JPH08340175A - Manufacturing device and method of electronic part provided with bump - Google Patents

Abstract

PURPOSE: To provide a method and a device for manufacturing an electronic part provided with bumps, wherein a series of steps where solder balls used for forming bumps on a work are picked up and mounted collectively on the work for the formation of an electronic part provided with bumps are automatically and continuously carried out. CONSTITUTION: There are provided a solder ball feeding section 4, a flux applying section 6, and a guide rail which positions a board. The flux applying section 6 is equipped with a storing tank 7 of flux 9, an endless belt 8, and a smoothing head 10 possessed of a sqeegee 18. The smoothing head 10 is provided outside a range of movement of a head 21. A first light source 40, a second light source, a light emitting section, and a photodetecting section are provided for checking solder balls for pickup failures, dropping, and mounting failures.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bumper-equipped electronic component manufacturing apparatus and method for forming bumps on electrodes of a workpiece to manufacture bumped electronic components.

[0002]

2. Description of the Related Art As a method of manufacturing a bumped electronic component by forming bumps (protruding electrodes) on electrodes of a work, a method using solder balls is known. In this method, the solder balls are transferred and mounted on the electrodes of the work by the transfer means, and then the work is heated in a heating furnace to melt and solidify the solder balls to generate bumps. This method is extremely advantageous in terms of work efficiency because a large number of bumps can be collectively formed on the electrodes of the work to manufacture the bumped electronic component.

[0003]

However, at present, a technique in which all the steps for manufacturing electronic components with bumps are automated has not been established yet.

It is therefore an object of the present invention to provide a bumper-equipped electronic component manufacturing apparatus and method capable of automatically mounting a solder ball on an electrode of a work with good workability to manufacture a bumped electronic component.

[0005]

To this end, the present invention provides a solder ball supply section, a flux coating section, a work positioning section, a transfer means for transferring a solder ball, and the transfer means for the solder. A manufacturing apparatus for a bumped electronic component, comprising: a ball supply unit, a flux coating unit, and a moving unit that moves between the workpiece positioning unit,
The flux applying section is composed of an endless belt having a surface to which the flux is attached, a power unit for rotating the endless belt, and a squeegee for smoothing the surface of the flux attached to the endless belt.

Further, the transfer means is driven by the moving means to move above the solder ball supply section to pick up the solder balls, and the endless belt having flux adhered to its surface is driven by the power section to rotate. And the step of smoothing the liquid level of this flux with a squeegee, and the transfer means moving above the endless belt, where the solder balls held on the lower surface of the transfer means are smoothed by the smoothing head. The solder ball is mounted on the upper surface of the work by causing the flux to adhere to the liquid surface of the formed flux and adhering the flux, and moving the transfer means above the positioning portion of the work and releasing the holding state there. A method of manufacturing an electronic component with bumps was configured from the steps.

[0007]

According to the above construction, the steps from picking up the solder balls of the solder ball supply portion to mounting them on the work to manufacture the electronic component with bumps can be automatically performed. Further, by depositing the flux in a layered form having a predetermined thickness on the surface of the endless belt and transferring the flux onto the solder balls, an appropriate amount of flux is deposited on the solder balls and the bumps can be formed well.

[0008]

Embodiments of the present invention will now be described with reference to the drawings. 1 is a manufacturing process diagram of an electronic component with bumps according to an embodiment of the present invention, FIG. 2 is a plan view of a manufacturing apparatus for the electronic component with bumps, and FIG. 3 is provided for the manufacturing device for the electronic component with bumps. It is a side view of a flux application part. FIG. 4
FIGS. 5A and 5B are cross-sectional views of main parts of the lower surface of the solder ball while flux is being applied, and FIGS. 5A and 5B are cross-sectional views of main parts of the solder ball being mounted on electrodes of the substrate. Is the same as the head
FIG. 7 is a front view of the light source of FIG. 7, and FIG. 7 is a front view of the head, a light emitting unit and a light receiving unit.

First, with reference to FIG. 1, a brief description will be given of the whole manufacturing process of the electronic component with bumps. In FIG. 1 (a), 3
Is a substrate as a work. As shown in FIG. 1B, the electrodes 20 are formed on the upper and lower surfaces of the substrate, and the electrode 2
A through hole 3a for electrically connecting 0s is formed.

Next, the chip C is mounted on the upper surface of the substrate 3 (FIG. 1C), and the electrode on the upper surface of the chip C and the electrode 20 on the upper surface of the substrate 3 are connected by the wire W (FIG. 1D). . Next, a mold body M that protects the chip C and the wire W is formed of synthetic resin (FIG. 1E). Next, the substrate 3 is turned upside down to mount the solder balls 5 on the upper surface of the electrode 20 (see FIG. 1).
(F)). Next, the substrate 3 is sent to a heating furnace and heated to melt and solidify the solder balls 5 to form bumps 5 '(FIG. 1 (g)).

Through the above steps, the bumped electronic component is completed.
Next, the steps of FIGS. 1F and 1G, that is, the step of mounting the solder balls 5 on the bump electrodes 20 and forming the bumps 5 ′ will be described in detail with reference to the drawings.

In FIG. 2, reference numeral 3 denotes the substrate shown in FIG. 1 (e), which is turned upside down, and a mold body M for molding the chip C is formed on the lower surface thereof. Reference numeral 1 is a table, and two guide rails 2 are arranged in the center of the upper surface of the table. The substrate 3 is conveyed along the guide rail 2 and is clamped by the guide rail 2 to be positioned at a predetermined position. In the present invention, the conveyance direction of the substrate 3 by the guide rail 2 is the X direction, and the direction orthogonal to this is the Y direction. A solder ball supply unit 4 is provided at a corner of the table 1. As shown in FIG. 3, the supply unit 4 is composed of a box, and a large amount of solder balls 5 are stored therein.

2 and 3, a flux coating section 6 is provided at the other corner of the table 1.
The flux applying section 6 includes a storage tank 7 for the flux 9,
An endless belt 8 and a smoothing head 10 are provided. The endless belt 8 is tuned to a pulley 11 and is driven by a motor 12 which is a power unit to rotate. 13 is a transmission belt. The lower part of the endless belt 8 is immersed in the flux 9 stored in the storage tank 7. Therefore, by dipping the lower running portion of the endless belt 8 in the flux 9 and running the flux, a proper amount of the flux 9 can be stably attached to the surface of the endless belt 8. The upper running portion of the endless belt 8 is exposed on the liquid surface of the flux 9, and is supported from below by the horizontal plate 14 to keep the upper running portion horizontal.

The smoothing head 10 is provided with a base plate 15 which is installed above the storage tank 7. Height adjusting tool 1 on the base plate 15
6 is installed, and a squeegee 18 is coupled to the lower end of the rod 17. By adjusting the height of the squeegee 18 with the height adjuster 16, the size of the gap between the lower end of the squeegee 18 and the surface of the endless belt 8 is adjusted. In FIG. 3, by rotating the endless belt 8 in the clockwise direction, the liquid surface of the flux 9 attached to the surface of the endless belt 8 is made flat and smooth. In FIG. 2, a solder ball recovery unit 19 is installed below the guide rail 2. The recovery unit 19 is composed of a box.

Next, a head as a solder ball transfer means and its moving means will be described. In FIGS. 2 and 3, reference numeral 21 is a box-shaped head. A suction hole 22 for vacuum-sucking and holding the solder ball 5 is provided on the lower surface of the head 21.
Are formed in a matrix (see also FIG. 4A). The head 21 is connected to a blower device (not shown) via a tube 23, and the inside of the head 21 is evacuated by the operation of the blower device, and the solder balls 5 are vacuum-sucked to the suction holes 22. Hold. Further, the vacuum suction of the blower device is released, or the blower device is operated in the reverse direction to blow air into the inside of the head 21, so that the holding state of the head 21 due to the vacuum suction is released, and the solder ball 5 holds the suction hole. It drops from 22. As a means for transferring the solder balls, in addition to the head 21, a method of attaching the solder balls to an adhesive tape and transferring the solder balls is also known.

In FIG. 2, a long frame 24 is installed above the table 1. A feed screw 25 and a guide rail 26 are arranged in parallel on the frame 24. 27 is a motor for rotating the feed screw 25. A nut 28 that is screwed into the feed screw 25 is coupled to the head 21. Therefore, when the motor 27 is driven and the feed screw 25 rotates, the nut 28 horizontally moves in the X direction along the feed screw 25, and the head 21 also moves in the guide rail 26.
Move horizontally in the X direction.

Both ends of the frame 24 are slidably installed on the guide rails 29 and 30. The guide rails 29 and 30 are orthogonal to the guide rail 26. Further, a feed screw 31 is arranged in parallel with the guide rail 29. A nut (not shown) with which the feed screw 31 is screwed is provided on the lower surface of the frame 24.
Therefore, when the motor 32 is driven to rotate the feed screw 31, the frame 24 and the head 21 connected to the frame 24 are rotated.
Moves horizontally in the Y direction along the guide rails 29 and 30.

As described above, the feed screws 25 and 31, the guide rails 26, 29 and 30, the motors 27 and 32, etc.
A moving means for horizontally moving the head 21 in the X direction and the Y direction is configured, whereby the head 21 moves between the solder ball supply portion 4, the flux application portion 6, and the substrate 3 positioned on the guide rail 2. Move freely. In FIG. 2, A is a moving range of the head 21. As shown in the figure, the smoothing head 10 is arranged outside the movement range A of the head 21, and by arranging in this way, even if the head 21 freely moves within the movement range A, the smoothing head 10 I try not to collide with.

Next, the inspection means will be described. In FIG. 2, reference numeral 40 denotes a long first light source. The first light source 40 is installed between the solder ball supplying section 4 and the flux applying section 6 and emits light from below toward the lower surface of the head 21 (see FIG. 6). An optical sensor 41 is built in the head 21. Therefore, when the solder balls 5 are vacuum-sucked in all the suction holes 22,
The suction holes 22 are completely shielded by the solder balls 5 and light does not enter the optical sensor 41. However, when the solder balls 5 are not vacuum-sucked to any of the suction holes 22, the first light source 40 emits light. The generated light passes through the suction hole 22 and enters the optical sensor 41. This reveals that the solder ball 5 has been picked up incorrectly. Ie the first
The light source 40 and the optical sensor 41 are inspection means for inspecting whether the solder balls 5 are correctly vacuum-sucked in all the suction holes 22, that is, whether or not there is a pickup error.

In FIG. 2, a second light source 42 is installed between the flux applying section 6 and the guide rail 2. Similarly to the first light source 40, the second light source 42 emits light toward the lower surface of the head 21, and whether or not the solder balls 5 are properly vacuum-sucked in all the suction holes 22, that is, the solder balls 5 Inspect for drop (see FIG. 6).

The reason for installing the second light source 42 is as follows. That is, the head 21 is moved up and down above the endless belt 8 to cause the solder balls 5 vacuum-adsorbed on the lower surface thereof to land on the flux 9 and to attach the flux 9 to the lower surface (see FIG. Since the flux 9 has a large viscosity, the solder ball 5 may drop from the suction hole 22 due to the viscosity when the solder ball 5 is brought into contact with the flux 9. When the head 21 from which the solder balls 5 have fallen off is moved above the substrate 3 to mount the solder balls 5 on the substrate 3, the substrate 3 becomes a defective product in which the solder balls 5 are insufficient. Therefore, during the movement of the head 21 to the substrate 3, it is inspected by the second light source 42 and the optical sensor 41 whether or not the solder balls 5 are correctly vacuum-sucked in all the suction holes 22. That is, the optical sensor 41 and the second light source 42 are
It is an inspection means for inspecting whether or not the solder ball 5 has fallen.

In FIG. 2, the guide rail 2 and the supply unit 4 are shown.
A light emitting portion 43 and a light receiving portion 44 are provided between them. As shown in FIG. 7, light is emitted horizontally from the light emitting unit 43 toward the light receiving unit 44. The head 21 mounts the solder balls 5 on the substrate 3 and then moves between the light emitting portion 43 and the light receiving portion 44 in a direction orthogonal to the optical path to move the solder ball supplying portion 4 to the solder ball supplying portion 4.
However, if the solder balls 5 remain attached to the lower surface of the head 21, the light is blocked and the light receiving portion 44 does not receive the light. If all the solder balls 5 are mounted on the substrate 3 and no solder balls 5 remain on the lower surface of the head 21, the light emitted from the light emitting section 43 is received by the light receiving section 44. As a result, it is inspected whether or not the solder balls 5 remain attached to the lower surface of the head 21, that is, whether or not the head 21 has mounted all the solder balls 5 on the substrate 3 and whether or not there is a mounting error.

This bumper-equipped electronic component manufacturing apparatus is configured as described above. Next, the operation for performing the steps shown in FIGS. 1F and 1G will be described. In FIG. 2, the head 21 moves above the solder ball supply portion 4 (arrow B). Therefore, the head 21 moves up and down, and the solder balls 5 are vacuum sucked and picked up by the suction holes 22 on the lower surface thereof. The description of the mechanism for causing the head 21 to move up and down is omitted.

In FIG. 2, the head 21 then moves to the left (above the first light source 40) (arrow B), and as described with reference to FIG. To inspect. If there is a pick-up error, the head 21 returns to above the solder ball supply unit 4 (arrow C), and again performs vertical movement to pick up the solder ball 5 and move it to the left again. Then, the first light source 40 is used to re-examine the presence or absence of a pickup error.

When there is no pick-up error and the solder balls 5 are correctly vacuum-sucked and held in all the suction holes 22, the head 21 moves above the endless belt 8 (arrow D). Before and after this, as described with reference to FIG. 3, the endless belt 8 rotates and the squeegee 18 smoothes the liquid surface of the flux 9. Then, the head 21 moves up and down to attach the flux 9 to the lower surface of the solder ball 5 which is vacuum-adsorbed on the lower surface thereof. FIG.
(A) and (b) show the operation.

Next, in FIG. 2, the head 21 moves from above the endless belt 8 to above the second light source 42 (arrow E), and as described with reference to FIG. Inspect for presence. If it is found that one or more solder balls 5 are falling from the lower surface of the head 21, the head 21 moves above the collecting portion 19 (arrow C) and is vacuum-adsorbed on the lower surface. All the solder balls 5 present are dropped onto the recovery unit 19. The head 21 that has dropped all the solder balls 5 moves to above the solder ball supply unit 4 and repeats the above-described operation.

Now, in FIG. 2, when it is detected by the second light source 42 that the solder balls 5 have not fallen, the head 21 moves above the substrate 3 (to the arrow) and moves up and down there. At the same time, the vacuum suction state of the solder balls 5 is released, so that all the solder balls 5 are collectively mounted on the substrate 3.

Next, the head 21 includes a light emitting portion 43 and a light receiving portion 44.
(Arrow B), and then toward the supply unit 4 (arrow B). At this time, as described with reference to FIG. 7, it is inspected whether or not the solder balls 5 remain attached to and are held on the lower surface of the head 21. Here, if it is detected that the solder balls 5 remain adhered, it is because the solder balls 5 have been improperly mounted on the substrate 3, that is, due to a mounting error, and the head 21 of the recovery unit 19 is not mounted. The solder balls 5 are moved upward and dropped into the collecting portion 19 to be collected. The board 3 is defective because the solder balls 5 are missing, and is removed to the outside of the line.

Next, the head 21 is connected to the solder ball supply unit 4
, And the above operation is repeated. The board 3 on which the solder balls 5 are properly mounted is conveyed along the guide rail 2 toward the next step. As described above, according to this bumper-equipped electronic component manufacturing apparatus, the head automatically picks up the solder balls in the supply section, attaches the flux to the solder balls, and automatically mounts a series of operations on the board. Can be done by In addition, the presence or absence of a solder ball pickup error, a drop in the middle of the solder ball, or a mounting error on the board can be quickly detected during each process, and if there is such a mistake, a recovery operation can be performed quickly. it can.

[0030]

According to the present invention, all the steps from picking up the solder balls of the solder ball supply portion to mounting them on the work can be automatically performed according to the present invention. Also, by configuring the flux application part with an endless belt or squeegee, it is possible to apply an appropriate amount of flux to the solder balls, and by further immersing the endless belt in the flux of the storage tank, the flux is stabilized on the surface. Can be attached to. Further, the head can be prevented from colliding with the smooth head, and the solder balls can be mounted while freely moving the transfer means. In addition, the presence or absence of a solder ball pick-up error, a drop in the middle, or a mounting error on a work such as a board is quickly detected during each process. ) Can perform actions.

[Brief description of drawings]

FIG. 1 is a manufacturing process diagram of an electronic component with bumps according to an embodiment of the present invention.

FIG. 2 is a plan view of an apparatus for manufacturing electronic components with bumps according to an embodiment of the present invention.

FIG. 3 is a side view of a flux applying section provided in the bumped electronic component manufacturing apparatus according to one embodiment of the present invention.

FIG. 4 is a cross-sectional view of an essential part of the solder ball of the manufacturing apparatus of the electronic component with bumps according to the embodiment of the present invention, in which flux is applied to the lower surface of the solder ball.

FIG. 5 is a cross-sectional view of essential parts of a solder ball of an electronic component manufacturing apparatus with bumps according to an embodiment of the present invention being mounted on electrodes of a substrate.

FIG. 6 is a front view of a head and a first light source of an apparatus for manufacturing electronic components with bumps according to an embodiment of the present invention.

FIG. 7 is a front view of a head, a light emitting section, and a light receiving section of a bumper-equipped electronic component manufacturing apparatus according to an embodiment of the present invention.

[Explanation of symbols]

 2 Guide rail (workpiece positioning part) 3 Board (workpiece) 4 Solder ball supply part 5 Solder ball 6 Flux applying part 7 Storage tank 8 Endless belt 9 Flux 10 Smoothing head 12 Motor 18 Squeegee 19 Collecting part 21 Head (transferring) 22) suction hole 25 feed screw 27 motor 28 nut 31 feed screw 32 motor 40 first light source 41 optical sensor 42 second light source 43 light emitting unit 44 light receiving unit

Claims (8)

[Claims] 1. A solder ball supply section, a flux application section, a workpiece positioning section, a transfer means for transferring a solder ball, and the transfer means for the solder ball supply section and the flux application section. A device for manufacturing an electronic component with bumps, comprising: a moving means for moving between the positioning parts of the work, wherein the flux applying part has an endless belt to which flux is attached, and the endless belt. An apparatus for manufacturing electronic components with bumps, comprising: a power unit that rotates and a squeegee that smoothes the surface of the flux attached to the endless belt. 2. The manufacturing apparatus for electronic components with bumps according to claim 1, wherein the endless belt is installed in a flux storage tank. 3. An inspection means for inspecting whether or not the solder ball is properly held by the transfer means is provided between the solder ball supply portion and the flux application portion. 1. A manufacturing apparatus for electronic components with bumps according to 1. 4. An inspection means for inspecting whether or not the solder balls are properly held by the transfer means is provided between the flux coating section and the work positioning section. The manufacturing apparatus for the electronic component with bumps described. 5. An inspection means is provided between the positioning portion of the work and the solder ball supply portion to inspect whether the solder balls remain in the transfer means. Item 1. An apparatus for manufacturing an electronic component with bumps according to Item 1. 6. A step of driving the transfer means to move above the solder ball supply section by being driven by the moving means to pick up the solder ball, and an endless belt having flux adhered to its surface driven by the power section. Rotating, and at that time, a step of smoothing the liquid surface of this flux by a squeegee, and the transfer means moved above the endless belt, where the solder balls held by the transfer means were smoothed by the squeegee. A step of causing water to adhere to the liquid surface of the flux to attach the flux, and moving the transfer means above the positioning portion of the work,
Therefore, the method of manufacturing an electronic component with bumps, comprising: mounting the solder ball on the upper surface of the work by releasing the holding state. 7. A method for manufacturing an electronic component with bumps, comprising: a step of forming a work having a substrate on which bumps are formed; and a step of forming bumps on the electrodes. The process of being driven to move above the solder ball supply unit and picking up the solder ball, and the endless belt having the flux adhered to its surface is driven by the power unit to rotate, and at this time, this flux is generated by the squeegee. And a step of smoothing the liquid surface of the flux, the transfer means moves above the endless belt, where the solder balls held by the transfer means are allowed to land on the liquid surface of the flux smoothed by the squeegee to form the flux. A step of adhering, moving the transfer means above the positioning part of the work,
Therefore, the method of manufacturing an electronic component with bumps, comprising: mounting the solder ball on the upper surface of the work by releasing the holding state. 8. The transfer means is in the process of moving from the flux coating section to the workpiece positioning section,
Whether or not the solder balls have fallen from the transfer means is inspected by an inspection means, and when the solder balls are dropped, the transfer means is moved to above the solder ball recovery part and the holding state is maintained there. 8. The method of manufacturing an electronic component with bumps according to claim 6, further comprising the step of releasing the solder balls and dropping the solder balls into the collecting portion to collect the solder balls.