JPH08774Y2 - Hybrid integrated circuit board with heat sink - Google Patents

Description

[Detailed description of the device]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit board having a heat sink.

[Prior art]

Conventionally, in a hybrid integrated circuit board on which electronic components with a large amount of heat dissipation are mounted, in order to reduce the possibility that the circuit function is hindered by heat generation, a conductor is brought into contact with the board to facilitate heat dissipation. For example, in an electronic component such as a power transistor that generates a large amount of heat, a heat radiating plate that helps the heat radiation effect is provided in advance in the electronic component itself. As a hybrid integrated circuit board on which these electronic components that easily generate heat are mounted, for example, those shown in FIGS. 4 and 5 showing a conventional example are known. A hybrid integrated circuit board on which electronic components 2, 2 ... Which easily generate heat are mounted and a state in which the hybrid integrated circuit board is mounted on another circuit board will be described with reference to these drawings. 3 are used in the hybrid integrated circuit board shown in FIGS. 4 and 5, for example, power transistors and the like which generate a large amount of heat, and these heat-generating electronic components 2, 2 ... The through holes 3, 3 ... Are previously formed at the position of the insulating substrate 1 to be mounted, and the heat sinks 6, 6 ... of the electronic components 2, 2 ... Are inserted therein. Further, the circuit wiring 20 is formed on one main surface of the substrate 1 by a conductor pattern or the like, and the conductor film 5 is formed on one surface of the other main surface. The heat generating electronic components 2, 2, ... Are fixed on a cylindrical heat sink 6 and covered with an insulator (not shown) such as ceramics. Other electronic components 4, 4, ... Are mounted on one main surface of the insulating substrate 1, and these are soldered together with the heat generating electronic components 2, 2 ,. By this soldering, the extraction electrodes of the electronic components 2, 2, ... Are connected to the circuit wiring 20 on the one main surface, and a part of the heat sink 6 is arranged flush with the other main surface of the insulating substrate 1. It Conductive lands 8, 8 ... Are formed on one side of the substrate, and one end of each crank-shaped lead terminal 7, 7 ... Is soldered to each electrode land 8, 8 ,. It has been derived. The metal heat dissipation plate 9'is of a substantially rectangular shape having substantially the same width dimension as that of the substrate. The width of the heat dissipation plate 9'is slightly narrowed except for both end edges thereof, and the length thereof is slightly longer than that of the substrate. . Through holes 1 for fixing to another wiring board 11 are provided at both end edges thereof.
0 and 10 are formed. Such a heat dissipation plate 9'is soldered so as to overlap the conductor film 5 formed on one surface of the other main surface of the insulating substrate 1. As a result, the heat-generating electronic components 2, 2, ... Are radiated through the heat sinks 6, 6 ,.
A hybrid integrated circuit board is configured that contacts the. As shown in FIG. 5, in such a hybrid integrated circuit board 1, the heat sink 9'side is soldered to another circuit board 11 together with other electronic components to form a part of the circuit wiring.

[Problems to be solved by the device]

However, when the conventional hybrid integrated circuit board is soldered to the circuit board 11, the solder for soldering the heat dissipation plate 9'to the insulating board 1 may melt. Then,
The heat dissipation plate 9'moves and comes into contact with the lead terminals 7, 7 ... Derived from the side of the insulating substrate 1 to cause a short circuit,
The heat sinks 6, 6 ... of the electronic components 2, 2, ...
However, there is a problem that the heat radiation effect of the electronic components 2, 2 ... SUMMARY OF THE INVENTION An object of the present invention is to provide a hybrid integrated circuit board which is provided with a heat dissipation plate which is capable of solving the above-mentioned problems by forming a recess whose one end is opened in the hybrid integrated circuit board.

[Means for solving the problem]

That is, according to the present invention, in order to solve the above problems, an insulating substrate 1 on which electronic components 2 and 4 are mounted, and one side surface of the insulating substrate 1 are formed on one main surface of the insulating substrate 1. A recess 13 that is open and has a heat sink positioning means, and the recess 13 and the insulating substrate 1 around the recess 13.
Conductor films 14 and 18 respectively formed on the main surface of the insulating film 1 and through holes 3 and 3 formed in the recess 13 so as to penetrate the insulating substrate 1.
, And the heat radiation plate 9 inserted into the recess 13 and positioned by the positioning means and soldered to the conductor film 14 and the through holes 3, 3 ,.
The heat sink 6 soldered to the
A hybrid integrated circuit board with a heat sink is provided.

[Action]

In the hybrid integrated circuit board according to the present invention, the concave portion 13 for accommodating the heat sink 9 is opened on one side surface of the insulating substrate 1. Therefore, when the heat sink 9 accommodated therein is soldered to another circuit board 11. It is possible to easily visually confirm from the side surface of the insulating substrate 1 whether or not the soldering is properly performed.
Further, since the heat dissipation plate 13 housed in the recess 13 is positioned by the positioning means, the heat dissipation plate 9 once housed in the recess 13 and soldered, even if the solder is subsequently melted, the insulating substrate It does not deviate from the predetermined position with respect to 1, and is fixed in the same position again by hardening the solder.
As a result, it is possible to prevent the lead terminals from being short-circuited.

【Example】

Next, an embodiment of the present invention will be specifically described with reference to the drawings. As shown in FIG. 1, a concave portion 13 is formed on one main surface (hereinafter, referred to as “lower surface”) of the insulating substrate 1 made of ceramic, glass-epoxy resin or the like. This recess 13
Is formed so as to open on one side surface of the insulating substrate 1, and in the case of the generally rectangular recess 13 as shown in the drawing, the recess 13 is surrounded by three surfaces excluding the one open side surface. Protrusions 16, 16 for positioning the heat dissipation plate 9 fitted therein are formed on opposite side surfaces of the recess 13. Further, the main surface of the recess 13 is covered with a conductor film 14 made of a thick film conductor layer, a plated film layer, or the like. As shown in FIG. 3, the insulating substrate 1 is formed with through holes 3, 3, ... Into which heat sinks 6, 6, ... To be described later are fitted, and one opening of the through holes 3, 3 ,. It is open to. As shown in FIG. 2, on the other main surface (hereinafter, referred to as “upper surface”) of the insulating substrate 1, a circuit wiring 20 is formed by a conductor pattern or the like, and the terminal electrode 12,
12 ... is formed. The illustrated terminal electrodes 12, 12 ... Are made of a conductive film formed in a semi-cylindrical surface-shaped recess formed on the side surface of the insulating substrate 1, and these are connected to the circuit board 20. The heat dissipation plate 9 is made of a metal plate having good heat conduction and solderability, and has a shape corresponding to the recess 13. That is, the planar shape is slightly smaller than the concave portion 13, and has concave notches 17 and 17 on the side surface corresponding to the protruding portions 16 and 16 of the concave portion 13. further,
Its thickness is set to be slightly smaller than the depth dimension of the recess 13. The heat dissipation plate 9 is fitted into the recess 13 of the insulating substrate 1 with the protrusions 16 and 16 and the notches 17 and 17 together, and is soldered to the conductor film 14 formed on the main surface of the recess 13. To be done. In this state, the heat radiation plate 9 is held at a fixed position in the recess 13 by the fitting of the protrusions 16, 16 and the notches 17, 17. Further, as shown in FIG. 3, heat-generating electronic components 2, 2, ... Such as power transistors are fixed on a cylindrical heat sink 6 and covered with an insulator (not shown) such as ceramics. Has been done. And this heat sink 6,
6 are fitted into the through holes 3, 3 ... of the insulating substrate 1,
One end surface thereof is soldered to the heat dissipation plate 9 fitted in the recess 13. Other electronic components 4, 4, ... Such as chip-shaped electronic components and semiconductor ICs are mounted on the main surface of the insulating substrate 1 on the side where the circuit wiring 20 is formed, and these electronic components 2, 2, ... Soldered with. By this soldering, the extraction electrodes of the electronic components 2, 2, ... Are connected to the circuit wiring 20 on the one main surface. As described above, the hybrid integrated circuit board including the heat sink 9 is completed. However, when the hybrid integrated circuit board is mounted on another circuit board 11, the heat sink 9 is installed as shown in FIGS. The conductor film 18 of the insulating substrate 1 on one main surface and its periphery is soldered onto the other circuit board 11. In this state, since one side surface of the heat dissipation plate 9 can be seen from one side surface side of the insulating substrate 1, the soldering state of the heat dissipation plate 9 to the insulating substrate 1 side and the soldering of the circuit board to another substrate 11 are performed. The attached state can be easily confirmed. The present invention is not necessarily limited to the above-described embodiment, and for example, the shape of the protrusion or the notch of the positioning means for the heat sink 9 in the recess 13 may be changed, or the notch may be radiated to the recess 13 side. It goes without saying that a protrusion may be formed on the plate 9 side.

[Effect of device]

As described above, according to the present invention, another circuit board 11
The effect that the heat sink 9 does not move with respect to the insulating substrate 1 during soldering to and the hybrid integrated circuit board with the heat sink whose soldering state can be easily confirmed can be provided.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a hybrid integrated circuit board with a heat sink according to an embodiment of the present invention seen from the lower surface side, and FIG. 2 is a perspective view of the hybrid integrated circuit board mounted on another circuit board. 3 is a vertical side view of the same state, FIG. 4 is a perspective view of a hybrid integrated circuit board showing a conventional example, and FIG. 5 is a state in which the hybrid integrated circuit board is mounted on another circuit board. It is a vertical side view. 1 ... Insulating substrate, 2 ... Heat-generating electronic component, 3 ... Through hole, 4 ... General electronic component, 6 ... Heat sink, 9 ...
… Heat sink, 13 …… Recessed part of insulating substrate, 14, 18 …… Conductor film

Claims (1)

[Scope of utility model registration request] 1. An insulating substrate 1 on which electronic components 2 and 4 are mounted,
A recess 13 formed on one main surface of the insulating substrate 1, one side surface of which is open on one side surface of the insulating substrate 1, and a radiator plate positioning means is formed, and the recess 13 and insulation around the recess 13. Conductor films 14 and 18 respectively formed on the main surface of the substrate 1.
, Through-holes 3, 3, ... Formed in the recess 13 so as to penetrate the insulating substrate 1, and inserted into the recess 13 and positioned by the positioning means, and the conductor film 14
, A heat sink 6 soldered to the heat sink 6 inserted into the through holes 3, 3 ,.
A hybrid integrated circuit board with a heat radiating plate, comprising: an electronic component 2 attached to the heat sink 6.