JPH0881725A - Aluminum foil for cathode of electrolytic capacitor - Google Patents
Aluminum foil for cathode of electrolytic capacitorInfo
- Publication number
- JPH0881725A JPH0881725A JP24324994A JP24324994A JPH0881725A JP H0881725 A JPH0881725 A JP H0881725A JP 24324994 A JP24324994 A JP 24324994A JP 24324994 A JP24324994 A JP 24324994A JP H0881725 A JPH0881725 A JP H0881725A
- Authority
- JP
- Japan
- Prior art keywords
- foil
- aluminum foil
- etching
- cathode
- electrolytic capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、電解コンデンサ陰極用
アルミニウム箔、詳しくは、交流電解エッチングが行わ
れる純アルミニウム系の電解コンデンサ陰極用アルミニ
ウム箔の改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an aluminum foil for a cathode of an electrolytic capacitor, and more particularly to an improvement of an aluminum foil for a cathode of an electrolytic capacitor of a pure aluminum type which is subjected to AC electrolytic etching.
【0002】[0002]
【従来の技術】電解コンデンサの静電容量は電極の表面
積に比例するから、電解コンデンサ用アルミニウム箔に
は、表面積を拡大するために、一般にエッチング処理が
施される。陰極用アルミニウム箔においては、エッチン
グ方法は材料系により異なり、純アルミニウム系箔の場
合には塩酸溶液中で交流による定電流電解エッチングが
行われ、銅やマンガンを添加した合金系箔の場合には自
己腐食作用による化学エッチングが行われる。2. Description of the Related Art Since the capacitance of an electrolytic capacitor is proportional to the surface area of an electrode, the aluminum foil for electrolytic capacitors is generally subjected to an etching treatment in order to increase the surface area. In the cathode aluminum foil, the etching method differs depending on the material system, in the case of a pure aluminum foil, constant current electrolytic etching by alternating current is performed in a hydrochloric acid solution, and in the case of an alloy foil added with copper or manganese. Chemical etching is performed by self-corrosion.
【0003】このうち電解エッチングが行われる純アル
ミニウム系の陰極用箔は、陽極用箔と異なり、耐電圧皮
膜を付けるための化成処理が不必要なため、普通純度の
アルミニウム箔が陰極用箔として使用されているが、表
面積の増大につながらない化学溶解(腐食)の小さい材
料のほうが高い静電容量を得る上で好ましいことから、
微量不純物の調整によりエッチング特性を改善する成分
面での工夫や、鋳塊の溶体化処理や熱間圧延での析出を
出来るだけ少なくして不純物をマトリックス中に固溶さ
せるなどの製造上の工夫が行われている。[0003] Of these, the pure aluminum-based cathode foil, which is subjected to electrolytic etching, is different from the anode foil in that it requires no chemical conversion treatment for forming a withstand voltage film, so that a normal-purity aluminum foil is used as the cathode foil. Although used, a material with a small chemical dissolution (corrosion) that does not lead to an increase in surface area is preferable for obtaining a high capacitance,
Ingenuity in terms of composition to improve etching characteristics by adjusting trace impurities, manufacturing ingenuity such that impurities are solid-solved in matrix by minimizing precipitation in solution treatment or hot rolling of ingot Is being done.
【0004】しかしながら、陰極用純アルミニウム系箔
に対する交流電解エッチングは塩酸溶液中で行われるた
め、電気化学的な溶解以外に化学的な溶解も避けられ
ず、実際の溶解量は理論量より多いのが常である。これ
は、電解でつくられたエッチピットの壁が化学的に溶解
されるためで、この化学的溶解作用が溶解量の増大を招
き、表面積の拡大効果を阻害している。However, since the AC electrolytic etching of the pure aluminum foil for the cathode is performed in a hydrochloric acid solution, chemical dissolution is inevitable in addition to electrochemical dissolution, and the actual dissolution amount is larger than the theoretical amount. Always. This is because the walls of the etch pits formed by electrolysis are chemically dissolved, and this chemical dissolution action leads to an increase in the amount of dissolution, hindering the effect of increasing the surface area.
【0005】一方、陽極材料として用いられる電解コン
デンサ用アルミニウム箔として、アルミニウム純度99.9
%以上で、Ti、V、Zrのうちの1種以上を微量範囲
で含有させるとともに、これらの元素の箔表層部におけ
る合計濃度を箔内部における濃度より高めることによっ
て、エッチピットの溶解を抑制してエッチピットを深く
トンネル状に進行させ、大きな拡面率が得られるように
した電解コンデンサ用アルミニウム箔が提案されてい
る。(特開平4-62822 号公報) On the other hand, as an aluminum foil for an electrolytic capacitor used as an anode material, aluminum purity 99.9
% Or more, at least one of Ti, V, and Zr is contained in a trace amount range, and the total concentration of these elements in the foil surface layer portion is made higher than the concentration inside the foil to suppress dissolution of etch pits. Aluminum foil for electrolytic capacitors has been proposed in which the etch pits are deeply tunneled to obtain a large surface expansion ratio. (JP-A-4-62822)
【0006】発明者は、上記の提案に着目し、これを基
礎として、静電容量が高く且つ強度、とくに電解箔に要
求される折り曲げ強度にも優れた陰極用純アルミニウム
系箔を得るために、交流電解におけるエッチピットの生
成、進行、エッチピット壁の溶解および強度特性と、微
量元素、微量含有不純物、箔の厚さ方向におけるこれら
元素の濃度分布などとの関係について多角的に検討を重
ねた結果、アルミニウム中の特定元素の含有量および濃
度分布を調整することにより、優れたエッチング特性と
強度を付与できることを発見し、本発明に至ったもので
ある。[0006] The inventor focused on the above proposal, and based on this, in order to obtain a pure aluminum-based foil for a cathode having a high electrostatic capacity and strength, particularly excellent bending strength required for an electrolytic foil. , Multi-faceted study on the relationship between the generation and progress of etch pits in AC electrolysis, the dissolution and strength characteristics of etch pit walls, trace elements, trace impurities, and concentration distribution of these elements in the thickness direction of the foil As a result, they have found that excellent etching characteristics and strength can be imparted by adjusting the content and concentration distribution of a specific element in aluminum, and have reached the present invention.
【0007】[0007]
【発明が解決しようとする課題】本発明は、上記の検
討、発見に基づいてなされたものであり、その目的は、
交流電解エッチングにおける化学溶解性が抑制され、増
大した密度のエッチングピットの形成により静電容量を
高め、電解箔として必要な強度、とくに折り曲げ強度も
良好な電解コンデンサ陰極用アルミニウム箔を提供する
ことにある。The present invention has been made based on the above studies and discoveries, and its purpose is to:
To provide an aluminum foil for an electrolytic capacitor cathode, in which chemical solubility in AC electrolytic etching is suppressed, electrostatic capacity is increased by forming etching pits with increased density, and strength required as an electrolytic foil, particularly bending strength is also good. is there.
【0008】[0008]
【課題を解決するための手段】上記の目的を達成するた
めの本発明による電解コンデンサ陰極用アルミニウム箔
は、Ti、V、ZrおよびNiを各々20ppm 以下、合計
で0.4ppm以上含み、Fe0.03〜0.15%、Si0.02〜0.15
%を含有し、残部Alと不可避的不純物からなるアルミ
ニウム箔であり、該アルミニウム箔の表面から厚さ方向
に0.2 μm 内部までの表層部に、前記Ti、V、Zrお
よびNiが合計で0.6 〜8000ppm の濃度で存在している
ことを構成上の特徴とする。An aluminum foil for an electrolytic capacitor cathode according to the present invention for achieving the above object contains Ti, V, Zr and Ni in an amount of 20 ppm or less, respectively, and a total of 0.4 ppm or more. ~ 0.15%, Si 0.02-0.15
%, With the balance Al and unavoidable impurities, and the surface layer portion from the surface of the aluminum foil to 0.2 μm inside in the thickness direction contains Ti, V, Zr, and Ni in a total amount of 0.6 to The structural feature is that it exists at a concentration of 8000 ppm.
【0009】本発明における微量含有成分の意義および
限定理由について説明すると、Ti、V、ZrおよびN
iは、交流電解エッチング時のエッチング皮膜の欠陥部
の発生量に関係するものであり、極微量で化学溶解性に
影響を及ぼすものであるから特に厳密に規制することが
必要である。Explaining the significance and the reason for limitation of the trace amounts of components in the present invention, Ti, V, Zr and N are described.
i is related to the generation amount of the defective portion of the etching film at the time of AC electrolytic etching, and since it is an extremely small amount that affects the chemical solubility, it is necessary to strictly control it.
【0010】Ti、V、ZrおよびNiの含有量は各々
20ppm 以下であり、合計0.4ppm以上含有するのが好まし
い。各々の含有量が20ppm を越えると、エッチング皮膜
の欠陥が多くなり過ぎ、エッチピット壁の溶解が急増し
て表面積の減少を招く。さらに好ましくは0.1 〜20ppm
の範囲であり、0.1ppm未満ではエッチング皮膜の欠陥が
少なく、エッチングの進行が不十分となり易く、表面積
の拡大効果が得られない場合が多い。合計量が0.4ppm未
満では、エッチング皮膜の欠陥部の発生量が少な過ぎ、
エッチングの不進行が生じる。The contents of Ti, V, Zr and Ni are respectively
The content is 20 ppm or less, preferably 0.4 ppm or more in total. When each content exceeds 20 ppm, the number of defects in the etching film becomes too large, the dissolution of the etch pit wall increases rapidly, and the surface area decreases. More preferably 0.1 to 20 ppm
If the amount is less than 0.1 ppm, the number of defects in the etching film is small, the progress of etching is likely to be insufficient, and the effect of increasing the surface area is often not obtained. If the total amount is less than 0.4 ppm, the amount of defects in the etching film is too small,
Etching failure occurs.
【0011】FeおよびSiは、Al−Fe系およびA
l−Fe−Si系の化合物を析出してアルミニウム箔の
強度、とくに折り曲げ強度を向上させる。Fe含有量の
好ましい範囲は0.03〜0.15%であり、0.03%未満ではそ
の効果が小さく、0.15%を越えて含有すると、エッチン
グ時に化学溶解性が増大し、表面積の拡大に有効な微細
なエッチピットの壁を溶解するため、静電容量の低下を
招き易い。Feのさらに好ましい含有範囲は0.03〜0.08
%である。Fe and Si are Al-Fe type and A type.
The l-Fe-Si-based compound is deposited to improve the strength of the aluminum foil, especially the bending strength. The preferable range of the Fe content is 0.03 to 0.15%, and if it is less than 0.03%, its effect is small. Since the wall of is melted, the capacitance is likely to decrease. The more preferable content range of Fe is 0.03 to 0.08.
%.
【0012】Si含有量の好ましい範囲は0.02〜0.15%
であり、0.02%未満ではその効果が小さく、0.15%を越
えて含有すると、交流電解エッチング時に化学溶解性が
増大し、生成されたエッチピットの壁を溶解するため、
表面積が減少し、静電容量の低下を生じ易い。Siのさ
らに好ましい含有範囲は0.02〜0.08%である。通常、F
e、Siともに0.04〜0.06%程度含有する。The preferred range of Si content is 0.02 to 0.15%
If less than 0.02%, its effect is small, and if it exceeds 0.15%, the chemical solubility increases during AC electrolytic etching, and the walls of the generated etch pits are dissolved.
The surface area is reduced, and the capacitance is likely to decrease. A more preferable content range of Si is 0.02 to 0.08%. Usually F
Both e and Si contain about 0.04 to 0.06%.
【0013】アルミニウム純度は99.7%以上が好まし
く、99.7%以下の純度では、FeおよびSiの含有量が
それぞれ0.15%を越え易く、塩酸に対する化学溶解性が
増大する。高純度、例えば99.9%以上になると、一次精
錬アルミニウム地金では製造困難で、偏析純化法や三層
電解法などによる精製が必要となるから、アルミニウム
純度としては99.7以上99.9未満のものを使用するのが好
ましい。The aluminum purity is preferably 99.7% or more, and when the purity is 99.7% or less, the contents of Fe and Si easily exceed 0.15%, and the chemical solubility in hydrochloric acid increases. If the purity is high, for example, 99.9% or more, it is difficult to manufacture with primary refined aluminum ingot, and it is necessary to purify by the segregation purification method or the three-layer electrolysis method.Therefore, use aluminum with a purity of 99.7 or more and less than 99.9. Is preferred.
【0014】アルミニウム箔の表層部にTi、V、Zr
およびNiが存在すると、塩酸による交流電解エッチン
グにおいて、箔表面の酸化皮膜に欠陥部が生じ、エッチ
ングの開始点が形成し易い。エッチングの開始点が形成
され且つエッチングが箔内部まで均一に進行するために
は、箔表面から厚さ方向に0.2 μm 内部までの表層部に
Ti、V、ZrおよびNiが合計で0.6 〜8000ppm の濃
度( 表層部における平均含有量) で存在していることが
好ましい。0.6ppm未満ではエッチングの開始点の形成が
少な過ぎるため十分な拡面効果が得られず、8000ppm を
越えて存在すると、エッチングの開始点形成が多くなり
過ぎ、全面溶解が生じ易くなる。箔表面から厚さ方向に
0.2 μm 内部までの表層部におけるTi、V、Zrおよ
びNiの平均合計量のさらに好ましい範囲は400 〜2000
ppm である。Ti, V, Zr is formed on the surface layer of the aluminum foil.
If Ni and Ni are present, a defective portion is generated in the oxide film on the foil surface in the AC electrolytic etching with hydrochloric acid, and the starting point of etching is easily formed. In order for the starting point of etching to be formed and for the etching to proceed evenly to the inside of the foil, Ti, V, Zr and Ni of 0.6 to 8000 ppm in total must be present in the surface layer portion from the foil surface to the inside of 0.2 μm in the thickness direction. It is preferably present at a concentration (average content in the surface layer portion). If it is less than 0.6 ppm, the formation of etching starting points is too small to obtain a sufficient surface expansion effect, and if it exceeds 8000 ppm, too many etching starting points are formed and the entire surface is likely to dissolve. From the foil surface in the thickness direction
A more preferable range of the average total amount of Ti, V, Zr and Ni in the surface layer portion up to 0.2 μm is 400 to 2000.
ppm.
【0015】アルミニウム箔の表層部以外の内部におけ
るTiV、ZrおよびNiの存在量は、好ましくは表層
部の存在量の数分の1〜十数分の1、例えば、存在量の
平均値で1/2〜1/80の範囲である。表層部にT
i、V、ZrおよびNiを偏在させる方法としては、こ
れらの成分を所定量、すなわち、Ti、V、Zrおよび
Niを各々20ppm 、合計で0.4ppm以上含有させたアルミ
ニウム素材を鋳造し、これをアルミニウム箔にする過程
において、熱間圧延時の加熱、中間焼鈍などの熱処理な
どにおいて、これらの成分を表層部に濃縮させる方法、
イオンスパッタリングや蒸着などの方法で表層部に付与
する方法などがある。なお、本発明においては、Cu、
Mn、Mg、Cr、Zn、Gaがそれぞれ0.02%以下の
範囲で含まれていても本発明の効果に影響を及ぼすこと
はない。The amount of TiV, Zr and Ni present inside the aluminum foil other than the surface layer is preferably a fraction to one tenth of the amount present in the surface layer, for example, 1 as an average value of the amount present. The range is / 2 to 1/80. T on the surface
As a method for unevenly distributing i, V, Zr, and Ni, an aluminum material containing predetermined amounts of these components, that is, 20 ppm each of Ti, V, Zr, and Ni, 0.4 ppm or more in total, is cast, and this is In the process of forming an aluminum foil, heating during hot rolling, heat treatment such as intermediate annealing, a method of concentrating these components in the surface layer portion,
There is a method of applying to the surface layer portion by a method such as ion sputtering or vapor deposition. In the present invention, Cu,
Even if each of Mn, Mg, Cr, Zn, and Ga is contained in the range of 0.02% or less, the effect of the present invention is not affected.
【0016】[0016]
【作用】本発明においては、Ti、V、Zr、Ni、さ
らにFe、Siを特定量含有させ、Ti、V、Zrおよ
びNiを表面から厚さ方向に0.2 μm 内部までの表層部
に特定量存在させることにより、交流電解エッチング時
の化学溶解が抑制されてエッチング性が高まり、且つ折
り曲げ強度にも優れた陰極用アルミニウム箔が得られ
る。In the present invention, Ti, V, Zr, Ni, and Fe, Si are contained in specific amounts, and Ti, V, Zr, and Ni are contained in specific amounts in the surface layer portion from the surface to 0.2 μm in the thickness direction When present, an aluminum foil for a cathode can be obtained in which chemical dissolution during AC electrolytic etching is suppressed, the etching property is improved, and the bending strength is excellent.
【0017】[0017]
【実施例】以下、本発明の実施例を比較例と対比して説
明する。 実施例1 表1に示す組成を有するアルミニウム鋳塊を製造し、均
質化処理した後、常法により熱間圧延、冷間圧延を施し
て、厚さ0.05mmのアルミニウム箔とした。ついで、アル
ミニウム箔の表層部にイオンスパッタリングによりT
i、V、ZrおよびNiを付与した。表層部におけるこ
れらの元素の合計量を表1に示す。なお、表1におい
て、試験材No.8は従来の陰極用純アルミニウム箔であ
る。EXAMPLES Examples of the present invention will be described below in comparison with comparative examples. Example 1 An aluminum ingot having a composition shown in Table 1 was produced, homogenized, and then hot-rolled and cold-rolled by a conventional method to give an aluminum foil having a thickness of 0.05 mm. Then, the surface layer of the aluminum foil is subjected to T by ion sputtering.
i, V, Zr and Ni were applied. Table 1 shows the total amounts of these elements in the surface layer portion. In Table 1, test material No. 8 is a conventional pure aluminum foil for cathode.
【0018】[0018]
【表1】 [Table 1]
【0019】得られたアルミニウム箔について、下記の
方法に従って、折り曲げ強度および静電容量を評価し
た。 折り曲げ試験:JIS P 8115のMIT 形自動折り曲げ試験器
を使用し、幅10±0.3mm、長さ100mm の試験片を作製し
て試験器にセットし、折り曲げ半径0.5 ±0.05mm、荷重
2.5 ±0.05N 、折り曲げ角度90±2 度、折り曲げ繰り返
し速度6 回/sの条件で折り曲げ試験を行い、試験片が破
断するまでの折り曲げ回数を測定し、折り曲げ強度を評
価した。なお、折り曲げ回数は90度曲げで1 回、元にも
どして2 回とする。 静電容量測定:アルミニウム箔について、45℃のエッチ
ング液(12.5 容量%塩酸+0.5 容量%硝酸+0.6 容量%
リン酸)中で、電流密度0.2A/cm2で25HZの交流電解を25
0 秒間行った。その後、60℃のアジピン酸アンモニウム
溶液中で3Vに化成処理し、LCR メーターで静電容量を測
定した。 折り曲げ回数および静電容量を表2に示す。表2に示さ
れるように、本発明に従うアルミニウム箔は、いずれも
従来の陰極用純アルミニウム箔に比べ、優れた静電容量
と折り曲げ強度を有している。The bending strength and capacitance of the obtained aluminum foil were evaluated according to the following methods. Bending test: Using the JIS P 8115 MIT automatic bending tester, make a test piece with a width of 10 ± 0.3 mm and a length of 100 mm and set it in the tester, bending radius 0.5 ± 0.05 mm, load
A bending test was performed under the conditions of 2.5 ± 0.05 N, bending angle of 90 ± 2 degrees, and bending repetition rate of 6 times / s, and the number of times of bending until the test piece was broken was measured to evaluate the bending strength. The number of folds will be once for 90 degree bending and twice for undoing. Capacitance measurement: For aluminum foil, etching solution at 45 ° C (12.5% by volume hydrochloric acid + 0.5% by volume nitric acid + 0.6% by volume)
25 HZ AC electrolysis at a current density of 0.2 A / cm 2 in phosphoric acid).
It went for 0 seconds. Then, it was subjected to chemical conversion treatment to 3 V in an ammonium adipate solution at 60 ° C, and the capacitance was measured with an LCR meter. Table 2 shows the number of times of bending and the capacitance. As shown in Table 2, each of the aluminum foils according to the present invention has superior capacitance and bending strength as compared with the conventional pure aluminum foil for cathode.
【0020】[0020]
【表2】 [Table 2]
【0021】比較例1 表3に示す組成を有するアルミニウム鋳塊を製造し、実
施例1と同様に処理して、厚さ0.05mmのアルミニウム箔
とした。ついで、アルミニウム箔の表層部にイオンスパ
ッタリングにより、Ti、V、ZrおよびNiを付与し
た。表層部におけるこれらの元素の合計量を表1に示
す。得られたアルミニウム箔について、実施例1と同一
の方法で折り曲げ強度および静電容量を評価した。結果
を表4に示す。なお、表3において、本発明の条件を外
れたものには下線を付した。Comparative Example 1 An aluminum ingot having the composition shown in Table 3 was produced and treated in the same manner as in Example 1 to obtain an aluminum foil having a thickness of 0.05 mm. Then, Ti, V, Zr and Ni were applied to the surface layer of the aluminum foil by ion sputtering. Table 1 shows the total amounts of these elements in the surface layer portion. The bending strength and the capacitance of the obtained aluminum foil were evaluated in the same manner as in Example 1. The results are shown in Table 4. In Table 3, those that do not satisfy the conditions of the present invention are underlined.
【0022】[0022]
【表3】 [Table 3]
【0023】[0023]
【表4】 [Table 4]
【0024】表4にみられるように、試験材No.1、No.2
は、所定量のSiおよびFeを含有しないため、強度が
十分でない。試験材No.3は、SiおよびFeの含有量が
多過ぎるため、エッチング時の化学溶解性が増大し、エ
ッチングピットの壁を溶解する結果、静電容量が低下す
る。試験材No.4は、V、Zrが含まれていないため、静
電容量が低い。試験材No.5は、Ti、Zr、Niの含有
量が多過ぎ、表層部におけるTi、V、ZrおよびNi
の合計量も本発明の限定範囲を越えているため、エッチ
ング開始点が過多となって全面溶解が生じる結果、静電
容量が低下している。As shown in Table 4, test materials No. 1 and No. 2
Does not contain a predetermined amount of Si and Fe, and has insufficient strength. Since the test material No. 3 contains too much Si and Fe, the chemical solubility at the time of etching is increased and the wall of the etching pit is dissolved, resulting in a decrease in capacitance. Since the test material No. 4 does not contain V or Zr, it has a low capacitance. Test material No. 5 contained too much Ti, Zr, and Ni, and Ti, V, Zr, and Ni in the surface layer portion
Also, since the total amount exceeds the limit range of the present invention, the etching start point becomes excessive and the entire surface is melted, resulting in a decrease in capacitance.
【0025】[0025]
【発明の効果】以上のとおり、本発明によれば、電解エ
ッチング時の化学溶解が抑制されて、静電容量が高く、
且つ強度も良好な陰極用アルミニウム箔が得られる。As described above, according to the present invention, the chemical dissolution during electrolytic etching is suppressed and the electrostatic capacity is high.
In addition, an aluminum foil for cathode having good strength can be obtained.
Claims (1)
以下、合計で0.4ppm以上含み、Fe0.03〜0.15%(質量
%、以下同じ)、Si0.02〜0.15%を含有し、残部Al
および不可避的不純物からなるアルミニウム箔であり、
該アルミニウム箔の表面から厚さ方向に0.2 μm 内部ま
での表層部に、前記Ti、V、ZrおよびNiが合計で
0.6 〜8000ppm の濃度で存在していることを特徴とする
電解コンデンサ陰極用アルミニウム箔。1. Ti, V, Zr and Ni are each 20 ppm
In the following, the total content is 0.4 ppm or more, Fe 0.03 to 0.15% (mass%, the same applies below), Si 0.02 to 0.15%, and the balance Al.
And an aluminum foil consisting of inevitable impurities,
In the surface layer portion from the surface of the aluminum foil to the inside of 0.2 μm in the thickness direction, the above Ti, V, Zr and Ni are contained in total.
Aluminum foil for electrolytic capacitor cathodes, characterized by being present in a concentration of 0.6 to 8000 ppm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24324994A JP2793964B2 (en) | 1994-09-12 | 1994-09-12 | Aluminum foil for cathode of electrolytic capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24324994A JP2793964B2 (en) | 1994-09-12 | 1994-09-12 | Aluminum foil for cathode of electrolytic capacitor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0881725A true JPH0881725A (en) | 1996-03-26 |
JP2793964B2 JP2793964B2 (en) | 1998-09-03 |
Family
ID=17101064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24324994A Expired - Fee Related JP2793964B2 (en) | 1994-09-12 | 1994-09-12 | Aluminum foil for cathode of electrolytic capacitor |
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JP (1) | JP2793964B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006068300A1 (en) * | 2004-12-21 | 2006-06-29 | Showa Denko K.K. | Aluminum material for electrolytic capacitor electrode, production method of electrode material for electrolytic capacitor, anode material for aluminum electrolytic capacitor, and aluminum electrolytic capacitor |
JP2007009318A (en) * | 2005-05-31 | 2007-01-18 | Showa Denko Kk | Aluminum material for electrolytic capacitor electrode, method for manufacturing electrode material for electrolytic capacitor, anode material for aluminum electrolytic capacitor, and aluminum electrolytic capacitor |
JP2010248551A (en) * | 2009-04-14 | 2010-11-04 | Mitsubishi Alum Co Ltd | Aluminum foil for electrolytic capacitor cathode and method for manufacturing the same |
JP2016192505A (en) * | 2015-03-31 | 2016-11-10 | 日立エーアイシー株式会社 | Wet electrolytic capacitor |
-
1994
- 1994-09-12 JP JP24324994A patent/JP2793964B2/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006068300A1 (en) * | 2004-12-21 | 2006-06-29 | Showa Denko K.K. | Aluminum material for electrolytic capacitor electrode, production method of electrode material for electrolytic capacitor, anode material for aluminum electrolytic capacitor, and aluminum electrolytic capacitor |
JP2007009318A (en) * | 2005-05-31 | 2007-01-18 | Showa Denko Kk | Aluminum material for electrolytic capacitor electrode, method for manufacturing electrode material for electrolytic capacitor, anode material for aluminum electrolytic capacitor, and aluminum electrolytic capacitor |
JP2010248551A (en) * | 2009-04-14 | 2010-11-04 | Mitsubishi Alum Co Ltd | Aluminum foil for electrolytic capacitor cathode and method for manufacturing the same |
JP2016192505A (en) * | 2015-03-31 | 2016-11-10 | 日立エーアイシー株式会社 | Wet electrolytic capacitor |
Also Published As
Publication number | Publication date |
---|---|
JP2793964B2 (en) | 1998-09-03 |
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