JPH09129468A - Manufacture of high-frequency inductor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a high-frequency inductor to be improved in yield and lessened in man-hours by a method wherein a groove is cut in the rear side of an insulating board along scribing lines, and an outer terminal electrode is formed on a strip-like board which is scribed along a direction in which the terminal electrodes are formed. SOLUTION: Grooves are provided in a lattice to the rear side of an insulating board 10 in a lateral and a longitudinal direction. Conductor patterns 14 and 16 are formed on the front, side of the board 10 in regions demarcated by the grooves. The conductor pattern 14 is provided like a spiral onto the front side of the board 10, an insulating film 15 is formed on the pattern 14 except its center and end, and a conductor pattern 16 which is led out to the opposite end is formed on the surface of the insulating film 15. That is, the ends of the conductor patterns are led out to the opposed side. The insulating board 10 where the conductor patterns 14 and 16 are formed is cut off along the grooves in the direction of A. An outer terminal electrode is applied and baked on the edge faces of the board where the conductor patterns are led out.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an inductor used in a high frequency region, and in particular, forming a conductor pattern for the inductor on the surface of an insulating substrate and connecting both ends to external terminal electrodes on the end faces. The present invention relates to a method for manufacturing a high frequency inductor.

[0002]

2. Description of the Related Art In the field of inductors (coils) as well, in order to meet the demand for size reduction and thickness reduction, a type that does not use windings has been put into practical use. In these inductors, a conductor pattern is formed on an insulating substrate by a thick film printing method or a thin film method.

Usually, a large number of spiral conductor patterns are formed in the vertical and horizontal directions on the surface of an insulating substrate, and the insulating substrate is scribed (divided) in the vertical and horizontal directions to obtain chips. A method of applying and baking a conductor film on the end surface of the conductor pattern from which the end portion is drawn out is employed.

[0004]

These inductors have a size of 3 mm or less, and are often cut at the conductor pattern portion due to the positional deviation of the scribe. In that case, the desired characteristics are not obtained. You won't get it. Therefore, there is a manufacturing problem in terms of yield.

As described above, scribing requires high precision and close attention, which is a major factor in increasing man-hours and costs. The present invention is intended to reduce the number of steps by facilitating the scribing at a predetermined position to improve the yield, and to enable the terminal electrodes to be continuously and automatically formed.

[0006]

According to the present invention, a groove along a scribe line is formed on the back surface of an insulating substrate, and a strip-shaped substrate scribed in the direction of forming the terminal electrode is used to form the external terminal electrode. The above-mentioned problems are solved by forming the.

That is, in a method of manufacturing a high frequency inductor in which a conductor pattern for an inductor is provided on the surface of an insulating substrate and both ends thereof are connected to external terminal electrodes on the end face of the substrate, in a direction perpendicular to the back surface of the insulating substrate, respectively. A plurality of parallel grooves are formed, and a conductor pattern for an inductor is formed on the surface of the insulating substrate in a portion separated by the grooves so that both ends are opposed to each other. Divide along the groove located on the side where the pattern is drawn out, form an external terminal electrode connected to the inductor conductor pattern on the end face, and form an insulating substrate along the groove on the end face side where no external terminal electrode is formed. It is characterized by dividing.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION The method of manufacturing a high frequency inductor according to the present invention comprises the following steps. 1. Formation of grooves on the back surface of the insulating substrate 1. 2. Formation of a conductor pattern on the surface of an insulating substrate (including formation of an insulating film) 3. Scribing along the extracted end face of the conductor pattern. 4. Applying conductor paste for external terminal electrodes to the end surface. Baking of conductor paste 6. Scribe along the rest of the scribe line

The above steps 5 and 6 may be reversed.

[0010]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a bottom view showing the back surface of an insulating substrate used in the method of manufacturing a high frequency inductor according to the present invention. On the back surface of the insulating substrate 10 made of alumina or the like, grooves 11 and 12 are formed in a grid pattern in the vertical and horizontal directions.

On the surface of this insulating substrate, the grooves 11 and 12 are formed.
A large number of conductor patterns are formed in the area partitioned by. As shown in FIG. 2, the conductor pattern 14 is formed in a spiral shape on the surface of the insulating substrate 10, and an insulating film 15 is formed leaving a central portion and an end portion. The conductor pattern 16 is formed at the end. That is, both ends of the conductor pattern are pulled out to the opposite sides. The conductor pattern can be formed by a thick film printing method or a thin film method such as vapor deposition.

The insulating substrate 10 on which the conductor pattern is formed in this manner is scribed along the groove 11 on the side from which the end is pulled out. That is, the cutting is performed along the groove in the direction A shown in FIG.

External terminal electrodes 17 are applied and baked on the end surface of the scribed insulating substrate on the side where the conductor pattern is drawn out, as shown in FIG. Since the insulating substrate has a strip shape, it can be applied continuously and automatically. By scribing the insulating substrate on which the external terminal electrodes are formed along the groove 12, an inductor chip is obtained.

Alternatively, as shown in FIG. 4, the meandering conductor pattern 44 may be formed and both ends thereof may be drawn to the end faces to form the external terminal electrodes 47. The external terminal electrode is formed on the entire extracted end face or only a part thereof. In the example shown in FIG. 4, the external terminal electrode 47 is formed only partially, and in the example shown in FIG. 5, the external terminal electrode 57 is formed on the entire end surface. When the stray capacitance between the external terminal electrodes becomes a problem in the high frequency region, the external terminal electrodes may be formed small.

[0016]

According to the present invention, it is possible to easily divide the insulating substrate at a predetermined position, prevent deterioration of the characteristics of the inductor, and obtain a high-frequency inductor having a good yield.

Further, since the external terminal electrodes are formed on the strip-shaped insulating substrate, continuous processing is facilitated and the manufacturing method is suitable for automation.

[Brief description of the drawings]

FIG. 1 is a bottom view showing an embodiment of the present invention.

FIG. 2 is a plan view showing an embodiment of the present invention.

FIG. 3 is a perspective view showing an embodiment of the present invention.

FIG. 4 is a plan view showing another embodiment of the present invention.

FIG. 5 is a plan view showing another embodiment of the present invention.

[Explanation of symbols]

 10: Insulating substrate 11, 12: Groove 14, 16: Conductor pattern 17, 47, 57: External terminal electrode

Front Page Continuation (72) Inventor Mitsuo Sakakura, Tamagawa Village, Hiki-gun, Saitama Large-scale Tamagawa, Hamahara 828 Address Toko Co., Ltd. Tamagawa factory

Claims (5)

[Claims] 1. A method of manufacturing a high frequency inductor, comprising: a conductor pattern for an inductor on the surface of an insulating substrate, the ends of which are connected to external terminal electrodes on the end face of the substrate, respectively in a direction perpendicular to the back surface of the insulating substrate. A plurality of parallel grooves are formed, and a conductor pattern for an inductor is formed on the surface of the insulating substrate in a portion separated by the grooves so that both ends are opposed to each other. Divide along the groove located on the side where the pattern is drawn out, form an external terminal electrode connected to the inductor conductor pattern on the end face, and form an insulating substrate along the groove on the end face side where no external terminal electrode is formed. A method of manufacturing a high-frequency inductor, characterized by dividing. 2. A method for manufacturing a high frequency inductor, comprising: a conductor pattern for an inductor provided on the surface of an insulating substrate; both ends of which are connected to external terminal electrodes on the end face of the substrate; A plurality of parallel grooves are formed, and a conductor pattern for an inductor is formed on the surface of the insulating substrate in a portion separated by the grooves so that both ends are opposed to each other. Divide along the groove located on the side where the pattern is pulled out, apply the external terminal electrode conductor connected to the inductor conductor pattern to the end face, and after baking the external terminal electrode, the end face where the external terminal electrode is not formed A method of manufacturing a high-frequency inductor, characterized in that the insulating substrate is divided along the side grooves. 3. The method for manufacturing a high frequency inductor according to claim 1, wherein the inductor conductor pattern is formed in a spiral shape. 4. The method for manufacturing a high frequency inductor according to claim 1, wherein the inductor conductor pattern is formed in a meandering shape. 5. The method of manufacturing a high frequency inductor according to claim 1, wherein the external terminal electrode is formed on a part of the end face.