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JPH09267270A - Diamond abrasive belt and cement slab grinding method therewith - Google Patents

Diamond abrasive belt and cement slab grinding method therewith

Info

Publication number
JPH09267270A
JPH09267270A JP7788196A JP7788196A JPH09267270A JP H09267270 A JPH09267270 A JP H09267270A JP 7788196 A JP7788196 A JP 7788196A JP 7788196 A JP7788196 A JP 7788196A JP H09267270 A JPH09267270 A JP H09267270A
Authority
JP
Japan
Prior art keywords
polishing
diamond
polishing belt
belt
cement plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7788196A
Other languages
Japanese (ja)
Inventor
Susumu Imamura
進 今村
Tetsuo Tanaka
哲夫 田中
Naoki Shitamae
直樹 下前
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RIKEN KORANDAMU KK
Mitsubishi Materials Corp
Original Assignee
RIKEN KORANDAMU KK
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RIKEN KORANDAMU KK, Mitsubishi Materials Corp filed Critical RIKEN KORANDAMU KK
Priority to JP7788196A priority Critical patent/JPH09267270A/en
Publication of JPH09267270A publication Critical patent/JPH09267270A/en
Pending legal-status Critical Current

Links

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

PROBLEM TO BE SOLVED: To make improvements in production efficiency by way of reducing a span of dwell time necessary for changing such expendables as an abrasive roll and an abrasive belt in a process for grinding a cement slab as well as hold the extent of cost requiring the regeneration and replacement of these expendables down, insofar as possible. SOLUTION: After conveying the surface of a cement slab S finished through the extrusion molding in a state of being exposed, first of all, an abrasive roll 31 on which diamond abrasive grains D1 are attached tight is rotated and a surface of the cement slab S is roughly ground. Next, an abrasive belt 41, where an electrocoating abrasive grain part secured with diamond abrasive grains D2 smaller than the abrasive grains D1 by means of a metal plating layer is plurally installed on the surface, is rotated as well, and the surface of the cement slab S roughly ground is a little finely ground. Finally, a finishing abrasive belt 51 on which silicon carbide abrasive grains C are attached tight is rotated, thereby finishing the surface of the cement slab S somewhat finely ground after grinding it further once more.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、ダイヤモンドの砥
粒を用いたダイヤモンド研磨ベルトと、このダイヤモン
ド研磨ベルトを用いて押し出し成形されたセメント板の
表面を仕上げ研磨する研磨方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a diamond polishing belt using diamond abrasive grains, and a polishing method for finish polishing the surface of a cement plate extruded and molded using the diamond polishing belt.

【0002】[0002]

【従来の技術】建築物の化粧版等に使用されるセメント
板については、押し出し成形後、厚みのむらを無くし表
面をより平滑にきめ細かく仕上げるために仕上げ研磨が
なされている。この仕上げ研磨を行なう研磨装置は、図
5に示すように、押し出し成形を終えたセメント板Sの
表面を露出させた状態で搬送するベルトコンベヤ(搬送
手段)1の上方に、セメント板Sの搬送方向に沿って複
数の研磨手段が配置されたものである。
2. Description of the Related Art Cement plates used for decorative plates of buildings are subjected to finish polishing after extrusion to eliminate unevenness in thickness and to finish the surface more smoothly and finely. As shown in FIG. 5, the polishing apparatus for performing the final polishing conveys the cement plate S above the belt conveyor (conveying means) 1 that conveys the cement plate S that has been extruded with the surface thereof exposed. A plurality of polishing means are arranged along the direction.

【0003】これら研磨手段は、セメント板Sの搬送方
向上流側に、ダイヤモンドの砥粒が固着された研磨ロー
ル3a、4aを回転させることによって研磨を行なう粗
(中粗)研磨手段3、4と、さらにセメント板Sの搬送
方向下流側に、炭化ケイ素の砥粒が固着された環状の研
磨ベルト5a、6aを回転させることによって研磨を行
なう仕上げ研磨手段5、6とからなり、これら研磨手段
3、4、5、6によって、セメント板Sの表面を搬送し
ながら4段階に研磨を行うものである。
These polishing means are coarse (medium coarse) polishing means 3 and 4 which perform polishing by rotating the polishing rolls 3a and 4a to which the abrasive grains of diamond are fixed on the upstream side in the conveying direction of the cement plate S. Further, on the downstream side in the transport direction of the cement plate S, there are constituted final polishing means 5 and 6 for polishing by rotating annular polishing belts 5a and 6a to which abrasive grains of silicon carbide are fixed. While carrying the surface of the cement plate S by 4, 5, and 6, polishing is performed in four steps.

【0004】[0004]

【発明が解決しようとする課題】ところで、この研磨装
置に使用されている研磨ロール3a、4aは、ロール本
体の表面にダイヤモンドの砥粒が金属めっきにより固着
されたものであるが、研削能力が低下した場合の交換に
時間がかかり、再めっきに必要なコストが高いことが指
摘されていた。また、研磨ベルト5a、6aは、交換に
要する時間は短いものの研削能力の低下が研磨ロールに
比べて早く交換頻度が高いために長期的に見て交換に要
する時間が多くなり、しかも研磨ベルトは使い捨てなの
でその分コスト高になることが指摘されていた。
The polishing rolls 3a, 4a used in this polishing apparatus have abrasive grains of diamond adhered to the surface of the roll body by metal plating. It has been pointed out that it takes time to replace it when it drops and the cost required for re-plating is high. Further, although the polishing belts 5a and 6a require a short time for replacement, the deterioration of the grinding ability is faster than the polishing rolls and the frequency of replacement is high, and therefore the time required for replacement is long in the long run. It was pointed out that the cost was high because it was disposable.

【0005】本発明は上記の事情に鑑みてなされたもの
であり、セメント板を研磨する工程において研磨ロール
や研磨ベルトといった消耗部品の交換に要する運転停止
時間を少なくして生産効率を向上させるとともに、消耗
部品の再生、交換にかかるコストを低く抑えるセメント
板の研磨方法および研磨ベルトを提供するものである。
The present invention has been made in view of the above circumstances, and improves the production efficiency by reducing the operation stop time required for exchanging consumable parts such as a polishing roll and a polishing belt in the step of polishing a cement plate. The present invention provides a method for polishing a cement plate and a polishing belt, which keeps costs for reclaiming and replacing consumable parts low.

【0006】[0006]

【課題を解決するための手段】請求項1に記載されたダ
イヤモンド研磨ベルトは、環状とされた布材の表面に、
ダイヤモンドの砥粒が金属めっき層により固定された電
着砥粒部が複数設けられており、該電着砥粒部は、布材
の周方向に離間して配置されていることを特徴とする。
A diamond polishing belt according to a first aspect of the present invention has a ring-shaped surface of a cloth material,
A plurality of electro-deposited abrasive grain parts in which diamond abrasive grains are fixed by a metal plating layer are provided, and the electro-deposited abrasive grain parts are arranged apart from each other in the circumferential direction of the cloth material. .

【0007】請求項2に記載されたダイヤモンド研磨ベ
ルトは、請求項1に記載された研磨ベルトにおける電着
砥粒部が布材の表面にドット状に配置されていることを
特徴とする。
A diamond polishing belt according to a second aspect of the invention is characterized in that the electrodeposition abrasive grain portions of the polishing belt according to the first aspect are arranged in a dot shape on the surface of the cloth material.

【0008】請求項3に記載されたダイヤモンド研磨ベ
ルトは、請求項2に記載された研磨ベルトにおける電着
砥粒部が、格子模様の交点に配置されるごとく縦横に整
列されるとともに、研磨ベルトの回転方向に一致して配
された布材の繊維方向に対して斜めに配置されているこ
とを特徴とする。
According to a third aspect of the present invention, in the diamond polishing belt according to the second aspect, the electrodeposition abrasive grains in the polishing belt are aligned vertically and horizontally so that they are arranged at the intersections of the lattice pattern, and the polishing belt. Is arranged obliquely with respect to the fiber direction of the cloth material arranged so as to coincide with the rotation direction of.

【0009】請求項4に記載されたセメント板の研磨方
法は、請求項1、2、3のいずれかに記載されたダイヤ
モンド研磨ベルトを用いたセメント板の研磨方法であっ
て、押し出し成形を終えたセメント板の表面を露出させ
た状態で搬送し、その搬送過程において、まず、ダイヤ
モンドの砥粒が固着された研磨ロールを回転させてセメ
ント板の表面を削ることによって粗く研磨を行ない、粗
く研磨したときに用いた砥粒よりも細かいダイヤモンド
の砥粒が固着された環状のダイヤモンド研磨ベルトを回
転させ、粗く研磨されたセメント板の表面をもう一度削
ることによってやや細かく研磨を行ない、環状の研磨ベ
ルトを回転させ、やや細かく研磨されたセメント板の表
面をさらにもう一度削ることによって仕上げ研磨を行な
うことを特徴とする。
A method for polishing a cement plate according to a fourth aspect is a method for polishing a cement plate using the diamond polishing belt according to any one of the first, second and third aspects, wherein extrusion molding is completed. The cement plate is transported with the surface exposed, and in the process of transportation, first, the polishing roll to which the diamond abrasive grains are fixed is rotated to scrape the surface of the cement plate to roughen the surface. Rotate the annular diamond polishing belt to which the finer diamond grains are fixed than the one used when doing, and perform fine polishing a little more by scraping the surface of the roughened cement plate again, the annular polishing belt It is characterized by performing final polishing by rotating and rotating the surface of the cement plate that has been slightly finely ground again. .

【0010】[0010]

【発明の実施の形態】本発明に係るダイヤモンド研磨ベ
ルトおよびそれを用いたセメント板の研磨方法を図1な
いし図4に示して説明する。図1に示すセメント板の研
磨装置は、押し出し成形を終えたセメント板Sを搬送す
るベルトコンベヤ10と、このベルトコンベヤの上方
に、セメント板Sの表面を研磨する研磨手段20を備え
るものである。
DESCRIPTION OF THE PREFERRED EMBODIMENTS A diamond polishing belt according to the present invention and a cement plate polishing method using the same will be described with reference to FIGS. The cement plate polishing apparatus shown in FIG. 1 includes a belt conveyor 10 that conveys the cement plate S that has been extruded, and a polishing means 20 that polishes the surface of the cement plate S above the belt conveyor. .

【0011】この研磨手段20は、セメント板Sの搬送
方向上流側に配置されてセメント板Sを粗く研磨する粗
研磨手段30と、この粗研磨手段30よりもセメント板
Sの搬送方向下流側に配置されてやや細かく研磨する中
粗研磨手段40と、この中粗研磨手段40よりもセメン
ト板Sの搬送方向下流側に配置されてセメント板Sをき
め細かく研磨する仕上げ研磨手段50とからなる。
The polishing means 20 is arranged on the upstream side of the cement plate S in the conveying direction, and rough polishing means 30 for roughly polishing the cement plate S, and downstream of the rough polishing means 30 in the conveying direction of the cement plate S. The medium rough polishing means 40 is arranged and slightly finely polishes, and the final polishing means 50 is arranged downstream of the medium rough polishing means 40 in the transport direction of the cement plate S and finely polishes the cement plate S.

【0012】粗研磨手段30は、ダイヤモンドの砥粒D
1が固着された研磨ロール31が回転可能に支持された
もので、この研磨ロール31を、搬送途中のセメント板
Sに沿わせて回転させることによって研磨を行なうよう
になっている。砥粒D1は、ロール本体32の表面に形
成された金属めっき相によって固定されており、#30
の粒の粗いものが使用されている。
The rough polishing means 30 is a diamond abrasive grain D.
A polishing roll 31 to which 1 is fixed is rotatably supported, and polishing is performed by rotating this polishing roll 31 along a cement plate S in the course of conveyance. The abrasive grains D 1 are fixed by the metal plating phase formed on the surface of the roll body 32, and # 30
Coarse grain is used.

【0013】中粗研磨手段40は、砥粒D1よりも粒が
細かいダイヤモンドの砥粒D2が固着された環状の研磨
ベルト(ダイヤモンド研磨ベルト)41が、離間して配
置された回転ローラ42、42間に回転可能に支持され
たもので、この研磨ベルト41を、粗研磨手段30と同
様に搬送途中のセメント板Sに沿わせて回転させること
によって研磨を行なうようになっている。
In the medium rough polishing means 40, an annular polishing belt (diamond polishing belt) 41, to which abrasive grains D 2 of diamond finer than the abrasive grains D 1 are fixed, is provided with a rotating roller 42 arranged at a distance. , 42 is rotatably supported, and polishing is performed by rotating the polishing belt 41 along the cement plate S in the course of conveyance, as in the rough polishing means 30.

【0014】仕上げ研磨手段50は、砥粒D2よりもや
や粒が大きい炭化ケイ素の砥粒Cが固着された環状の研
磨ベルト51が、離間して配置された回転ローラ52、
52間に回転可能に支持されたもので、この研磨ベルト
51を、粗研磨手段30、中粗研磨手段40と同様に搬
送途中のセメント板Sに沿わせて回転させることによっ
て研磨を行なうようになっている。砥粒Cは、研磨ベル
ト51の下地となる布地に接着剤によって固着されてお
り、#120の粒の細かいものが使用されている。
The final polishing means 50 comprises an annular polishing belt 51 to which silicon carbide abrasive grains C, which are slightly larger than the abrasive grains D 2, are fixed, and a rotating roller 52, which is arranged at a distance.
The polishing belt 51 is rotatably supported between 52, and polishing is performed by rotating the polishing belt 51 along the cement plate S in the course of transportation, similarly to the rough polishing means 30 and the medium rough polishing means 40. Has become. The abrasive grains C are fixed to the cloth as the base of the polishing belt 51 with an adhesive, and fine grains of # 120 are used.

【0015】ところで、中粗研磨手段40における研磨
ベルト41は、図2および図3に示すように、環状とさ
れた表布材(布材)43の表面に、ダイヤモンドの砥粒
2を金属めっき層44により固定した電着砥粒部45
が複数設けられたものである。なお、表布材43の裏面
には、表布材43と同様に環状とされた裏布材46が、
接着層47を介して全面に貼り付けられている。
By the way, the polishing belt 41 in the rough grinding unit 40 in, as shown in FIGS. 2 and 3, the table cloth, which is the annular surface of the (fabric material) 43, a metal abrasive grains D 2 diamond Electrodeposited abrasive grain portion 45 fixed by the plating layer 44
Are provided in plural. In addition, on the back surface of the front cloth material 43, an annular back cloth material 46 similar to the front cloth material 43,
It is attached to the entire surface via the adhesive layer 47.

【0016】表布材43は、ポリエステル等の化学繊維
からなり、その織り方は平織りや綾織り、あるいは他の
織り方のいずれでもよいが、伸びを防ぐたのに織り目が
緻密であることが望ましい。また、織り糸の太さは、繊
維の種類や用途にもよるが75〜400デニール程度、
特に75〜300デニールであることが望ましい。75
デニール未満では布地が薄すぎて強度が不足し、400
デニールよりも太いと布が厚くなりすぎて必要な柔軟性
が得られない。
The surface cloth material 43 is made of a chemical fiber such as polyester, and may be woven by plain weave, twill weave, or other weaves, but the weave is dense to prevent elongation. desirable. The thickness of the weaving yarn depends on the type and use of the fiber, but is about 75 to 400 denier,
In particular, it is desirable that the denier is 75 to 300. 75
If it is less than denier, the fabric is too thin and lacks strength.
If it is thicker than denier, the cloth becomes too thick and the required flexibility cannot be obtained.

【0017】表布材43には、導電性を付与するために
Cu(銅)の無電解めっき層48が全体に形成されてい
る。この無電解めっき層48の析出量は0.1〜0.5
g/dm2、望ましくは0.2〜0.3g/dm2とされ
る。0.1g/dm2未満では十分な導電性が得られ
ず、0.5g/dm2より厚ければ繊維が硬化しすぎて
しまう。
On the surface cloth material 43, an electroless plating layer 48 of Cu (copper) is formed on the entire surface in order to impart conductivity. The amount of the electroless plating layer 48 deposited is 0.1 to 0.5.
g / dm 2, preferably it is 0.2 to 0.3 g / dm 2. If it is less than 0.1 g / dm 2 , sufficient conductivity cannot be obtained, and if it is more than 0.5 g / dm 2 , the fiber is too hard.

【0018】電着砥粒部45は、#170のダイヤモン
ドの砥粒D2と、これら砥粒D2を表布材43に接着する
金属めっき層44とから構成されている。この金属めっ
き層44の厚さは、砥粒D2の平均粒径の30〜70
%、特に40〜50%が望ましい。30%未満では砥粒
保持力が低下して砥粒D2の脱落が増加し、70%より
大きければ砥粒D2の突出量が減って研磨の切れ味が低
下する。
The electrodeposited abrasive grain portion 45 comprises abrasive grain D 2 of # 170 diamond and a metal plating layer 44 for adhering these abrasive grains D 2 to the surface cloth material 43. The thickness of the metal plating layer 44 is 30 to 70 of the average particle diameter of the abrasive grains D 2.
%, Especially 40 to 50% is desirable. If it is less than 30%, the abrasive grain holding power is lowered and the drop of the abrasive grains D 2 is increased, and if it is more than 70%, the protrusion amount of the abrasive grains D 2 is decreased and the sharpness of polishing is lowered.

【0019】電着砥粒部45はひとつひとつが小さな円
形であり、これらが表布材43の表面に、お互いに離間
して格子模様の交点に配置されるごとく縦横に整列され
てドット状とされており、しかも研磨ベルト41の回転
方向に一致して配された布材の繊維方向(図中矢印X方
向)に対して斜め(θ=72°)に配置されて千鳥模様
とされている。
Each of the electro-deposited abrasive grain portions 45 is a small circle, and these are arranged vertically and horizontally on the surface of the surface cloth material 43 so as to be spaced apart from each other at the intersections of the lattice pattern to form a dot shape. In addition, the zigzag pattern is arranged obliquely (θ = 72 °) with respect to the fiber direction (the arrow X direction in the drawing) of the cloth material that is arranged to match the rotation direction of the polishing belt 41.

【0020】一方、裏布材46は主に研磨ベルト41の
引っ張り強度を高めるもので、要求される強度に応じて
表布材よりも厚手の布が選択される。その材質や織り方
は表布材と同様でよいが、より引っ張り強度を高めるた
めに、特に長手方向に各種の強化繊維を混紡してもよ
い。
On the other hand, the back cloth material 46 mainly increases the tensile strength of the polishing belt 41, and a cloth thicker than the front cloth material is selected according to the required strength. The material and weave may be the same as those of the surface cloth material, but various reinforcing fibers may be mixed in the longitudinal direction in order to further increase the tensile strength.

【0021】接着層47を形成する接着剤としては弾力
性に富むものが好ましく、ゴム系接着剤、ウレタン系接
着剤、エポキシ系弾性接着剤等から適宜選択される。な
お、接着強度上の要求を満たすことができれば、弾力性
を高めるために発泡させてもよい。
The adhesive forming the adhesive layer 47 is preferably highly elastic and is appropriately selected from rubber adhesives, urethane adhesives, epoxy elastic adhesives and the like. It should be noted that foaming may be performed in order to enhance elasticity as long as the requirement for adhesive strength can be satisfied.

【0022】ここで、上記の研磨ベルト41の製造方法
を説明する。まず、表布材43に、無電解めっき時にC
uを析出させるための表面触媒化処理を施す。なお、表
布材43はあらかじめ十分に引き伸ばしておくことが望
ましい。こうしておくことによって繊維の微視的な緩み
が是正されて表面の平坦度が高められる。
Now, a method of manufacturing the above-mentioned polishing belt 41 will be described. First, C is applied to the surface cloth material 43 during electroless plating.
A surface catalyzation treatment for precipitating u is performed. In addition, it is desirable that the surface cloth material 43 be sufficiently stretched in advance. By doing so, the microscopic looseness of the fibers is corrected and the flatness of the surface is enhanced.

【0023】表面触媒化処理は、表布材を構成する繊維
糸の正面に、Au、Pt、Pd、Ag等の貴金属触媒核
を付与する処理で、表布材43をまずSnCl2等の還
元剤溶液に浸漬してセンシタイジングした後、これを水
洗いし、さらにPdCl2等の貴金属の塩溶液に浸漬し
て水洗いする。
The surface-catalyzed treatment is a treatment in which noble metal catalyst nuclei such as Au, Pt, Pd, and Ag are provided on the front surface of the fiber yarn constituting the surface cloth material. The surface cloth material 43 is first reduced with SnCl 2 or the like. After immersing in an agent solution for sensitizing, it is washed with water, and further immersed in a salt solution of a noble metal such as PdCl 2 and washed with water.

【0024】次に、こうして得られた表布材43をCu
の無電解めっき液に浸漬し、表面触媒化処理が施された
繊維表面に金属被膜を析出させ、布全体に導電性を付与
する。
Next, the surface cloth material 43 obtained in this manner is made of Cu.
The electroless plating solution is used to deposit a metal coating on the surface of the fiber which has been subjected to the surface catalyzation treatment, to impart conductivity to the entire cloth.

【0025】次に、無電解めっき層48を形成した表布
材43を十分に洗浄した後、電着砥粒部45を形成する
部分が丸く除去されたマスキングを表布材43の表面に
施したうえで砥粒D2を分散したCuの電気めっき液に
浸漬して電源陰極に接続し、電気めっき液内に配置した
陽極との間で通電することによって、マスキングが除去
された部分に砥粒D2を金属めっき層44で固着して電
着砥粒部45を形成する。
Next, after thoroughly cleaning the surface cloth material 43 on which the electroless plating layer 48 is formed, the surface of the surface cloth material 43 is masked so that the portion forming the electrodeposition abrasive grain portion 45 is removed in a round shape. Then, it is immersed in a Cu electroplating solution in which abrasive grains D 2 are dispersed, connected to a power source cathode, and an electric current is applied to an anode arranged in the electroplating solution to polish the portion where the masking is removed. The particles D 2 are fixed by the metal plating layer 44 to form the electrodeposition abrasive grain portion 45.

【0026】そして、マスキングを除去した後、表布材
43の裏面に接着剤を用いて裏布材46を貼り付けるこ
とによって研磨ベルト41を得る。
Then, after removing the masking, the back cloth material 46 is attached to the back surface of the front cloth material 43 with an adhesive to obtain the polishing belt 41.

【0027】次に、上記のセメント板の研磨装置を用い
て、押し出し成形を終えたセメント板Sを研磨するその
行程を説明する。
Next, the process of polishing the cement plate S that has been extruded using the above-mentioned cement plate polishing apparatus will be described.

【0028】押し出し成形を終えたセメント板Sをベル
トコンベヤ10によって搬送しながら、まず、粗研磨手
段30において、ダイヤモンドの砥粒D1が固着された
研磨ロール31を回転させることによって粗研磨を行な
う。
While the cement plate S, which has been extruded, is conveyed by the belt conveyor 10, the rough polishing means 30 first performs rough polishing by rotating the polishing roll 31 to which the diamond abrasive grains D 1 are fixed. .

【0029】次に、中粗研磨手段40において、ダイヤ
モンドの砥粒D2が固着された研磨ベルト41を回転さ
せることによって中粗研磨を行なう。このとき、研磨ベ
ルト41には、小さな円形の電着砥粒部45がお互いに
離間して格子模様の交点に配置されるごとく縦横に整列
されてドット状とされているので、研磨ベルト41がそ
の周方向に非常に柔軟になるとともに、セメント板Sの
研削粉が電着砥粒部45の間から後方に流されるように
なる。しかも、ドット状に配置された電着砥粒部45
が、研磨ベルト41の回転方向に一致して配された布材
の繊維方向に対して斜めに配置されて千鳥模様とされて
いるので、電着砥粒部45がセメント板Sの表面に満遍
なく接触し、セメント板Sの表面が平滑に研削される。
Next, in the medium rough polishing means 40, the medium rough polishing is performed by rotating the polishing belt 41 to which the diamond abrasive grains D 2 are fixed. At this time, since the small circular electro-deposited abrasive grain portions 45 are spaced apart from each other and arranged in the vertical and horizontal directions to form a dot shape on the polishing belt 41, the polishing belt 41 is It becomes very flexible in the circumferential direction, and the grinding powder of the cement plate S is made to flow backward from between the electrodeposition abrasive grain portions 45. Moreover, the electrodeposited abrasive grain portions 45 arranged in dots
However, since they are arranged in a zigzag pattern obliquely with respect to the fiber direction of the cloth material arranged in conformity with the rotation direction of the polishing belt 41, the electroplated abrasive grain portions 45 are evenly distributed on the surface of the cement plate S. The surfaces of the cement plate S are contacted and ground smoothly.

【0030】最後に、仕上げ研磨手段50において、炭
化ケイ素の砥粒Cが固着された環状の研磨ベルト51を
回転させることによって仕上げ研磨を行なう。以上の三
段階の研磨行程を経ることによって滑らかな表面を有す
るセメント板Sが製作される。
Finally, in the final polishing means 50, final polishing is performed by rotating the annular polishing belt 51 to which the abrasive grains C of silicon carbide are fixed. A cement board S having a smooth surface is manufactured through the above three steps of polishing process.

【0031】上記のセメント板の研磨装置において中粗
削り用として使用される研磨ベルト41には、小さな円
形の電着砥粒部45がお互いに離間して格子模様の交点
に配置されるごとく縦横に整列されてドット状とされて
いるので、研磨ベルト41がその周方向に非常に柔軟に
なって滑らかに回転するようになり、電着砥粒部45が
表布材43から剥がれにくい。また、セメント板Sの研
削粉が電着砥粒部45の間から後方に流されるようにな
ってベルトの表面、特に電着砥粒部45の進行方向前部
の僅かな段差にも研削粉がたまりにくい。
In the polishing belt 41 used for the medium roughing in the above-mentioned cement plate polishing apparatus, small circular electrodeposition abrasive grain portions 45 are vertically and horizontally arranged so as to be spaced from each other and arranged at the intersections of the lattice pattern. Since the polishing belt 41 is aligned and formed into a dot shape, the polishing belt 41 becomes very flexible in the circumferential direction and smoothly rotates, and the electro-deposited abrasive grain portion 45 does not easily peel off from the surface cloth material 43. Further, since the grinding powder of the cement plate S is made to flow backward from between the electrodeposition abrasive grain portions 45, the grinding powder is also formed on the surface of the belt, particularly on a slight step on the front portion in the traveling direction of the electrodeposition abrasive grain portions 45. Difficult to collect.

【0032】さらに、ドット状に配置された電着砥粒部
45が、研磨ベルト41の回転方向に一致して配された
表布材43の繊維方向に対して斜めに配置されて千鳥模
様とされているので、電着砥粒部45がセメント板Sの
表面に満遍なく接触してセメント板Sに研磨によるすじ
がつきにくい。
Further, the electrodeposited abrasive grain portions 45 arranged in dots are arranged obliquely with respect to the fiber direction of the surface cloth material 43 arranged so as to coincide with the rotation direction of the polishing belt 41 to form a zigzag pattern. As a result, the electro-deposited abrasive grain portions 45 evenly contact the surface of the cement plate S, and the cement plate S is unlikely to have streaks due to polishing.

【0033】このように、研磨ベルト41は研削能力が
高く耐久性にも優れているために交換頻度が低い。しか
も、この研磨ベルト41を中粗研磨手段40に採用し、
その前段に粗研磨手段30を、後段に仕上げ研磨手段5
0をそれぞれ配置し、ダイヤモンドの砥粒を用いた研磨
ロール31、炭化ケイ素の砥粒を用いた研磨ベルト51
をそれぞれ1基ずつとしたので、従来の研磨装置に比べ
て交換による作業の中断時間が半減する。すなわち、従
来の研磨装置に比べて消耗部品の交換による作業の中断
時間が半減して生産効率が向上するとともに、新品への
交換頻度が非常に少なくなってランニングコストが削減
される。
As described above, since the polishing belt 41 has a high grinding ability and excellent durability, it is replaced less frequently. Moreover, this polishing belt 41 is adopted as the medium rough polishing means 40,
The rough polishing means 30 is provided at the front stage, and the finish polishing means 5 is provided at the rear stage.
0 are arranged respectively, a polishing roll 31 using diamond abrasive grains, and a polishing belt 51 using silicon carbide abrasive grains
Since the number of each is one, the work interruption time due to replacement is halved compared to the conventional polishing apparatus. That is, as compared with the conventional polishing apparatus, the work interruption time due to replacement of consumable parts is halved to improve the production efficiency, and the frequency of replacement with a new product is extremely reduced to reduce the running cost.

【0034】[0034]

【実施例】上記のように構成された研磨ベルト41を使
用して実際にセメント板Sの研磨試験を行い、研磨ベル
ト41の研削能力および寿命を調査した。なお、この試
験においては、粗研磨手段30、仕上げ研磨手段50に
よる研磨は行わず、中粗研磨手段40のみを用いるもの
とし、この中粗研磨手段40に研磨ベルト41を装着し
てセメント板Sの研磨を行った場合と、同じ条件で従来
の炭化ケイ素の砥粒が固着された研磨ベルトを装着して
研磨を行った場合について、セメント板Sの研削のべ長
さに対するセメント板S表面の換算取代(研削される厚
み)大きさをそれぞれ測定した。以下に当該研磨試験に
各試験条件を示す。 セメント板送り速度:5m/min ベルト速度:800m/min ベルトサイズ:100mm×1525mm 研削負荷:0.288HP/25mm 被研削材:押し出しセメント板 60mm(幅)×60
0(長さ)mm コンタクト(回転ローラ):38φスチールプレーンロ
ール
EXAMPLE A cement plate S was actually subjected to a polishing test using the polishing belt 41 configured as described above, and the grinding ability and life of the polishing belt 41 were investigated. In this test, the rough polishing means 30 and the finish polishing means 50 are not used for polishing, and only the medium rough polishing means 40 is used. Of the surface of the cement plate S with respect to the total length of grinding of the cement plate S in the case where the conventional polishing belt to which the abrasive grains of silicon carbide are fixed under the same condition is mounted The reduced size (thickness to be ground) was measured. The test conditions for the polishing test are shown below. Cement plate feed speed: 5 m / min Belt speed: 800 m / min Belt size: 100 mm x 1525 mm Grinding load: 0.288 HP / 25 mm Grinding material: Extruded cement plate 60 mm (width) x 60
0 (length) mm Contact (rotating roller): 38φ steel plain roll

【0035】試験により測定されたセメント板Sの研削
のべ長さに対するセメント板表面の換算取代の大きさを
表すグラフを図4に示す。グラフから明確なように、研
磨ベルト41を装着した場合においては、試験修了まで
換算取代148〜169μmが維持された。試験開始か
ら終了まで(セメント板Sののべ長さ1200mまで)
ほとんど安定した研削能力が示された。また、のべ長さ
1200mの時点でも依然として研削能力の低下が見ら
れないことから、これ以上の寿命を有するものと推測さ
れる。
FIG. 4 is a graph showing the size of the conversion allowance on the surface of the cement board with respect to the total grinding length of the cement board S measured by the test. As is clear from the graph, when the polishing belt 41 was attached, the conversion allowance 148 to 169 μm was maintained until the completion of the test. From the start to the end of the test (up to a total length of cement board S of 1200 m)
An almost stable grinding ability was shown. Further, even when the total length is 1200 m, the grinding ability is still not deteriorated, so it is presumed that the life is longer than this.

【0036】[0036]

【発明の効果】請求項1に記載されたダイヤモンド研磨
ベルトによれば、環状とされた布材の表面に、ダイヤモ
ンドの砥粒を金属めっき層により固定した電着砥粒部が
複数設けられており、該電着砥粒部は、布材の周方向に
離間して配置されているので、金属めっきされる部分が
減り、ベルト自体が布材の周方向に非常に柔軟になって
回転が滑らかになり、電着砥粒部が布材から剥がれにく
くすることができる。
According to the diamond polishing belt of the first aspect of the invention, a plurality of electrodeposited abrasive grains having diamond abrasive grains fixed by a metal plating layer are provided on the surface of an annular cloth material. Since the electro-deposited abrasive grain portions are arranged apart from each other in the circumferential direction of the cloth material, the metal-plated portion is reduced, and the belt itself becomes very flexible in the circumferential direction of the cloth material, and the belt is not rotated. It becomes smooth, and the electro-deposited abrasive grain portion can be made difficult to peel off from the cloth material.

【0037】請求項2に記載されたダイヤモンド研磨ベ
ルトによれば、研磨ベルトにおける電着砥粒部が布材の
表面にドット状に配置されているので、セメント板の研
削粉が電着砥粒部の間から後方に流されるようになり、
これによってベルトの表面、特に電着砥粒部の進行方向
前部の僅かな段部に研削粉がたまりにくくなる。したが
って、従来の研磨ベルトに比べてより長時間その研削能
力を高く保つことができる。
According to the diamond polishing belt of the second aspect, since the electrodeposition abrasive grain portions of the polishing belt are arranged in a dot pattern on the surface of the cloth material, the grinding powder of the cement plate is the electrodeposition abrasive grain. It will be washed backward from between the parts,
As a result, it becomes difficult for the grinding powder to collect on the surface of the belt, particularly on the slight step portion in the front portion in the traveling direction of the electrodeposition abrasive grain portion. Therefore, the grinding ability can be kept high for a longer time as compared with the conventional polishing belt.

【0038】請求項3に記載されたダイヤモンド研磨ベ
ルトによれば、電着砥粒部が、格子模様の交点に配置さ
れるごとく縦横に整列されるとともに、研磨ベルトの回
転方向に一致して配された布材の繊維方向に対して斜め
に配置されているので、電着砥粒部がセメント板の表面
に満遍なく接触するようになる。したがって、研磨によ
るすじをつきにくくしてセメント板の表面を平滑に仕上
げることができる。
According to the diamond polishing belt of the third aspect, the electrodeposited abrasive grain portions are vertically and horizontally aligned as they are arranged at the intersections of the lattice pattern, and are arranged so as to match the rotation direction of the polishing belt. Since they are arranged obliquely with respect to the fiber direction of the formed cloth material, the electrodeposited abrasive grains come into uniform contact with the surface of the cement plate. Therefore, it is possible to make the surface of the cement plate smooth by making it difficult to generate streaks due to polishing.

【0039】請求項4に記載されたセメント板の研磨方
法によれば、研磨の工程を粗研磨、中粗研磨、仕上げ研
磨の3段階とすることによって、従来に比べて各研磨工
程に備わる消耗部品が全体として少なくなり、しかも中
粗研磨の工程において、従来の研磨ベルトに比べて耐久
性、研削能力が高いダイヤモンド研磨ベルトを採用する
ことにより、全体としてそれら消耗部品の交換による作
業の中断時間を短縮して生産効率を向上させるととも
に、消耗部品の再生、新品との交換にかかるランニング
コストを低く抑えることができる。
According to the cement plate polishing method of the fourth aspect, the polishing process is performed in three stages of rough polishing, medium rough polishing, and final polishing, so that the polishing process has more wear than conventional ones. By using a diamond polishing belt that has fewer parts as a whole and has higher durability and grinding ability than conventional polishing belts in the process of medium-rough polishing, overall work interruption time due to replacement of these consumable parts The production cost can be shortened to improve the production efficiency, and the running cost for recycling consumable parts and replacement with new ones can be kept low.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係るダイヤモンド研磨ベルトを備える
セメント板の研削装置の実施の形態を示す斜視図であ
る。
FIG. 1 is a perspective view showing an embodiment of a cement plate grinding apparatus including a diamond polishing belt according to the present invention.

【図2】本発明に係るダイヤモンド研磨ベルトの実施の
形態を示す平面図である。
FIG. 2 is a plan view showing an embodiment of a diamond polishing belt according to the present invention.

【図3】図2におけるIII−III線矢視断面図であ
る。
FIG. 3 is a sectional view taken along the line III-III in FIG.

【図4】本発明に係るダイヤモンド研磨ベルトの研磨試
験の結果を示すグラフである。
FIG. 4 is a graph showing the results of a polishing test of the diamond polishing belt according to the present invention.

【図5】従来のセメント板の研磨装置を示す斜視図であ
る。
FIG. 5 is a perspective view showing a conventional cement plate polishing apparatus.

【符号の説明】[Explanation of symbols]

10 ベルトコベヤ 20 研磨手段 30 粗研磨手段 31 研磨ロール 40 中粗研磨手段 41 研磨ベルト(ダイヤモンド研磨ベルト) 43 表布材(布材) 44 金属めっき層 45 電着砥粒層 48 無電解めっき層 50 仕上げ研磨手段 51 研磨ベルト D1、D2 ダイヤモンドの砥粒 C 炭化ケイ素の砥粒 S セメント板10 Belt Cobber 20 Polishing Means 30 Rough Polishing Means 31 Polishing Rolls 40 Medium Rough Polishing Means 41 Polishing Belts (Diamond Polishing Belts) 43 Surface Cloth Materials (Cloth Materials) 44 Metal Plating Layers 45 Electrodeposited Grain Layers 48 Electroless Plating Layers 50 Finishing Polishing means 51 Polishing belt D 1 , D 2 Diamond abrasive grains C Silicon carbide abrasive grains S Cement plate

───────────────────────────────────────────────────── フロントページの続き (72)発明者 下前 直樹 福島県いわき市泉町黒須野字江越246−1 三菱マテリアル株式会社いわき製作所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Naoki Shimozene 246-1 Ekoshi, Kurosuno, Izumi-cho, Iwaki-shi, Fukushima Mitsubishi Materials Corporation Iwaki Works

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 環状とされた布材の表面に、ダイヤモン
ドの砥粒が金属めっき層により固定された電着砥粒部が
複数設けられており、 該電着砥粒部は、布材の周方向に離間して配置されてい
ることを特徴とするダイヤモンド研磨ベルト。
1. A ring-shaped cloth material is provided with a plurality of electro-deposited abrasive particles, in which diamond abrasive particles are fixed by a metal plating layer, on the surface of the cloth material. A diamond polishing belt, characterized in that they are spaced apart in the circumferential direction.
【請求項2】 請求項1に記載されたダイヤモンド研磨
ベルトにおいて、 前記電着砥粒部が布材の表面にドット状に配置されてい
ることを特徴とするダイヤモンド研磨ベルト。
2. The diamond polishing belt according to claim 1, wherein the electrodeposition abrasive grain portions are arranged in a dot shape on the surface of the cloth material.
【請求項3】 請求項2に記載されたダイヤモンド研磨
ベルトにおいて、 前記電着砥粒部が、格子模様の交点に配置されるごとく
縦横に整列されるとともに、研磨ベルトの回転方向に一
致して配された布材の繊維方向に対して斜めに配置され
ていることを特徴とするダイヤモンド研磨ベルト。
3. The diamond polishing belt according to claim 2, wherein the electro-deposited abrasive grain portions are aligned vertically and horizontally as arranged at intersections of a lattice pattern, and are aligned with a rotation direction of the polishing belt. A diamond polishing belt, wherein the diamond polishing belt is arranged obliquely with respect to the fiber direction of the arranged cloth material.
【請求項4】 請求項1、2、3のいずれかに記載され
たダイヤモンド研磨ベルトを用いたセメント板の研磨方
法であって、 押し出し成形を終えたセメント板の表面を露出させた状
態で搬送し、その搬送過程において、 ダイヤモンドの砥粒が固着された研磨ロールをその周方
向に回転させてセメント板の表面を削ることによって粗
く研磨を行ない、 粗く研磨したときに用いた砥粒よりも細かいダイヤモン
ドの砥粒が固着された環状のダイヤモンド研磨ベルトを
その周方向に回転させ、粗く研磨されたセメント板の表
面を削ることによってやや細かく研磨を行ない、 環状の研磨ベルトをその周方向に回転させ、やや細かく
研磨されたセメント板の表面を削ることによって仕上げ
研磨を行なうことを特徴とするセメント板の研磨方法。
4. A method for polishing a cement plate using the diamond polishing belt according to claim 1, wherein the cement plate after extrusion molding is conveyed with its surface exposed. However, during the transportation process, the polishing roll to which the diamond abrasive grains are adhered is rotated in the circumferential direction to scrape the surface of the cement plate to perform rough polishing. Rotate the ring-shaped diamond polishing belt to which the diamond grains are fixed in the circumferential direction, and grind the surface of the cement plate that has been roughly polished to perform fine grinding, and rotate the ring-shaped polishing belt in the circumferential direction. A method for polishing a cement board, which comprises performing finish polishing by shaving the surface of a slightly finely ground cement board.
JP7788196A 1996-03-29 1996-03-29 Diamond abrasive belt and cement slab grinding method therewith Pending JPH09267270A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7788196A JPH09267270A (en) 1996-03-29 1996-03-29 Diamond abrasive belt and cement slab grinding method therewith

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7788196A JPH09267270A (en) 1996-03-29 1996-03-29 Diamond abrasive belt and cement slab grinding method therewith

Publications (1)

Publication Number Publication Date
JPH09267270A true JPH09267270A (en) 1997-10-14

Family

ID=13646426

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7788196A Pending JPH09267270A (en) 1996-03-29 1996-03-29 Diamond abrasive belt and cement slab grinding method therewith

Country Status (1)

Country Link
JP (1) JPH09267270A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013049999A (en) * 2011-08-31 2013-03-14 Ohbayashi Corp Method for finishing surface using self leveling material
WO2015008572A1 (en) * 2013-07-19 2015-01-22 国立大学法人名古屋工業大学 Metallic polishing pad and production method therefor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01246063A (en) * 1988-03-25 1989-10-02 Takekawa Iron Works Co Ltd Wide-belt sanding machine
JPH02180566A (en) * 1988-12-28 1990-07-13 Toshio Sugiura Polishing sheet equipped with hard abrasive grain and manufacture thereof
JPH03121767A (en) * 1989-09-30 1991-05-23 Kikukawa Tekkosho:Kk Wide belt sander

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01246063A (en) * 1988-03-25 1989-10-02 Takekawa Iron Works Co Ltd Wide-belt sanding machine
JPH02180566A (en) * 1988-12-28 1990-07-13 Toshio Sugiura Polishing sheet equipped with hard abrasive grain and manufacture thereof
JPH03121767A (en) * 1989-09-30 1991-05-23 Kikukawa Tekkosho:Kk Wide belt sander

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013049999A (en) * 2011-08-31 2013-03-14 Ohbayashi Corp Method for finishing surface using self leveling material
WO2015008572A1 (en) * 2013-07-19 2015-01-22 国立大学法人名古屋工業大学 Metallic polishing pad and production method therefor
US9815170B2 (en) 2013-07-19 2017-11-14 Nagoya Institute Of Technology Metallic abrasive pad and method for manufacturing same

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