JPH09231520A - Thin-film magnetic head and magnetic head device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress the temp. rise of an MR elements layer of a thin-film magnetic head having an MR head element. SOLUTION: A band-shaped horizontal heat conduction layer 80 consisting of the same material as the material of an upper shielding layer 8 is drawn out of the end of the upper shielding layer 8. The front end of this horizontal heat conduction layer 80 is provided with a perpendicular heat conduction layer 81. This perpendicular heat conduction layer 81 is composed of a first layer, a second layer, a third layer 84 and a heat radiation layer 90. The heat generated form the MR element layer 80 transfer from the upper shielding layer 8 through the horizontal heat conduction layer 80 to the perpendicular heat conduction layer 81 and is dissipated outside from the surface of the heat radiation layer 90.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film magnetic head having a magnetoresistive head element or a composite thin film magnetic head having an inductive head element and a magnetoresistive head element integrally formed. is there.

[0002]

2. Description of the Related Art In recent years, in a hard disk drive device or the like as an external storage device of a computer, an inductive head element H1 for recording a signal and a magnetoresistive head element H2 for reproducing a signal (hereinafter referred to as an MR head element). ) And a composite type thin film magnetic head, which are integrated, are attracting attention. Generally, in a composite type thin film magnetic head, as shown in FIG. 9, as an MR head element H2 on a substrate (1),
Insulating layer (2), lower shield layer (3), lower insulating layer (4), M
The R element layer (5), the electrode layers (6) and (6), and the upper insulating layer (7) are sequentially stacked. Further, on the head element H2, as an inductive head element H1, an upper shield layer (8), a coil layer (not shown), a gap spacer layer (12), an upper core layer are provided.
(13) and the protective layer (16) are sequentially laminated. The upper shield layer (8) has a function as a magnetic shield between the MR head element H2 and the inductive head element H1 and also has a function as a lower core layer of the inductive head element H1.

In signal reproduction by a hard disk drive, the composite thin film magnetic head scans the surface of a disk rotating at high speed while maintaining a floating state with respect to the signal recording surface of the disk. In this process, the magnetization direction of the MR element layer (5) changes depending on the magnetization direction of the disk, and the resistance value of the MR element layer (5) changes accordingly. Therefore, if a current is passed from the electrode layers (6) and (6) to the MR element layer (5) and the voltage between the electrode layers (6) and (6), that is, the voltage across the MR element layer (5) is measured, The resistance change of the MR element layer (5) can be detected as a voltage change. The hard disk drive device reads the data written on the signal recording surface of the disk by utilizing the change in the resistance value of the MR element layer (5) thus obtained.

[0004]

As described above, the MR element layer
When a current is applied to (5), the MR element layer (5) has a resistance and thus generates heat, and the temperature rises. As a result, the magnetic characteristics of the MR element layer (5) are changed, the reproduction output of the MR head element H2 is lowered, and noise is generated. or,
Generally, electromigration occurs inside the MR element layer (5), and when the electromigration progresses, the MR element layer (5) is finally broken and current does not flow. Here, since the degree of progress of electromigration depends on the temperature and the current density,
The above-mentioned temperature rise accelerates the progress of electromigration. As a result, the life of the thin film magnetic head is shortened.

By the way, in the floating type thin film magnetic head, since the disk rotates at a high speed in a state where the thin film magnetic head is levitated, it is expected that the temperature rise is suppressed by the cooling effect by the air flow. However, in the above thin-film magnetic head, the entire head element is covered with the protective layer (16) having a low thermal conductivity, so that the cooling effect by the air flow cannot be sufficiently obtained. Further, in the portable personal computer, the rotation speed of the recording medium of the magnetic recording device is slow and the radius of the recording medium is small due to the limitation of power consumption.
The cooling effect by the air flow cannot be sufficiently obtained. Furthermore, in the process of capturing image data in a personal computer, a very large capacity file is saved.
When reading such a file, M
A current flows through the R element layer (5), and the temperature rise becomes large. An object of the present invention is to suppress the temperature rise of the MR element layer (5) and solve the above problems all at once.

[0006]

A thin film magnetic head according to the present invention comprises a magnetoresistive head element H2 on a substrate (1), the head element H2 comprising a lower shield layer (3) and an upper shield layer. In the thin film magnetic head having the MR element layer (5) interposed between (8) and the entire head element being covered by the protective layer (16), it is made of the same material as the upper shield layer (8). The horizontal heat conduction layer (80) is composed of the substrate (1) and the protective layer (1).
6) extends from the end of the upper shield layer (8) along the surface of the substrate (1) to the outer position of the head element, and is overlapped with the end of the horizontal heat conduction layer (80) to protect it. A vertical heat conductive layer (81) made of a material having a higher thermal conductivity than the layer (16) is formed, and the vertical heat conductive layer (81) penetrates the protective layer (16) and is exposed from the surface of the protective layer. ing.

In the thin film magnetic head, the MR element layer (5) is formed by applying a current to the MR element layer (5) during signal reproduction.
The heat generated from the heat is transmitted to the horizontal heat conduction layer (80) through the upper shield layer (8) and further exposed through the vertical heat conduction layer (81) formed on the surface of the horizontal heat conduction layer (80). Emitted from the surface to the outside. Here, the vertical heat conduction layer (81) is the protective layer (16).
Since it is formed of a material having a higher thermal conductivity than that of the conventional thin film magnetic head in which the entire head element is covered with the protective layer (16), a larger amount of heat is dissipated. In general, the upper shield layer (8) is made of a material having a high thermal conductivity such as a Ni-Fe alloy, and is located near the MR element layer (5). Therefore, by forming the horizontal heat conduction layer (80) from the same material as the upper shield layer (8), a large amount of heat can be transferred to the vertical heat conduction layer (81). If the horizontal heat conduction layer (80) is simultaneously formed in the step of forming the upper shield layer (8), the number of steps does not increase.

Another thin film magnetic head according to the present invention is a substrate
(1) A magnetoresistive head element H2 is provided on the head element H2. The head element H2 includes a lower shield layer (3) and an upper shield layer.
In a thin film magnetic head constituted by interposing an MR element layer (5) between (8) and having the entire head element covered with a protective layer (16), protrudes outwardly from the upper shield layer (8). A vertical heat conduction layer (31) made of a material having a higher thermal conductivity than that of the protective layer (16) is formed at an end of the lower shield layer (3), and the vertical heat conduction layer (31) is a protective layer. It penetrates through (16) and is exposed from the surface of the protective layer.

In the thin film magnetic head, the MR element layer (5) is formed by applying a current to the MR element layer (5) during signal reproduction.
The heat generated by the heat is transmitted from the lower shield layer (3) to the vertical heat conduction layer (31) and is radiated to the outside from the exposed surface. Here, since the vertical heat conduction layer (31) is formed of a material having a higher heat conductivity than the protection layer (16), for example, a Ni-Fe alloy, the entire head element is covered with the protection layer (16). More heat is dissipated than the conventional thin film magnetic head. or,
Generally, the lower shield layer (3) is the above upper shield layer.
Similar to (8), it is made of a material having a high thermal conductivity such as a Ni-Fe alloy, and it is still located near the MR element layer (5). Therefore, by forming the vertical heat conduction layer (31) at the end of the lower shield layer (3), a large amount of heat can be transferred to the vertical heat conduction layer (31).

Specifically, the vertical heat conduction layer is a main layer portion made of the same material as the bump layer (15) laminated on the tip portions of the plurality of terminal layers (14) extending from the head element H2. The surface of the main layer portion is formed on the same plane as the surface of the protective layer.

In the specific structure, since the bump layer (15) is made of a material having a higher thermal conductivity than the protective layer (16), such as Cu, a large amount of heat can be dissipated. Further, in the process of forming the bump layer (15) on the tip of the terminal layer (14) extending from the head element H2, at the same time, the vertical heat is applied to the surface of the horizontal heat conduction layer (80) or the surface of the lower shield layer (3). If the conductive layer is formed, the number of steps does not increase.

Further, specifically, a pad layer formed on the surface of the bump layer (15) so as to cover the surface of the main layer portion.
A heat dissipation layer (90) made of the same material as (17) is formed.

Generally, the pad layer 17 is made of Au, and in this case, the heat dissipation layer 90 is made of Au. On the other hand, the bump layer (15) is generally formed of Cu, and in this case, the main layer portion is formed of Cu, which is vulnerable to oxidation and corrosion. By covering the surface of the main layer portion, damage due to oxidation or corrosion of the main layer portion can be prevented. Here, since the heat dissipation layer (90) is made of a material having a higher thermal conductivity than the protection layer (16), for example, Au, a sufficient heat dissipation effect can be obtained. In addition, a pad layer is formed on the surface of the bump layer (15).
In the step of forming (17), the heat dissipation layer (9
Forming 0) does not increase the number of steps.

The magnetic head device according to the present invention is constructed by attaching a thin film magnetic head to the tip of a metal head supporting member. The thin film magnetic head comprises a magnetoresistive head element H2 on a substrate (1),
Is between the lower shield layer (3) and the upper shield layer (8).
The R element layer (5) is interposed, and the entire head element is covered with the protective layer (16).

The thin film magnetic head has an upper shield layer.
The horizontal heat conduction layer (80) made of the same material as (8)
Between the end (1) and the protective layer (16) of the upper shield layer (8) along the surface of the substrate (1) to the outer position of the head element, the horizontal heat transfer layer (80) A vertical heat conduction layer that is made of a material with higher heat conductivity than the protective layer (16)
(81) is formed, the vertical heat conduction layer (81) is penetrated through the protective layer (16) and exposed from the surface of the protective layer, and the exposed surface and the surface of the head supporting member are made of a metal wire ( 92) connected to each other.

In the above magnetic head device of the present invention, the MR element layer (5) is supplied with a current at the time of reproducing a signal so that the MR element
The heat generated from the element layer (5) passes from the upper shield layer (8) through the horizontal heat conduction layer (80) to the vertical heat conduction layer (81) formed on the surface of the horizontal heat conduction layer (80). It is transmitted. Further, the heat transmitted to the vertical heat conduction layer (81) is transmitted to the head supporting member via the wire (92), and the heat is dissipated from the entire surface of the head supporting member. Therefore, the heat dissipation area is increased by the above configuration, and a higher heat dissipation effect can be obtained.

Furthermore, in another configuration of the magnetic head device according to the present invention, the thin film magnetic head has an upper shield layer (8).
A vertical heat conduction layer (31) made of a material having a higher thermal conductivity than that of the protective layer (16) is formed at an end portion of the lower shield layer (3) protruding further outward than the vertical heat conduction layer (31). 31) is a protective layer (16)
And is exposed from the surface of the protective layer, and the exposed surface and the surface of the head supporting member are connected to each other by a metal wire (92).

In the magnetic head device, the MR element layer
The heat generated from (5) is transferred from the lower shield layer (3) to the vertical heat conduction layer (31). Further, the heat transferred to the vertical heat conduction layer (31) is transferred to the wire (92) as in the magnetic head device.
The heat is dissipated from the entire surface of the head support member by being transmitted to the head support member via Therefore, the heat dissipation area is increased by the above configuration, and a higher heat dissipation effect can be obtained.

[0019]

According to the thin film magnetic head of the present invention,
Since the heat generated from the MR element layer (5) is dissipated to the outside through the vertical heat conduction layer, the temperature rise of the MR element layer (5) is suppressed. As a result, the reproduction output of the MR head element H2 is prevented from being lowered, noise is generated, and further deterioration of the MR head element H2 is prevented. Further, according to the magnetic head device of the present invention, the heat generated from the MR element layer (5) is dissipated from the entire surface of the head supporting member, so that a high heat radiation effect is obtained, and as a result, the temperature rise is further reduced. It can be effectively suppressed.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Three embodiments in which the thin film magnetic head of the present invention is applied to a hard disk drive will be specifically described below with reference to the drawings. First Embodiment As shown in FIG. 1, in the hard disk drive device of the present embodiment, a spring plate (22) made of a stainless alloy is attached to the tip end of a swing arm (21), and the spring plate (22) is attached.
A composite type thin film magnetic head (20) is fixed to the tip of the device by a conductive adhesive formed by mixing an epoxy resin and silver powder. The composite thin film magnetic head (20) has an air bearing surface S formed on the surface facing the disk, and the head portion (40), the pad portion (50) and the vertical heat conduction layer (8) are formed on the side surface thereof.
1) is formed. The head section (40) includes an inductive head element H1 and an MR head element H2, and the pad section (50) has four pad layers (17) (17) (for connecting both head elements to an external circuit). 17) (17) is formed.

FIG. 2 shows a structure of the head portion (40) and the vertical heat conduction layer (81) of the composite type thin film magnetic head (20) as seen from the front side, and a pair of layers is formed on the lower shield layer (3). Electrode layer (6)
(6) is formed, and an upper shield layer (8) is formed on both electrode layers (6) and (6) on the side facing the recording medium.
Also, from the end of the upper shield layer (8),
A strip-shaped horizontal heat conduction layer (80) made of the same material as (8)
A vertical heat conduction layer (81) is provided at the tip of the horizontal heat conduction layer (80) and is drawn out in a direction away from the surface facing the recording medium. The vertical heat conduction layer (81) includes a heat dissipation layer (90) made of the same material as the pad layer (17). Vertical heat conduction layer (8
The specific laminated structure of 1) will be described later. An upper core layer (13) is formed on the upper shield layer (8) on the side facing the recording medium, and a coil layer (10) is formed around the upper core layer (13). There is. Furthermore, the electrode layers (6) (6) and the coil layer (10) respectively comprise a pair of terminal layers (14) (14).
Has been pulled out.

FIG. 4 is an enlarged cross-sectional view taken along the line AA of FIG. 2 showing the laminated structure of the vertical heat conduction layer (81). The insulating layer (2) and the lower shield layer (3) are provided on the substrate (1). ), Lower insulating layer
(4), the electrode layer (6), the upper insulating layer (7), and the horizontal heat conduction layer (80) drawn from the upper shield layer (8) are sequentially formed. A first layer (82) made of the same material as the coil layer (10) is formed on the upper surface of the horizontal heat conduction layer (80) as the vertical heat conduction layer (81). A gap spacer layer (12) is formed around the (82). Furthermore, on the upper surface of the first layer (82), a second layer (83) made of the same material as the upper core layer (13) and a third layer (84) made of the same material as the bump layer (15). Are sequentially laminated, and the third layer (84) constitutes the thickest main layer portion. The third layer (84) is a protective layer (1
The surface R penetrates 6) and is aligned with the surface of the protective layer (16). Further, covering the surface R of the third layer (84), the pad layer (17)
A heat dissipation layer (90) made of the same material as the above is formed.

Next, the manufacturing process of the composite type thin film magnetic head (20) will be specifically described. FIG. 6 and FIG.
Each of them represents a laminated structure of the head portion (40) and the pad portion (50) of the composite type thin film magnetic head (20). As shown in FIG. 6, first, on a substrate (1) made of Al ₂ O ₃ —TiO, M
An insulating layer made of Al ₂ O ₃ as the R head element H2
(2), lower shield layer made of Ni-Fe alloy (3), Al ₂
A lower insulating layer (4) made of O _3, an MR element layer (5) made of Ni—Fe, electrode layers (6) and (6) made of Cu, an upper insulating layer (7) made of Al ₂ O ₃ and Ni−. An upper shield layer (8) made of Fe alloy is sequentially formed. Where the upper shield layer (8)
When the mask is formed, a mask in which the shapes of the upper shield layer (8) and the horizontal heat conduction layer (80) are combined is adopted as a mask, and at the same time as the upper shield layer (8), as shown in FIG. (8
0) is formed. Next, as shown in FIG. 6, as an inductive head element H1, a lower insulating layer (9) made of photoresist was used.
And a coil layer (10) made of Cu is formed. Here, at the same time when forming the coil layer (10), as shown in FIG.
A first layer (82) is formed at the tip of the horizontal heat conduction layer (80) from the same material as the coil layer (10).

Then, as shown in FIG. 6, an upper insulating layer (11) made of a photoresist and a gap spacer layer (12) made of Al ₂ O ₃ are formed. The gap spacer layer (12) is made of Al. Since it is formed of ₂ O ₃ , its thermal conductivity is low. Therefore, the gap spacer layer (12) formed on the surface of the first layer (82) is removed, and as shown in FIG.
The surface of (82) is exposed.

Next, on the upper surface of the gap spacer layer (12),
As shown in FIG. 6, the upper core layer (13) made of Ni-Fe is formed, and at the same time, as shown in FIG. 4, the upper layer of the first layer (82) is made of the same material as the upper core layer (13). Two layers (83) are formed. Subsequently, as shown in FIG. 7, a terminal layer (14) made of Cu and a bump layer (15) made of Cu are sequentially formed. Here, when forming the bump layer (15), at the same time, as shown in FIG. 4, the third layer (8
4) is formed.

Thereafter, as shown in FIGS. 4, 6 and 7.
Covering the third layer (84), both head elements and the bump layer (15),
A protective layer (16) made of Al ₂ O ₃ is formed. Then, the surface of the protective layer (16) is polished to give a third layer (84) and a bump layer (15).
The surface of the is exposed from the protective layer (16). Finally, the third layer (8
A heat dissipation layer (90) and a pad layer (17) made of Au are respectively formed on the surface R of 4) and the surface of the bump layer (15) to complete the composite type thin film magnetic head (20). Here, since the heat dissipation layer (90) is made of Au, it has a high thermal conductivity and a sufficient heat dissipation effect can be obtained. Also, the third layer (84) is made of Cu and is weak against oxidation and corrosion, but its surface R is covered with the heat dissipation layer (90) made of Au, so that damage due to oxidation and corrosion is prevented. .

In the composite thin film magnetic head (20), the heat generated from the MR element layer (5) at the time of signal reproduction passes vertically from the upper shield layer (8) through the horizontal heat conduction layer (80). It is transmitted to the first layer (82) of the layer (81), and further radiated from the surface of the heat dissipation layer (90) to the outside through the second layer (83) and the third layer (84).

Here, the upper shield layer (8) is made of Ni-Fe.
It is formed from a high thermal conductivity, such as alloy materials, Al ₂
It has higher thermal conductivity than the lower insulating layer (4) and the upper insulating layer (7) made of O ₃ . Therefore, if the horizontal heat conduction layer (80) is formed from the same material as the upper shield layer (8), M
Lower insulating layer (4) existing closest to the R element layer (5)
Alternatively, use the same material as the upper insulating layer (7) for the horizontal heat transfer layer (8
Than the structure that forms the vertical heat conduction layer (8).
You can tell 1). Further, the first layer (82), the second layer (83), the third layer (84), and the heat dissipation layer (9) that constitute the vertical heat conduction layer (81).
Since (0) is formed of a material having a higher thermal conductivity than the protective layer (16), it has a larger amount of heat than a conventional thin film magnetic head in which the entire head element is covered with the protective layer (16). Dissipated.

Further, when recording a signal, the coil layer (1
Heat will be generated from (0), but the upper shield layer (8)
Exists also in a position close to the coil layer (10), and this heat is also radiated to the outside through the horizontal heat conduction layer (80) and the vertical heat conduction layer (81).

Second Embodiment In the composite type thin film magnetic head (20) of the first embodiment, the horizontal heat conduction layer (80) is formed by being drawn out from the end of the upper shield layer (8), and its tip end is formed. Vertical heat transfer layer (81)
In this embodiment, the vertical heat conduction layer (31) is provided at the end of the lower shield layer (3). The laminated structure of the head portion (41) and the pad portion (51) of the composite type thin film magnetic head (23) is the same as that of the first embodiment shown in FIGS. 6 and 7. The configuration of the hard disk drive device of this embodiment is also the same as that of the first embodiment shown in FIG.

FIG. 3 shows a structure of the head portion (41) and the vertical heat conduction layer (31) of the composite type thin film magnetic head (23) as seen from the front side, and a pair of layers is formed on the lower shield layer (3). Electrode layer (6)
(6) is formed. A vertical heat conduction layer (31) is provided at an end of the lower shield layer (3) at a position apart from the electrode layer (6). The vertical heat conduction layer (31) is a pad layer (17).
It has a heat dissipation layer (90) made of the same material as. The specific laminated structure of the vertical heat conduction layer (31) will be described later.
An upper shield layer (8) is formed on both electrode layers (6) and (6) on the side facing the recording medium. Furthermore, on the upper shield layer (8), the upper core layer is provided on the side facing the recording medium.
(13) is formed, and a coil layer is formed around the upper core layer (13).
(10) is formed. Further, a pair of terminal layers (14) and (14) are respectively drawn out from the electrode layers (6) (6) and the coil layer (10).

FIG. 5 is an enlarged cross-sectional view showing the laminated structure of the vertical heat conduction layer (31), taken along the line 3A-A in FIG. 3. The insulating layer (2) and the lower shield layer (3) are formed on the substrate (1). ) Are sequentially formed. On the upper surface of the lower shield layer (3), a first layer (32) made of the same material as the upper shield layer (8) is formed as the vertical heat conduction layer (31). ), A lower insulating layer (4), an upper insulating layer (7) and a gap spacer layer (12) are sequentially laminated. Further, on the upper surface of the first layer (32), the second layer (3) made of the same material as the coil layer (10) is provided.
3), the third layer (34) made of the same material as the upper core layer (13),
And the fourth layer (35) made of the same material as the bump layer (15) is sequentially laminated, and the fourth layer (35) constitutes the thickest main layer portion. The fourth layer (35) penetrates the protective layer (16) and has a surface R
Are aligned with the surface of the protective layer (16). Further, a heat dissipation layer (90) made of the same material as the pad layer (17) is formed so as to cover the surface R of the fourth layer (35).

Next, the manufacturing process of the composite type thin film magnetic head (23) will be specifically described. As shown in FIG.
On the substrate (1) made of Al ₂ O ₃ —TiO, first, as the MR head element H2, an insulating layer (2) made of Al ₂ O ₃ and Ni—
Lower shield layer (3) made of Fe alloy, lower insulating layer (4) made of Al ₂ O ₃ , MR element layer (5) made of Ni-Fe, C
The electrode layers (6) and (6) made of u and the upper insulating layer (7) made of Al ₂ O ₃ are formed. Here, the electrode layer (6) is formed on the lower shield layer (3) by providing a vertical heat conduction layer forming region. The lower insulating layer (4) and the upper insulating layer (7) are made of Al ₂
Since it is formed of O ₃ , its thermal conductivity is low. Therefore, as shown in FIG. 5, the lower insulating layer (4) and the upper insulating layer are
An opening is provided in (7). Next, as shown in FIG. 6, the upper insulating layer
An upper shield layer made of a Ni-Fe alloy on the upper surface of (7)
At the same time as forming (8), as shown in FIG. 5, a first layer (32) is formed in the opening from the same material as the upper shield layer (8). Further, as shown in FIG. 6, the inductive head element H1
As a lower insulating layer (9) made of photoresist and C
A coil layer (10) made of u is formed. Where the coil layers
At the same time when forming (10), as shown in FIG.
On the upper surface of (32), from the same material as the coil layer (10), the second layer (3
Form 3).

Then, as shown in FIG. 6, an upper insulating layer (11) made of photoresist and a gap spacer layer (12) made of Al ₂ O ₃ are formed. The gap spacer layer (12) is made of Al. Since it is formed of ₂ O ₃ , its thermal conductivity is low. Therefore, the gap spacer layer (12) formed on the surface of the second layer (33) is removed, and as shown in FIG.
The surface of (33) is exposed.

Next, on the upper surface of the gap spacer layer (12),
As shown in FIG. 6, the upper core layer (13) made of Ni-Fe is formed, and at the same time, as shown in FIG. 5, the upper surface of the second layer (33) is made of the same material as the upper core layer (13). Form three layers (34). Subsequently, as shown in FIG. 7, a terminal layer (14) made of Cu and a bump layer (15) made of Cu are sequentially formed. Here, when forming the bump layer (15), at the same time, as shown in FIG. 5, a fourth layer (3
5) is formed.

Then, as shown in FIGS. 5, 6 and 7,
Covering the fourth layer (35), both head elements and the bump layer (15),
A protective layer (16) made of Al ₂ O ₃ is formed. Then, the surface of the protective layer (16) is polished to give a fourth layer (35) and a bump layer (15).
The surface of the is exposed from the protective layer (16). Finally, the fourth layer (3
A heat dissipation layer (90) and a pad layer (17) made of Au are respectively formed on the surface R of 5) and the surface of the bump layer (15) to complete the composite type thin film magnetic head (23). Here, as in the first embodiment, the heat dissipation layer (90) is made of Au, so that a sufficient heat dissipation effect can be obtained. Also, the fourth made of Cu
Since the surface R of the layer (35) is covered with the heat dissipation layer (90) made of Au, damage due to oxidation and corrosion can be prevented as in the first embodiment.

In the above composite type thin film magnetic head (23), the heat generated from the MR element layer (5) at the time of signal reproduction is generated from the lower shield layer (3) to the first layer (32) of the vertical heat conduction layer (31). ), Is transmitted to the second layer (33), the third layer (34) and the fourth layer (35), and is radiated to the outside from the surface of the heat dissipation layer (90).

The lower shield layer (3) is made of Ni-Fe.
It is formed from a high thermal conductivity, such as alloy materials, Al ₂
It has higher thermal conductivity than the lower insulating layer (4) and the upper insulating layer (7) made of O ₃ . Therefore, the structure in which the vertical heat conduction layer (31) is formed at the end of the lower shield layer (3) is used for the MR element layer.
A larger amount of heat is applied to the vertical insulation layer than the structure in which the vertical heat conduction layer (31) is formed at the end of the lower insulation layer (4) or the end of the upper insulation layer (7) located closest to (5). It can be transferred to the conductive layer (31). In addition, as in the first embodiment, the first layer (32), the second layer (33), and the third layer (3) that form the vertical heat conduction layer (31).
4), the fourth layer (35) and the heat dissipation layer (90) are made of a material having higher thermal conductivity than the protective layer (16), so that the entire head element is covered with the protective layer (16). More heat is dissipated than conventional thin-film magnetic heads.

Third Embodiment A hard disk drive device of this embodiment shown in FIG.
A spring plate (24) made of a stainless alloy is attached to the tip of the swing arm (21), and the tip of the spring plate (24) is
The same composite thin film magnetic head (20) as in the first embodiment is
It is fixed by a conductive adhesive formed by mixing an epoxy resin and silver powder. Further, the heat dissipation pad layer (91) made of Au is formed on the spring plate (24) at the tip of the composite type thin film magnetic head (20). The heat dissipation pad layer
The (91) and the surface of the vertical heat conduction layer (81) formed on the side surface of the composite type thin film magnetic head (20) are connected to each other by a metal wire (92).

In the hard disk drive device of the present embodiment, the heat generated from the MR element layer (5) passes from the upper shield layer (8) to the horizontal heat conduction layer (80) as in the first embodiment. , The first layer (82) and the second layer of the vertical heat conduction layer (81)
(83), the third layer (84) and the heat dissipation layer (90). Furthermore,
The heat transferred to the heat dissipation layer (90) is transferred to the spring plate (24) via the wire (92) and the heat dissipation pad layer (91), and is dissipated from the entire surface of the spring plate (24).

According to the composite type thin film magnetic heads in the first, second and third embodiments, the MR element layer is reproduced during signal reproduction.
Since the heat generated from (5) is dissipated to the outside from the surface of the heat dissipation layer (90) as described above, the temperature rise of the MR element layer (5) can be suppressed. As a result, the MR head element H
2 of the reproduction output, the generation of noise, and the deterioration of the MR head element H2 are prevented.

Further, according to the hard disk drive devices of the above-mentioned first, second and third embodiments, the composite thin film magnetic head is made of a spring plate by means of a conductive adhesive formed by mixing an epoxy resin and silver powder. Since it is fixed to the spring plate, static electricity generated between the composite thin-film magnetic head and the recording medium due to the rotation of the recording medium can be made to flow to the spring plate, and it is possible to prevent the harmful effects of static electricity. Particularly, in the third embodiment, the generated static electricity is transferred from the upper shield layer (8) to the horizontal heat conduction layer (80), the vertical heat conduction layer (81), the heat dissipation layer (90),
After passing through the wire (92) and the heat dissipation pad layer (91), the spring plate (2
Since it can be flown to 4), the effect of releasing static electricity can be further enhanced and a highly reliable composite thin film magnetic head can be obtained.

Further, according to the hard disk drive device of the third embodiment, as described above, the heat generated from the MR element layer (5) is dissipated from the entire surface of the spring plate (24), so that the heat dissipation area is reduced. Will increase. As a result, MR
The temperature rise of the element layer (5) can be effectively suppressed.

The above description of the embodiments is for explaining the present invention, and should not be understood so as to limit the invention described in the claims or to reduce the scope.
In addition, the configuration of each part of the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications can be made within the technical scope described in the claims.

For example, in the second embodiment, the vertical heat conduction layer (31) is provided at the end of the lower shield layer (3), but the horizontal heat conduction layer (31) made of the same material as the lower shield layer (3) is used. It is also possible to form the conductive layer by drawing it from the lower shield layer (3) and provide the vertical heat conductive layer (31) at the tip of the horizontal heat conductive layer. In the third embodiment, the tip of the spring plate (24) has a vertical heat conduction layer (8) at the tip of the horizontal heat conduction layer (80).
The same composite type thin film magnetic head (2)
0) is attached, but the same composite type thin film magnetic head (23) as that of the second embodiment in which the vertical heat conduction layer (31) is provided at the end of the lower shield layer (3), the spring plate (24 ) It is also possible to attach to the tip part. Also, in the first embodiment, the second layer (83) made of the same material as the upper core layer (13) is formed as the vertical heat conduction layer (81), but the second layer (83) is omitted. Then, it is possible to form a thick third layer (84) made of the same material as the bump layer (15) to be formed next. Further, in the second embodiment, as the vertical heat conduction layer (31), the third layer (34) made of the same material as the upper core layer (13) is formed, but the third layer (34) is omitted. Then, the bump layer (1
It is also possible to form a thick fourth layer (35) made of the same material as 5).

[Brief description of drawings]

FIG. 1 is a perspective view showing a main part of a hard disk drive device according to first and second embodiments.

FIG. 2 is a plan view showing an essential part of a composite type thin film magnetic head in first and third embodiments.

FIG. 3 is a plan view showing a main part of a composite type thin film magnetic head according to a second embodiment.

FIG. 4 is a cross-sectional view showing a laminated structure of a vertical heat conduction layer of the composite type thin film magnetic head in the first and third examples.

FIG. 5 is a sectional view showing a laminated structure of a vertical heat conduction layer of a composite type thin film magnetic head in a second example.

FIG. 6 is a sectional view showing a laminated structure of a head portion of the composite type thin film magnetic head in the first, second and third embodiments.

FIG. 7 is a cross-sectional view showing a laminated structure of a pad portion of the head.

FIG. 8 is a perspective view showing a main part of a hard disk drive device according to a third embodiment.

FIG. 9 is a cross-sectional view showing a laminated structure of a head portion of a conventional composite type thin film magnetic head.

[Explanation of symbols]

 (3) Lower shield layer (31) Vertical heat conduction layer (8) Upper shield layer (80) Horizontal heat conduction layer (81) Vertical heat conduction layer (90) Heat dissipation layer (91) Heat dissipation pad layer (92) Wire

Claims (6)

[Claims] 1. A magnetoresistive head element H2 is provided on a substrate (1), and the head element H2 comprises a lower shield layer (3).
A thin film magnetic head in which a magnetoresistive effect element layer (5) is interposed between the upper shield layer (8) and the head element and the entire head element is covered with a protective layer (16). A horizontal heat conduction layer (80) made of the same material as that of the head element is provided between the substrate (1) and the protective layer (16) along the surface of the substrate (1) from the end of the upper shield layer (8). A vertical heat conduction layer (81) made of a material having a higher heat conductivity than that of the protective layer (16) is formed on the horizontal heat conduction layer (80) so that the vertical heat conduction layer (81) extends to the outer position and overlaps with the tip of the horizontal heat conduction layer (80). The heat conduction layer (81) is a protective layer (16).
A thin-film magnetic head characterized in that it is exposed through the protective layer from the surface of the protective layer. 2. A magnetoresistive head element H2 is provided on a substrate (1), said head element H2 comprising a lower shield layer (3).
A thin film magnetic head in which a magnetoresistive effect element layer (5) is interposed between the upper shield layer (8) and the head element and the entire head element is covered with a protective layer (16). A vertical heat conduction layer (31) made of a material having a higher thermal conductivity than that of the protective layer (16) is formed at an end portion of the lower shield layer (3) protruding further outward than the vertical heat conduction layer (31). Reference numeral 31) is a thin-film magnetic head characterized by penetrating the protective layer (16) and being exposed from the surface of the protective layer. 3. The vertical heat conduction layer comprises a main layer portion made of the same material as the bump layer (15) laminated on the tip portions of the plurality of terminal layers (14) extending from the head element H2, The thin film magnetic head according to claim 1 or 2, wherein the surface of the main layer portion is formed on the same plane as the surface of the protective layer. 4. A heat dissipation layer (90) made of the same material as the pad layer (17) formed on the surface of the bump layer (15) is formed so as to cover the surface of the main layer portion. Item 3. The thin-film magnetic head according to item 3. 5. A magnetic head device constructed by attaching a thin film magnetic head to the tip of a metal head supporting member, wherein the thin film magnetic head comprises a magnetoresistive head element H2 on a substrate (1). The head element H2 comprises a magnetoresistive effect element layer (5) interposed between a lower shield layer (3) and an upper shield layer (8), and the entire head element is covered with a protective layer (16). In the known magnetic head device,
Horizontal heat conduction layer made of the same material as the upper shield layer (8)
(80) is the upper shield layer between the substrate (1) and the protective layer (16)
It extends from the end of (8) along the surface of the substrate (1) to the outer position of the head element, and is superposed on the tip of the horizontal heat conduction layer (80) so as to conduct heat more than the protective layer (16). A vertical heat conduction layer (81) made of a material having a high rate is formed, and the vertical heat conduction layer (81) is formed.
Is exposed through the protective layer (16) from the surface of the protective layer, and the exposed surface and the surface of the head supporting member are made of metal.
A magnetic head device characterized in that they are connected to each other by (92). 6. A magnetic head device comprising a thin film magnetic head attached to the tip of a metal head supporting member, wherein the thin film magnetic head comprises a magnetoresistive head element H2 on a substrate (1). The head element H2 comprises a magnetoresistive effect element layer (5) interposed between a lower shield layer (3) and an upper shield layer (8), and the entire head element is covered with a protective layer (16). In the known magnetic head device,
A vertical heat conduction layer (31) made of a material having a higher heat conductivity than the protection layer (16) is formed at an end of the lower shield layer (3) protruding outwardly from the upper shield layer (8), The vertical heat conduction layer
(31) penetrates the protective layer (16) and is exposed from the protective layer surface,
A magnetic head device characterized in that the exposed surface and the surface of the head supporting member are connected to each other by a metal wire (92).