JPH09116214A - Gas supplying device for excimer laser device and its laser gas exchanging method, laser gas injecting method, and abnormality processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To incorporate a halogen generator using a halogen occluding material in a laser device so that halogen can be safely and accurately supplied to the laser device and, at the same time, to reduce the size and improve the reliability of the laser device as a whole. SOLUTION: Either a buffer gas supply line 24 or a mixed gas supply line through which a mixed gas of a buffer gas and a rare gas is supplied is connected to the input port side of a halogen generator 10 and a laser chamber 1 is connected to the output port side of the generator 10 through a halogen gas supply line 14. An input valve for exchange and a coupling for input are arranged on the input port side and an output valve for exchange and a coupling for output are arranged on the output port side so that the generator 10 can be singly detached from a laser device. In addition, the chamber 1 is directly connected to the output port side through the line 14 and a valve 8 for laser chamber and a coupling for laser chamber are arranged on the laser chamber gas supply line 7 side of the chamber 1 so that the chamber 1 and generator 10 can be exchanged integrally.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an excimer laser gas supply device and a control method thereof.

[0002]

2. Description of the Related Art Excimer lasers have recently been applied to photochemical reaction processes as a high-power laser in the ultraviolet region, and have been put into practical use in semiconductors, polymers and inorganic materials, and in the medical field. There is. Among excimer lasers, for example, in a Kr F (krypton / fluorine) excimer laser, a mixed gas of halogen gas F ₂ , rare gas Kr, and buffer gas Ne (or He, Ar, etc.) is used as a laser gas. This mixed gas is supplied as a laser gas into the laser chamber, and is excited by an external excitation power source to generate laser oscillation in the laser chamber.

In the conventional excimer laser, the halogen gas is supplied from a mixed gas cylinder with a buffer gas connected to the laser through a pipe. However, halogen gas is very reactive and very dangerous if leaked. Therefore, it is necessary to install a housing in the halogen gas cylinder and to use various safety devices, such as a device that constantly exhausts the circumference of the cylinder, a device that closes the supply valve when halogen gas is detected, and double piping, which is very expensive. Was becoming.

Further, impurities are generated in the course of normal laser operation, and the halogen reacts with various materials in the laser chamber to form impurities and the halogen is gradually lost, so that the output of the excimer laser is reduced. Going down. Therefore, it is necessary to keep the output of the excimer laser constant by removing the generated impurities and supplementing the lost halogen.

Therefore, an invention relating to a halogen generator using a substance that absorbs halogen (hereinafter referred to as a halogen storage substance) in order to safely supply halogen gas so that the concentration of halogen is within a predetermined value Is published by the publication of Japanese Patent Publication No. 5050298. FIG. 40 shows an excimer laser device including a halogen generator according to this publication, which will be described in detail below with reference to FIG.

The controller 81 is configured to excite the excimer laser 80 and to perform all the controls necessary for laser oscillation. This excimer laser device includes a gas management mechanism 82 for laser. The gas management mechanism 82 may be configured as a part of the excimer laser 80 or as a separate and independent unit connected to the excimer laser 80 and the controller 81. The gas management mechanism 82 has a circulation pump 83, and is configured to circulate the laser gas counterclockwise from the excimer laser 80 through the pipes 84, 85, and 86 and return it to the excimer laser 80 as shown in FIG. . Further, the gas management mechanism 82 has a cryogenic cleaner 87. The cryogenic cleaner 87 takes in the gas flow from the pipe 84 via the valve 87a and returns the permeated gas flow to the pipe 85 via the valve 87b. ing. In normal operation, all gas flow circulated by circulation pump 83 passes through cryogenic cleaner 87.

The gas management mechanism 82 has a chemical gas cleaner 88 in order to remove impurities which cannot be removed by the cryogenic cleaner 87. This chemical gas cleaner 88
The gas flow is taken in from the pipe 85 via the valve 88a, and the permeated gas flow is sent to the pipe 85 via the valve 88b.
Back to. The chemical gas cleaner 88 takes in a part or all of the gas flow from the pipe 85, removes the impurity gas, and also removes all the halogen gas contained in the gas flow.

The halogen generator 10 is for generating a halogen gas and automatically injecting the gas into the gas circulation path in order to keep the concentration of the halogen gas in the laser chamber constant. This halogen generator 10 includes a valve 1
The gas flow is taken from the pipe 85 via 0a, the halogen gas is injected into this gas flow, and then returned to the pipe 85 via the valve 10b.

Now, since the halogen generator 10 is filled with a fluoronickel material (solid) made of, for example, KF and NiF2 as a halogen storage substance, the halogen generator 10 is very compact, and the halogen generator 10 is Can be built into the device. When this fluoronickel material is heated, fluorine gas (F ₂ ) is generated. By controlling this temperature, the fluorine gas (F ₂ ) in the laser gas mixture is
₂ ) Partial pressure can be kept constant. The reaction when fluorine gas is generated from the fluoronickel material is represented by the following formula 1.

Embedded image 2 [K ₂ Ni F ₆ · KF] (s) → 2K ₃ Ni F ₆ (s) + F ₂ (g) + ΔH Here, ΔH indicates the heat of formation by this reaction.

The above reaction is a reversible reaction, and at this time, Cla representing the relationship between the partial pressure of fluorine gas (F ₂ ) and the absolute temperature.
The usius-Clapeyron relational expression “lnP = −ΔH / R (1 /
“T) + C” is established. Here, P is the partial pressure of fluorine gas (F ₂ ), ΔH is the heat of formation, R is the gas constant, T is the absolute temperature (K), and C is the constant. As can be seen from this equation, the logarithm of the partial pressure of fluorine gas is proportional to the reciprocal of the absolute temperature, and FIG. 41 shows this relationship. Therefore, the partial pressure of the fluorine gas (F ₂ ) can be controlled to a target value by controlling the temperature of the halogen storage substance within a predetermined range. Since the partial pressure of fluorine gas is proportional to its molar concentration, the fluorine gas concentration can be kept constant by controlling this, and laser operation can be continuously and stably performed. For this reason, in the following explanation, "halogen gas partial pressure" will be used.
Is used in a meaning equivalent to “halogen gas concentration”. The partial pressure means a certain fixed volume, for example, the number of molecules of a specific gas in the volume inside the laser chamber. Taking halogen gas as an example, if there are n moles of halogen gas in the laser chamber, the volume of the laser chamber is set to V, and “P × V = n × R × T”, that is, “halogen gas partial pressure P∝ halogen gas And the halogen gas partial pressure P is a parameter that is determined irrespective of increase / decrease of other types of gas (rare gas or the like) in the laser chamber.

By the way, the fluoronickel material comprising KF and NiF2 reacts very well with HF which is a typical impurity gas of a fluorine-based excimer laser gas. The HF is, for example, H (hydrogen) of a polymer compound (packing or the like) in the laser chamber, H ₂ O (water) existing in the laser chamber, H (hydrogen atom) occluded in a metal, and the above fluorine gas. It reacts with (F ₂ ) and is generated as an impurity gas. The reaction at this time is represented by the formula 2
It is represented by

[Chemical formula 2] KF (s) + 4HF (g) → KF ・ 4HF (s) Ni F2 (s) + 4HF (g) → Ni F2 ・ 4HF (s)

By such a reaction, when the laser is operated in a state where the halogen storage material and the impurity gas HF are in contact with each other, a halogen gas of high purity (F ₂ (g) in the above example) is generated. In addition, a large amount of impurity gas HF is generated at the same time. As a result, the function as a halogen generator cannot be fulfilled, and even if it is used as a halogen generator, the impurity gas HF or the like as described above is generated, so that the laser oscillation is stopped. For this reason, in the conventional laser device, the laser gas is circulated by the circulation pump 83 in the halogen generator 1.
Before being circulated to 0, the cryogenic cleaner 87 and the chemical gas cleaner 88 described above are passed through to completely remove the impurity gas of the laser and then circulate to the halogen generator 10.

It should be noted that the palast volume 90 is used for the valve 90a, when performing maintenance such as cleaning and replacement of the laser window.
The operation of 90b temporarily stores all the gas in the laser chamber. Also, rare gas cylinder 9
Reference numeral 1 compensates for the loss of rare gas via the valve 91a, and negative pressure pump 92 is used to completely exhaust the gas in the circulation path via the valve 92a.

In such an excimer laser device,
In the case of normal laser operation, the laser gas from which impurities have been removed in the cryogenic cleaner 87 is guided to the halogen generator 10, where the halogen gas is injected to make the partial pressure of the halogen gas constant, and this mixed gas is It is returned to the laser chamber of the excimer laser 80 via the pipe 86. Further, when the chemical gas cleaner 88 is used, the laser gas from which the halogen gas has been removed in the chemical gas cleaner 88 is guided to the halogen generator 10, where the halogen gas is injected to supplement the halogen gas and the halogen gas is supplied. The partial pressure of the gas is made constant and returned into the laser chamber.
As a result, the laser device can be operated stably. Furthermore, since the partial pressure of the halogen gas (F ₂ ) of the fluoronickel material is very small at room temperature, it is preferable in terms of safety.

[0015]

However, the following problems are pointed out in the excimer laser device using the circulation pump, the cryogenic cleaner 87, the chemical gas cleaner 88, etc. in the front part of the halogen generator 10. Has been done. 1) The circulation pump 83, the cryogenic cleaner 87, and the chemical gas cleaner 88 have very large external dimensions of the apparatus itself, and therefore the entire laser apparatus becomes large. However, for example, an exposure apparatus in a semiconductor manufacturing process in which an excimer laser device is widely used as a light source is installed in a clean room with high cleanliness. As a result, the large installation area of the excimer laser device causes a large cost problem.

2) The circulation pump 83, the cryogenic cleaner 87, the chemical gas cleaner 88, and the like have a complicated structure, and therefore the reliability is poor. In particular, in order to prevent the halogen gas from leaking, only a bellows type pump can be used as the circulation pump 83, but this bellows type pump is low in durability. 3) Halogen generator 1 when the excimer laser device is operating.
0 is always heated by the heater to increase the partial pressure of the halogen gas. Therefore, it is necessary to surely increase the safety against leakage of halogen gas. However, in the excimer laser device using the conventional halogen generator 10, there is no description about this safety device, and improvement such as installation of the safety device is desired.

The present invention has been made in view of the above problems, and a halogen generator using a halogen storage substance is incorporated in a laser device to supply halogen safely and accurately, and at the same time, the laser device It is an object of the present invention to provide a gas supply device for an excimer laser device, which can be downsized as a whole and whose reliability such as durability can be improved.

[0018]

In order to achieve the above object, in a gas supply device for an excimer laser device according to the present invention, a mixed gas of a buffer gas, a rare gas and a halogen gas is supplied to a laser gas in a laser chamber 1. The laser gas is excited to oscillate the laser light, and the halogen storage material 11 of the halogen generator 10 is controlled to a predetermined temperature and a predetermined partial pressure so that the laser light has a desired characteristic. In the excimer laser device that controls the partial pressure of the halogen gas in the laser chamber 1 by controlling the injection amount of the generated halogen gas, the buffer gas supply line 24 is provided on the input port side of the halogen generator 10.
Or mixed gas supply line 2 of buffer gas and rare gas
The laser chamber 1 is connected to the output port side of the halogen generator 10 via the halogen gas supply line 14.

A buffer gas (Ne
Etc.) or a mixed gas of a buffer gas and a rare gas (Kr) is introduced, a halogen gas having a partial pressure corresponding to the control temperature is generated from the halogen storage substance in the halogen generator and is automatically mixed, It is introduced into the halogen gas supply line of the excimer laser device. Moreover, by making the pressure of the buffer gas or the mixed gas of the buffer gas and the rare gas higher than the gas pressure in the laser chamber, the halogen gas having a predetermined partial pressure can be supplied into the laser chamber even during the laser operation. Further, since the pure buffer gas or the mixed gas of the buffer gas and the rare gas is passed through the halogen generator as described above, the halogen generator is not contaminated by the impurity gas and is stable for a long period of time. A generator can be used.

Further, in the gas supply device of the excimer laser device, the replacement input valve 60 and the input joint 62 are arranged on the input port side of the halogen generator 10, and the replacement is provided on the output port side. It is preferable to dispose the output valve 65 and the output joint 67 so that the halogen generator 10 can be detached as a single unit.

With the above construction, the halogen generator can be easily attached and detached.

In the gas supply device of the excimer laser device, a replacement input valve 60 and an input joint 62 are arranged on the input port side of the halogen generator 10.
The laser chamber 1 is directly connected to the output port side via a halogen gas supply line 14, and the laser chamber valve 8 and the laser chamber joint 6 are provided on the laser chamber gas supply line 7 side of the laser chamber 1.
1, a laser chamber 1 and a halogen generator 10 are provided.
May be exchangeable at the same time.

With the above structure, the laser chamber 1 and the halogen generator 10 can be replaced at the same time.

The gas supply device of the excimer laser device has a pressure sensor 9 for detecting the gas pressure in the laser chamber 1 and a first vacuuming means (44, 41) for evacuating the laser chamber 1. And the buffer gas supply line 2 provided on the input port side of the halogen generator 10.
4 or a gas input valve 21 for opening and closing the mixed gas supply line 27 of the buffer gas and the rare gas, and the halogen gas supply line 14, which is provided with the buffer gas, or the mixed gas of the buffer gas and the rare gas,
A valve 16 for halogen injection that opens and closes injection of a mixed gas with a halogen gas into the laser chamber 1 and a first vacuuming means (44, 41) are operated at the time of exchanging the laser gas to evacuate the inside of the laser chamber 1. After that, the halogen generator 1
In order to control the injection amount of the halogen gas generated at 0 into the laser chamber 1 to a predetermined amount, the gas input valve 21 until the gas pressure signal input from the pressure sensor 9 reaches a predetermined value.
And a gas controller 6 that outputs a command to open the halogen injection valve 16.

With the above structure, the mixed gas with the buffer gas having a predetermined partial pressure of halogen gas or the mixed gas with the mixed gas of the buffer gas and the rare gas is injected until the pressure in the laser chamber reaches a predetermined value. Therefore, the halogen gas injection amount at the time of laser gas replacement becomes accurate.

Further, the gas supply device of the excimer laser device is provided on the monitor 5 for detecting laser characteristics and the input port side of the halogen generator 10, and the buffer gas supply line 24 or the buffer gas and the rare gas are provided. A gas input valve 21 for opening and closing the mixed gas supply line 27, and the halogen gas supply line 14,
A halogen injection valve 16 for opening and closing injection of the buffer gas, or a mixed gas of the buffer gas and the rare gas, and a halogen gas into the laser chamber 1.
During the laser operation, the present halogen gas partial pressure in the laser chamber 1 is estimated based on the detection data of the monitor 5, and the halogen gas laser generated by the halogen generator 10 is based on this halogen gas partial pressure. In order to control the injection amount into the chamber 1 to a predetermined amount, a gas controller 6 that outputs a command to open the gas input valve 21 and the halogen injection valve 16 for a predetermined time may be provided.

The monitor detects laser characteristics during laser operation. Since this laser characteristic has a positive correlation with the halogen gas concentration, that is, the halogen gas partial pressure, the halogen gas partial pressure can be estimated from the laser characteristic data. By injecting the halogen gas controlled to a predetermined partial pressure for a predetermined time based on the above estimated current partial pressure of the halogen gas,
The halogen gas injection amount during laser operation can be controlled accurately.

The gas supply device of the excimer laser device is provided in the monitor 5 for detecting laser characteristics and the halogen gas supply line 14, and contains the buffer gas or the mixed gas of the buffer gas and the rare gas.
A mass flow controller 19 for controlling the flow rate of a mixed gas of a halogen gas generated by the halogen generator 10 into the laser chamber 1, and a monitor 5 during laser operation.
In order to estimate the current partial pressure of the halogen gas in the laser chamber 1 based on the detection data of 1. The controller 19 may include a gas controller 6 that outputs a command for controlling the flow rate of the mixed gas of the halogen gas.

Since the flow rate of the halogen gas controlled to a predetermined partial pressure is accurately controlled by the mass flow controller on the basis of the current partial pressure of the halogen gas estimated by the monitor, the halogen gas injection amount during the laser operation is highly accurate. Controlled.

The gas supply device of the excimer laser device is provided on the monitor 5 for detecting laser characteristics and on the input port side of the halogen generator 10, and is provided with the buffer gas supply line 24 or the buffer gas and rare gas. A gas input valve 21 for opening and closing the mixed gas supply line 27, and the halogen gas supply line 14,
A halogen injection valve 16 for opening and closing the injection of the mixed gas of the buffer gas and the halogen gas or the mixed gas of the buffer gas and the rare gas and the halogen gas into the laser chamber 1, and a monitor during the laser operation. 5
The present halogen gas partial pressure in the laser chamber 1 is estimated on the basis of the detection data, and the injection amount of the halogen gas generated by the halogen generator 10 into the laser chamber 1 is determined based on the halogen gas partial pressure. In order to control quantitatively, a gas controller 6 that outputs a command to control the temperature of the halogen generator 10 to a predetermined temperature with the gas input valve 21 and the halogen injection valve 16 open may be provided.

The temperature of the halogen generator is controlled while changing it to a predetermined value based on the current partial pressure of halogen gas estimated by the monitor. Therefore, the halogen gas partial pressure of the mixed gas of the buffer gas and the halogen gas or the mixed gas of the buffer gas and the rare gas and the halogen gas is accurately controlled. As a result, the injection amount of the halogen gas becomes accurate.

Further, in the gas supply device of the excimer laser device, a check valve 23 that allows gas to permeate only in the input direction may be arranged on the input port side of the halogen generator 10.

With the above structure, the halogen gas generated by the halogen generator does not enter the buffer gas supply line, the buffer gas cylinder, or the like. Therefore, the halogen gas can be supplied safely and with high accuracy.

In the gas supply device of the excimer laser device, the mixed gas of the buffer gas and the halogen gas or the mixed gas of the buffer gas and the rare gas and the halogen gas is provided on the output port side of the halogen generator 10. The halogen gas supply line 14 may be connected via a buffer tank 26 that stores a mixed gas of

With the above structure, a mixed gas of a buffer gas and a halogen gas or a mixed gas of a buffer gas and a rare gas and a halogen gas can be supplied with high accuracy.

The gas supply device of the excimer laser device includes a monitor 5 for detecting laser characteristics, second evacuation means (44, 29) for evacuating the buffer tank 26,
A halogen injection valve 16 for opening and closing the supply of the halogen gas generated by the temperature control of the halogen generator 10 to the buffer tank 26, and the buffer tank 26 for the buffer gas or the mixed gas of the buffer gas and the rare gas. Buffer injection valve 34 for opening and closing the supply of water
And a buffer tank output valve 28 for opening and closing the supply of the mixed gas of the halogen gas in the buffer tank 26 to the laser chamber 1, and the second vacuuming means (44, 29) are operated during the laser operation. After evacuating the buffer tank 26, the present halogen gas partial pressure is estimated based on the detection data of the monitor 5, and the halogen gas generated by controlling the halogen generator 10 to a predetermined temperature is injected into the halogen injection valve 16. The buffer tank 2 by a predetermined amount based on the estimated halogen gas partial pressure by opening and closing for a predetermined time.
6, the buffer injection valve 34 is opened / closed to fill the buffer tank 26 with the buffer gas or the mixed gas of the buffer gas and the rare gas, and the buffer tank output valve 28 is opened / closed for a predetermined period of time to fill the buffer tank 26. A gas controller 6 for outputting a command to inject the filled mixed gas into the laser chamber 1 may be provided.

The present halogen gas partial pressure is estimated by the monitor, and a predetermined partial pressure of the halogen gas and a predetermined pressure of the buffer gas or a mixed gas of the buffer gas and the rare gas are determined based on the estimated partial pressure of the halogen gas. Since only the buffer tank is filled with the mixed gas, the mixed gas filled in the buffer tank is injected into the laser chamber, so that the halogen gas injection amount is accurately controlled.

Further, a mixed gas of a buffer gas, a rare gas and a halogen gas is supplied into the laser chamber 1 as a laser gas, the laser gas is excited to oscillate a laser beam, and the characteristic of the laser beam becomes a desired characteristic. As described above, the halogen storage material 11 of the halogen generator 10 is controlled to a predetermined temperature and a halogen gas generated at a predetermined partial pressure is injected into the laser chamber 1 through the halogen gas supply line 14, and the laser chamber 1 In the excimer laser device for controlling the partial pressure of the halogen gas in the laser chamber 1 of the halogen gas, the first vacuum evacuation means (44, 41) for evacuating the laser chamber 1 and the halogen gas supply line 14 are provided. Halogen injection valve 16 for opening and closing the injection into the first and second vacuum evacuation means at the time of laser gas exchange.
After activating (44, 41) to evacuate the interior of the laser chamber 1, a halogen injection valve 16 is provided to control the injection amount of the halogen gas generated by the halogen generator 10 into the laser chamber 1 to a predetermined amount. And a gas controller 6 that outputs a command to open for a predetermined time.

With the above structure, since the halogen gas having a predetermined partial pressure is injected into the laser chamber for a predetermined time, the halogen gas injection amount at the time of exchanging the laser gas can be accurately controlled.

Further, a mixed gas of a buffer gas, a rare gas and a halogen gas is supplied as a laser gas into the laser chamber 1, the laser gas is excited to oscillate a laser beam, and the characteristic of the laser beam becomes a desired characteristic. As described above, the halogen storage material 11 of the halogen generator 10 is controlled to a predetermined temperature and a halogen gas generated at a predetermined partial pressure is injected into the laser chamber 1 through the halogen gas supply line 14, and the laser chamber 1 In the excimer laser device for controlling the partial pressure of the halogen gas therein, a pressure sensor 9 for detecting the gas pressure in the laser chamber 1, a first evacuation means (44, 41) for evacuating the laser chamber 1,
A halogen injection valve 16 provided in the halogen gas supply line 14 for opening and closing injection of halogen gas into the laser chamber 1 and the laser chamber 1 by operating the first evacuation means (44, 41) at the time of exchanging the laser gas. After the inside is evacuated, in order to control the injection amount of the halogen gas generated by the halogen generator 10 into the laser chamber 1, to a predetermined amount,
The gas controller 6 outputs a command to open the halogen injection valve 16 until the gas pressure signal input from the pressure sensor 9 reaches a predetermined value.

With the above structure, since the halogen gas having a predetermined partial pressure is injected until the inside of the laser chamber has a predetermined pressure, the halogen gas injection amount at the time of exchanging the laser gas can be accurately controlled.

Further, a mixed gas of a buffer gas, a rare gas and a halogen gas is supplied into the laser chamber 1 as a laser gas, the laser gas is excited to oscillate a laser beam, and the characteristic of the laser beam becomes a desired characteristic. As described above, the excimer laser for controlling the halogen gas partial pressure in the laser chamber 1 by controlling the halogen storage material 11 of the halogen generator 10 to a predetermined temperature and controlling the injection amount of the halogen gas generated at a predetermined partial pressure. In the apparatus, an exhaust line 40 for exhausting the laser gas in the laser chamber 1
First temperature sensors 45 and 52 that detect the temperature of the halogen filter 42 that removes the halogen gas of No. 2 and second temperature sensors 12 and 51 that detect the temperature of the halogen generator 10.
A halogen sensor 43 for detecting the halogen gas concentration of the exhaust gas in the exhaust line 40, and the first temperature sensor 4
5, 52, the second temperature sensor 12, 51 and the halogen sensor 43, when at least one detection signal exceeds a predetermined value and becomes abnormal, the gas controller 6 that outputs an abnormality detection signal and And / or the abnormality determination means 54 and the abnormality detection signal, the halogen generator 1
Heater shut-off means 54a for turning off the power of the heater 13 of 0
3, 54a4 and the halogen injection valves 16 and 1 of the halogen gas supply line 14 based on the abnormality detection signal.
7, 18 and exhaust valves 41, 2 of the exhaust line 40
The valve shutoff means 54a1 and 54a2 for closing 9 may be provided.

Abnormalities such as the temperature of the halogen generator, the temperature of the halogen filter and the halogen gas concentration of the exhaust gas are constantly monitored. When at least one of these is abnormal, the halogen generator heater is turned off to stop halogen gas generation, and the halogen gas supply line and exhaust line valves are closed to stop halogen gas exhaust. To do.

Further, in the excimer laser device for supplying a mixed gas of a buffer gas, a rare gas and a halogen gas as a laser gas into the laser chamber 1 and exciting the laser gas to oscillate a laser beam, the laser chamber 1
First temperature sensors 45, 52 for detecting the temperature of a halogen filter 42 for removing the halogen gas in the exhaust line 40 for exhausting the laser gas therein, and a halogen sensor 4 for detecting the halogen gas concentration of the exhaust gas in the exhaust line 40.
3, and at least one of the first temperature sensor 45, 52 and the halogen sensor 43 has a predetermined value or more and becomes abnormal, a gas controller 6 and / or an abnormality detection signal is output. An abnormality determining means 54,
According to the abnormality detection signal, the halogen gas supply line 1
The valve shutoff means 54a1 and 54a2 for closing the respective halogen injection valves 16, 17, 18 of No. 4 and the exhaust valves 41, 29 of the exhaust line 40 may be provided.

Similarly to the above, the temperature of the halogen filter and the concentration of halogen gas in the exhaust gas are constantly monitored for abnormalities,
When at least one of them is abnormal, the valves of the halogen gas supply line and the exhaust line are closed to stop the exhaust of the halogen gas.

Further, in an excimer laser device which supplies a mixed gas of a buffer gas, a rare gas and a halogen gas as a laser gas into the laser chamber 1 and excites the laser gas to oscillate a laser beam, the halogen gas is supplied and the laser gas is supplied. It is preferable to provide a supply / exhaust interlock means 64 for preventing both exhausts from being performed at the same time.

In order to prevent the activated carbon of the halogen gas filter for removing the halogen gas provided in the exhaust line from reacting with the halogen gas by mistake, the halogen gas cannot be supplied and exhausted at the same time. Therefore, the abnormal temperature rise of the activated carbon of the halogen gas filter does not occur.

Further, a mixed gas of a buffer gas, a rare gas and a halogen gas is supplied into the laser chamber 1 as a laser gas, the laser gas is excited to oscillate a laser beam, and the characteristic of the laser beam becomes a desired characteristic. As described above, the excimer laser for controlling the halogen gas partial pressure in the laser chamber 1 by controlling the halogen storage material 11 of the halogen generator 10 to a predetermined temperature and controlling the injection amount of the halogen gas generated at a predetermined partial pressure. In the apparatus, a replacement input valve 60 and an input joint 62 arranged on the input port side of the halogen generator 10, and the halogen generator 10
Of the replacement output valve 65 and the output joint 67 disposed on the output port side of the
A halogen gas supply line 14 for supplying halogen gas into the laser chamber 1 via a halogen generator 10;
First vacuuming means (44, 41) for vacuuming the pipe between the replacement input valve 60 and the replacement output valve 65, the vacuumed halogen gas supply line 14, the halogen generator 10, and the replacement Purge means 35, 36 for purging the pipe between the input valve 60 and the replacement output valve 65 with at least an inert gas may be provided.

Since replacement valves and joints are provided on both sides of the halogen generator, it is safe and easy to attach and detach.
At this time, there is a portion where air is accumulated at the portion connecting the halogen generator and the pipe, but this portion can be easily exhausted and purged with an inert gas or the like.

Further, in the laser gas exchanging method of the gas supply device of the excimer laser device of the present invention, the mixed gas of the buffer gas, the rare gas and the halogen gas is supplied as the laser gas into the laser chamber 1, and the laser gas is excited to emit the laser light. By controlling the injection amount of the halogen gas generated at a predetermined partial pressure by controlling the halogen storage material 11 of the halogen generator 10 to a predetermined temperature so that the characteristics of the laser light have a desired characteristic while oscillating light. In a laser gas exchange method for a gas supply device of an excimer laser device for controlling a halogen gas partial pressure in the laser chamber 1, a halogen gas on the output port side of the halogen generator 10 is evacuated after the laser chamber 1 is evacuated during the laser gas exchange. By opening the halogen injection valve 16 of the supply line 14 for a predetermined time, the halogen And a method for a predetermined quantity injected into the laser chamber 1 a scan.

Further, in the laser gas exchanging method for the gas supply device of the excimer laser device of the present invention, the mixed gas of the buffer gas, the rare gas and the halogen gas is supplied as the laser gas into the laser chamber 1, and the laser gas is excited to emit the laser light. By controlling the injection amount of the halogen gas generated at a predetermined partial pressure by controlling the halogen storage material 11 of the halogen generator 10 to a predetermined temperature so that the characteristics of the laser light have a desired characteristic while oscillating light. In a laser gas exchanging method of a gas supply device of an excimer laser device for controlling a halogen gas partial pressure in the laser chamber 1, in the laser gas exchanging, after evacuating the inside of the laser chamber 1, the gas pressure in the laser chamber 1 becomes a predetermined value. Until then, the halogen injection port of the halogen gas supply line 14 on the output port side of the halogen generator 10 By opening the blanking 16, and a process for a predetermined amount injected a halogen gas into the laser chamber 1.

Further, in the laser gas exchanging method of the gas supply device of the excimer laser device of the present invention, the mixed gas of the buffer gas, the rare gas and the halogen gas is supplied as the laser gas into the laser chamber 1, and the laser gas is excited to excite the laser. By controlling the injection amount of the halogen gas generated at a predetermined partial pressure by controlling the halogen storage material 11 of the halogen generator 10 to a predetermined temperature so that the characteristics of the laser light become a desired characteristic while oscillating light. In a laser gas exchanging method of a gas supply device of an excimer laser device for controlling a halogen gas partial pressure in the laser chamber 1, when the laser gas is exchanged, the inside of the laser chamber 1 is evacuated, and then the gas pressure in the laser chamber 1 becomes a predetermined value. Until that time, the gas input valve 21 on the input port side of the halogen generator 10 and the halo on the output port side. By opening the halogen injection valve 16 of Ngasu supply line 14, and a process for a predetermined amount of injection of halogen gas into the laser chamber 1.

Further, in the laser gas injection method of the gas supply device for the excimer laser device of the present invention, the mixed gas of the buffer gas, the rare gas and the halogen gas is supplied as the laser gas into the laser chamber 1, and the laser gas is excited to emit the laser light. By controlling the injection amount of the halogen gas generated at a predetermined partial pressure by controlling the halogen storage material 11 of the halogen generator 10 to a predetermined temperature so that the characteristics of the laser light become a desired characteristic while oscillating light. In a laser gas injection method of a gas supply device of an excimer laser device for controlling a halogen gas partial pressure in the laser chamber 1, a current halogen gas partial pressure is estimated based on a detected laser characteristic during laser operation, and the halogen gas is also estimated. Gas input valve 21 and output on the input port side of the halogen generator 10 based on the gas partial pressure Halogen gas supply line over up side 1
By opening the halogen injection valve 16 of No. 4 for a predetermined time, the injection amount of the halogen gas into the laser chamber 1 is controlled.

Further, the laser gas injection method of the gas supply device for the excimer laser device of the present invention supplies a mixed gas of a buffer gas, a rare gas and a halogen gas as a laser gas into the laser chamber 1 and excites the laser gas to excite the laser. By controlling the injection amount of the halogen gas generated at a predetermined partial pressure by controlling the halogen storage material 11 of the halogen generator 10 to a predetermined temperature so that the characteristics of the laser light have a desired characteristic while oscillating light. In a laser gas injection method of a gas supply device of an excimer laser device for controlling a halogen gas partial pressure in a laser chamber 1, a current halogen gas partial pressure is estimated based on a detected laser characteristic during laser operation, and the halogen gas is also estimated. Based on the gas partial pressure, the mass flow controller 19 on the output port side of the halogen generator 10 By performing that flow control, and a method of controlling the injection amount of the laser chamber 1 halogen gas.

Further, in the laser gas injection method of the gas supply device of the excimer laser device of the present invention, the mixed gas of the buffer gas, the rare gas and the halogen gas is supplied as the laser gas into the laser chamber 1, and the laser gas is excited to emit the laser light. By controlling the injection amount of the halogen gas generated at a predetermined partial pressure by controlling the halogen storage material 11 of the halogen generator 10 to a predetermined temperature so that the characteristics of the laser light have a desired characteristic while oscillating light. In a laser gas injection method of a gas supply device of an excimer laser device for controlling a halogen gas partial pressure in a laser chamber 1, a current halogen gas partial pressure is estimated based on a detected laser characteristic during a laser operation, and halogen generation is performed. Valve 21 for gas input on the input port side of the vessel 10 and valve for halogen injection on the output port side In a state in which 6 open, by controlling the temperature of the halogen generator 10 on the basis of the halogen gas partial pressure the estimated laser chamber 1 halogen gas
The method is to control the injection amount into the.

Further, the laser gas injection method of the gas supply device for the excimer laser device of the present invention supplies the mixed gas of the buffer gas, the rare gas and the halogen gas as the laser gas into the laser chamber 1 and excites the laser gas to generate the laser light. By controlling the injection amount of the halogen gas generated at a predetermined partial pressure by controlling the halogen storage material 11 of the halogen generator 10 to a predetermined temperature so that the characteristics of the laser light have a desired characteristic while oscillating light. In a laser gas injection method of a gas supply device of an excimer laser device for controlling a partial pressure of a halogen gas in the laser chamber 1, a buffer tank 26 is evacuated during a laser operation, and a current halogen gas is detected based on a detected laser characteristic. The partial pressure is estimated, and the halogen gas generated in the halogen generator 10 is estimated as described above. It was charged into a buffer tank 26 by a predetermined amount based on Ngasu partial pressure, further buffer tank 26
Is filled with a predetermined amount of a buffer gas or a mixed gas of a buffer gas and a rare gas, and the mixed gas filled in the buffer tank 26 is injected into the laser chamber 1.

Further, according to the method for abnormally treating the gas supply device of the excimer laser device of the present invention, a mixed gas of a buffer gas, a rare gas and a halogen gas is supplied as a laser gas into the laser chamber 1, and the laser gas is excited to generate a laser beam. The halogen storage material 1 of the halogen generator 10 oscillates light and makes the characteristics of the laser light have desired characteristics.
In a method of abnormally treating a gas supply device of an excimer laser device, which controls the halogen gas partial pressure in the laser chamber 1 by controlling the injection amount of the halogen gas generated at a predetermined partial pressure by controlling No. When at least one of the temperature of the reactor 10, the temperature of the halogen filter 42 for removing the halogen gas in the exhaust line 40, and the halogen gas concentration of the exhaust gas in the exhaust line 40 is abnormal, the halogen generator In this method, the power source of the heater 13 of 10 is cut off, and the halogen gas supply line 14 and the exhaust line 40 are cut off.

Further, according to the method for abnormally treating the gas supply device of the excimer laser device of the present invention, the mixed gas of the buffer gas, the rare gas and the halogen gas is supplied as the laser gas into the laser chamber 1, and the laser gas is excited to emit the laser light. The halogen storage material 1 of the halogen generator 10 oscillates light and makes the characteristics of the laser light have desired characteristics.
In a method for abnormally treating a gas supply device of an excimer laser device, which controls the halogen gas partial pressure in the laser chamber 1 by controlling the injection amount of the halogen gas generated at a predetermined partial pressure by controlling No. 1 at a predetermined partial pressure, an exhaust line When at least one of the temperature of the halogen filter 42 for removing the halogen gas of 40 and the halogen gas concentration of the exhaust gas of the exhaust line 40 is abnormal, the halogen gas supply line 14 and the exhaust line 40 are shut off. How to do it.

[0059]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments and examples of the present invention will be described below with reference to the drawings. First,
The first embodiment will be described, and FIG. 1 shows its basic configuration. The halogen generator 10 is provided with an input port and an output port, a buffer gas supply line 24 from the buffer gas cylinder 20 is connected to the input port via a gas input valve 21, and a halogen gas is supplied to the output port. The line 14 is connected through a halogen injection valve 16. The halogen gas supply line 14 has a mass flow controller (mass flow controller) 19 for injecting halogen gas with high accuracy during laser operation.
Further, the output side of the mass flow controller 19 is connected to the laser chamber gas supply line 7 via the halogen injection valve 18. The mass flow controller 19 controls the amount of gas passing therethrough so that the mass flow rate corresponds to the magnitude of a command signal from the outside. The mass flow controller 19 and the halogen injection valve 18 may be reversed.

Further, the halogen gas supply line 14 has
A bypass line 14a for injecting a halogen gas (hereinafter, this line is also referred to as a halogen gas supply line) is provided in parallel with the mass flow controller 19, and a laser chamber gas supply line 7 is provided via a halogen injection valve 17. It is connected to the.

The buffer gas cylinder 20 has a valve 2
2 and the rare gas cylinder 30 are connected to the laser chamber gas supply line 7 via a valve 31, respectively. Further, the laser chamber gas supply line 7 is connected to the laser chamber 1 via a laser chamber valve 8. Further, the laser chamber gas supply line 7 is connected to the exhaust line 40 via an exhaust valve 41. In the exhaust line 40, a halogen filter 42, a halogen sensor 43, and a vacuum pump 44 are sequentially connected from an exhaust valve 41. The vacuum pump 44 operates according to an operation command from the gas controller 6.

The halogen generator 10 is filled with the halogen storage material 11 as described above, and the heater 13 is provided around the halogen storage material 11 so that the temperature can be controlled.
And a temperature sensor 12 are provided. Temperature sensor 12
Is composed of, for example, a thermocouple, and this temperature detection signal is input to the temperature controller 15.
Similarly, the heater 13 is connected to the temperature controller 15. The temperature controller 15 controls the amount of heat generated by the heater 13 while monitoring the temperature detection signal so that the temperature of the halogen storage substance 11 becomes a predetermined value.

A command value of the desired temperature is input to the temperature controller 15 from the gas controller 6 of the laser,
Further, the temperature controller 15 outputs an abnormality occurrence signal to the gas controller 6 when an abnormality occurs in the halogen generator 10 (for example, the temperature of the halogen storage substance has risen abnormally excessively).

A front mirror 2 is provided in front of the laser chamber 1 in the direction of travel of the laser beam via a laser window 1a, and a rear mirror 3 is provided behind it in the direction of the laser beam via a laser window 1b. A beam splitter 4 is provided in front of the front mirror 2, and a part of laser output light is reflected by the beam splitter 4 and guided to a monitor 5. The monitor 5 has a beam width representing the characteristics of the input laser light,
The spectral line width, pulse energy, etc. are detected, and the detected data is output to the gas controller 6. The gas controller 6 estimates the current halogen gas partial pressure in the laser chamber 1 based on the input detection data, and the temperature controller 15 issues a temperature command to the halogen controller so that the halogen gas partial pressure becomes a desired pressure based on the estimation result. Is output, and at the same time the opening and closing of each valve is controlled. In this way, the temperature of the halogen generator 10 is controlled and the halogen gas partial pressure is controlled to a predetermined value. Also, the laser chamber 1
Is equipped with a pressure sensor 9 for detecting the total pressure of the laser gas, and this pressure signal is input to the gas controller 6.

Further, the halogen filter 42 contains activated carbon for removing halogen gas, and a temperature sensor 45 for detecting the temperature of the activated carbon is provided. The temperature signal from the temperature sensor 45 is input to the gas controller 6. The halogen sensor 43 is a halogen filter 42.
The halogen gas concentration in the exhaust gas that has passed through is detected, and this concentration signal is input to the gas controller 6. The gas controller 6 monitors the temperature signal and the concentration signal to check whether the temperature of the halogen filter 42 rises and the concentration of exhaust gas is abnormal, thereby improving safety.

The gas controller 6 controls the entire gas supply apparatus as described above, and can be constituted by, for example, a microcomputer system mainly including a microcomputer.

In this embodiment, the case where the total reflection mirror is used as the rear mirror 3 is shown, but an optical element in which a wavelength selection element such as a prism, a grating or an etalon is combined may be arranged. . Such an example corresponds to the case of a narrow band excimer laser used as a light source for a stepper exposure apparatus, for example.

Next, each processing flow when the gas supply device of the excimer laser having the above-mentioned structure is used will be described. 2 to 9 show an example of a flow chart at the time of exchanging the laser gas, which will be described below with reference to these drawings. In the following flowchart, the subroutine is represented by "SUB" and each step number is represented by S.

FIG. 2 shows a first example of a flow chart of the main routine at the time of exchanging the laser gas. (S1) First, a subroutine "SUB 1" is executed in which all the gas in the laser chamber 1 is exhausted to perform vacuuming. (S2) Next, a subroutine "SUB 2" for injecting a halogen gas into the laser chamber 1 is executed. (S3) Next, a subroutine "SUB3" for injecting rare gas into the laser chamber 1 is executed. (S4) Then, the subroutine "SUB 4" for injecting the buffer gas into the laser chamber 1 is executed, and the main routine process is ended.

As a second example of the flow chart of the main routine at the time of exchanging the laser gas, the same process as from S2 may be performed after the initial injection of the buffer gas is performed after the evacuation in S1. An example of a flowchart at this time will be described based on FIG. (S11) First, a subroutine "SUB 1" is executed in which all the gas in the laser chamber 1 is exhausted to perform vacuuming. (S12) Next, a subroutine "SUB 5" for initially injecting the buffer gas into the laser chamber 1 is executed. (S13) Next, a subroutine "SUB 2" for injecting a halogen gas into the laser chamber 1 is executed. (S14) Next, a subroutine "SUB 3" for injecting the rare gas into the laser chamber 1 is executed. (S15) Then, the subroutine "SUB 4" for injecting the buffer gas into the laser chamber 1 is executed, and the main routine process is ended.

Each of the "SUB 1" to "SUB 5" subroutines will be described in detail below. FIG. 4 shows a gas exhaust subroutine for the “SUB 1” laser chamber.
Here, the laser chamber valve 8 and the exhaust valve 4
1 is closed. (S21) The halogen injection valves 17, 18 and 22 are closed. (S22) The vacuum pump 44 is operated. (S23) The valve 8 for the laser chamber and the exhaust valve 41 are opened to start the exhaust. (S24) The pressure P1 in the laser chamber 1 is the predetermined value Pv
Wait until: Here, the predetermined value Pv is a small pressure value that can be regarded as a substantially vacuum. (S25) The exhaust valve 41 is closed. (S26) The operation of the vacuum pump 44 is stopped.

In this way, the laser gas is exhausted by the vacuum pump 44 and the exhaust valve 41 so that the pressure P1 in the laser chamber 1 becomes equal to or lower than the predetermined value Pv. At this time, the predetermined value Pv is set to a value such that the exhaust time of the laser is restricted and the impurity concentration remaining in the laser chamber does not affect the performance of the laser.
It should be noted that the vacuum pump 44 and the exhaust valve 41 are examples of the vacuuming means, and the invention is not limited to this, and the same applies to the following description.

Although "SUB 2" represents a halogen gas injection subroutine, two examples are shown here. FIG. 5 shows "SUB 2" of the first halogen gas injection subroutine example.
"a" is represented. Here, the halogen injection valve 17
Shall be closed. (S31) The gas input valve 21 and the halogen injection valve 16 are closed. (S32) Halogen storage substance 11 of halogen generator 10
Wait until the temperature Th of falls within the predetermined temperature range. Here, the above temperature range is a range for setting the halogen gas partial pressure to a desired value, and is represented by "TCM1≤Th≤Tcm1". The gas controller 6 transmits the data of the above temperature range (TCM1, Tcm1, etc.) to the temperature controller 15, and when the temperature of the halogen storage substance 11 can be controlled within the temperature range commanded by the temperature controller 15, the gas controller 6 is controlled. Signal to be sent to 6 such as "Temperature control OK"
Etc. may be waited for. Alternatively, the current temperature data may be directly transmitted from the temperature controller 15 to the gas controller 6 to monitor whether the gas controller 6 is within the above temperature range.

(S33) Halogen injection valves 16 and 1
Open 7. At this time, since the laser chamber 1 and the laser chamber gas supply line 7 are in a vacuum state, the halogen gas of the halogen generator 10 is rapidly injected into the laser chamber. (S34) Wait until the opening time tH of the halogen injection valves 16 and 17 exceeds the predetermined halogen gas injection time K, and when it exceeds the injection time K, proceed to S35. The halogen gas partial pressure is controlled to a predetermined value (halogen gas partial pressure value of the halogen generator 10) by waiting until the time K at which the halogen gas partial pressures in the halogen generator 10 and the laser chamber 1 match. That is, since the partial pressure of the halogen gas required for laser oscillation is about several hpa in the case of the KrF excimer laser, the partial pressure of the halogen gas cannot be detected with high accuracy from the output value of the pressure sensor 9 as it is. Have difficulty. Therefore, in this example, the halogen gas having a desired partial pressure is injected by the partial pressure of the halogen gas corresponding to the temperature in the halogen generator 10, so that a desired amount of the halogen gas can be injected with high accuracy. The opening time K of the halogen injection valves 16 and 17 depends on the length of the pipe from the halogen generator 10 to the laser chamber 1 and the volume of the laser chamber 1, but is about several seconds. . (S35) The halogen injection valves 16 and 17 are closed.

In this way, the halogen gas is injected into the laser chamber 1 with high accuracy. If the evacuation subroutine of "SUB 1" is insufficient, the halogen gas is injected into the laser chamber 1 by diffusion, so that the injection time becomes very long and the desired halogen gas partial pressure is reached. Will be difficult to obtain. In the above flowchart, when the mass flow controller 19 of FIG. 1 is not mounted, the halogen injection valve 16 is directly connected to the laser chamber gas supply line 7, and only the halogen injection valve 16 is provided without the halogen injection valve 17. You may open and close by S33 and S35. The same applies to the following description.

Next, based on FIG. 6, a detailed description of "SUB 2b" of the second halogen gas injection subroutine example will be given.
Here, it is assumed that the halogen injection valve 17 is closed. (S41) The gas input valve 21 and the halogen injection valve 16 are closed. (S42) Halogen storage substance 11 of halogen generator 10
Wait until the temperature Th of falls within the predetermined temperature range. At this time, the temperature range is represented by "TCM2 ≤ Th ≤ Tcm2", and "TCM2 ≥ TCM1" and "Tcm2 ≥ Tcm1", respectively.
Is set to satisfy. Here, TCM1 and Tcm1 are temperature ranges set in the above-mentioned "SUB 2a", and in this example, a temperature range higher than that in "SUB 2a" is set. This is because the partial pressure of the halogen gas is set to be higher than the partial pressure of the halogen gas in the laser chamber 1, for example, five times (a partial pressure of the halogen gas of about 25 hpa).

(S43) The valves 21, 16 and 17 are opened. As a result, the mixed gas of the buffer gas and the halogen gas is injected into the laser chamber 1. (S44) The pressure P1 in the laser chamber 1 is the predetermined value Ph
Wait until equal. Here, since the mixed gas corresponding to the halogen gas partial pressure of 25 hpa is injected as described above, this pressure value Ph has a magnitude that can be detected by the pressure sensor 9 sufficiently accurately. (For example, Ph = 1
It is about 00hpa. Therefore, the halogen gas can be injected with high accuracy. (S45) The halogen injection valves 16 and 17 are closed, and the subroutine processing ends.

In this way, the halogen gas can be injected into the laser chamber with high accuracy as well. In addition, "SUB 2
“B” is also effective when the buffer gas or the like is initially injected before the halogen gas is injected.

Next, based on FIG. 7, a detailed description of "SUB 3" of the example of the rare gas injection subroutine will be given. Here, it is assumed that the valve 31 is closed. (S51) The valve 31 is opened to inject rare gas. (S52) The pressure P1 in the laser chamber 1 is the predetermined value Pr.
Wait until equal. As a result, a rare gas having a desired gas pressure is injected into the laser chamber 1. (S53) The valve 31 is closed and the subroutine processing is ended. In this way, the rare gas having a desired gas pressure is injected.

Further, "SUB 4" of the example of the buffer gas injection subroutine will be described in detail with reference to FIG. Here, it is assumed that the valve 22 is closed. (S61) The valve 22 is opened and the buffer gas is injected. (S62) The pressure P1 in the laser chamber 1 is the predetermined value PB.
Wait until equal. Thereby, the buffer gas having a desired gas pressure is injected into the laser chamber 1. (S63) The valve 22 is closed and the subroutine processing is ended.

In this way, the buffer gas having a desired gas pressure is injected. The injection pressure Ph of the mixed gas of the buffer gas and the halogen gas in the above-mentioned "SUB 2b" is Ph
However, if it is set to be smaller than the predetermined value PB, the buffer gas having a desired gas pressure can be injected by the "SUB 4". Further, if the injection pressure Ph of the mixed gas is set equal to the predetermined value PB, it is not always necessary to inject the buffer gas by the present "SUB 4".

Next, referring to FIG. 9, a detailed description will be given of "SUB 5" which is an example of a buffer gas initial injection subroutine. Here, it is assumed that the valve 22 is closed. (S71) The valve 22 is opened and the buffer gas is injected. (S72) The pressure P1 in the laser chamber 1 is the predetermined value PB0.
Wait until equal. Here, the predetermined value PB0 is a positive value near 0. That is, when the pressure sensor 9 has a negative offset, it cannot be accurately detected while the halogen gas partial pressure is small. Therefore, the buffer gas is initially injected before the halogen gas is injected, and the output value of the pressure sensor 9 is decreased. 0
That's all. Thereby, the halogen gas having a desired partial pressure can be accurately injected into the laser chamber 1. (S73) The valve 22 is closed and the subroutine processing is ended.

In this way, the buffer gas is initially injected. As described above, “SUB 2a” or “SUB 2b” can be applied as a subroutine for injecting a halogen gas after this.

Now, a flow chart for injecting a halogen gas during the laser operation will be described. FIG. 10 is an example of a flowchart of the main routine at this time, which will be described below with reference to FIG. (S81) First, a subroutine "SUB 6" for inputting data representing the laser characteristics from the monitor 5 is executed. Here, the laser characteristic data according to the current partial pressure of the halogen gas and the target data value are input. (S82) Next, a subroutine "SUB 7" for calculating the injection amount or injection speed of the halogen gas is executed. That is, the current value and the target value of the laser characteristic data are compared with each other, and the amount of halogen gas to be injected or the injection speed is calculated from this. (S83) Next, a subroutine "SUB 8" for injecting a halogen gas during operation is executed. Here, the halogen gas is injected into the laser chamber 1 in an injection amount based on the calculated result.

FIG. 11 shows a first example "SUB6" of the subroutine "SUB6" for inputting data representing laser characteristics from the monitor 5.
6a ”is shown and will be described in detail with reference to FIG. (S91) The target laser beam width Bw0 is read from a predetermined storage area of the memory in the gas controller 6. (S92) From the monitor 5, the current laser beam width Bw
Read. The present inventors have confirmed that the beam width Bw and the halogen gas partial pressure have a positive correlation, as shown in FIG. Therefore, the current beam width B
The halogen gas partial pressure is monitored by w. The beam width Bw is detected as follows, for example. CC
Laser light is made incident on a light receiving element such as a D array, and charges corresponding to the intensity of the laser light are accumulated in each element of the CCD. The charge is converted into a voltage by a circuit that integrates the current when the charge accumulated in each channel is discharged and converts the current into a voltage. Therefore, the laser beam width can be monitored (calculated) by analyzing the light intensity of each channel, that is, the voltage. In addition, a CCD with a predetermined voltage value or more
The laser beam width can also be monitored by detecting the channel of the device.

Also, the data indicating the laser characteristics is monitored 5
The second example of the subroutine "SUB 6" input from "SUB
6b ”will be described with reference to FIG. (S101) Target laser spectral line width Lw0
Is read from a predetermined storage area of the memory in the gas controller 6. (S102) The current spectral line width Lw of the laser is read from the monitor 5. According to the proposers of the present invention, FIG.
4, it is confirmed that the spectral line width Lw0 and the halogen gas partial pressure have a positive correlation. Therefore, the halogen gas partial pressure is monitored by the current spectral line width Lw.

The spectral line width Lw is monitored as follows, for example. It is well known that the angle at which light incident on the diffraction grating is diffracted and the angle at which light passing through the etalon is emitted are determined by the wavelength of the light. Therefore,
When the laser light is incident on, for example, a diffraction grating, it is diffracted at an angle according to the wavelength included in the laser light. At this time, when the diffracted light is received by a light receiving element such as a CCD array, the diffracted light is incident on the CCD light receiving element of each channel corresponding to the wavelength, so that the charge amount (voltage value) of the light receiving element of each channel is The light intensity distribution for each wavelength can be known from the size. In this way, the shape of the spectrum of the laser light can be detected, and for example, the width of the wavelength at which the light intensity is half the maximum value or more, that is, the spectral line width Lw.
(Full width at half maximum) can be known. With an etalon, you can monitor in much the same way.

Note that it is effective to estimate the partial pressure of halogen gas by the spectral line width Lw in the case of a narrow band excimer laser. A part of the output laser light of the narrow band excimer laser is introduced into the monitor etalon, and the interference fringes of the light passing through this monitor etalon are received by the CCD light receiving element as described above to monitor the spectral line width Lw. It becomes possible.

Further, the data indicating the laser characteristics is monitored 5
Third example of the subroutine "SUB 6" input from "SUB
6c "will be described with reference to FIG. (S111) The target excitation intensity of the laser, that is, the charging voltage Hv0 of the laser power supply is read from a predetermined storage area of the memory in the gas controller 6. (S112) The current charging voltage Hv of the laser power supply is read from the monitor 5. Here, the relationship between the charging voltage Hv and the halogen gas partial pressure will be described. In the excimer laser device, the excitation intensity, that is, the voltage applied to the output charging capacitor of the laser power supply (hereinafter referred to as the charging voltage) is controlled so that the pulse energy of the output laser light has a predetermined value. Since the pulse energy decreases as the halogen gas partial pressure decreases, the charging voltage is increased in order to maintain this pulse energy at a predetermined value. Therefore, the halogen gas partial pressure can be monitored by monitoring the charging voltage.

The limitation to the above three monitor examples is not the gist of the present invention, and any means capable of directly or indirectly monitoring the halogen gas partial pressure may be used.

Next, the subroutine "SUB 7" for calculating the injection amount or injection speed of the halogen gas will be described with reference to FIGS. Figure 16 shows "SUB
7] shows a first example "SUB 7a" of "7". (S121) The target value A0 and the measured value A are compared, and "A0
When <A ”, the process proceeds to S122, when“ A0 = A ”, the process proceeds to S123, and when“ A0> A ”, the process proceeds to S124. Here, the target value A0 and the measured value A represent the target value of each data representing the laser characteristics in the above-mentioned subroutine "SUB 6" and the input value from the monitor.
For example, when the halogen gas partial pressure is monitored by the laser beam width Bw, "A0 = Bw0" and "A = Bw"
It will be.

(S122) Assuming that the variable for determining the halogen gas injection amount is "H", "H ← H-ΔH" is set. That is, a value obtained by subtracting a predetermined amount of ΔH from the value of the variable H in the previous cycle processing is the variable H in the current cycle processing.
Value. As a result, the halogen gas partial pressure is set to be lower than that in the previous processing. After the above setting, the subroutine processing is ended. (S123) The variable H that determines the amount of halogen gas injection is set to "H = H", and the subroutine processing ends. That is, a value equal to the value of the variable H in the previous cycle processing is set as the value of the variable H in the current cycle processing. As a result, the halogen gas partial pressure is maintained as it is. (S124) The variable H that determines the injection amount of halogen gas is set to "H ← H + ΔH", and the subroutine processing is ended. That is, a value obtained by adding ΔH having a predetermined magnitude to the value of the variable H in the previous cycle processing is set as the value of the variable H in the current cycle processing. As a result, the halogen gas partial pressure is made higher than the previous time.

FIG. 17 shows a second example "SUB 7" of "SUB 7".
b ”is shown. (S131) The target value A0 and the measured value A are compared, and "A0
When <A ”, the process proceeds to S132, when“ A0 = A ”, the process proceeds to S133, and when“ A0> A ”, the process proceeds to S134. Here, the target value A 0 and the measured value A are
It is the same as described in “a”. (S132) The variable H that determines the halogen gas injection amount is set to "H ← 0", and the subroutine processing ends. That is, no halogen gas is injected. (S133) The variable H that determines the amount of halogen gas to be injected is set to "H ← 0", and the subroutine processing ends. That is, no halogen gas is injected. (S134) The variable H that determines the amount of halogen gas to be injected is set to "H ← H0", and the subroutine processing ends.
Here, H0 is a constant having a predetermined size. As a result, a predetermined amount of halogen gas is injected so that the partial pressure of halogen gas becomes higher than that in the previous processing.

Next, an example of the subroutine "SUB 8" for injecting a halogen gas during operation will be described with reference to FIGS. First, FIG. 18 illustrates a first example “SUB 8a” of “SUB 8”. (S141) Wait until the temperature ST of the halogen storage substance 11 reaches the injection temperature STin. As a result, the halogen gas partial pressure is controlled to a predetermined value. (S142) The time tH is calculated by "tH = k1 * H". Here, H is a variable that determines the amount of halogen gas injection required in the above-mentioned "SUB 7", and k1
Is a coefficient of a predetermined size. Therefore, the time tH changes in proportion to the magnitude of the halogen gas injection amount H. (S143) The gas input valve 21 and the halogen injection valves 16 and 17 are opened for tH and then closed. As a result, a predetermined amount of halogen gas according to the halogen gas injection amount H is injected together with the buffer gas.

Next, a second example "SUB 8b" of "SUB 8" will be described with reference to FIG. "SUB 8b" shows an example in which the flow rate of the halogen gas is controlled by changing the flow rate of the mass flow controller 19. (S151) Wait until the temperature ST of the halogen storage material 11 reaches the injection temperature STin. As a result, the halogen gas partial pressure is controlled to a predetermined value. (S152) The flow velocity Q of the mass flow controller 19 is obtained by "Q = k2 * H". Here, H is a variable (in this case, the injection amount per unit time) that determines the injection amount of the halogen gas obtained in the above "SUB 7", and k2 is a coefficient of a predetermined size. Therefore, the flow rate Q is proportional to the amount of the halogen gas injection amount H.
Changes. (S153) The flow rate of the mass flow controller 19 is set to the flow rate Q obtained above, and the gas input valve 21 and the halogen injection valves 16 and 18 are opened. Above `` SUB 8
By processing "b" together with the aforementioned "SUB 6" and "SUB 7" in a predetermined cycle, the halogen gas injection amount can be controlled by the mass flow controller 19, and therefore the injection amount can be controlled very accurately.

Next, a third example "SUB 8c" of "SUB 8" will be described with reference to FIG. "SUB 8c" shows an example in which the halogen gas partial pressure is controlled by changing the temperature of the halogen storage material 11. (S161) The injection temperature STin of the halogen storage material 11 is calculated by "STin = k3 * H". Here, H is a variable that determines the amount of halogen gas injection determined in the above-mentioned "SUB 7", and k3 is a coefficient of a predetermined magnitude. Therefore, the injection temperature STin changes in proportion to the amount H of the halogen gas injected. (S162) The temperature ST of the halogen storage material 11 is S16.
Wait until the injection temperature STin obtained in 1 is reached. As a result, the halogen gas partial pressure according to the halogen gas injection amount H is controlled. (S163) The flow rate of the mass flow controller 19 is set to a predetermined value Q, and the gas input valve 21 and the halogen injection valves 16 and 18 are opened.

The above "SUB 8b" is replaced with "SUB 6" and "SUB
7 "in a predetermined cycle, the partial pressure of the halogen gas generated from the halogen storage material 11 can be controlled, and thus the injection amount per unit time can be accurately controlled.

Next, the safety processing of the gas supply system of the present invention will be described. Since the excimer laser uses a very dangerous halogen gas, a safety device is required. In particular, since the halogen generator 10 is used in the present invention, a safety treatment different from the conventional one is required. FIG. 21 is a subroutine "SUB" of the processing for this.
9 ”is shown. (S171) The temperature THG of the halogen storage material 11 is read from the temperature controller 15. At the same time, the temperature sensor 45
The temperature TFL of the halogen filter 42 is read from, and the halogen concentration CH is read from the halogen sensor 43. (S172) Abnormality detection and abnormality processing subroutine "SUB
10 ”is executed. Here, it is determined whether or not there is an abnormality on the basis of each temperature and concentration data read in S171, and when there is an abnormality, each process for safety is performed.
This subroutine "SUB 9" is executed in the overall control processing routine of the gas controller 6 as needed when safety is to be confirmed. In this way, safety is always maintained.

An example of the abnormality detection and abnormality processing subroutine "SUB 10" will be described below in detail with reference to FIG. (S181) In this step, it is determined whether or not at least one of the following three determination conditions is satisfied, and when it is satisfied, the process proceeds to S182. If not (all three determination conditions are denied), it is regarded as safe, the process proceeds to "return", and the process of "SUB 10" is ended. The first condition is “THG> TALM HG”, and it is considered abnormal when the halogen gas partial pressure is higher than a specified value, which is dangerous. The second condition is "T
FL> TALM FL ”, and the temperature T of the halogen filter 42
If FL is higher than a specified value, it is dangerous and is considered abnormal. The third condition is "CH> CALM H", and when the halogen concentration CH in the exhaust gas exceeds a predetermined value, it is dangerous because it is dangerous.

(S182) First, the laser oscillation is stopped. This can be done, for example, by turning off an excitation power supply (not shown). (S183) Next, the heater 13 of the halogen generator 10 is turned off so that the halogen gas is not generated.
At this time, the gas controller 6 is the temperature controller 1
5, the temperature controller 15 may turn off the power of the heater 13, or the gas controller 6 may directly turn off the power of the heater 13. (S184) And all the valves are closed. (S185) The abnormality is notified to the outside of the excimer laser device. This is notified by, for example, an abnormal alarm or an abnormal display that can be understood by the operator, or by transmitting an abnormal signal to other control devices or manufacturing devices associated with the excimer laser device. After this, the process proceeds to "end" and the present process ends.

In S184, when gas leaks from the laser chamber 1, the laser chamber valve 8 and the exhaust valve 41 are opened, and the laser gas is exhausted by the vacuum pump 44. The gas leak from the laser chamber 1 can be detected by, for example, whether or not the gas pressure P1 in the laser chamber 1 has dropped below a predetermined value.

Since the abnormality detection and the abnormality processing are related to safety, not only the software processing as described above but also the
By performing hardware processing at the same time, safety is further enhanced. FIG. 23 and FIG. 24 show examples of hardware processing, and show an operating state in a normal state and an operating state in an abnormal state, respectively. In FIG. 23, a temperature sensor 51 is a temperature sensor whose output contact is turned off when the temperature of the halogen storage substance 11 exceeds a predetermined value, and a temperature sensor 52 is used when the temperature of the halogen filter 42 exceeds a predetermined value. It is a temperature sensor whose output contact is turned off. The temperature sensor 51, the temperature sensor 52, the power supply 53 for abnormal stop circuit, and the coil 54c of the relay 54 are connected in series. Here, the relay 54 is the temperature sensor 51.
Also, the temperature sensor 52 is used as an example of abnormality determining means for determining whether or not the temperature abnormality is detected. Although the abnormal stop circuit power supply 53 is shown as a DC power supply in FIG. 23, it may be an AC power supply and the relay 54 may be an AC power supply.

The valve V represents an automatic valve for control as described above, and it is assumed here that all automatic valves are included. The valve V includes a contact 54a1 and a contact 54 of the relay 54 from the valve power supply 55.
Drive current is supplied via a2. Here, the a-contact 54a1 and the a-contact 54a2 are an example of valve shutoff means for shutting off the valve V according to the determination result of the abnormality determination means, and are not limited thereto. That is, it is a shutoff means that shuts off the valve V by hardware in response to an abnormality detection signal from the abnormality determination means. In addition to the electrical interruption method as in this embodiment, mechanical interruption may be used. Thus, the reason why the two a-contacts 54a1 and 54a2 form a double circuit is to enhance safety. Similarly, the heater 13 of the halogen generator 10 includes the a-contact 54a3 and the a-contact 54a4 of the relay 54 from the heater power supply 56.
Drive current is supplied through the double circuit. Here, the a-contact 54a3 and the a-contact 54a4 are an example of a heater cutoff unit that cuts off the heat generation of the heater according to the determination result of the abnormality determination unit, and is not limited thereto.

In the abnormal stop circuit having the above structure, when the temperature of the halogen storage material 11 and the temperature of the halogen filter 42 are both normal, the output contacts of the temperature sensor 51 and the temperature sensor 52 are both turned on as shown in FIG. Because
The relay 54 of the abnormality determining means is operating. Therefore, since the a-contacts 54a1 and 54a2 of the valve cutoff means and the a-contacts 54a3 and 54a4 of the heater cutoff means are turned on, the valve opening / closing control and the temperature control by the heater 13 can be performed.

FIG. 24 shows the state when the temperature is abnormal. When either the temperature sensor 51 or the temperature sensor 52 detects a temperature abnormality, the output contact of the temperature sensor that has detected the abnormality is turned off, so that the coil 54c is de-energized and the relay 54 of the abnormality determining means is turned off. To do. Therefore, the a-contacts 54a1 and 54a2 of the valve cutoff means and the a-contacts 54a3 and 54a4 of the heater cutoff means are opened. Since all the energizing current to the valve V is cut off, even if there is an open valve, it is forcibly closed. Further, the energization current to the heater 13 is cut off, and the generation of halogen gas is forcibly stopped. Although all valves are shut off in this embodiment, at least the halogen gas supply line 14 and the exhaust line 40 may be shut off.

In this way, even in the case of a controller failure or the like, safety can be surely ensured by hardware abnormality processing. Further, the safety is enhanced by using the software-like abnormality processing together. For example, the "SUB
In S183 and S184 of "10", the controller may output the I / O by software to turn off the operation of the relay 54. In this case, the gas controller 6 functions as one of the abnormality determining means.

25 and 26 show an example of a hard block diagram of the interlocking process of the exhaust gas and the halogen gas supply for preventing the abnormal temperature rise of the halogen filter 42 during the exhaust gas. That is, when a gas with a high concentration of halogen gas is passed through the halogen filter 42 and exhausted, the activated carbon in the halogen filter 42 and the halogen gas suddenly react with each other to reach a high temperature, which may eventually cause an explosion, which is extremely dangerous. Is. This reaction is "C + 2F2
→ CF4 + ΔH ", which is accompanied by very high heat generation. Therefore, it is necessary to interlock so that the halogen gas cannot be supplied and exhausted at the same time. In this embodiment, a hardware circuit is used so that the halogen injection valves 17, 18 and the valve 22 are not opened when the exhaust valve 41 is open.

FIG. 25 shows the operation during exhaust, and FIG. 26 shows the operation during non-exhaust, which will be described below with reference to FIGS. 25 and 26. Here, the three a contacts 61a1, 61a
It is assumed that 2, 61a3 operate in conjunction with each other, for example, by the same exhaust switch. Also, the two a contacts 62a1,
It is assumed that 62a2 operates in conjunction with, for example, the same halogen gas injection switch. Both output terminals of the valve power source 55 are connected to the exhaust valve 41 via a contact points 61a1 and 61a2 of the exhaust switch. Further, both output terminals of the valve power source 55 are connected to a series circuit of the a contact 61a3 of the exhaust switch and the coil 64c of the relay 64. The relay 64 has at least two b contacts 64b1 and 64b2. Power supply for valve 5
Halogen injection for halogen gas injection through both output terminals of 5 through a series circuit of a contact 62a1 of the halogen gas injection switch and b contact 64b1 of the relay 64 and a series circuit of a contact 62a2 and b contact 64b2. Valve 17,
It is connected to 18, 22, etc. In this circuit, the relay 64 is an example of a supply / exhaust interlock means for interlocking the halogen gas supply and the exhaust, but is not limited to this.

If the exhaust switch is turned on, the a contacts 61a1 and 61a2 are turned on and the exhaust valve 41 is turned on.
Is energized to open the exhaust valve 41. At this time, since the a contact 61a3 is turned on and the coil 64c is energized, the relay 64 of the supply / exhaust interlock means is actuated, and the b
The contacts 64b1 and 64b2 are forcibly turned off. Therefore, even if the halogen gas injection switch is operated in this state, the halogen injection valves 17, 18 and the valve 22 will not open. When the exhaust switch is turned off, the exhaust valve 41 is closed, and at the same time, the energization of the coil 64c is cut off and the b contacts 64b1 and 64b2 of the relay 64 of the supply / exhaust interlock means are automatically turned on. Therefore, when the halogen gas injection switch operates in this state, the halogen injection valves 17 and 18 and the valve 22 are
You can open and close etc. In this way, the gas controller 6
Even in the event of a failure, the valve for injecting halogen gas and the valve for exhaust can be opened and closed reliably and safely.

Now, the second embodiment will be described. The second embodiment is an example in which a check valve 23 is attached between the input port of the halogen generator 10 and the gas input valve 21 on the input side with respect to the first embodiment, and FIG. Is shown. Here, since the other structure of the check valve 23 is the same as that of the first embodiment, the same reference numerals are given and the description thereof will be omitted.
The check valve 23 prevents the halogen gas generated by the halogen generator 10 from entering the buffer gas supply line 24 and the buffer gas cylinder 20 side.
Since the check valve 23 does not mix halogen gas with other gas lines, the halogen gas is supplied with high accuracy and safety is ensured. The processing contents such as the laser gas exchange processing, the halogen gas injection processing during operation, and the safety processing in the second embodiment can be performed in the same manner as in the first embodiment.

Next, in the third embodiment, a mixed gas of buffer gas and rare gas (for example, Kr is used as a supply gas cylinder).
This is an example using a mixed gas of 1.2% and Ne 98.8%), and FIG. 28 shows the hardware configuration thereof. In this embodiment, a mixed gas cylinder 25 is used instead of the buffer gas cylinder 20 and the rare gas cylinder 30. The mixed gas supply line 27 from the mixed gas cylinder 25 is connected to the input port of the halogen generator 10 via the gas input valve 21 and to the laser chamber gas supply line 7 via the valve 22. Other configurations are the same as those in the first embodiment, and the same configurations are given the same numbers and their explanations are omitted.

The advantage of this structure is that only one gas supply line for the buffer gas and the rare gas to the laser chamber 1 is required, and the concentration of the rare gas changes even if halogen gas is injected during the laser operation. Therefore, it is possible to control the gas supply with high accuracy as a whole.

29 and 30 show a processing example of the main routine at the time of exchanging the laser gas when the above mixed gas is used. First, a first main routine example will be described with reference to FIG. (S191) A sub-routine "SUB 1" for exhausting the gas in the laser chamber 1 to evacuate is executed. (S192) A subroutine "SUB 2" for injecting a halogen gas into the laser chamber 1 is executed. (S193) The subroutine "SUB 20" for injecting the mixed gas of the buffer gas and the rare gas into the laser chamber 1 is executed. After that, the process ends.

Further, FIG. 30 shows a second main routine example at the time of exchanging the laser gas when the mixed gas is used. In this example, after the evacuation, the initial injection of the mixed gas is performed, and then the same processing as that from S192 is performed. (S201) First, a subroutine "SUB 1" for exhausting the gas in the laser chamber 1 to evacuate it is executed. (S202) Next, a subroutine "SUB 21" for initially injecting the mixed gas into the laser chamber 1 is executed. (S203) Next, a subroutine "SUB 2" for injecting a halogen gas into the laser chamber 1 is executed. (S204) Then, a subroutine "SUB 20" for injecting the mixed gas into the laser chamber 1 is executed. After that, the process ends.

29 and 30, the subroutines "SUB 1" and "SUB 2" are the same as those described in the first embodiment.

Hereinafter, the subroutine "SUB 20" for injecting the mixed gas of the buffer gas and the rare gas into the laser chamber 1 will be described with reference to FIG. Here, it is assumed that the valve 22 is closed. (S211) The valve 22 is opened to inject the mixed gas. (S212) The pressure P1 in the laser chamber 1 is the predetermined value P.
Wait until it equals Br. As a result, a mixed gas having a desired gas pressure is injected into the laser chamber 1. (S213) The valve 22 is closed. In this way, the mixed gas having a desired gas pressure is injected.

Next, with reference to FIG. 32, a subroutine "SUB 21" for initially injecting the mixed gas into the laser chamber 1 will be described. Here, it is assumed that the valve 22 is closed. (S221) The valve 22 is opened to inject the mixed gas. (S222) The pressure P1 in the laser chamber 1 is the predetermined value P
Wait until it is equal to Br0. Here, the predetermined value PBr0 is 0
Is a positive predetermined value close to. This is for the same reason as the sub-buffer gas initial injection subroutine "SUB 5" of the first embodiment. Thereby, the halogen gas having a desired partial pressure can be accurately injected into the laser chamber 1. (S223) The valve 22 is closed. In this way, the mixed gas is initially injected.

The contents of the halogen gas injection process during operation and the safety process in the third embodiment can be performed in the same manner as in the first embodiment.

Next, a fourth embodiment will be described with reference to FIG. This embodiment is an example in which a buffer tank 26 for mixing a buffer gas and a halogen gas is arranged between the output port of the halogen generator 10 and the halogen gas supply line 14. The output port of the halogen generator 10 is connected to the input side of the buffer tank 26 via the halogen injection valve 16, and the output side of the buffer tank 26 is connected to the halogen gas supply line 14 via the buffer tank output valve 28. ing. Nothing is connected to the input port side of the halogen generator 10. The gas supply line of the buffer gas cylinder 20 is provided with a buffer injection valve 34.
Is connected in parallel with the output side of the halogen injection valve 16 to the input side of the buffer tank 26. The input side of the buffer tank 26 is connected to the input side of the halogen filter 42 via the buffer tank exhaust valve 29 and in parallel with the output side of the exhaust valve 41. Other configurations that are the same as those in the first embodiment are designated by the same reference numerals and will not be described.

Even in the case of such a configuration, by performing the same laser gas exchange process as in the first embodiment, halogen gas injection process during operation, and safety process, the halogen gas concentration can be accurately adjusted. It will be adjustable. At this time, the halogen gas injection process during operation is performed as follows using the buffer tank 26.

FIG. 34 shows the buffer tank 2 as described above.
6 shows a halogen gas injection subroutine "SUB 8d" during operation in the case where 6 is attached, which will be described with reference to FIG. The subroutine "SUB 8d" is regarded as an example of the subroutine "SUB 8" for injecting a halogen gas during the operation in FIG. 10 of the first embodiment. (S231) The injection temperature STin of the halogen storage material 11 is calculated by "STin = k3 * H". Here, H is a variable that determines the halogen gas injection amount obtained in "SUB 7" of the first embodiment, and k3 is a coefficient of a predetermined magnitude. Therefore, the injection temperature STin increases in proportion to the amount of the halogen gas injection amount H. (S232) Wait until the temperature ST of the halogen storage substance 11 reaches the injection temperature STin obtained in step S231. As a result, the halogen gas partial pressure is controlled according to the halogen gas injection amount H.

(S233) Buffer injection valve 34,
After closing the halogen injection valve 16 and the buffer tank output valve 28, the buffer tank exhaust valve 29
To open the vacuum pump 44 and operate the vacuum pump 44 for a predetermined time t.
The buffer tank 26 is evacuated only for BT. (S234) Next, the buffer tank exhaust valve 29 is closed and the halogen injection valve 16 is opened for a predetermined time tBH, for example.
Just open it. As a result, the buffer tank 26 is filled with the halogen gas. (S235) Next, the halogen injection valve 16 is closed and the buffer injection valve 34 is opened for a predetermined time tBB, for example. As a result, the buffer gas is filled in the buffer tank 26. (S236) Next, after closing the buffer injection valve 34, the buffer tank output valve 28 and the halogen injection valve 17 are opened for a predetermined time tBR. As a result, a predetermined amount of halogen gas is injected from the buffer tank 26 into the laser chamber 1. (S237) The buffer tank output valve 28 and the halogen injection valve 17 are closed, and the subroutine processing ends.

In the example of the above flow chart, the temperature of the halogen generator 10 is controlled based on the estimation result of the monitor 5 (the size of the variable H that determines the halogen gas injection amount in S231). It is not limited. That is, the halogen partial pressure may be controlled by controlling the opening / closing time of the halogen injection valve 16 while keeping the temperature constant at a predetermined value, as in the case of the aforementioned “SUB 8a”. If there is no mass flow controller 19,
The buffer tank output valve 28 is directly connected to the laser chamber gas supply line 7, and the halogen injection valve 17 is connected.
It is sufficient to open and close only the buffer tank output valve 28 without it. Further, the vacuum pump 44 and the buffer tank exhaust valve 29 are examples of the vacuuming means and are not limited thereto.

Next, a fifth embodiment will be described. The fifth embodiment shows an example in which the halogen gas supply line is directly connected to the laser chamber 1, and the halogen generator 10 and the halogen gas supply line are integrally attached to the laser chamber 1. The hardware configuration will be described in detail with reference to FIG. The halogen injection valves 17 and 18 of the halogen gas supply lines 14 and 14 a arranged on the output port side of the halogen generator 10 are directly connected to the laser chamber 1. When the mass flow controller 19 is not mounted, the halogen gas supply line 14 is directly connected to the laser chamber 1. And the halogen generator 10
The replacement input valve 60 connected to the input port of
Buffer gas supply line 24 of the buffer gas cylinder 20
Are connected via the gas input valve 21 and the input joint 62. The exhaust line of the laser chamber 1 is connected to the laser chamber gas supply line 7 from the laser chamber valve 8 via the laser chamber joint 61 and the valve 73. Laser chamber joint 61
Since the pipes can be separated at the input joint 62, the laser chamber 1 and the halogen generator 1 can be separated.
The part where 0 is integrated can be easily replaced. A cable between the temperature controller 15, the temperature sensor 12, and the heater 13, each valve, and the gas controller 6
For example, the cable between them is a detachable connector 12
It is separable by a, 13a, etc.

Further, at the time of replacement, the inside of the laser chamber 1, the halogen gas supply lines 14 and 14a and the halogen generator 1 are replaced.
0 is washed with, for example, an inert gas (hereinafter referred to as purge)
An inert gas cylinder and a valve 36 that opens and closes the cylinder are used as a purging unit for this purpose. In this embodiment,
A helium gas cylinder 35 is connected to an exhaust line 40 via a valve 36 as an example of a purging unit.

Laser chamber 1 having such a configuration
Fig. 36 shows an example of a flowchart for replacing the
6, the flow chart will be described in detail. here,
It is assumed that the valve 73 is open and the valves 22 and 31 are closed. (S241) The temperature of the halogen storage material 11 is returned to room temperature by the temperature controller 15, and the temperature controller 15
Check that the control of is stopped. This can be confirmed, for example, by the pressure P1 in the laser chamber 1 being below a predetermined value, the temperature of the halogen storage substance 11 being below a predetermined value, or the like. (S242) The gas input valve 21 and the valve 36 are closed. And the valves 60, 16, 17, 18, 8, 4
Open one. (S243) The count number n is initialized, that is, "n =
0 ".

(S244) The vacuum pump 44 is operated, and the halogen gas supply lines 14 and 14 in the laser chamber 1 are operated.
The inside of a and the halogen generator 10 are evacuated. (S245) The pressure P1 in the laser chamber 1 is the predetermined value P
v Continue evacuation until: (S246) The vacuum pump 44 is stopped. (S247) The exhaust valve 41 is closed, and the valve 3
6 is opened and helium gas is injected into the laser chamber 1. As a result, the halogen gas supply lines 14, 14a and the halogen generator 10 in the laser chamber 1 are purged with helium. (S248) The pressure P1 in the laser chamber 1 is the predetermined value P
Continue the helium purge until it becomes He or higher.

(S249) It is judged whether or not the count number n is equal to or more than the predetermined number N, and if it is N or more, the process proceeds to S252, and if not, the process proceeds to S250. As a result, the exhaust and the helium purge are repeated a predetermined number of times. (S250) The count number n is incremented by 1. (S251) The valve 36 is closed and the exhaust valve 41 is opened, and the process returns to S244.

(S252) The valve 36 is closed and the helium purge is completed. Although the processing of the controller is completed at this step, it is possible to notify the operator or the like of the processing completion by a display or a signal sound. (S253) The operator turns off the power supply switch to the laser device for safety. (S254) And joints 61 and 62 for laser chambers
The laser chamber 1 and the halogen generator 10 are removed by. Here, the laser chamber 1 and the halogen generator 1
By closing the valve 72 when removing 0, the laser chamber gas supply line 7 is prevented from being contaminated by air.

As described above, since the laser chamber 1 and the halogen generator 10 can be replaced at the same time during maintenance, workability during maintenance is good. Moreover, since the halogen gas supply lines 14 and 14a are directly connected to the laser chamber 1, the halogen gas supply pipe is shortened, and therefore the apparatus can be configured compactly, safely and at a low cost. Furthermore, since the piping is short, the response of halogen gas injection during laser operation is improved,
Good controllability of halogen gas.

Next, a sixth embodiment will be described. The present embodiment is an example in which the halogen generator 10 can be replaced independently, and its hardware configuration diagram is shown in FIG. The input port and the output port of the halogen generator 10 are provided with a replacement input valve 60 and a replacement output valve 65, respectively, and further, outside the replacement input valve 60 and the replacement output valve 65, an input joint is provided. 62 and an output joint 67 are provided. In the input joint 62,
Buffer gas supply line 24 of the buffer gas cylinder 20
Are connected via the valve 68, the check valve 23, and the gas input valve 21. The check valve 23 is connected so that the halogen gas does not flow into the buffer gas supply line 24. Further, the laser chamber gas supply line 7 is provided between the valve 68 and the check valve 23 via the pipe 71 and the valve 22.
Connected to Further, a pipe 71 is provided between the check valve 23 and the valve 21 via a pipe 72 and an automatic valve 70.
Connected to Further, the output joint 67 is connected to the halogen gas supply lines 14, 1 via the halogen injection valve 16.
4a. Furthermore, helium gas cylinder 3
The gas supply line 5 is connected to the laser chamber gas supply line 7 via a valve 36. In this embodiment, the replacement input valve 60 and the replacement output valve 65 may be automatic valves or may be manual valves that open and close manually. In the case of an automatic valve, the valve shall be forced to close when the power supply to the valve is cut off.

An example of a flowchart for replacing the halogen generator 10 having the above-mentioned structure will be described with reference to FIG. Here, it is assumed that the replacement input valve 60 and the replacement output valve 65 are open. (S261) The temperature of the halogen storage material 11 is returned to room temperature by the temperature controller 15, and the temperature controller 15
Check that the control of is stopped. This can be confirmed as in S241 described above. (S262) The valves 8, 21, 31, 36, 68 are closed. Then, the halogen injection valves 16, 17, 18 and the valves 22, 70 are opened. (S263) The count number n is initialized, that is, "n =
0 ".

(S264) The exhaust valve 41 is opened. (S265) The vacuum pump 44 is operated for a predetermined time, and the halogen gas supply lines 14 and 14a and the halogen generator 10 are operated.
The inside is evacuated. (S266) After closing the exhaust valve 41, the valve 36 is opened for a predetermined time to inject helium gas into the halogen generator 10. As a result, the halogen gas supply line 1
4, 14a and the halogen generator 10 are purged with helium. (S267) The valve 36 is closed.

(S268) It is judged whether or not the count number n is equal to or greater than the predetermined number N, and when it is equal to or greater than N, the helium purge is completed, and the process proceeds to S270. Otherwise S
Proceeding to 269, exhaust and helium purge are repeated a predetermined number of times. (S269) The count number n is advanced by 1, and the process returns to S264. (S270) Since the processing of the controller has been completed in the steps so far, it is possible to notify the operator or the like of the completion of the processing by display, a signal sound, or the like. The operator turns off the power supply switch to the laser device for safety. (S271) Then, if the replacement input valve 60 and the replacement output valve 65 are manual, they are closed. Further, when this valve is automatic, it is closed before the processing is finished in the previous step S270, but is forcibly closed when the power supply switch is turned off. (S272) The halogen generator 10 is removed using the input joint 62 and the output joint 67.

With this structure, the halogen generator 10 can be easily polluted with air without leaking the halogen gas.
Can be replaced. Further, by closing the valve 16 before ending the process in S270, the halogen gas supply lines 14 and 14a and the laser chamber gas supply line 7 are prevented from being contaminated with air. As described above, the space between the halogen gas supply lines 14 and 14a, the halogen generator 10 and the gas input valve 21 is evacuated by the vacuum pump 44 and the exhaust valve 41. The vacuum pump 44 and the exhaust valve 41 are an example of a vacuuming means, and are not limited to these.

When mounting the halogen generator 10,
The procedure can be almost the same as that described above, and FIG. 39 shows a flowchart at that time. Here, it is assumed that the replacement input valve 60 and the replacement output valve 65 are in a closed state. (S281) The halogen generator 10 is attached by the input joint 62 and the output joint 67. (S282) The power supply switch for the laser device is turned on. (S283) It is confirmed that the control of the temperature controller 15 is stopped. (S284) After closing the valves 8, 31, 36, 68,
The halogen injection valves 16, 17, 18 and the gas input valve 21 and the valves 22, 70 are opened. Here, the reason for opening the gas input valve 21 and the valves 22 and 70 is to exhaust the air accumulated between the replacement input valve 60 and the gas input valve 21. (S285) The count number n is initialized, that is, "n =
0 ".

(S286) The exhaust valve 41 is opened. (S287) The vacuum pump 44 is operated for a predetermined time, and the halogen gas supply lines 14 and 14a and the halogen generator 10 are operated.
The inside is evacuated. (S288) After closing the exhaust valve 41, the valve 36 is opened for a predetermined time to open the halogen gas supply lines 14, 14a.
Also, the input side and output side joints of the halogen generator 10 are purged with helium. (S289) The valve 36 is closed.

(S290) It is judged whether or not the count number n has become a predetermined number N or more. When it is N or more, the helium purge has been completed, so the routine proceeds to S292. Otherwise S
Proceeding to 291, exhaust and helium purge are repeated a predetermined number of times. (S291) The count number n is advanced by 1, and the process returns to S286. (S292) The operator opens the replacement input valve 60 and the replacement output valve 65 and closes the valve 70. Valve 7
By closing 0, halogen gas is prevented from entering the buffer gas supply line. In this way, the halogen generator 10 can be easily attached and detached and can be safely replaced.

The flowcharts described so far show the processing flow of the excimer laser apparatus as a whole including the gas controller 6 and the temperature controller 15. Therefore, the gas controller 6 and the temperature controller 15 may be integrated controllers instead of being separated, and the operation and effect at this time are similar.

[0140]

Since the pressure of the buffer gas or the mixed gas of the buffer gas and the rare gas is made higher than the gas pressure in the laser chamber and the buffer gas or the mixed gas is introduced into the halogen generator, The halogen gas generated from the halogen storage material in the halogen generator can be injected into the laser chamber. As a result, the halogen gas having a predetermined partial pressure can be supplied into the laser chamber even during the laser operation. Further, as described above, the pure buffer gas or the mixed gas of the buffer gas and the rare gas is passed through the halogen generator, so that the halogen generator is not contaminated by the impurity gas and is stable for a long period of time. A halogen generator can be used.

Further, since the valve and the joint are provided on each of the input port side and the output port side of the halogen generator, the halogen generator can be easily attached and detached by itself, and the workability at the time of replacement of the halogen generator is improved. To do.

Since the valve and the joint are arranged on the input port side of the halogen generator and the valve and the joint are arranged on the laser chamber gas supply line side of the laser chamber, the laser chamber and the halogen generator are replaced at the same time. It has become possible. Therefore, the maintainability of the laser chamber and the halogen generator can be improved. In addition, since the pipe is shortened, it is safe and compact, and the response of halogen gas injection is improved, so that the controllability of the halogen gas partial pressure is improved.

Further, at the time of exchanging the laser gas, the inside of the laser chamber is evacuated, and then halogen gas having a predetermined partial pressure is injected until the gas pressure in the laser chamber reaches a predetermined value. Can be controlled.
Therefore, the laser characteristics that oscillate after the laser gas exchange can be improved.

Further, during the laser operation, it is possible to inject a predetermined amount of halogen gas of a predetermined partial pressure into the laser chamber based on the current partial pressure (concentration) of halogen gas in the laser chamber estimated by the monitor, Therefore, the halogen gas injection amount during laser operation can be controlled accurately and safely. As a result, desired laser characteristics can be easily obtained.

On the input port side of the halogen generator,
Since a check valve that allows gas to pass through only in the input direction is installed,
Halogen gas does not enter the buffer gas supply line or buffer gas cylinder. As a result, the halogen gas can be supplied safely and with high accuracy.

Further, since the halogen gas supply line is connected to the output port side of the halogen generator via the buffer tank, the current halogen gas partial pressure (concentration) in the laser chamber estimated by the monitor during the laser operation is set. Based on this, it is possible to inject a predetermined amount of halogen gas with a predetermined partial pressure into the laser chamber. Therefore, the halogen gas injection amount during laser operation can be controlled accurately and safely. As a result, desired laser characteristics can be easily obtained.

At the time of exchanging the laser gas, after the inside of the laser chamber is evacuated, the valve of the halogen gas supply line for injecting the halogen gas of a predetermined partial pressure into the laser chamber is opened for a predetermined time to accurately inject the halogen gas. You can control. Therefore, the laser characteristics that oscillate after the laser gas exchange can be improved.

Further, when the laser gas is replaced, the inside of the laser chamber is evacuated, and then halogen gas having a predetermined partial pressure is injected until the gas pressure in the laser chamber reaches a predetermined value. Can be controlled.
Therefore, the laser characteristics that oscillate after the laser gas exchange can be improved.

Abnormalities such as the temperature of the halogen generator, the temperature of the halogen filter, the halogen concentration of the exhaust gas, etc. are constantly monitored, and when there is an abnormality, the heater of the halogen generator is turned off to stop the halogen gas generation. The valves of the halogen gas supply line and the exhaust line are closed to stop the exhaust of the halogen gas. This makes it possible to construct a safe gas supply device.

Further, since both the injection and the exhaust of the halogen gas cannot be performed at the same time, the abnormal temperature rise of the halogen gas filter is eliminated and the safety can be improved.

Valves and joints are provided on both sides of the halogen generator, and the portion where air is collected at the portion connecting the halogen generator and the pipe can be easily exhausted and can be easily purged with an inert gas or the like. As a result, laser gas injection after replacement of the halogen generator is easy and highly accurate, and laser light with good characteristics can be oscillated.

[Brief description of the drawings]

FIG. 1 is a hardware configuration diagram of a first embodiment of the present invention.

FIG. 2 shows a first example of a flowchart of a main routine at the time of exchanging a laser gas according to the first embodiment.

FIG. 3 shows a second example of a flowchart of a main routine at the time of exchanging a laser gas according to the first embodiment.

FIG. 4 is a gas exhaust subroutine in the laser chamber according to the first embodiment.

FIG. 5 is a first example of a halogen gas injection subroutine of the first embodiment.

FIG. 6 is a second example of a halogen gas injection subroutine of the first embodiment.

FIG. 7 is an example of a rare gas injection subroutine of the first embodiment.

FIG. 8 shows an example of a buffer gas injection subroutine of the first embodiment.

FIG. 9 shows an example of a buffer gas initial injection subroutine of the first embodiment.

FIG. 10 is an example of a main routine of halogen gas injection during laser operation.

FIG. 11 is a first example of a subroutine for reading data from a monitor.

FIG. 12 is a diagram showing a relationship between a halogen gas partial pressure and a beam width.

FIG. 13 is a second example of a subroutine for reading data from a monitor.

FIG. 14 is a diagram showing a relationship between a halogen gas partial pressure and a beam spectrum width.

FIG. 15 is a third example of a subroutine for reading data from a monitor.

FIG. 16 is a first example of a subroutine for calculating a halogen gas injection amount or an injection rate.

FIG. 17 is a second example of a subroutine for calculating a halogen gas injection amount or injection rate.

FIG. 18 is a first example of a halogen gas injection subroutine during laser operation.

FIG. 19 is a second example of a halogen gas injection subroutine during laser operation.

FIG. 20 is a third example of a halogen gas injection subroutine during laser operation.

FIG. 21 is a subroutine example of safety processing of the gas supply device.

FIG. 22 is a subroutine example of abnormality detection and abnormality processing.

FIG. 23 is an example of a hardware configuration block diagram for abnormality detection and abnormality processing (when normal).

FIG. 24 is an example of a hardware configuration block diagram of abnormality detection and abnormality processing (at the time of abnormality).

FIG. 25 is an example of a block diagram of an interlock process of exhaust gas and halogen gas supply. (When exhausting)

FIG. 26 is an example of a block diagram of an interlock process of exhaust gas and halogen gas supply. When not exhausted)

FIG. 27 is a hardware configuration diagram of the second embodiment of the present invention.

FIG. 28 is a hardware configuration diagram of the third embodiment of the present invention.

FIG. 29 shows a first example of a flowchart of a main routine at the time of exchanging a laser gas according to the third embodiment.

FIG. 30 shows a second example of a flowchart of the main routine at the time of exchanging the laser gas in the third example.

FIG. 31 is an example of a subroutine for injecting a mixed gas of a buffer gas and a rare gas according to the third embodiment.

FIG. 32 shows an example of a mixed gas initial injection subroutine for a buffer gas and a rare gas according to the third embodiment.

FIG. 33 is a hardware configuration diagram of the fourth embodiment of the present invention.

FIG. 34 is an example of a halogen gas injection subroutine during laser operation in the fourth embodiment.

FIG. 35 is a hardware configuration diagram of a fifth embodiment of the present invention.

FIG. 36 is an example of a flowchart for replacing the laser chamber of the fifth embodiment.

FIG. 37 is a hardware configuration diagram of a sixth embodiment of the present invention.

FIG. 38 is an example of a flowchart for removing the halogen generator according to the sixth embodiment.

FIG. 39 is an example of a flowchart when mounting the halogen generator of the sixth embodiment.

FIG. 40 is an excimer laser device equipped with a halogen generator representing the prior art.

FIG. 41 is a diagram showing the relationship between the temperature of the halogen storage substance of the halogen generator and the halogen gas partial pressure.

[Explanation of symbols]

1 ... Laser chamber, 1a, 1b ... Laser window, 2 ... Front mirror, 3 ... Rear mirror, 4 ... Beam splitter,
5 ... Monitor, 6 ... Gas controller, 7 ... Laser chamber gas supply line, 8 ... Laser chamber valve, 9 ...
Pressure sensor, 10 ... Halogen generator, 10a, 10b ...
Valve, 11 ... Halogen storage material, 12 ... Temperature sensor,
13 ... Heater, 14 ... Halogen gas supply line, 14a
... Bypass line (halogen gas supply line), 15 ...
Temperature controller, 16 ... Halogen injection valve, 17
... Halogen injection valve, 18 ... Halogen injection valve, 19 ... Mass flow controller, 20 ... Buffer gas cylinder, 21 ... Gas input valve, 22 ... Valve, 2
3 ... Check valve, 24 ... Buffer gas supply line, 25 ... Mixed gas cylinder, 26 ... Buffer tank, 27 ... Mixed gas supply line, 28 ... Buffer tank output valve, 29
... buffer tank exhaust valve, 30 ... rare gas cylinder, 31 ... valve, 34 ... buffer injection valve, 35
... Helium gas cylinder, 36 ... Valve, 40 ... Exhaust line, 41 ... Exhaust valve, 42 ... Halogen filter, 4
3 ... Halogen sensor, 44 ... Vacuum pump, 51 ... Temperature sensor, 52 ... Temperature sensor, 53 ... Abnormal stop circuit power supply,
54 ... Relay, 55 ... Valve power supply, 56 ... Heater power supply, 60 ... Replacement input valve, 61 ... Laser chamber joint, 62 ... Input joint, 65 ... Replacement output valve, 6
7 ... Output joint, 80 ... Excimer laser, 81 ... Controller, 82 ... Gas management mechanism, 83 ... Circulation pump, 8
4, 85, 86 ... Pipe, 87 ... Cryogenic cleaner 87,
87a, 87b ... Valve, 88 ... Chemical gas cleaner, 8
8a, 88b ... Valve, 90 ... Palast volume, 9
1 ... Rare gas cylinder, 91a ... Valve, 92 ... Negative pressure pump, 92a ... Valve.

Claims (25)

[Claims] 1. A mixed gas of a buffer gas, a rare gas and a halogen gas is supplied as a laser gas into a laser chamber (1), the laser gas is excited to oscillate a laser beam, and the laser beam has a desired characteristic. The halogen storage substance (11) of the halogen generator (10) is controlled to a predetermined temperature to control the injection amount of the halogen gas generated at a predetermined partial pressure. In the excimer laser device that controls the gas partial pressure, either the buffer gas supply line (24) or the mixed gas supply line (27) of the buffer gas and the rare gas is provided on the input port side of the halogen generator (10). The gas supply of the excimer laser device is characterized in that the laser chamber (1) is connected to the output port side of the halogen generator (10) through the halogen gas supply line (14). apparatus. 2. A replacement input valve (60) and an input joint (62) are provided on the input port side of the halogen generator (10), and a replacement output valve (6) is provided on the output port side.
5. The gas supply device for an excimer laser device according to claim 1, wherein the halogen generator (10) is detachably mounted as a single unit by disposing 5) and the output joint (67). 3. A replacement input valve (60) and an input joint (62) are provided on the input port side of the halogen generator (10), and a halogen gas supply line (1) is provided on the output port side.
The laser chamber (1) is directly connected via the laser chamber (1) and the laser chamber valve (8) and the laser chamber joint (61) are provided on the laser chamber gas supply line (7) side of the laser chamber (1). The gas supply device for an excimer laser device according to claim 1, wherein the gas supply device is arranged so that the laser chamber (1) and the halogen generator (10) can be simultaneously replaced. 4. A pressure sensor (9) for detecting a gas pressure in the laser chamber (1), and a first vacuuming means for evacuating the laser chamber (1).
(44, 41) and a gas input provided on the input port side of the halogen generator (10) for opening and closing the buffer gas supply line (24) or the mixed gas supply line (27) of the buffer gas and rare gas. Valve (21) and a halogen gas supply line (14) are provided in the laser chamber of the buffer gas, or a mixed gas of the buffer gas and rare gas, and a halogen gas.
After the halogen injection valve (16) that opens and closes the injection into (1) and the first vacuum evacuation means (44, 41) are activated to change the laser gas, the inside of the laser chamber (1) is evacuated. In order to control the injection amount of halogen gas generated by the halogen generator (10) into the laser chamber (1) to a predetermined amount, gas input until the gas pressure signal input from the pressure sensor (9) reaches a predetermined value. The gas supply device for an excimer laser device according to claim 1, further comprising a gas controller (6) that outputs a command to open the valve (21) and the halogen injection valve (16). 5. A monitor (5) for detecting laser characteristics, and a buffer gas supply line (24) or a mixed gas supply of the buffer gas and rare gas, which is provided on the input port side of the halogen generator (10). A gas input valve (21) for opening and closing the line (27), provided in the halogen gas supply line (14), the buffer gas, or a mixed gas of the buffer gas and rare gas, and a mixed gas of a halogen gas. Laser chamber
The halogen injection valve (16) that opens and closes the injection into (1) and the current halogen gas partial pressure in the laser chamber (1) is estimated based on the detection data of the monitor (5) during laser operation. , Laser chamber of halogen gas generated in halogen generator (10) based on this halogen gas partial pressure (1)
A gas controller (6) for outputting a command to open the gas input valve (21) and the halogen injection valve (16) for a predetermined time in order to control the injection amount to the predetermined amount. The gas supply device of the excimer laser device according to claim 1. 6. A monitor (5) for detecting a laser characteristic, the halogen gas supply line (14), the buffer gas, or a mixed gas of the buffer gas and a rare gas, and the halogen generator (10). ), A mass flow controller (19) that controls the flow rate of the mixed gas with the halogen gas to the laser chamber (1), and the laser chamber (1) based on the detection data of the monitor (5) during laser operation. In order to estimate the current partial pressure of halogen gas in the chamber and to control the amount of halogen gas injected into the laser chamber (1) to a predetermined amount based on this partial pressure of halogen gas, the halogen gas is supplied to the mass flow controller (19). The gas supply device for an excimer laser device according to claim 1, further comprising a gas controller (6) that outputs a command for controlling a flow rate of a mixed gas of gases. 7. A monitor (5) for detecting laser characteristics, and a buffer gas supply line (24) provided on the input port side of the halogen generator (10) or for supplying a mixed gas of the buffer gas and a rare gas. A gas input valve (21) for opening and closing the line (27), provided in the halogen gas supply line (14), a mixed gas of the buffer gas and the halogen gas, or a mixed gas of the buffer gas and a rare gas and a halogen. The halogen injection valve (16) that opens and closes the injection of the gas mixture with the gas into the laser chamber (1), and the current inside the laser chamber (1) based on the detection data of the monitor (5) during laser operation. A laser chamber for the halogen gas generated in the halogen generator (10) based on this halogen gas partial pressure while estimating the halogen gas partial pressure
In order to control the amount injected into (1) to a predetermined amount, the temperature of the halogen generator (10) is controlled to a predetermined temperature with the gas input valve (21) and the halogen injection valve (16) open. The gas supply device for an excimer laser device according to claim 1, further comprising a gas controller (6) for outputting a command. 8. The check valve (23) which allows gas to permeate only in the input direction is provided on the input port side of the halogen generator (10), according to claim 1, 2 or 3. A gas supply device for the excimer laser device described. 9. A buffer tank for storing a mixed gas of the buffer gas and the halogen gas or a mixed gas of the buffer gas and the rare gas and the halogen gas at the output port side of the halogen generator (10). The gas supply device for an excimer laser device according to claim 1, 2, 3 or 8, wherein a halogen gas supply line (14) is connected through (26). 10. A monitor (5) for detecting laser characteristics, a second evacuation means (44, 29) for evacuating the buffer tank (26), and a temperature control of the halogen generator (10). A halogen injection valve (16) for opening and closing the supply of the generated halogen gas to the buffer tank (26), and supplying the buffer gas or the mixed gas of the buffer gas and the rare gas to the buffer tank (26). A buffer injection valve (34) that opens and closes, a buffer tank output valve (28) that opens and closes the supply of the mixed gas of the halogen gas in the buffer tank (26) to the laser chamber (1), and during laser operation, After activating the second vacuuming means (44, 29) to evacuate the buffer tank (26), the present halogen gas partial pressure is estimated based on the detection data of the monitor (5), and the halogen generator is generated. It is generated by controlling (10) to a specified temperature. After the halogen injection valve (16) is opened / closed for a predetermined time to fill the buffer tank (26) with a predetermined amount based on the partial pressure of the halogen gas, the buffer injection valve (34) is opened / closed. The tank (26) is filled with a buffer gas or a mixed gas of a buffer gas and a rare gas, and the buffer tank output valve (28) is opened and closed for a predetermined time to fill the mixed gas in the buffer tank (26) with the laser chamber ( The gas supply device for an excimer laser device according to claim 9, further comprising a gas controller (6) that outputs a command to inject into 1). 11. A mixed gas of a buffer gas, a rare gas and a halogen gas is supplied as a laser gas into a laser chamber (1), the laser gas is excited to oscillate a laser beam, and the laser beam has a desired characteristic. The halogen gas generated by controlling the halogen storage substance (11) of the halogen generator (10) to a predetermined temperature so as to have a predetermined partial pressure is supplied to the laser chamber through the halogen gas supply line (14).
In the excimer laser device for injecting into the inside of the laser chamber (1) and controlling the partial pressure of the halogen gas inside the laser chamber (1), the first vacuuming means for vacuumizing the inside of the laser chamber (1)
(44, 41), a halogen injection valve (16) provided in the halogen gas supply line (14) for opening and closing the injection of the halogen gas into the laser chamber (1), and the first vacuum evacuation when the laser gas is replaced. Laser chamber of halogen gas generated by halogen generator (10) after activating means (44, 41) to evacuate laser chamber (1)
In order to control the injection amount into (1) to a predetermined amount, a gas controller (6) that outputs a command to open the halogen injection valve (16) for a predetermined time is used for the gas of the excimer laser device. Supply device. 12. A mixed gas of a buffer gas, a rare gas and a halogen gas is supplied as a laser gas into a laser chamber (1), the laser gas is excited to oscillate a laser beam, and the laser beam has a desired characteristic. The halogen gas generated by controlling the halogen storage substance (11) of the halogen generator (10) to a predetermined temperature so as to have a predetermined partial pressure is supplied to the laser chamber through the halogen gas supply line (14).
A pressure sensor that detects the gas pressure in the laser chamber (1) in an excimer laser device that controls the halogen gas partial pressure in the laser chamber (1) by injecting it into the laser chamber (1).
(9) and first evacuation means for evacuating the laser chamber (1)
(44, 41), a halogen injection valve (16) provided in the halogen gas supply line (14) for opening and closing the injection of the halogen gas into the laser chamber (1), and the first vacuum evacuation when the laser gas is replaced. Laser chamber of halogen gas generated by halogen generator (10) after activating means (44, 41) to evacuate laser chamber (1)
In order to control the amount injected into (1) to a specified amount, a pressure sensor
A gas supply device for an excimer laser device, comprising: a gas controller (6) that outputs a command to open a halogen injection valve (16) until a gas pressure signal input from (9) reaches a predetermined value. 13. A mixed gas of a buffer gas, a rare gas and a halogen gas is supplied as a laser gas into a laser chamber (1), the laser gas is excited to oscillate a laser beam, and the laser beam has a desired characteristic. The halogen storage substance (11) of the halogen generator (10) is controlled to a predetermined temperature to control the injection amount of the halogen gas generated at a predetermined partial pressure. In the excimer laser device that controls the gas partial pressure, a halogen filter (42) that removes the halogen gas in the exhaust line (40) that exhausts the laser gas in the laser chamber (1).
Temperature sensor (45,52) for detecting the temperature of the first and second temperature sensor for detecting the temperature of the halogen generator (10)
(12, 51), a halogen sensor (43) for detecting the halogen gas concentration of the exhaust gas of the exhaust line (40), a first temperature sensor (45, 52), the second temperature sensor (12, 51)
51) and / or the halogen sensor (43), the gas controller (6) and / or the abnormality determining means (54) that output an abnormality detection signal when the detection signal of at least one of them exceeds a predetermined value and becomes abnormal. ), And the heater cutoff means (54a3, 54a4) for turning off the power source of the heater (13) of the halogen generator (10) by the abnormality detection signal.
And the halogen gas supply line (1
4) Each halogen injection valve (16, 17, 18) and exhaust line
Valve shutoff means to close each exhaust valve (41, 29) of (40)
(54a1, 54a2) are provided, The gas supply apparatus of the excimer laser apparatus characterized by the above-mentioned. 14. An excimer laser device for supplying a mixed gas of a buffer gas, a rare gas and a halogen gas as a laser gas into a laser chamber (1) and exciting the laser gas to oscillate a laser beam, the laser chamber (1) Halogen filter (42) that removes halogen gas in the exhaust line (40) that exhausts the laser gas inside
Temperature sensor (45,52) for detecting the temperature of the exhaust gas, a halogen sensor (43) for detecting the halogen gas concentration of the exhaust gas in the exhaust line (40), and a first temperature sensor (45,52) If at least one of the halogen sensor (43) and the detection signal exceeds a predetermined value and becomes abnormal, a gas controller (6) and / or abnormality determination means (54) that outputs an abnormality detection signal , The halogen gas supply line (1
4) Each halogen injection valve (16, 17, 18) and exhaust line
Valve shutoff means to close each exhaust valve (41, 29) of (40)
(54a1, 54a2) are provided, The gas supply apparatus of the excimer laser apparatus characterized by the above-mentioned. 15. An excimer laser device for supplying a mixed gas of a buffer gas, a rare gas, and a halogen gas as a laser gas into a laser chamber (1) and exciting the laser gas to oscillate laser light. A gas supply device for an excimer laser device, comprising a supply / exhaust interlocking means (64) for preventing the laser gas from being exhausted at the same time. 16. A mixed gas of a buffer gas, a rare gas and a halogen gas is supplied as a laser gas into the laser chamber (1), the laser gas is excited to oscillate a laser beam, and the laser beam has a desired characteristic. The halogen storage substance (11) of the halogen generator (10) is controlled to a predetermined temperature to control the injection amount of the halogen gas generated at a predetermined partial pressure. In the excimer laser device that controls the gas partial pressure, the replacement input valve (60) and the input joint (62) arranged on the input port side of the halogen generator (10) and the output of the halogen generator (10). A replacement output valve (65) and an output joint (67) arranged on the port side, and at least a halogen gas that supplies halogen gas into the laser chamber (1) via the replacement output valve (65). Supply line (14) Halogen generator (10), the replacement input valve
First vacuuming means (44, 41) for vacuuming the pipe between the (60) and the replacement output valve (65), the vacuumed halogen gas supply line (14), and the halogen generator (10). ), And a purging means (35, 36) for purging the pipe between the replacement input valve (60) and the replacement output valve (65) with at least an inert gas. Gas supply device. 17. A mixed gas of a buffer gas, a rare gas and a halogen gas is supplied as a laser gas into the laser chamber (1), the laser gas is excited to oscillate a laser beam, and the laser beam has a desired characteristic. The halogen gas content in the laser chamber (1) is controlled by controlling the halogen storage material (11) of the halogen generator (10) to a predetermined temperature and controlling the injection amount of the halogen gas generated at a predetermined partial pressure. In the laser gas exchange method of the gas supply device of the excimer laser device for controlling the pressure, when the laser gas is exchanged, the inside of the laser chamber (1) is evacuated, and then the halogen gas supply line (14) on the output port side of the halogen generator (10) is used. ) Is opened by opening the halogen injection valve (16) for a certain period of time.
(1) A method for exchanging a laser gas in a gas supply device of an excimer laser device, which comprises injecting a predetermined amount into the inside. 18. A mixed gas of a buffer gas, a rare gas and a halogen gas is supplied as a laser gas into the laser chamber (1), the laser gas is excited to oscillate a laser beam, and the laser beam has a desired characteristic. The halogen gas content in the laser chamber (1) is controlled by controlling the halogen storage material (11) of the halogen generator (10) to a predetermined temperature and controlling the injection amount of the halogen gas generated at a predetermined partial pressure. In the laser gas exchange method of the gas supply device of the excimer laser device that controls the pressure, at the time of laser gas exchange, after the inside of the laser chamber (1) is evacuated, halogen is generated until the gas pressure in the laser chamber (1) reaches a predetermined value. Open a halogen injection valve (16) in the halogen gas supply line (14) on the output port side of the vessel (10) to inject a predetermined amount of halogen gas into the laser chamber (1). Laser gas replacement method of a gas supply apparatus of the excimer laser device, characterized by. 19. A mixed gas of a buffer gas, a rare gas and a halogen gas is supplied as a laser gas into a laser chamber (1), the laser gas is excited to oscillate a laser beam, and the laser beam has a desired characteristic. The halogen gas content in the laser chamber (1) is controlled by controlling the halogen storage material (11) of the halogen generator (10) to a predetermined temperature and controlling the injection amount of the halogen gas generated at a predetermined partial pressure. In the laser gas exchange method of the gas supply device of the excimer laser device for controlling the pressure, at the time of the laser gas exchange, after the inside of the laser chamber (1) is evacuated, the gas pressure in the laser chamber (1) is kept at a predetermined value Gas input valve (21) on the input port side of the generator (10) and halogen gas supply line (1
A laser gas exchange method for a gas supply device of an excimer laser device, characterized in that a predetermined amount of halogen gas is injected into the laser chamber (1) by opening the halogen injection valve (16) of 4). 20. A mixed gas of a buffer gas, a rare gas and a halogen gas is supplied as a laser gas into the laser chamber (1), the laser gas is excited to oscillate a laser beam, and the laser beam has a desired characteristic. The halogen gas content in the laser chamber (1) is controlled by controlling the halogen storage material (11) of the halogen generator (10) to a predetermined temperature and controlling the injection amount of the halogen gas generated at a predetermined partial pressure. In the laser gas injection method of the gas supply device of the excimer laser device that controls the pressure, the current halogen gas partial pressure is estimated based on the detected laser characteristics during laser operation, and halogen generation is performed based on this halogen gas partial pressure. Open the gas input valve (21) on the input port side of the container (10) and the halogen injection valve (16) on the halogen gas supply line (14) on the output port side for a predetermined time. A laser gas injection method for a gas supply device of an excimer laser device, wherein the injection amount of halogen gas into the laser chamber (1) is controlled by opening. 21. A mixed gas of a buffer gas, a rare gas, and a halogen gas is supplied as a laser gas into the laser chamber (1), the laser gas is excited to oscillate a laser beam, and the laser beam has a desired characteristic. The halogen gas content in the laser chamber (1) is controlled by controlling the halogen storage material (11) of the halogen generator (10) to a predetermined temperature and controlling the injection amount of the halogen gas generated at a predetermined partial pressure. In the laser gas injection method of the gas supply device of the excimer laser device that controls the pressure, the current halogen gas partial pressure is estimated based on the detected laser characteristics during laser operation, and halogen generation is performed based on this halogen gas partial pressure. The amount of halogen gas injected into the laser chamber (1) is controlled by controlling the flow rate with the mass flow controller (19) on the output port side of the vessel (10). Laser gas injection method for a gas supply device for an excimer laser device and controls. 22. A mixed gas of a buffer gas, a rare gas, and a halogen gas is supplied as a laser gas into the laser chamber (1), the laser gas is excited to oscillate a laser beam, and the laser beam has a desired characteristic. The halogen gas content in the laser chamber (1) is controlled by controlling the halogen storage material (11) of the halogen generator (10) to a predetermined temperature and controlling the injection amount of the halogen gas generated at a predetermined partial pressure. In the laser gas injection method of the gas supply device of the excimer laser device that controls the pressure, the current halogen gas partial pressure is estimated based on the detected laser characteristics during the laser operation, and the halogen generator (1
(0) with the gas input valve (21) on the input port side and the halogen injection valve (16) on the output port side open, based on the halogen gas partial pressure estimated above.
A laser gas injection method for a gas supply device of an excimer laser device, characterized in that the amount of halogen gas injected into the laser chamber (1) is controlled by controlling the temperature of (0). 23. A mixed gas of a buffer gas, a rare gas and a halogen gas is supplied as a laser gas into the laser chamber (1), the laser gas is excited to oscillate a laser beam, and the laser beam has a desired characteristic. The halogen gas content in the laser chamber (1) is controlled by controlling the halogen storage material (11) of the halogen generator (10) to a predetermined temperature and controlling the injection amount of the halogen gas generated at a predetermined partial pressure. In the laser gas injection method of the gas supply device of the excimer laser device for controlling the pressure, in the laser operation, after the buffer tank (26) is evacuated,
The current halogen gas partial pressure is estimated based on the detected laser characteristics, and the halogen gas generated in the halogen generator (10) is filled in the buffer tank (26) by a predetermined amount based on the estimated halogen gas partial pressure. The buffer tank (26) is filled with a predetermined amount of buffer gas or a mixed gas of buffer gas and rare gas, and the buffer tank (26)
A method for injecting a laser gas in a gas supply device of an excimer laser device, comprising injecting a mixed gas filled in the laser chamber (1). 24. A mixed gas of a buffer gas, a rare gas, and a halogen gas is supplied as a laser gas into the laser chamber (1), the laser gas is excited to oscillate a laser beam, and the laser beam has a desired characteristic. The halogen gas content in the laser chamber (1) is controlled by controlling the halogen storage material (11) of the halogen generator (10) to a predetermined temperature and controlling the injection amount of the halogen gas generated at a predetermined partial pressure. In the method of abnormally treating the gas supply device of the excimer laser device for controlling the pressure, the temperature of the halogen generator (10), the temperature of the halogen filter (42) for removing the halogen gas in the exhaust line (40), and the exhaust line ( If at least one of the three with the halogen gas concentration of the exhaust gas in 40) is abnormal, a halogen generator
A method of abnormally treating a gas supply device of an excimer laser device, characterized in that the halogen gas supply line (14) and the exhaust line (40) are cut off while the heater (13) of (10) is turned off. 25. A mixed gas of a buffer gas, a rare gas, and a halogen gas is supplied as a laser gas into the laser chamber (1), the laser gas is excited to oscillate a laser beam, and the laser beam has a desired characteristic. The halogen gas content in the laser chamber (1) is controlled by controlling the halogen storage material (11) of the halogen generator (10) to a predetermined temperature and controlling the injection amount of the halogen gas generated at a predetermined partial pressure. In the abnormal treatment method of the gas supply device of the excimer laser device that controls the pressure, the temperature of the halogen filter (42) for removing the halogen gas in the exhaust line (40) and the halogen gas concentration of the exhaust gas in the exhaust line (40) When at least one of the two is abnormal, the halogen gas supply line (14) and the exhaust line (4
0) is cut off, a method of abnormally treating a gas supply device of an excimer laser device.