JPH09148009A - Card edge connector structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a card edge connector construction improved in its reliability of contact (conduction). SOLUTION: A card (printed board) 11 includes a card edge part 13 composed by forming, in the way of arrangement, plural electrically conductive pads 12 near the edge part. A connector main body 14 is provided with plural elastic and electrically conductive contacts 17 in which a touching part 17b made electrically conductive by in pressure contact with pads 12 in an approximately rectangular long groove-like recess 15 and the inner side of the recess 15. A bottom plate member 19 is slidably provided on the bottom part of the recess 15 via a spring 18 and this bottom plate member 19 is pressed down against the energizing force of the spring 18 in compliance with insertion of the card edge part 13 taking place by the pressing force of the card 11, and the card edge part 13 is pushed up to a specific position by the energizing force of the spring 18 owing to release of the above-mentioned pressing force. After foreign matter on the surfaces of the pads 12 are subjected to wiping (removal), those come in contact at some proper position.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a card edge connector structure. Of the connector main body having a plurality of elastic conductive contacts arranged corresponding to the pad having a concave portion and a contact portion inside the concave portion that is brought into pressure contact with the pad for conduction. The present invention relates to a card edge connector structure adapted to be inserted into a recess.

[0002]

2. Description of the Related Art FIGS. 7A and 7B are views showing a conventional card edge connector structure, in which FIG. 7A is a sectional view and FIG. 7B is a perspective view.

In the figure, reference numeral 1 denotes a card (printed circuit board), and a card 1 has a card edge portion 3 formed by arranging a plurality of conductive pads (patterns) 2 in the vicinity of its edge portion. Have

Reference numeral 4 denotes a connector body made of resin or the like,
The connector body 4 has a concave portion 5 having a substantially rectangular long groove opening at the top thereof, and a plurality of slits 6 arranged so as to be orthogonal to the longitudinal direction of the concave portion 5.
have. A contact 7 made of a conductive metal having elasticity is arranged in each slit 6. The contact 7 is bent such that one end portion 7 a thereof projects from the lower surface of the connector body 4 and a part (contact portion) 7 b of the intermediate portion on the other end side projects inward from the inner wall of the recess 5.

Although not shown, the connector body 4 is mounted on the mother board by inserting the projecting one end portion 7a of the contact 7 into a through hole of a mother board (printed circuit board) and soldering. .

By aligning the tip of the card edge portion 3 of the card 1 with the opening of the recess 5 of the connector body 4 and pressing the card edge portion 3 until the tip of the card edge portion 3 abuts on the bottom surface of the recess 5, the card edge portion 3 is inserted. The contact portion 7b of each contact 7 is brought into pressure contact with the corresponding pad 2 of the card edge portion 3 to be conductive.

[0007]

However, according to the prior art, dust, dust, or
When a foreign substance such as an oxide film adheres or a foreign substance enters between the contact and the pad, the contact portion of the contact may float from the corresponding pad, resulting in contact (conduction) failure.

Further, since the dimension of the concave portion of the connector body in the lateral direction is set to be larger than the plate thickness of the card edge portion of the card, as shown by the dotted line in FIG. There was a case in which contact (pad) contact failure occurred between the contact and the pad.

Therefore, an object of the present invention is to provide a card edge connector structure which improves reliability of contact (conduction) between a contact and a pad and improves reliability.

[0010]

Among the inventions disclosed in the present application, a typical one will be briefly described. A card edge portion formed by arraying a plurality of conductive pads in the vicinity of the edge portion of a printed circuit board (card) is formed into a substantially rectangular long groove-like concave portion and the inside of the concave portion is pressed into contact with the pad for conduction. A card edge connector structure configured to be inserted into the concave portion of a connector main body provided with a plurality of elastic conductive contacts provided in an array corresponding to the pad having a contact portion, is configured as follows. To be done.

As a measure for preventing foreign matter from adhering or entering, an urging member is provided at the bottom of the recess of the connector body, and the urging member urges the card edge portion in a direction opposite to the insertion direction of the card edge portion. When the card is pressed into the recess, the tip of the card edge portion is pushed down in the direction of the bottom of the recess against the biasing force of the biasing member, and the pressing force is released to push the biasing member. A bottom plate member that pushes up the card edge portion to a predetermined position in the opening direction of the recess by an urging force is slidably provided on the bottom side of the contact portion of the contact of the recess.

When the card edge portion of the printed circuit board is inserted into the concave portion of the connector body, the tip of the card edge portion abuts the bottom plate member, and the bottom plate member is pushed into the concave portion by further inserting it against the urging force of the urging member. Move to the bottom side. At this time, the contact part of the contact and the pad rub against each other while being pressed against each other, and foreign matter such as dust, dust, and oxide film attached to the contact part of the contact and the surface of the pad, or a foreign matter entering between the contact and the pad. Are wiped (removed) by the wiping action of the contacts.

Next, when the pressure applied to the printed circuit board is released, the printed circuit board is placed at a predetermined position (a position necessary for obtaining proper contact between the contact portion of the contact and the pad) via the bottom plate member by the urging force of the urging member. ) Is pushed out. Therefore, good contact (conduction) between the surfaces from which foreign substances have been removed by the friction between the contact portion of the contact and the pad
Is obtained.

As a measure for preventing the inclination of the printed circuit board (card), an inclination prevention guide having a dimension substantially the same as the widthwise dimension of the recess is provided for the pad of the card edge portion and the pad adjacent thereto. Form in the part between. Tilt prevention guide is printed circuit board (card edge part)
It is possible to form a plurality of them at appropriate intervals according to the size.

When the printed circuit board is inserted into the recess of the connector body, the tilt prevention guide is fitted between the inner walls of the recess which are orthogonal to the lateral direction, and the tilt of the printed circuit board is prevented. A contact (conduction) failure between the contact portion of the contact and the pad is prevented.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. (1) First Embodiment FIG. 1 is a sectional view showing the configuration of the first embodiment of the present invention. In the figure, 11 is a card (printed circuit board), and the card 11 has a card edge portion 13 formed by arraying a plurality of conductive pads (patterns) 12 on both sides in the vicinity of the edge portion thereof. Have

Reference numeral 14 denotes a connector main body made of resin or the like, and the connector main body 14 has a concave portion 15 having an approximately rectangular long groove opening on the upper surface thereof. The depth of the recess 15 is set deeper than the conventional one. Further, the connector body 14 has a plurality of slits 16 arranged so as to be orthogonal to the longitudinal direction of the recess 15, and each slit 16 has a pair of slits made of a conductive metal having elasticity. The contacts 17 are arranged so as to face each other.

The contact 17 is bent such that one end 17a thereof projects from the lower surface of the connector body 14 and a part (contact portion) 17b of the intermediate portion on the other end side slightly projects inward from the inner wall of the recess 15. The other end is bent so as not to interfere with the insertion of the card edge portion 13.

A bottom plate member 19 is provided in the vicinity of the bottom surface of the recess 15 of the connector body 14 via a spring 18 so as to be slidable along the inner wall of the recess 15. The bottom plate member 19 is arranged such that the upper surface thereof is located at the regular fitting position a by the urging force of the spring 18 and the engaging portion (not shown) when no external force is applied. The normal fitting position a corresponds to the position of the bottom surface of the conventional recess.

The connector main body 14 is mounted on the mother board 14 by inserting the projecting one end 17a of the contact 17 into a through hole of a mother board (printed circuit board) not shown and soldering it.

As shown in FIG. 1A, however, the tip of the card edge portion 13 of the card 11 is pressed in accordance with the opening of the concave portion 15 of the connector body 14, and the tip of the card edge portion 13 is pressed. The bottom plate member 19 inside the recess 15
The bottom plate member 19 is pushed down against the biasing force of the spring 18, and is pushed down to the limit as shown in FIG. 1 (B).

At this time, the contact portion 17b of the contact 17
And the pad 12 corresponding thereto rub against each other while being pressed against each other, and are invaded between the contact 17 and the pad 12 or foreign matter such as dust, dust, and oxide film adhered to the contact portion 17b of the contact 17 or the surface of the pad 12. The foreign matter is wiped (removed) by the wiping action of the contact 17.

When the pressure is released in this state, the card edge portion 13 is pushed through the bottom plate member 19 by the urging force of the spring 18.
1 is pushed up to the normal mating position a,
As shown in (A), the contact portion 17b of the contact 17 comes into contact with the corresponding central portion of the pad 12.

According to the present embodiment, the bottom plate member 19 biased by the spring 18 is provided inside the recess 15, and the contact portion 17b of the contact 17 wipes the pad 12 from one end side to the other end side. Later contact 1
The contact portion 17 b of No. 7 contacts at the approximate center portion of the pad 12. Therefore, the foreign matter is removed, and good contact (conduction) can be obtained. (2) Second Embodiment FIG. 2 is a diagram showing the configuration of the second embodiment of the present invention.
(A) is a cross-sectional view, and (B) and (C) are enlarged views of main parts. The same components as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

In this embodiment, unlike the first embodiment, the spring 18 and the bottom plate member 19 are not provided, and the bottom surface of the recess 15 is set at the same position (normal fitting position) as the conventional one. By devising the shape of the contact,
The foreign matter is removed.

That is, as shown in FIG. 2 (A), the contact 20 has two convexly curved contact portions 20b and a contact portion (wiping) at the intermediate portion opposite to the protruding one end portion 20a. Part) 20c.

The tip of the card edge portion 13 of the card 11 is pressed in conformity with the opening of the recess 15 of the connector body 14, and is inserted until the tip of the card edge portion 13 contacts the bottom surface of the recess 15. At this time, as shown in FIG. 2B, the contact portion (wiping portion) of the contact 20.
Prior to the contact portion 20b, 20c rubs against the pad 12 while being pressed against it.

As a result, as shown in FIG. 2C, foreign matter 21 such as dust, dust, and oxide film attached to the surface of the pad 12 is wiped by the contact portion (wiping portion) 20c of the contact 20. Wiping (removal) is caused by the action, and the contact portion 20b comes into contact with the pad 12 from which the foreign matter has been removed. Therefore, good contact (conduction) can be obtained. Further, since there are two contact portions of the contact with the pad, the reliability of contact (conduction) is high. (3) Third Embodiment FIG. 3 is a diagram showing the configuration of the third embodiment of the present invention.
(A) is a cross-sectional view, and (B) and (C) are enlarged views of main parts. The same components as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

In this embodiment, unlike the first embodiment, the spring 18 and the bottom plate member 19 are not provided, and the bottom surface of the recess 15 is set at the same position (normal fitting position) as the conventional one. By devising the shape of the contact,
The foreign matter is removed.

That is, as shown in FIG. 3A, the contact 22 has a plurality of convex (saw blade) curved contact portions 22 at an intermediate portion opposite to the protruding one end portion 22a.
b.

The tip of the card edge portion 13 of the card 11 is pressed to fit the opening of the recess 15 of the connector body 14, and is inserted until the tip of the card edge portion 13 abuts the bottom surface of the recess 15. At this time, as shown in FIG. 3B, the contact portion 22b of the contact 22 rubs against the pad 12 sequentially while being pressed against the pad 12 from the convex portion near the opening.

As a result, as shown in FIG. 3C, the foreign matter 21 such as dust, dust and oxide film adhered to the surface of the pad 12 is wiped by the wiping action of the contact portion 22b of the contact 22 ( Then, one or more of the convex portions of the contact portion 22b comes into contact with the pad from which the foreign matter has been removed. Therefore, good contact (conduction) can be obtained. Further, since the contact portion of the contact with the pad is formed by a plurality of convex portions, the reliability of contact (conduction) is high. (4) Fourth Embodiment FIG. 4 is a diagram showing the configuration of the fourth embodiment of the present invention. The same components as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

In this embodiment, unlike the first embodiment, the spring 18 and the bottom plate member 19 are not provided, and the bottom surface of the recess 15 is set at the same position (normal fitting position) as the conventional one. The foreign matter is removed by devising the card edge portion of the card (printed circuit board).

That is, the card 11 has its card edge portion 13 as shown in FIGS. 4 (A) and 4 (B).
A wiping protrusion 23 having a convex shape for wiping the contact portion 17b of the contact 17 is provided in the vicinity of the tip of the contact portion 17 in correspondence with each contact 17 of the recess 15.

The front end of the card edge portion 13 of the card 11 is pressed against the opening of the recess 15 of the connector body 14, and is inserted until the front end of the card edge portion 13 abuts the bottom surface of the recess 15. At this time, as shown in FIG. 4A, the wiping protrusion 23 of the card edge portion 13
Rub against each other while being pressed against the contact portion 17b of the contact 17.

As a result, as shown in FIG. 4B, the foreign matter 24 such as dust, dust and oxide film attached to the surface of the contact portion 17b of the contact 17 is wiped by the wiping action of the wiping protrusion 23. The contact portion 17b, which is (removed) and the foreign matter 24 is removed, contacts the pad 12. Therefore, good contact (conduction) can be obtained. (5) Fifth Embodiment FIG. 5 is a diagram showing the configuration of the fifth embodiment of the present invention.
(A) is a sectional view, and (B) is a perspective view. The same components as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

In this embodiment, unlike the first embodiment, the spring 18 and the bottom plate member 19 are not provided, and the bottom surface of the recess 15 is set at the same position (normal fitting position) as the conventional one. By devising the card edge portion of the card (printed circuit board), the inclination of the card is prevented.

That is, the card 11 has its card edge portion 13 as shown in FIGS. 5 (A) and 5 (B).
In addition, a plurality of tilt prevention guides 25 are formed by forming protrusions on both sides.

The thickness of this tilt prevention guide 25 is such that
The dimension is set to be substantially the same as the dimension in the lateral direction of No. 5, and is formed in the portion between the pad and the pad adjacent thereto. The number of the tilt prevention guides 25 and the formation interval are not limited to the card 1
It is appropriately set according to the size of 1 (card edge portion 13).

As shown in FIG. 5 (A), the thickness of the card edge portion 13 is set to be smaller than the dimension of the concave portion 15 in the lateral direction by a dimension [b × 2].
As it is, the card 11 tilts and causes a contact failure between the contact 17 and the pad 12, but in this embodiment, the tilt prevention guide 25 is fitted between both inner walls of the recess 15 orthogonal to the lateral direction. Therefore, the inclination of the card is prevented, and the contact (conduction) between the contact portion of the contact and the corresponding pad becomes good. (6) Sixth Embodiment FIG. 6 is a diagram showing the configuration of the sixth embodiment of the present invention.
(A) is a perspective view before the card is inserted, and (B) is a perspective view while the card is being inserted. The same components as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

In this embodiment, unlike the first embodiment, the spring 18 and the bottom plate member 19 are not provided, and the bottom surface of the recess 15 is set at the same position (normal fitting position) as the conventional one. The foreign matter is removed by devising a part of the concave portion 15 of the connector body 14 and a part of the card edge portion 13 of the card 11.

That is, a lateral insertion opening 26 penetrating inward and outward from the bottom surface of the concave portion 15 to the opening of the upper surface is formed in one wall portion orthogonal to the longitudinal direction of the concave portion 15, and the end portion of the card edge portion 13 is formed. A convex wiping protrusion 27 for wiping the contact portion 17b of the contact 17 is formed on the. Then, the card 11 is inserted sideways from the side insertion slot 26.

As shown in FIG. 6A, the end portion of the card edge portion 13 of the card 11 on which the wiping protrusion 27 is formed is laterally pressed so as to be aligned with the lateral insertion opening 26 of the connector body 14. As shown in FIG. 6 (B),
With the tip 13a of the card edge portion 13 along the bottom surface of the concave portion 15, the card edge portion 13 is inserted until the end portion of the card edge portion 13 where the wiping protrusion 27 is formed contacts the other inner wall.
At this time, the wiping protrusions 27 of the card edge portion 13 rub against each other while contacting the contact portions 17b of the contacts 17 with pressure.

As a result, the contact portion 17 of the contact 17 is
Foreign matter such as dust, dust, and oxide film attached to the surface of b
The wiping action of the wiping protrusion 27 wipes (removes) the foreign matter, and the contact portion 17b from which the foreign matter is removed contacts the pad 12. Therefore, good contact (conduction) can be obtained.

Although not shown, the connector body 1
A pair of convex wiping protrusions protruding inward can be provided in the vicinity of the horizontal insertion opening 26 of No. 4, and by doing so, foreign matter such as dust, dust, and oxide film attached to the surface of the pad 12 can be removed. Wiping (removal) can be performed by the wiping action of the wiping protrusions, and even better contact (conduction) between the contact portion 17b of the contact 17 and the corresponding pad 12 can be obtained.

[0046]

Since the present invention is configured as described above, the reliability of the contact (conduction) between the contact and the pad is improved, and a card edge connector structure with improved reliability is provided. .

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a first embodiment of the present invention,
(A) shows a normal state, and (B) shows a state in which the card is pushed.

FIG. 2 is a diagram showing a second embodiment of the present invention, (A)
Is a cross-sectional view, and (B) and (C) are enlarged views of main parts.

FIG. 3 is a diagram showing a third embodiment of the present invention, (A)
Is a cross-sectional view, and (B) and (C) are enlarged views of main parts.

FIG. 4 is a diagram showing a fourth embodiment of the present invention, (A)
Shows before wiping, and (B) shows after wiping.

FIG. 5 is a diagram showing a fifth embodiment of the present invention, (A)
Is a cross-sectional view, and (B) is a perspective view.

FIG. 6 is a perspective view showing a sixth embodiment of the present invention,
(A) shows before the card is inserted, and (B) shows that the card is being inserted.

FIG. 7 is a diagram showing a conventional technique, in which (A) is a sectional view;
(B) is a perspective view.

[Explanation of symbols]

 11 Card (Printed Circuit Board) 12 Pad 13 Card Edge Part 14 Connector Body 15 Recess 16 Slit 17 Contact 17b Contact Part 18 Spring 19 Bottom Plate Member

Claims (8)

[Claims] 1. A card edge portion formed by arraying a plurality of conductive pads in the vicinity of an edge portion of a printed circuit board is formed into a substantially rectangular long groove-like recess and the inside of the recess is pressed against the pad for conduction. A card edge connector structure having a plurality of elastic conductive contacts arranged correspondingly to the pad having a contact portion to be inserted into the recess of the connector body. An urging member is provided at the bottom of the concave portion, and is urged by the urging member in a direction opposite to the insertion direction of the card edge portion, and the card edge portion is pressed by the pressing when the card edge portion is inserted into the concave portion. Is pushed down in the direction of the bottom of the recess against the biasing force of the biasing member by the tip of the portion,
The bottom plate member that pushes up the card edge portion to a predetermined position in the opening direction of the recess by the urging force of the urging member by releasing the pressing force is slid toward the bottom side of the contact portion of the recess. A card edge connector structure characterized by being provided as much as possible. 2. A card edge portion, which is formed by arranging a plurality of conductive pads in the vicinity of an edge portion of a printed circuit board in an array, is formed into a concave portion having a substantially rectangular long groove, and the pad is pressed against the pad to conduct electricity. A connector having a plurality of elastic conductive contacts arranged in an array corresponding to the pad having a contact portion to be inserted into the recess of the connector main body. A card edge characterized in that a convex wiping portion is formed on the upstream side with respect to the insertion direction of the card edge portion with respect to the contact portion and wipes by contacting the pad prior to contact of the contact portion. Connector structure. 3. The card edge connector structure according to claim 2, wherein a plurality of the wiping portions are formed in a saw-tooth shape. 4. A card edge portion formed by arraying a plurality of conductive pads in the vicinity of an edge portion of a printed circuit board is formed into a concave portion having a substantially rectangular long groove and the inside of the concave portion is pressed against the pad for conduction. A card edge connector structure adapted to be inserted into the concave portion of a connector body provided with a plurality of elastic conductive contacts arranged in an array corresponding to the pad having a contact portion A card edge connector characterized in that a convex wiping protrusion for wiping a contact portion of the contact is formed in the vicinity of a tip portion of the portion so as to correspond to each contact of the recess. 5. A card edge portion formed by arraying a plurality of conductive pads in the vicinity of an edge portion of a printed circuit board is formed into a substantially rectangular long groove-like concave portion and the inside of the concave portion is pressed into contact with the pad for conduction. A card edge connector structure that is adapted to be inserted into the concave portion of a connector main body provided with a plurality of elastic conductive contacts provided correspondingly to the pad having a contact portion A card edge connector structure, wherein an inclination prevention guide having a dimension substantially the same as a dimension in a lateral direction is formed in a portion of the card edge portion between the pad and a pad adjacent thereto. 6. A card edge portion formed by arranging a plurality of conductive pads in the vicinity of an edge portion of a printed circuit board in a concave shape of a generally rectangular long groove and the inside of the concave portion are brought into pressure contact with the pad for conduction. A card edge connector structure having a plurality of elastic conductive contacts arranged correspondingly to the pad having a contact portion to be inserted into the recess of the connector body. The one side wall portion orthogonal to the longitudinal direction of the recess is formed with a lateral insertion opening penetrating inward and outward over the opening from the bottom of the recess, and the card edge portion is introduced from the lateral insertion opening, A card edge connector structure characterized by being inserted along the bottom of a recess. 7. The card edge connector structure according to claim 6, wherein a convex wiping protrusion for wiping the contact portion of each contact is formed on the card edge portion. 8. The card edge connector structure according to claim 6, wherein a convex wiping protrusion for wiping each of the pads of the card edge portion is formed in the vicinity of the inner side of the lateral insertion slot.