for electronic components.

[0001]

2. Description of the Related Art Conventionally, in an electronic component assembly in which electronic components of this type are laminated and mounted on a printed circuit board, external connection leads of the electronic components are directly laminated and joined. For example, Japanese Unexamined Patent Publication No. 6-151683 discloses a technique relating to an electronic component assembly in which a plurality of external connection leads are formed, and the external connection leads are temporarily joined together, and then an IC package is mounted on a printed circuit board. Has been described.

[0002]

In the above-mentioned prior art,
The lead length and bending angle are different between the upper and lower layers of the electronic components to be laminated. For example, the lowermost lead is formed short and substantially horizontal, and the uppermost lead is formed long and has a large bending angle. Therefore, there is a problem in that it is necessary to change the length of each lead according to the height of the electronic components to be laminated and to mold the leads.

Further, since the electronic component cannot be held until the electronic component assembly and the substrate are aligned with each other and the electronic component assembly is mounted on the substrate, there is a problem that the leads must be temporarily joined. . Further, since the temporary joining is performed by heating, an extra heat is applied to the LSI, which causes a problem that the reliability of the LSI is deteriorated.

Further, the supply amount of solder for joining the electronic components to each other and the electronic component and the printed circuit board must be changed according to the number of leads to be laminated. However, the relationship between the amount of change in the supply amount of solder and the amount of change in the number of leads is not uniquely determined. Therefore, there is a problem that an optimum amount of solder for the number of electronic components to be stacked must be obtained.

An object of the present invention is to provide an electronic component assembly capable of stacking electronic components irrespective of the mounting height, a method for manufacturing the same, and a method for manufacturing the same.

Another object of the present invention is to provide an electronic component assembly that does not require temporary bonding, a method for manufacturing the same, and a method for manufacturing the same.

[0007]

In order to solve the above problems, an electronic component assembly of the present invention includes a plurality of stacked electronic components and a plurality of the electronic components protruding from each of the plurality of electronic components. It includes a plurality of leads aligned in the stacking direction and a connecting member for electrically connecting the plurality of leads, and the connecting member is provided corresponding to each of the plurality of leads and holds the corresponding lead. It includes a plurality of lead holding portions and a conductive connecting portion that connects the plurality of lead holding portions at a predetermined interval.

Further, in another electronic component assembly of the present invention, the leads of each of the plurality of electronic components are provided in a plurality of rows along an edge of the electronic component, and the leads of the plurality of rows correspond to the leads. A plurality of the connecting members are provided.

Further, in another electronic component assembly of the present invention, at least one of the plurality of lead holding portions includes a key portion oriented in a lead insertion direction.

In another electronic component assembly of the present invention, at least one of the plurality of lead holding portions includes a spring portion that elastically clamps the inserted lead.

Further, another electronic component assembly of the present invention is characterized in that at least one of the plurality of lead holding portions is soldered to the inserted lead.

Further, the connecting member of the present invention has a plurality of lead holding portions for holding the inserted leads and a plurality of conductive connecting portions for connecting the plurality of lead holding portions at predetermined intervals. It includes a connection member and an auxiliary member that connects the plurality of connection members at predetermined intervals.

Further, the method of manufacturing an electronic component assembly of the present invention includes a plurality of lead holding portions for holding the inserted leads and a conductive connecting portion for connecting the plurality of lead holding portions at a predetermined interval. A method of manufacturing an electronic component using a connecting member, the first step of stacking a plurality of electronic components, and aligning a plurality of leads protruding from the plurality of electronic components in a stacking direction of the electronic component, A second step of inserting a corresponding one of the plurality of leads into each of the plurality of lead holding portions of the connecting member; mounting the plurality of electronic components on a wiring board; A third step of connecting the lead of the lowest one of the components to the wiring board.

Further, in another method of manufacturing an electronic component assembly according to the present invention, a plurality of the connecting members are prepared, and the plurality of connecting members are connected at predetermined intervals by an auxiliary member, and the auxiliary member is the second member. It is characterized in that it is removed after the insertion of the lead in the step of.

Further, another method of manufacturing an electronic component assembly according to the present invention is characterized in that, in the second step, the plurality of lead holding portions and the plurality of leads are connected by reflow soldering. To do.

Further, in another method of manufacturing an electronic component assembly of the present invention, the plurality of electronic components include three or more electronic components, and in the second step, the connecting portion of the connecting member is placed at a predetermined position. 8. The method of manufacturing an electronic component assembly according to claim 7, wherein the number of stacked stages of the plurality of electronic components is set to a desired number by cutting with.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION An electronic component assembly, a method of manufacturing the same, and an embodiment of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 1, an electronic component assembly 100 which is an embodiment of the present invention comprises LSI memories 20, 21 and 22 and a clip lead 10 which are vertically stacked. The LSI memories 20, 21 and 22 have leads 30, 31 and 32, respectively. The clip lead 10 sandwiches and holds the leads 30, 31, and 32 at a predetermined interval. The electronic component assembly 100 is mounted on the printed board 40.

Referring to FIGS. 1 and 2, the clip lead 10 is composed of a lead holding portion 11 and a connecting portion 12. The lead holding portion 11 is connected to the clip lead 10 and L
Bonding with the SI memories 20, 21 and 22 is performed. When the leads 30, 31, and 32 are inserted, the lead holding portion 11 sandwiches and holds the leads. The lead holding unit 11 is provided according to the number of stacked LSI memories.

The connecting portion 12 connects the lead holding portions 11 to each other. The material of the connecting portion 12 is the same conductive material as the clip lead 10. The length of the connecting portion 12 is
It is set so that it is not necessary to mold the leads when the LSI memories 20, 21 and 22 are stacked. This setting is performed so that the lead interval of each layer when the LSI memories 20, 21 and 22 are stacked and the length of the connecting portion 12 are the same.

As described above, according to the electronic component assembly of the embodiment of the present invention, the clip lead having the lead joint portion for sandwiching and holding the LSI lead is provided.
Therefore, it is not necessary to temporarily join the leads of the LSI. Further, a connecting portion 12 that connects the lead holding portions 11 is provided, and the length of the connecting portion 12 is set to match the lead interval of the stacked LSIs. Therefore, it is not necessary to form the leads of the LSI when the LSIs are stacked.

Next, a second embodiment of the electronic component assembly of the present invention will be described in detail with reference to the drawings. In the electronic component assembly of the second embodiment, except for the lead holding portion 13,
The configuration is similar to that of the first embodiment.

Referring to FIG. 3, the lead holding portion 13 is
The hook portion 14 has the same direction as the direction in which the lead 30 is inserted. When the lead 30 is inserted into the lead holding portion 13, the hook portion 14 engages the lead 30. The hook portion 14 does not generate a physical resistance force when the lead is inserted, but generates a physical resistance force when a force is applied to the lead 30 in the direction of being pulled out from the lead holding portion 13, and the lead 30 is It is prevented that the lead holding portion 13 is pulled out.

As described above, according to the electronic component assembly of the second embodiment of the present invention, the hook portion 14 engaging with the lead 30 is provided so as to prevent the lead 30 from being pulled out. Therefore, it is only necessary to bond the LSI lead to the lead holding portion. Therefore, it is not necessary to connect the lead and the lead holding portion by soldering or the like.

Next, a third embodiment of the electronic component assembly of the present invention will be described in detail with reference to the drawings. The electronic component assembly 100 of the third embodiment has the same configuration as that of the first embodiment except for the lead holding portion 15.

Referring to FIG. 4A, the lead holder 1
5 has spring portions 16 and 17 oriented in the same direction as the direction in which the lead 30 is inserted.

Referring to FIG. 4B, the lead holder 1
5, when the lead 30 is inserted, the spring parts 16 and 17 are inserted.
Engages the lead 30. The spring portions 16 and 17 do not generate a physical resistance force when the lead is inserted, but do generate a physical resistance force by the spring when a force is applied to the lead 30 in the direction of being pulled out from the lead holding portion 15. , The lead 30 is prevented from being pulled out from the lead holding portion 15.

Referring to FIG. 4C, when the lead holding portion 15 and the lead 30 are misaligned, the spring portions 16 and 17 increase the amount of deflection of the upper spring 16 and lower springs. Reduce the amount of deflection of 17 and use the upper spring 1
The lead 30 is held by being sandwiched between 6 and the lower spring 17.

With reference to FIG. 4 (d), the spring portions 16 and 17 are formed by increasing the deflection amounts of the upper spring 16 and the lower spring 17, respectively, even when the lead 33 thicker than the lead 30 is inserted. The lead 30 is sandwiched and held.

As described above, according to the electronic component assembly of the second embodiment of the present invention, the spring portions 16 and 17 which engage with the lead 30 are provided so as to prevent the lead 30 from being pulled out. Therefore, it is not necessary to connect the lead and the lead holding portion by soldering or the like. Further, the positional deviation between the lead holding portion 15 and the lead can be absorbed. Further, even if the lead thickness is changed, it is not necessary to remake the clip lead 10.

Next, an embodiment of a method of manufacturing an electronic component assembly according to the present invention will be described in detail with reference to the drawings. In this embodiment, an electronic component assembly in which two LSI memories 20 and 21 are vertically stacked is manufactured.

Referring to FIG. 5, in the first step, the leads 30 and 31 of the LSI memories 20 and 21 are inserted into the lead holding portions 11 of the clip lead 10, respectively. Clip lead 10 and LSI memories 20 and 21
The clip lead 10 sandwiches and holds the leads 30 and 31. The clip lead 10 has a connecting portion 18 that connects adjacent clip leads. The connecting portion 18 is formed of the same metal as the clip lead when the clip lead 10 is manufactured. Connection part 18
Is cut in a fifth step described later to disconnect the electrical connection between the adjacent clip leads 10.

Referring to FIG. 6, in the second step, the first
Clip lead 10 and LSI joined in the process of
The memories 20 and 21 are the pads 4 of the printed circuit board 40.
The lead holding unit 11 at the lowermost stage is aligned and mounted with respect to No. 1. The solder paste is previously supplied to the pad 41.

Referring to FIG. 7, in the third step, soldering is performed on all the joints between the lead holding portion 11 and the leads except for the joint portion between the lead holding portion 11 and the lead at the lowermost stage. In this embodiment, soldering is performed by a dispenser method using a syringe containing a solder paste at the joint between the upper lead holding portion 11 and the lead 30.

Referring to FIG. 8, in the fourth step, the printed circuit board 40 on which the electronic component assembly 100 is mounted is subjected to solder reflow by the reflow method, and the electronic component assembly 1
00 and the printed circuit board 40 are soldered. At this time, the solder supplied to the pad 41 simultaneously solders the lead holding portion 11 and the lead 31 in the lowermost stage.

Referring to FIG. 9, in the fifth step, the connecting portion 18 is cut off.

In the third step of the above-mentioned embodiment, after all the leads 30 and 31 and the lead holding portion 11 are soldered, in the fourth step, the lowermost lead holding portion 1
1 and the pad 41 may be soldered.

As described above, according to the method of manufacturing the electronic component assembly of the embodiment of the present invention, the electronic component assembly can be manufactured without molding the leads of the electronic component. Further, since the lead holding portion is provided so as to sandwich and hold the lead, it is not necessary to temporarily join the lead holding portion and the lead with solder or the like.

Next, the second embodiment of the method of manufacturing the electronic component assembly of the present invention will be described in detail.

In the second embodiment, as compared with the first embodiment of the method for manufacturing an electronic component assembly described above, each lead holding portion 11 of the clip lead 10 is solder-plated. Is different. The first step and the second step are
This is the same as that of the first embodiment of the method of manufacturing the electronic component assembly described above.

In the third step, solder reflow is performed by the reflow method, and the electronic component assembly 100 and the printed circuit board 40, the lead holding portion 11 and the leads are soldered, respectively. At this time, the solder supplied to the pad 41 simultaneously solders the lead holding portion 11 and the lead 31 in the lowermost stage.

In the fourth step, the connecting portion 18 is cut off.

As described above, according to the method of manufacturing the electronic component assembly of the second embodiment of the present invention, the lead holding portion 11 is provided.
Since the solder plating is applied to the
It is not necessary to perform the step of supplying solder to the leads by a method such as a dispenser method.

Next, a third embodiment of the method of manufacturing an electronic component assembly of the present invention will be described in detail with reference to the drawings.
In the third embodiment, the clip lead 10 includes a lead holding portion 13 having a hook portion 14. The first step and the second step are the same as those of the first embodiment of the method of manufacturing the electronic component assembly described above.

Referring to FIG. 3, in the first step,
The lead 30 inserted in the lead holding portion 13 has a hook portion 1
4 is engaged. The hook portion 14 does not generate a physical resistance force when the lead is inserted, but generates a physical resistance force when a force is applied to the lead 30 in the direction of being pulled out from the lead holding portion 13, and the lead 30 is It is prevented that the lead holding portion 13 is pulled out.

In the third step, the electronic component assembly 10
The printed circuit board 40 on which 0 is mounted is subjected to solder reflow by a reflow method, and the electronic component assembly 100 and the printed circuit board 40 are soldered. At this time, the pad 41
The lead holding section 1 at the bottom stage by the solder supplied to the
1 and the lead 31 are also soldered at the same time.

In the fourth step, the connecting portion 18 is cut off.

As described above, according to the method of manufacturing the electronic component assembly of the third embodiment of the present invention, the lead holding portion 13 is provided.
Since the hook portion 14 is provided, it is not necessary to solder the lead holding portion and the lead.

Next, a fourth embodiment of the method of manufacturing an electronic component assembly according to the present invention will be described in detail with reference to the drawings.

Referring to FIG. 10, the fourth embodiment is different from the first embodiment of the method of manufacturing an electronic component assembly described above in that the clip lead 10 includes a mold 18. The mold 18 is made of insulating resin and connects adjacent clip leads. The first step, the second step, the third step and the fourth step are the same as those in the first embodiment of the method for manufacturing an electronic component assembly described above.

In the fourth embodiment, since the mold 18 is insulative, it may be connected without being removed from the clip lead 10.

As described above, according to the method of manufacturing the electronic component assembly of the fourth embodiment of the present invention, the clip lead 1
Since the insulating mold 18 is provided on the
It is possible to omit the step of removing the from the clip lead 10.

In addition to the above embodiments, the present invention can be implemented in various ways. For example, the lead holding portion 11 and the LSI lead may be adhered by a conductive adhesive or by welding the joint with a laser or the like.

Alternatively, three electronic components may be laminated to form a three-stage electronic component assembly, and then a part of the electronic component assembly may be cut to generate a two-stage electronic component assembly.

Further, in the fourth embodiment of the method of manufacturing an electronic component assembly described above, the mold 18 is kept connected without being removed, but the mold 18 may be removed.

[0056]

As is apparent from the above description, according to the present invention, there is provided the connecting member for sandwiching and holding the leads of the electronic component at a predetermined interval. Therefore, it is not necessary to form leads for electronic components according to the stacking height. Further, it is not necessary to temporarily fix the leads of the electronic component.

[Brief description of drawings]

FIG. 1 is a sectional view showing a configuration of an embodiment of an electronic component assembly of the present invention.

FIG. 2 is a sectional view showing a clip lead according to an embodiment of the present invention.

FIG. 3 is a sectional view showing a lead holding portion of a clip lead according to a second embodiment of the present invention.

FIG. 4 is a sectional view showing a lead holding portion of a clip lead according to a third embodiment of the present invention.

FIG. 5 is a perspective view showing a first step of an embodiment of the method for manufacturing an electronic component assembly of the present invention.

FIG. 6 is a cross-sectional view showing a second step of one embodiment of the method for manufacturing an electronic component assembly of the present invention.

FIG. 7 is a sectional view showing a third step of the embodiment of the method of manufacturing the electronic component assembly according to the present invention.

FIG. 8 is a cross-sectional view showing a fourth step of one embodiment of the method for manufacturing an electronic component assembly of the present invention.

FIG. 9 is a sectional view showing a fifth step of an embodiment of the method for manufacturing an electronic component assembly of the present invention.

FIG. 10 is a perspective view showing a second embodiment of the method for manufacturing an electronic component assembly of the present invention.

[Explanation of symbols]

 10 Clip Lead 20, 21, 22 LSI Memory 30, 31, 32 Lead 40 Printed Circuit Board

Claims (10)

[Claims] 1. A plurality of stacked electronic components, a plurality of leads projecting from each of the plurality of electronic components and aligned in the stacking direction of the plurality of electronic components, and the plurality of leads are electrically connected. A plurality of lead holding portions, each of which is provided corresponding to each of the plurality of leads and holds the corresponding lead, and the plurality of lead holding portions are connected at a predetermined interval. And an electrically conductive connecting portion for controlling the electronic component assembly. 2. The leads of each of the plurality of electronic components are provided in a plurality of rows along the edge of the electronic component, and a plurality of the connecting members are provided corresponding to the leads of the plurality of rows. The electronic component assembly according to claim 1, which is characterized in that. 3. At least one of the plurality of lead holding portions
2. The electronic component assembly according to claim 1, wherein the one includes a key portion facing the insertion direction of the lead. 4. At least one of the plurality of lead holding portions
2. The electronic component assembly according to claim 1, wherein the one includes a spring portion that elastically clamps the inserted lead. 5. At least one of the plurality of lead holding portions
The electronic component assembly according to claim 1, wherein one of them is soldered to the inserted lead. 6. A plurality of connecting members each having a plurality of lead holding portions for holding the inserted leads and a conductive connecting portion for connecting the plurality of lead holding portions at a predetermined interval, and a plurality of these connecting members. A connecting member for an electronic component, comprising: an auxiliary member that connects the connecting members at predetermined intervals. 7. A method of manufacturing an electronic component using a connecting member including a plurality of lead holding portions for holding the inserted leads and a conductive connecting portion for connecting the plurality of lead holding portions at a predetermined interval, A first step of stacking a plurality of electronic components and aligning a plurality of leads protruding from the plurality of electronic components in a stacking direction of the electronic component; and each of the plurality of lead holding portions of the connecting member, A second step of inserting a corresponding one of the plurality of leads, and mounting the plurality of electronic components on a wiring board,
A third step of connecting the lead of the lowest one of the plurality of electronic components to the wiring board, the method of manufacturing an electronic component assembly. 8. A plurality of the connecting members are prepared, and the plurality of connecting members are connected at predetermined intervals by an auxiliary member,
8. The method of manufacturing an electronic component assembly according to claim 7, wherein the auxiliary member is removed after the lead is inserted in the second step. 9. The method of manufacturing an electronic component assembly according to claim 7, wherein in the second step, the lead holding portions and the leads are connected by reflow soldering. 10. The number of stacked stages of the plurality of electronic components includes three or more electronic components as the plurality of electronic components, and cutting the connecting portion of the connecting member at a predetermined position in the second step. 8. The method of manufacturing an electronic component assembly according to claim 7, wherein: