JPH0855869A - Forming method for wire ball and its device - Google Patents
Forming method for wire ball and its deviceInfo
- Publication number
- JPH0855869A JPH0855869A JP6211789A JP21178994A JPH0855869A JP H0855869 A JPH0855869 A JP H0855869A JP 6211789 A JP6211789 A JP 6211789A JP 21178994 A JP21178994 A JP 21178994A JP H0855869 A JPH0855869 A JP H0855869A
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- wire
- tip
- metal wire
- ball
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78268—Discharge electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85053—Bonding environment
- H01L2224/85054—Composition of the atmosphere
- H01L2224/85075—Composition of the atmosphere being inert
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】金属ワイヤの先端を溶融して形成
するワイヤボールの形成方法およびその装置に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for forming a wire ball by melting the tip of a metal wire.
【０００２】[0002]
【従来の技術】図５には、ワイヤボール１の形成装置の
従来例が示されている。この形成装置は、トーチロッド
14とクランパ12とキャピラリ10とトランデューサ13を有
して構成されている。2. Description of the Related Art FIG. 5 shows a conventional example of a wire ball 1 forming apparatus. This forming device is a torch rod
14, a clamper 12, a capillary 10 and a transducer 13 are provided.
【０００３】ワイヤボール１を形成する金属ワイヤ２
は、銅（Ｃｕ）や半田（錫（Ｓｎ）と鉛（Ｐｂ）の合
金）等のワイヤであり、金属ワイヤ２の先端を溶融して
ワイヤボール１を形成する。A metal wire 2 forming a wire ball 1
Is a wire of copper (Cu), solder (alloy of tin (Sn) and lead (Pb)), or the like, and melts the tip of the metal wire 2 to form the wire ball 1.
【０００４】前記ワイヤボール１の形成装置のキャピラ
リ10には貫通孔15が形成され、前記金属ワイヤ２の先端
側を通してガイドする。また、キャピラリ10を支持する
トランデューサ13が設けられており、キャピラリ10はこ
のトランデューサ13の動作によって上下等の移動が可能
となっている。また、キャピラリ10の後端側には所定の
タイミングで金属ワイヤ２を挟み固定するクランパ12が
設けられている。A through hole 15 is formed in the capillary 10 of the wire ball 1 forming device to guide the metal wire 2 through the tip side thereof. Further, a transducer 13 that supports the capillary 10 is provided, and the capillary 10 can be moved up and down by the operation of the transducer 13. Further, a clamper 12 for sandwiching and fixing the metal wire 2 at a predetermined timing is provided on the rear end side of the capillary 10.
【０００５】また、トーチロッド14は基端側を支点とし
て矢印方向に回動自在に設けられており、トーチロッド
14の先端部には、金属ワイヤ２の先端に間隙を介して対
向させ高電圧を印加する放電電極11と、この放電電極11
と金属ワイヤ２の先端を含む空間領域（点線で囲まれた
空間領域）に水素（Ｈ2 ）等の還元ガスを含む雰囲気ガ
ス（例えば、水素（Ｈ2 ）とアルゴン）を噴出供給する
ガス噴射口22が設けられている。Further, the torch rod 14 is provided so as to be rotatable in the arrow direction with the base end side as a fulcrum.
A discharge electrode 11 for applying a high voltage is provided at the tip of 14 to face the tip of the metal wire 2 with a gap, and the discharge electrode 11
A gas jet for supplying an atmospheric gas (for example, hydrogen (H 2 ) and argon) containing a reducing gas such as hydrogen (H 2 ) to a space region including the tip of the metal wire 2 (a space region surrounded by a dotted line). A mouth 22 is provided.
【０００６】このような形成装置において、図のよう
に、金属ワイヤ２をキャピラリ10の貫通孔15に通し、キ
ャピラリ10の先端側から適当な長さ分だけ金属ワイヤ２
を突出させ、金属ワイヤ２をクランパ12で挟み固定し
て、金属ワイヤ２の先端と放電電極11を対向配置し、ガ
ス噴出口22から金属ワイヤ２の先端を含む空間領域に雰
囲気ガスを噴出供給して、放電電極11に高電圧を印加
し、放電電極11と金属ワイヤ２の先端間に放電（スパー
ク）を行い、この放電エネルギによって金属ワイヤ２の
先端を溶融してワイヤボール１を形成する。In such a forming apparatus, the metal wire 2 is passed through the through hole 15 of the capillary 10 as shown in the figure, and the metal wire 2 is moved by an appropriate length from the tip side of the capillary 10.
The metal wire 2 is sandwiched and fixed by the clamper 12, the tip of the metal wire 2 and the discharge electrode 11 are arranged to face each other, and the atmospheric gas is jetted and supplied from the gas jet port 22 to the space region including the tip of the metal wire 2. Then, a high voltage is applied to the discharge electrode 11 to cause a discharge (spark) between the discharge electrode 11 and the tip of the metal wire 2, and the tip of the metal wire 2 is melted by this discharge energy to form the wire ball 1. .
【０００７】上記のようにワイヤボール１が形成された
後に、トーチロッド14の先端部が回動して金属ワイヤ２
の先端側から退避移動し、図６の（ａ）に示されるよう
に、適宜に加熱されている基板（例えばＬＳＩ（半導体
集積回路）チップ）８上の電極（ランド）９にキャピラ
リ10によってワイヤボール１が押し付けられ溶着する。
この溶着後、図６の（ｂ）のように、ワイヤボール１と
金属ワイヤ２をちぎり離して電極９上にバンプを形成す
る。あるいは、ワイヤボール１と金属ワイヤ２をちぎり
離さずに、図６の（ｃ）のように、金属ワイヤ２をキャ
ピラリ10の移動によって周囲の電極へ引き回して接続す
るワイヤボンディングを行う。After the wire ball 1 is formed as described above, the tip portion of the torch rod 14 is rotated to rotate the metal wire 2
As shown in FIG. 6A, the wire 10 is moved by a capillary 10 to an electrode (land) 9 on a substrate (for example, an LSI (semiconductor integrated circuit) chip) 8 that has been retreated from the tip side of the substrate. The ball 1 is pressed and welded.
After this welding, as shown in FIG. 6B, the wire ball 1 and the metal wire 2 are torn apart to form a bump on the electrode 9. Alternatively, without breaking the wire ball 1 and the metal wire 2 apart, as shown in FIG. 6C, the metal wire 2 is moved to the surrounding electrode by the movement of the capillary 10 to perform wire bonding.
【０００８】[0008]
【発明が解決しようとする課題】ところで、金属ワイヤ
２を構成している銅（Ｃｕ）又は半田（錫（Ｓｎ）と鉛
（Ｐｂ）の合金）等は酸化を起こし易く、大気中では金
属ワイヤ２の表面には酸化膜が形成されてしまい、ま
た、放電によって金属ワイヤ２を溶融しているときに
も、金属ワイヤ２の溶融部分の表面上に酸化が起こって
しまい、均質で真球状のワイヤボール１を形成すること
ができない。By the way, copper (Cu) or solder (an alloy of tin (Sn) and lead (Pb)) or the like which composes the metal wire 2 easily oxidizes, and the metal wire is exposed in the atmosphere. An oxide film is formed on the surface of No. 2, and even when the metal wire 2 is melted by electric discharge, oxidation occurs on the surface of the melted portion of the metal wire 2, resulting in a uniform and spherical shape. The wire ball 1 cannot be formed.
【０００９】そこで、金属ワイヤ２の先端を含む空間領
域を充たしている雰囲気ガス中の水素（Ｈ2 ）等で金属
ワイヤ２の先端や溶融中の金属ワイヤ２の先端表面の還
元（酸化膜の除去）を、例えば、還元ガスに水素を用い
た場合には下記の化学式に基づいて行う。Therefore, reduction of the tip surface of the metal wire 2 or the tip surface of the metal wire 2 during melting (oxide film formation) by hydrogen (H 2 ) in the atmosphere gas filling the space region including the tip of the metal wire 2 The removal) is performed based on the following chemical formula when hydrogen is used as the reducing gas, for example.
【００１０】半田のワイヤの場合、ＳｎＯ＋Ｈ2 →Ｓｎ
＋Ｈ2 Ｏ、ＰｂＯ＋Ｈ2 →Ｐｂ＋Ｈ2 ＯIn the case of a solder wire, SnO + H 2 → Sn
+ H 2 O, PbO + H 2 → Pb + H 2 O
【００１１】 銅のワイヤの場合、ＣｕＯ＋Ｈ2 →Ｃｕ＋Ｈ2 ＯIn the case of a copper wire, CuO + H 2 → Cu + H 2 O
【００１２】しかしながら、ガス噴出口22がトーチロッ
ド14の先端部、つまり、金属ワイヤ２に対して横方向側
に設けられているために、ワイヤボール１を形成するた
め放電を行うときには、常に金属ワイヤ２の横側から雰
囲気ガスが噴出することとなり、図７の（ａ）に示され
るように、金属ワイヤ２の先端が雰囲気ガスの流れ方向
になびいて揺れ動いてしまう。この金属ワイヤ２の先端
が揺れ動くことによって、放電電極11と金属ワイヤ２の
先端の間隔が放電中変動し、また、同じ雰囲気ガスの状
態位置に留まっておらず、金属ワイヤ２の先端に供給さ
れる放電のエネルギの状態（放電状態）が安定せず、ワ
イヤボール１が真球ではなく歪な形状となってしまう。
また、上記のことから順次ワイヤボール１を形成する放
電毎の放電電極11と金属ワイヤ２の先端間の放電状態も
異なるため、大きさや形状や品質等のばらつきが生じる
という問題があった。However, since the gas ejection port 22 is provided at the tip end portion of the torch rod 14, that is, on the side in the lateral direction with respect to the metal wire 2, metal discharge is always performed to form the wire ball 1. Atmospheric gas is ejected from the side of the wire 2, and the tip of the metal wire 2 sways in the flowing direction of the atmospheric gas and sways, as shown in FIG. When the tip of the metal wire 2 swings, the distance between the discharge electrode 11 and the tip of the metal wire 2 fluctuates during discharge, and the same atmosphere gas is not retained at the same position but is supplied to the tip of the metal wire 2. The state of discharge energy (discharge state) is not stable, and the wire ball 1 is not a true sphere but a distorted shape.
Further, from the above, the discharge state between the discharge electrode 11 and the tip of the metal wire 2 for each discharge that sequentially forms the wire ball 1 is different, so that there is a problem that the size, shape, quality, and the like vary.
【００１３】また、ガス噴出口22から金属ワイヤ２に対
して横方向に雰囲気ガスが流れているので、図７の
（ｂ）のように、金属ワイヤ２の先端の雰囲気ガスの流
れ方向側に片寄ったワイヤボール１が形成されていしま
い、ワイヤボンディングを行ったときに金属ワイヤ２が
ワイヤボール１の境目で断線してしまうという問題があ
った。Further, since the atmospheric gas flows laterally from the gas ejection port 22 with respect to the metal wire 2, as shown in FIG. 7B, the tip end of the metal wire 2 is directed toward the atmospheric gas flow direction. There is a problem that the wire ball 1 which is deviated is formed and the metal wire 2 is broken at the boundary of the wire ball 1 when wire bonding is performed.
【００１４】本発明は上記課題を解決するためになされ
たものであり、その目的は、金属ワイヤの先端が揺れ動
いてしまうのを抑え、放電電極と金属ワイヤの先端間の
放電状態を安定させ、ワイヤボンディングの際断線の起
こらない、かつ、ワイヤボールの形成毎において、大き
さや形状や品質等にばらつきのないワイヤボールを形成
することができるワイヤボールの形成方法およびその装
置を提供することである。The present invention has been made to solve the above problems, and its object is to prevent the tip of a metal wire from swaying and to stabilize the discharge state between the discharge electrode and the tip of the metal wire. (EN) A wire ball forming method and a wire ball forming method capable of forming a wire ball which is not broken during wire bonding and has no variation in size, shape, quality, etc. every time a wire ball is formed. .
【００１５】[0015]
【課題を解決するための手段】上記目的を達成するため
に、本発明は次のように構成されている。すなわち、第
１の発明のワイヤボールの形成方法は、キャピラリに通
した金属ワイヤの先端側に放電電極を対向し、この放電
電極と金属ワイヤ先端を含むスパーク空間領域に還元ガ
スを含む雰囲気ガスを供給し、この雰囲気ガスの雰囲気
中で放電電極と金属ワイヤ先端間に放電を行い、この放
電エネルギによって金属ワイヤ先端を溶融して金属ワイ
ヤ先端にボールを形成するワイヤボールの形成方法にお
いて、前記雰囲気ガスをキャピラリの軸長方向に沿わせ
てキャピラリの先端側に噴出供給することを特徴として
構成されている。In order to achieve the above object, the present invention is constructed as follows. That is, in the wire ball forming method of the first invention, the discharge electrode is opposed to the tip side of the metal wire passed through the capillary, and the atmosphere gas containing the reducing gas is supplied to the spark space region including the discharge electrode and the tip of the metal wire. In the method of forming a wire ball, the method comprises: supplying and discharging between a discharge electrode and a metal wire tip in an atmosphere of this atmosphere gas, and melting the metal wire tip by this discharge energy to form a ball on the metal wire tip. The gas is jetted and supplied to the tip side of the capillary along the axial direction of the capillary.
【００１６】また、第２の発明のワイヤボールの形成方
法は、前記雰囲気ガスは雰囲気ガス噴射ノズルから供給
し、該雰囲気ガス噴射ノズルのガス噴出先端側は直筒ガ
イドと成し、この直筒ガイドをキャピラリと同軸状に配
置して雰囲気ガスをキャピラリの軸長方向に沿わせて噴
出供給することを特徴として構成されている。Also, in the wire ball forming method of the second invention, the atmospheric gas is supplied from an atmospheric gas injection nozzle, and the gas ejection tip side of the atmospheric gas injection nozzle is a straight cylinder guide. It is characterized in that it is arranged coaxially with the capillaries so that the atmospheric gas is jetted and supplied along the axial direction of the capillaries.
【００１７】本発明のワイヤボールの形成装置は、金属
ワイヤが通されるキャピラリと、キャピラリに通された
金属ワイヤの先端に間隙を介して対向する放電電極と、
該放電電極と金属ワイヤ先端を含むスパーク空間領域に
還元ガスを含む雰囲気ガスを供給する雰囲気ガス噴射ノ
ズルとを有し、雰囲気ガス噴射ノズルから噴射される雰
囲気ガスの雰囲気中で放電電極と金属ワイヤ先端間に放
電を行い、この放電エネルギによって金属ワイヤ先端を
溶融して金属ワイヤ先端にボールを形成するワイヤボー
ルの形成装置において、前記雰囲気ガス噴射ノズルのガ
ス噴出先端側は直筒ガイドと成し、この直筒ガイドはキ
ャピラリと同軸状に配置して噴出雰囲気ガスをキャピラ
リの軸長方向に沿わせてキャピラリの先端側に噴出供給
することを特徴として構成されている。The wire ball forming apparatus of the present invention comprises a capillary through which a metal wire is inserted, and a discharge electrode facing the tip of the metal wire through the capillary with a gap.
The discharge electrode and the metal wire have an atmosphere gas injection nozzle that supplies an atmosphere gas containing a reducing gas to a spark space region including the tip of the metal wire, and the discharge electrode and the metal wire in the atmosphere of the atmosphere gas injected from the atmosphere gas injection nozzle. In a wire ball forming apparatus that discharges between the tips and melts the tip of the metal wire by this discharge energy to form a ball at the tip of the metal wire, the gas ejection tip side of the atmosphere gas injection nozzle is a straight tube guide, This straight cylinder guide is arranged coaxially with the capillary, and is characterized in that the jetting atmosphere gas is jetted and supplied to the tip side of the capillary along the axial direction of the capillary.
【００１８】また、前記雰囲気ガス噴射ノズルの直筒ガ
イドはその開口をキャピラリの後端に臨ませて設けたこ
と、前記雰囲気ガス噴射ノズルの直筒ガイドはキャピラ
リを囲繞してキャピラリの後部側から先端側のボール形
成領域にかけて伸張して設けたこと、前記雰囲気ガス噴
射ノズルの直筒ガイドはキャピラリの先端側を局部的に
囲繞してキャピラリの先方側からボール形成領域にかけ
て伸張して設けたこともそれぞれ本発明装置の特徴とす
るところである。Further, the straight cylinder guide of the atmosphere gas injection nozzle is provided with its opening facing the rear end of the capillary, and the straight cylinder guide of the atmosphere gas injection nozzle surrounds the capillary and extends from the rear side to the tip side of the capillary. The ball guide region of the atmosphere gas injection nozzle is locally extended around the tip side of the capillary to extend from the tip side of the capillary to the ball formation region. This is a feature of the invention device.
【００１９】[0019]
【作用】上記構成の本発明において、雰囲気ガスを雰囲
気ガス噴射ノズルの直筒ガイドからキャピラリの軸長方
向に沿わせてキャピラリの先端側まで供給することによ
って、キャピラリの軸長方向に伸びている金属ワイヤの
先端部分の揺れ動きを抑えて、金属ワイヤの先端と放電
電極間の放電の状態を安定にし、真球状に整ったワイヤ
ボールを形成する。In the present invention having the above-mentioned structure, the metal extending in the axial direction of the capillary is supplied by supplying the atmospheric gas from the straight pipe guide of the atmospheric gas injection nozzle to the tip side of the capillary along the axial direction of the capillary. The swaying movement of the tip of the wire is suppressed, the state of discharge between the tip of the metal wire and the discharge electrode is stabilized, and a wire ball arranged in a spherical shape is formed.
【００２０】[0020]
【実施例】本発明による実施例を図面に基づいて説明す
る。なお、本実施例の説明において、従来例と同一名称
部分には同一符号を付し、その詳細な説明は省略する。Embodiments of the present invention will be described with reference to the drawings. In the description of the present embodiment, the same reference numerals will be given to the same names as those in the conventional example, and detailed description thereof will be omitted.
【００２１】図１には、第１の実施例のワイヤボール１
の形成方法とその装置が示されている。本実施例では、
金属ワイヤ２の先端付近に、従来例のように金属ワイヤ
２の横方向から雰囲気ガスを噴出供給するのではなく、
金属ワイヤの軸長方向に沿って雰囲気ガスを供給するこ
とを特徴とする。本実施例のワイヤボール１の形成装置
は、雰囲気ガス噴射ノズル４の開口部分をキャピラリ10
の後端側に臨ませて設けている。この形成装置を用い
て、雰囲気ガス噴射ノズル４からキャピラリ10の軸長方
向に沿ってキャピラリ10の先端側の放電電極11と金属ワ
イヤ２の先端を含むワイヤボール１の形成領域に雰囲気
ガスを噴出供給し、従来同様に、放電電極11と金属ワイ
ヤ２の先端間に放電を行い、この放電エネルギによって
金属ワイヤ２の先端を溶融してワイヤボール１を形成す
る。FIG. 1 shows a wire ball 1 according to the first embodiment.
The method of forming the same and the apparatus therefor are shown. In this embodiment,
Instead of jetting and supplying the atmospheric gas to the vicinity of the tip of the metal wire 2 from the lateral direction of the metal wire 2 as in the conventional example,
The feature is that the atmospheric gas is supplied along the axial direction of the metal wire. In the wire ball 1 forming apparatus of this embodiment, the opening portion of the atmospheric gas injection nozzle 4 is provided with a capillary 10.
It is provided facing the rear end side. Using this forming apparatus, the atmospheric gas is jetted from the atmospheric gas injection nozzle 4 along the axial direction of the capillary 10 to the formation region of the wire ball 1 including the tip of the discharge electrode 11 on the tip side of the capillary 10 and the tip of the metal wire 2. Then, as in the prior art, discharge is performed between the discharge electrode 11 and the tip of the metal wire 2, and the tip of the metal wire 2 is melted by this discharge energy to form the wire ball 1.
【００２２】本実施例によれば、従来例のように、金属
ワイヤ２の横方向から雰囲気ガスをワイヤボール１の形
成領域に噴出供給するのではなく、キャピラリ10の後端
側に雰囲気ガス噴射ノズル４を設けて雰囲気ガスをキャ
ピラリ10の軸長方向に沿ってワイヤボール１の形成領域
に噴出供給するので、雰囲気ガスが、キャピラリ10の側
面と貫通孔15に沿って流れ揃い、特に貫通孔15から流れ
出た雰囲気ガスの流れが、金属ワイヤ２の横方向の動き
を抑え、金属ワイヤ２の先端がなびいて揺れ動くことが
なくなって、放電中における放電電極11と金属ワイヤ２
の先端間の間隔が一定し、放電電極11と金属ワイヤ２の
先端間の放電状態が安定して、形成されたワイヤボール
１が真球状に整った形状となり、また、大きさや形状や
品質等にばらつきの小さいワイヤボール１を安定して形
成することが可能となる。According to this embodiment, unlike the conventional example, the atmospheric gas is not jetted and supplied from the lateral direction of the metal wire 2 to the region where the wire ball 1 is formed, but the atmospheric gas is jetted to the rear end side of the capillary 10. Since the nozzle 4 is provided and the atmospheric gas is jetted and supplied to the region where the wire ball 1 is formed along the axial direction of the capillary 10, the atmospheric gas is uniformly flown along the side surface of the capillary 10 and the through hole 15, especially the through hole. The flow of the atmospheric gas flowing out from 15 suppresses the lateral movement of the metal wire 2, and the tip of the metal wire 2 does not flutter and sway, so that the discharge electrode 11 and the metal wire 2 during the discharge can be prevented.
The distance between the tips of the wire is constant, the discharge state between the discharge electrode 11 and the tip of the metal wire 2 is stable, the formed wire ball 1 has a perfectly spherical shape, and the size, shape, quality, etc. It is possible to stably form the wire ball 1 with a small variation.
【００２３】また、上記の如く、雰囲気ガスが金属ワイ
ヤ２の軸長方向に流れるので、ワイヤボール１が金属ワ
イヤ２の先端の横方向に片寄って形成されることがな
く、ワイヤボンディングを行ったときに金属ワイヤ２と
ワイヤボール１の境目で断線が起こることがなくなり、
製品の歩留りを向上させることができる。Further, since the atmospheric gas flows in the axial direction of the metal wire 2 as described above, the wire bonding is performed without forming the wire ball 1 laterally offset from the tip of the metal wire 2. Occasionally, disconnection will not occur at the boundary between the metal wire 2 and the wire ball 1,
The product yield can be improved.
【００２４】さらに、キャピラリ10の後端側から雰囲気
ガスを噴出し、キャピラリ10の側面および貫通孔15に沿
ってキャピラリ10の先端側のワイヤボール１の形成領域
まで雰囲気ガスを供給するので、キャピラリ10の周囲の
雰囲気ガスは、常にワイヤボール１の形成領域に流出し
て、放電中に加熱されるキャピラリ10の熱を取り去り、
キャピラリ10の冷却を行うことができる。Further, the atmospheric gas is ejected from the rear end side of the capillary 10 and is supplied to the side surface of the capillary 10 and the through hole 15 to the tip side of the capillary 10 where the wire ball 1 is formed. The ambient gas around 10 always flows into the area where the wire ball 1 is formed, removing the heat of the capillary 10 that is heated during the discharge,
Capillary 10 can be cooled.
【００２５】図２には、第２の実施例が示されている。
なお、本実施例の説明において、従来例および第１の実
施例と同一名称部分には同一符号を付し、その詳細な説
明は省略する。A second embodiment is shown in FIG.
In the description of the present embodiment, the same reference numerals will be given to the same names as those in the conventional example and the first embodiment, and detailed description thereof will be omitted.
【００２６】この実施例が第１の実施例と異なる特徴的
なことは、雰囲気ガス噴射ノズル４のガス噴出端側を直
筒ガイド５と成し、この直筒ガイド５をキャピラリ10の
後端側にキャピラリ10と同軸状に配置していることであ
り、雰囲気ガス噴射ノズル４には金属ワイヤ２を通すた
めのワイヤ通り口17が設けられ、図の点線で示されるよ
うに、クランパ12は雰囲気ガス噴射ノズル４内に収容配
置されるか、あるいは外部に配置される。This embodiment is different from the first embodiment in that the gas ejection end side of the atmospheric gas injection nozzle 4 constitutes a straight cylinder guide 5, and this straight cylinder guide 5 is arranged on the rear end side of the capillary 10. Since it is arranged coaxially with the capillary 10, the atmosphere gas injection nozzle 4 is provided with a wire passage opening 17 for passing the metal wire 2. As shown by the dotted line in the figure, the clamper 12 is provided with an atmosphere gas. It is housed in the injection nozzle 4 or arranged outside.
【００２７】この実施例によれば、第１の実施例と同様
な効果を持ち、特に、雰囲気ガス噴射ノズル４のガス噴
出端側を直筒ガイド５とし、直筒ガイド５をキャピラリ
10と同軸状に配置したので、雰囲気ガスの流れをキャピ
ラリ10（金属ワイヤ２）の軸長方向に、より揃えること
ができ、雰囲気ガスの流れによる金属ワイヤ２の横方向
への動きを抑える効果が大きくなり、放電状態がさらに
安定して、より真球状に整った形状となり、大きさや形
状や品質等のばらつきの小さいワイヤボール１を形成す
ることができる。According to this embodiment, the same effect as that of the first embodiment is obtained, and in particular, the gas ejection end side of the atmospheric gas injection nozzle 4 is used as the straight cylinder guide 5, and the straight cylinder guide 5 is used as a capillary.
Since it is arranged coaxially with 10, the atmosphere gas flow can be more aligned in the axial direction of the capillary 10 (metal wire 2), and the effect of suppressing the lateral movement of the metal wire 2 due to the atmosphere gas flow is achieved. Is further increased, the discharge state is further stabilized, and the wire ball 1 is formed into a more spherical shape, and the variation in size, shape, quality, etc. can be formed.
【００２８】図３には、第３の実施例が示されている。
なお、本実施例の説明において、従来例および第１、第
２の各実施例と同一名称部分には同一符号を付し、その
詳細な説明は省略する。FIG. 3 shows a third embodiment.
In the description of this embodiment, the same reference numerals will be given to the same names as those in the conventional example and the first and second embodiments, and the detailed description thereof will be omitted.
【００２９】この実施例では、第２の実施例の直筒ガイ
ド５をさらに伸張し、キャピラリ10を囲繞してキャピラ
リ10の後部側から先端側のワイヤボール１の形成領域に
かけて設けている。そして、前記同様に、雰囲気ガスを
この直筒ガイド５（キャピラリ10）に沿ってワイヤボー
ル１の形成領域に供給し、放電によって金属ワイヤ２の
先端を溶融してワイヤボール１を形成する。なお、ここ
での直筒ガイド５にはトランデューサ挿通口18が設けら
れ、トランデューサ13の先端側は挿通口18を通してキャ
ピラリ10に結合されている。また、雰囲気ガス噴射ノズ
ル４とトランデューサ13とは一体的に上下等の移動を行
う。In this embodiment, the straight tube guide 5 of the second embodiment is further extended to surround the capillary 10 and to extend from the rear side of the capillary 10 to the formation region of the wire ball 1 on the tip side. Then, similarly to the above, the atmospheric gas is supplied to the formation region of the wire ball 1 along the straight tube guide 5 (capillary 10), and the tip of the metal wire 2 is melted by the discharge to form the wire ball 1. The straight tube guide 5 here is provided with a transducer insertion port 18, and the tip end side of the transducer 13 is connected to the capillary 10 through the insertion port 18. Further, the atmospheric gas injection nozzle 4 and the transducer 13 integrally move up and down.
【００３０】この実施例によれば、前記実施例と同様な
効果を持ち、特に直筒ガイド５をワイヤボール１の形成
領域まで伸張したので、雰囲気ガスの流れがより整えら
れ、金属ワイヤ２の動きを抑えることができて、放電状
態が非常に良く安定して、真球状に整った形状となり、
大きさや形状や品質等のばらつきがないワイヤボール１
を形成できる。According to this embodiment, the same effect as that of the above-mentioned embodiment is obtained, and in particular, since the straight tube guide 5 is extended to the area where the wire ball 1 is formed, the flow of the atmospheric gas is further adjusted and the movement of the metal wire 2 is improved. Can be suppressed, the discharge state is very good and stable, and the shape becomes a perfect sphere,
Wire ball 1 with no variation in size, shape, quality, etc.
Can be formed.
【００３１】図４には、第４の実施例が示されている。
なお、本実施例の説明において、従来例および第１、第
２、第３の各実施例と同一名称部分には同一符号を付
し、その詳細な説明は省略する。FIG. 4 shows a fourth embodiment.
In the description of the present embodiment, the same reference numerals will be given to the same names as those in the conventional example and the first, second and third embodiments, and detailed description thereof will be omitted.
【００３２】この実施例では、雰囲気ガス噴射ノズル４
にキャピラリ嵌合口19を設け、キャピラリ嵌合口19にキ
ャピラリ10の先端側を嵌め込み、直筒ガイド５をキャピ
ラリ10の先方側からワイヤボール１の形成領域にかけて
局部的に設け、雰囲気ガスを直筒ガイド５に沿ってワイ
ヤボール１の形成領域に供給し、前記同様にワイヤボー
ル１を形成する。In this embodiment, the atmosphere gas injection nozzle 4
A capillary fitting port 19 is provided in the capillary fitting port 19, and the tip end side of the capillary 10 is fitted into the capillary fitting port 19. Then, it is supplied to the formation area of the wire ball 1, and the wire ball 1 is formed in the same manner as above.
【００３３】この実施例によれば、前記各実施例と同様
な効果を持ち、また、ここでの直筒ガイド５は、キャピ
ラリ10の先端側からワイヤボール１の形成領域にかけて
局部的に設けるので、キャピラリ10の先端側をキャピラ
リ嵌合口19に嵌め込んで簡単に設置することができる。According to this embodiment, the same effects as those of the above-mentioned respective embodiments are obtained, and since the straight tube guide 5 here is provided locally from the tip side of the capillary 10 to the area where the wire ball 1 is formed, The tip end side of the capillary 10 can be fitted into the capillary fitting port 19 to be easily installed.
【００３４】なお、本発明は上記実施例に限定されるこ
とはなく、様々な実施の態様を採り得る。例えば、上記
実施例の金属ワイヤ２は銅や半田のワイヤであったが、
金のワイヤでもよい。ただし、金は酸化の起こり難い物
質であるので、還元ガスを含む雰囲気ガス中でなく大気
中で放電を行いワイヤボール１を形成してもよいが、放
電をより安定させるために、雰囲気ガス中で放電を行い
ワイヤボール１を形成してもよく、この雰囲気ガスには
還元ガスを含まなくてもよい。The present invention is not limited to the above-mentioned embodiment, and various embodiments can be adopted. For example, although the metal wire 2 of the above-described embodiment is a copper or solder wire,
It may be a gold wire. However, since gold is a substance that does not easily oxidize, the wire ball 1 may be formed by discharging in the atmosphere instead of in the atmosphere gas containing the reducing gas. However, in order to stabilize the discharge in the atmosphere gas, The wire ball 1 may be formed by performing the electric discharge in the above, and the atmosphere gas may not include the reducing gas.
【００３５】[0035]
【発明の効果】本発明によれば、雰囲気ガスをキャピラ
リの軸長方向（つまりは金属ワイヤの軸長方向）に沿わ
せてキャピラリの先端側に噴出供給するので、雰囲気ガ
スの流れによって金属ワイヤの先端の横方向への動きが
抑えられて金属ワイヤの先端が揺れ動いてしまうことが
なく、金属ワイヤの先端と放電電極間の間隔が一定して
変動せず、また、金属ワイヤの先端が常に同じ雰囲気ガ
スの状態に留まっており、放電電極と金属ワイヤの先端
間の放電状態を安定させることができる。このことによ
り、真球状に整ったワイヤボールを形成するとができ、
また、大きさや形状や品質等のばらつきのないワイヤボ
ールを安定して形成することが可能となる。According to the present invention, since the atmospheric gas is jetted and supplied to the tip side of the capillary along the axial direction of the capillary (that is, the axial direction of the metal wire), the flow of the atmospheric gas causes the metallic wire to flow. The movement of the tip of the metal wire is suppressed in the lateral direction, the tip of the metal wire does not shake, the distance between the metal wire tip and the discharge electrode does not fluctuate constantly, and the metal wire tip is always The state of the same atmospheric gas remains, and the discharge state between the discharge electrode and the tip of the metal wire can be stabilized. This makes it possible to form a wire ball with a perfect spherical shape,
Further, it is possible to stably form a wire ball having no variation in size, shape or quality.
【００３６】また、上記の如く、雰囲気ガスを金属ワイ
ヤの軸長方向に沿わせて金属ワイヤの先端を含む空間領
域に噴出供給するので、ワイヤボールが金属ワイヤの軸
から外れ横方向に片寄って形成されることがなく、金属
ワイヤの軸上に真球状のワイヤボールが形成されるため
に、ワイヤボンディングの際に金属ワイヤがワイヤボー
ルの境で断線することがなくなる。Further, as described above, since the atmospheric gas is jetted and supplied along the axial direction of the metal wire to the space region including the tip of the metal wire, the wire ball deviates from the axis of the metal wire and is laterally offset. Since the spherical wire ball is formed on the axis of the metal wire without being formed, the metal wire is not broken at the boundary of the wire ball during wire bonding.
【００３７】さらに、雰囲気ガスをキャピラリの軸長方
向に沿わせて噴出しているので、キャピラリの周囲の雰
囲気ガスは常にワイヤボール形成領域に流出して放電中
にキャピラリの熱を取り、キャピラリを冷却することが
できる。Further, since the atmospheric gas is jetted along the axial direction of the capillary, the atmospheric gas around the capillary always flows out to the wire ball forming area to take the heat of the capillary during the discharge, and to discharge the capillary. Can be cooled.
【図１】本発明のワイヤボールの形成方法およびその装
置の一例を示す説明図である。FIG. 1 is an explanatory diagram showing an example of a wire ball forming method and an apparatus thereof according to the present invention.
【図２】第２の実施例を示す説明図である。FIG. 2 is an explanatory diagram showing a second embodiment.
【図３】第３の実施例を示す説明図である。FIG. 3 is an explanatory diagram showing a third embodiment.
【図４】第４の実施例を示す説明図である。FIG. 4 is an explanatory diagram showing a fourth embodiment.
【図５】従来のワイヤボールの形成装置の一例を示す説
明図である。FIG. 5 is an explanatory view showing an example of a conventional wire ball forming apparatus.
【図６】ワイヤボールを用いたバンプ形成方法およびワ
イヤボンディングの方法を示す説明図である。FIG. 6 is an explanatory diagram showing a bump forming method and a wire bonding method using a wire ball.
【図７】従来の課題を示す説明図である。FIG. 7 is an explanatory diagram showing a conventional problem.
１ ワイヤボール ２ 金属ワイヤ ４ 雰囲気ガス噴射ノズル ５ 直筒ガイド 10 キャピラリ 11 放電電極 1 Wire Ball 2 Metal Wire 4 Atmospheric Gas Injection Nozzle 5 Straight Pipe Guide 10 Capillary 11 Discharge Electrode
Claims (6)
に放電電極を対向し、この放電電極と金属ワイヤ先端を
含むスパーク空間領域に還元ガスを含む雰囲気ガスを供
給し、この雰囲気ガスの雰囲気中で放電電極と金属ワイ
ヤ先端間に放電を行い、この放電エネルギによって金属
ワイヤ先端を溶融して金属ワイヤ先端にボールを形成す
るワイヤボールの形成方法において、前記雰囲気ガスを
キャピラリの軸長方向に沿わせてキャピラリの先端側に
噴出供給することを特徴とするワイヤボールの形成方
法。1. A discharge electrode is opposed to a tip side of a metal wire passed through a capillary, and an atmosphere gas containing a reducing gas is supplied to a spark space region including the discharge electrode and the tip of the metal wire. In the method of forming a wire ball, in which a discharge electrode is used to perform a discharge between the metal wire tip and the discharge energy melts the metal wire tip to form a ball at the metal wire tip, the atmosphere gas is spread along the axial direction of the capillary. A method for forming a wire ball, characterized in that the wire is ejected and supplied to the tip side of the capillary.
供給し、該雰囲気ガス噴射ノズルのガス噴出先端側は直
筒ガイドと成し、この直筒ガイドをキャピラリと同軸状
に配置して雰囲気ガスをキャピラリの軸長方向に沿わせ
て噴出供給する請求項１記載のワイヤボールの形成方
法。2. The atmosphere gas is supplied from an atmosphere gas injection nozzle, and the gas ejection tip side of the atmosphere gas injection nozzle is a straight cylinder guide, and this straight cylinder guide is arranged coaxially with the capillary to supply the atmosphere gas to the capillary. The method of forming a wire ball according to claim 1, wherein the wire is jetted and supplied along the axial direction.
ャピラリに通された金属ワイヤの先端に間隙を介して対
向する放電電極と、該放電電極と金属ワイヤ先端を含む
スパーク空間領域に還元ガスを含む雰囲気ガスを供給す
る雰囲気ガス噴射ノズルとを有し、雰囲気ガス噴射ノズ
ルから噴射される雰囲気ガスの雰囲気中で放電電極と金
属ワイヤ先端間に放電を行い、この放電エネルギによっ
て金属ワイヤ先端を溶融して金属ワイヤ先端にボールを
形成するワイヤボールの形成装置において、前記雰囲気
ガス噴射ノズルのガス噴出先端側は直筒ガイドと成し、
この直筒ガイドはキャピラリと同軸状に配置して噴出雰
囲気ガスをキャピラリの軸長方向に沿わせてキャピラリ
の先端側に噴出供給する構成としたワイヤボールの形成
装置。3. A reducing gas is supplied to a capillary through which the metal wire is passed, a discharge electrode facing the tip of the metal wire passed through the capillary with a gap, and a spark space region including the discharge electrode and the tip of the metal wire. An atmosphere gas injection nozzle for supplying an atmosphere gas containing the gas, and discharges between the discharge electrode and the metal wire tip in the atmosphere of the atmosphere gas injected from the atmosphere gas injection nozzle, and the discharge energy melts the metal wire tip. In the wire ball forming apparatus for forming a ball on the tip of the metal wire, the gas ejection tip side of the atmosphere gas ejection nozzle is a straight tube guide,
This wire guide forming apparatus is arranged coaxially with the capillary, and is configured to supply the jet atmosphere gas to the tip side of the capillary along the axial direction of the capillary.
の開口をキャピラリの後端に臨ませて設けた請求項３記
載のワイヤボールの形成装置。4. The wire ball forming apparatus according to claim 3, wherein the straight cylinder guide of the atmospheric gas injection nozzle is provided with its opening facing the rear end of the capillary.
ャピラリを囲繞してキャピラリの後部側から先端側のボ
ール形成領域にかけて伸張して設けた請求項３記載のワ
イヤボールの形成装置。5. The wire ball forming apparatus according to claim 3, wherein the straight cylinder guide of the atmospheric gas injection nozzle is provided so as to surround the capillary and extend from the rear side of the capillary to the ball forming region on the tip side.
ャピラリの先端側を局部的に囲繞してキャピラリの先方
側からボール形成領域にかけて伸張して設けた請求項３
記載のワイヤボールの形成装置。6. The straight pipe guide of the atmosphere gas injection nozzle is provided so as to locally surround the tip end side of the capillary and extend from the tip side of the capillary to the ball forming region.
The wire ball forming apparatus described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6211789A JPH0855869A (en) | 1994-08-12 | 1994-08-12 | Forming method for wire ball and its device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6211789A JPH0855869A (en) | 1994-08-12 | 1994-08-12 | Forming method for wire ball and its device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0855869A true JPH0855869A (en) | 1996-02-27 |
Family
ID=16611639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6211789A Pending JPH0855869A (en) | 1994-08-12 | 1994-08-12 | Forming method for wire ball and its device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0855869A (en) |
-
1994
- 1994-08-12 JP JP6211789A patent/JPH0855869A/en active Pending
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