JPH0846409A - Nonreversible circuit element - Google Patents

Abstract

PURPOSE:To provide a nonreversible circuit element capable of easily coping with a shape change and reducing loss without solder melting due to heat dissipation by using a printed circuit board for an I/O terminal plate. CONSTITUTION:For the I/O terminal plate 1, the printed circuit board whose both surfaces are copper-plated is etched, I/O terminal electrodes 1a and 1b and ground terminal electrodes 1c and 1d are formed on the surface of the I/O terminal plate 1 and the I/O terminal electrodes 1aa and 1bb and the ground terminal electrode 1cd are formed on the back surface respectively. Since the covered copper (terminal) of the I/O terminal plate 1 is as thin as 50mum, the heat of reflow is hardly transmitted to the inner part of an isolator and is dissipated around. Also, since the area of the ground terminal electrode 1cd on the back surface is widened, ground impedance is made small and the loss of the isolator is reduced. Since the printed circuit board is used for the I/O terminal plate 1, the shape change by various requirements is easily coped with at low price.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nonreciprocal circuit device such as an isolator or a circulator having an I / O terminal board formed of a printed circuit board.

[0002]

2. Description of the Related Art Among conventional non-reciprocal circuit devices, a general structure of an isolator is shown in a developed view in FIG. In this development view, the isolator is turned upside down. In the figure, 21 is an I / O terminal board, 22 is a lower yoke, 2
3 is a single plate capacitor, 24 is a chip resistor, 25 is a metal plate, 26 is a ferrite assembly, 27 is a resin case, 28 is a magnet, and 29 is an upper yoke.

The isolator having the conventional structure is composed of the above-mentioned expanded parts, and the details of the I / O terminal board 21 are shown in FIG. In the figure, 21a and 21b are
These are metal I / O terminals, and these metal I / O terminals 21a and 21b are inserted into the resin 21e by a mold and molded. In addition, these metal I / O terminals 2
1a and 21b have their other ends 21aa and 21bb
It extends continuously to the back surface (the same applies in the figure below).

Further, although 21c and 21d are metal ground terminals, these metal ground terminals 21c and 21d are used.
11 is commonly connected to a common ground 2 as shown in FIG.
It is 1 cd and appears on the back side.

[0005]

However, the I / O terminal board 21 shown in FIGS. 9, 10 and 11 has the following problems. 1. The structure of the I / O terminal plate 21 requires a change of the mold or a new mold depending on the shape of the wiring pattern of the board on which the I / O terminal plate 21 is mounted, which increases the cost.

2. The metal I / O terminals 21a and 21b
For the ground terminals 21c and 21d, brass or phosphor bronze having high strength is used. However, in the isolator, a high-frequency current flows through the terminals, and therefore brass or phosphor bronze, which has poor electric conductivity, causes an increase in loss. Further, since copper having good electric conductivity is soft and easily deformed, there is a problem that it is difficult to insert copper into a resin as a metal terminal.

3. Since the metal I / O terminals 21a and 21b require strength, the thickness of the terminals is set to 0.1 to 0.1.
It needs to be 5 mm. Then thick metal I /
Since the O terminals 21a and 21b transmit heat well, when heat is applied from below when the isolator is solder-mounted on the circuit board, in the structure of the isolator as shown in FIG. 9, the metal I / O terminals 21a and 21b and Metal ground terminal 21
Heat is transferred from the c and 21d to the entire isolator, and the solder inside the isolator may melt, resulting in lack of reliability. Therefore, according to the present invention, by using a printed circuit board for the I / O terminal board, it is possible to easily cope with a shape change, and by using a thin copper-clad printed circuit board having good electrical conductivity, It is an object of the present invention to provide a non-reciprocal circuit device that can reduce loss and that heat does not escape to the surroundings and is not transmitted to the isolator body, so that there is no fear of solder melting. Still another object is to form the I / O terminal electrode and the ground terminal electrode of the I / O terminal board formed of the printed circuit board by the surface electrode or the side surface electrode formed on the printed circuit board or a combination thereof. An object is to provide a reversible circuit element.

[0008]

The solution to the problem of the present invention is that the I / O terminal electrode and the ground terminal electrode of the I / O terminal plate formed by the printed circuit board are
A non-reciprocal circuit device including at least one of a surface electrode formed on the mounting surface of the / O terminal plate and a side electrode formed on the side surface of the I / O terminal plate.

[0009]

According to the present invention, by using the printed circuit board for the I / O terminal board, it is possible to quickly and quickly meet the required shape changes at a low cost. Further, the loss of the isolator can be reduced by using the printed circuit board having good electric conductivity. Further, by using a thin copper-clad printed circuit board, heat due to solder reflow escapes to the surroundings and is not transmitted to the isolator body, so that the internal solder does not melt. Further, since the I / O terminal electrode and the ground terminal electrode are constituted by the surface electrode or the side surface electrode formed on the printed circuit board or both of them, the terminal electrode structure becomes compact and simple.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded view showing components of an isolator according to an embodiment of the present invention. In this development view, the isolator is turned upside down. In the figure, 1 is an I / O terminal plate, 2 is a lower yoke, 3 is a single plate capacitor, 4 is a chip resistor, 5 is a metal plate, 6 is a ferrite assembly, 7 is a resin case, 8 is a magnet, and 9 Is the upper yoke. In the present embodiment, among these developed parts, the means is applied to the I / O terminal board 1. Details of the I / O terminal board 1 are shown in FIG. 1A is a plan view of the I / O terminal board 1, and FIG. 1B is a rear view of the same.

As shown in FIG. 2, the I / O terminal board 1 is formed by etching a double-sided copper-clad printed circuit board to form an I / O on the surface of the I / O terminal board 1 (the same applies in the drawings). The terminal electrodes 1a and 1b, the ground terminal electrodes 1c and 1d, and the I / O terminal electrodes 1aa and 1bb and the ground terminal electrode 1cd are formed on the back surfaces thereof, respectively. The front surface I / O terminal electrodes 1a and 1b and the rear surface I / O terminal electrodes 1aa and 1bb, and the front surface ground terminal electrodes 1c and 1d and the rear surface ground terminal electrode 1cd are respectively I / O terminal plates. 1 side surface is connected.

In this embodiment, the solder connection with the mounting substrate electrode is performed by the I / O terminal electrodes 1a and 1b and the ground terminal electrode 1.
c, 1d surface electrodes, or notched side surface electrodes thereof, or both of them.

Since the thickness of the coated copper (terminal) of the I / O terminal board 1 used in this embodiment is as thin as 50 μm, the heat of reflow is difficult to be transferred to the inside of the isolator and is dissipated to the surroundings. Further, since the area of the ground terminal electrode 1cd on the back surface is widened, the ground impedance (common impedance) is reduced and the loss of the isolator is reduced.

FIG. 3 shows an I / O terminal board 31 which is another modification of the I / O terminal board 1 in FIG. 1, and FIG. 3A is a plan view of the I / O terminal board 31. B is also a back view. 3B is similar to FIG. 2B, but FIG.
A little different from A. That is, in FIG. 3A, I / O
On the surface of the terminal plate 31, the ground terminal electrodes 1c, 1d
Are connected to each other to form a wide earth pattern 1cd '. The wide ground pattern 1cd 'is covered and insulated by the resist (hatched portion). In this way, by widening the ground terminal electrode, the ground is strengthened and the loss is further reduced. The parts corresponding to those in the embodiment shown in FIG. 2 are designated by the same reference numerals and the description thereof will be omitted.

FIG. 4 shows an I / O terminal board 41 which is another modification of the I / O terminal board 1 in FIG. 1. FIG. 4A is a plan view of the I / O terminal board 41. B is also a back view. A ground terminal electrode 1e is separately provided between the I / O terminal electrodes 1a and 1b on the front surface of the I / O terminal plate 41, and is connected to the ground terminal electrode 1cd on the back surface at its side surface. The additional surface electrode and notched side surface electrode of the ground terminal electrode 1e can improve the mounting and fixing force to the circuit board. Others are the same as those in the embodiment shown in FIG.

FIG. 5 shows an I / O terminal board 51 which is another modification of the I / O terminal board 1 in FIG. 1, and FIG. 5A is a plan view of the I / O terminal board 51. B is also a back view. The area of the ground terminal electrodes 1c and 1d on the surface of the I / O terminal plate 51 is increased to improve the soldering strength with the board to be mounted and reduce the loss. Others are the same as those of the embodiment shown in FIG. 2, so the same reference numerals are given and the description thereof is omitted.

FIG. 6 shows an I / O terminal board 61 which is another modification of the I / O terminal board 1 in FIG. 1, and FIG. 6A is a plan view of the I / O terminal board 61. B is also a back view. The I / O terminal electrode 1a of the I / O terminal plate 61,
The side provided with 1b and the ground terminal electrodes 1c and 1d is changed to another relative side. In this way, it is possible to easily cope with a change in the terminal electrode arrangement. Others are almost the same as those of the embodiment shown in FIG. 2, and therefore, corresponding portions are given the same numbers and their explanations are omitted.

FIG. 7 is an exploded view showing parts of a circulator according to another embodiment of the present invention. In this developed view, the circulator is turned upside down. In the figure, 11 is an I / O terminal board, 12 is a lower yoke, and 13
Is a single plate capacitor, 14 is a metal plate, 15 is a ferrite assembly, 16 is a resin case, 17 is a magnet, and 18 is an upper yoke.

Details of the I / O terminal board 11 in this embodiment are shown in FIG. 1A is a plan view of the I / O terminal board 11, FIG. 1B is a rear view thereof, and FIG.
As shown in FIG. 8, the I / O terminal board 11 has double-sided copper-clad 3
I / O terminal board 1 by etching layer printed circuit board
I / O terminal electrodes 11a, 11b, 11c,
Ground terminal electrodes 11d and 11e are provided, and I /
O terminal electrodes 11aa, 11bb, 11ca, 11cb,
The ground terminal electrodes 11de are provided respectively. Then, the I / O terminal electrodes 11a, 11b, 1 on the front surface
1c and back side I / O terminal electrodes 11aa, 11bb, 11
ca (11cb) are connected to the side surfaces of the I / O terminal board 11, respectively, and the ground terminal electrodes 11d and 11e on the front surface and the ground terminal electrode 11de on the back surface are connected to each other. The front I / O terminal electrode 11c is commonly connected to the two I / O terminal electrodes 11ca and 11cb on the back surface, and the manner of connection is shown in FIG. 8C. That is, it is done via the intermediate electrode layer 11f and the through hole 11g of the I / O terminal board 11. Then, the I / O terminal electrode 11c is connected to the mounting substrate electrode only at the surface electrode.

In the above embodiment, the case where the I / O terminal boards of the isolator and the circulator are made of a printed circuit board is shown. Examples of the material of this printed circuit board include high-frequency resin, glass epoxy, fluororesin, fluororesin glass, polyimide, glass thermosetting PPO, and dielectric-containing resin-based material.
And so on. Since the present invention uses the printed circuit board for the I / O terminal board as shown in the above embodiment, it is possible to quickly deal with various shape changes without using an expensive and time-consuming mold. .

[0021]

According to the present invention, since the printed circuit board is used for the I / O terminal board, it is possible to easily meet the demanded shape changes at a low cost. Further, the loss of the isolator can be reduced by using the printed circuit board having good electric conductivity. Further, by using a thin copper-clad printed circuit board, heat due to solder reflow escapes to the surroundings and is not transmitted to the isolator body, so that the solder does not melt.

Further, since the I / O terminal electrode and the ground terminal electrode are constituted by the surface electrode or the side surface electrode formed on the printed circuit board or both of them, the terminal electrode structure becomes compact and simple.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an isolator according to an embodiment of the present invention.

2 shows the details of the I / O terminal board shown in FIG. 1, where A is a plan view and B is a rear view.

3 shows a modified embodiment of the I / O terminal board shown in FIG. 1, where A is a plan view and B is a rear view.

4 shows another modified embodiment of the I / O terminal board shown in FIG. 1, where A is a plan view and B is a rear view.

5 shows another modified embodiment of the I / O terminal board shown in FIG. 1, where A is a plan view and B is a rear view.

6 shows another modified embodiment of the I / O terminal board shown in FIG. 1, where A is a plan view and B is a rear view.

FIG. 7 is an exploded perspective view of a circulator according to another embodiment of the present invention.

8 shows the details of the I / O terminal board shown in FIG. 7, where A is a plan view, B is a rear view, and C is a cross-sectional view taken along line XX of A.

FIG. 9 is an exploded perspective view of a conventional isolator.

FIG. 10 is a perspective view showing the details of the I / O terminal board shown in FIG.

11 is a sectional view taken along line YY of FIG.

[Explanation of symbols]

1, 11 I / O terminal plate 2, 12 Lower yoke 3, 13 Single plate capacitor 4 Chip resistor 5, 14 Metal plate 6, 15 Ferrite assembly 7, 16 Resin case 8, 17 Magnet 9, 18 Upper yoke 1a, 1b 1aa, 1bb I / O terminal electrode 1c, 1d, 1cd, 1e Ground terminal electrode 11a, 11b, 11c I / O terminal electrode 11aa, 11bb, 11ca, 11cb I / O terminal electrode 11d, 11e, 11de Ground terminal electrode

Claims (1)

[Claims] 1. An I / formed by a printed circuit board.
The I / 0 terminal electrode and the ground terminal electrode of the O terminal plate are the surface electrodes formed on the mounting surface of the I / O terminal plate;
A nonreciprocal circuit device including at least one of side electrodes formed on a side surface of an O terminal plate.