JPH08340065A - Cooling device for electronic parts - Google Patents

Abstract

PURPOSE: To provide a high efficient cooling device for semiconductor chip which has a low height and a small volume. CONSTITUTION: A cooling device for electronic parts is used for electronic parts 2 having heat radiating fins and is provided with a base plate 18 on which the heat radiating fins come into contact with the heat radiating surface of the parts 2, fin walls 20 which are provided on the surface of the base plate 18 opposite to the parts 2 for forming flow passages 15 for cooling, and small- sized motors 14 which are formed in the flow passages 15 and have rotating shafts fitted with fans 16 at their both ends and the tops of the passages 15 are entirely or partially opened.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for cooling electronic parts, especially semiconductor chips.

[0002]

2. Description of the Related Art In various information devices such as computers and peripheral devices, and various electronic devices such as measuring devices and control devices, there is a strong demand for smaller and faster devices. Due to the rapid progress of semiconductor technology in recent years, the degree of integration and the operating speed have been dramatically improved, and the miniaturization and speedup of the various information devices and electronic devices have been significantly advanced.

As described above, the speeding up and downsizing of the equipment, that is, the increase in the degree of integration of the semiconductor and the increase in the operating speed, meanwhile, increase the power consumption of the semiconductor chip and the heat generation amount. Is causing the problem. In particular, in processor chips used as CPUs and the like, there are semiconductor chips that consume power of 10 W or more and generate heat of 100 ° C. or more.

In order to cool such a semiconductor chip, as shown in FIG. 7, a radiation fin 4 is provided on the back surface of the semiconductor chip 2, and a fan-equipped motor 6 is further provided thereon. Generate a cooling air flow by 6,
A method of forcibly cooling the semiconductor chip is adopted.

[0005]

However, a method of further installing a motor with a fan on the above-mentioned radiation fin is as follows.
There is a problem that the height of the semiconductor chip portion increases and the volume increases, which hinders downsizing of a device on which the semiconductor chip is mounted. Especially in personal computers and workstations, in order to miniaturize the device,
The space between the boards is narrowed, and the boards are brought into close contact with each other to be mounted in the housing. However, since a board on which a semiconductor chip having a motor with a fan is further mounted on such a radiation fin requires a width of two or three, it is not possible to mount the board efficiently. , The device could not be miniaturized.

Further, since the conventional motor with fan has no freedom by intake or exhaust only in the upward direction of the chip, there is another heating element in that direction, or
When the direction is covered with some kind of barrier, the heat dissipation effect is significantly reduced, and there is a problem that other electronic components are affected.

In order to solve such a problem, the applicant has proposed a cooling device shown in Japanese Patent Application No. 6-26425. However, in the cooling device disclosed in this application, a fin lid serving as a motor substrate is mounted (the cooling flow path is not an open type), and a structure with further improved cooling efficiency has been demanded.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a cooling device for a semiconductor chip which is excellent in cooling efficiency, has a low height, and has a small volume.
Another object of the present invention is to provide a semiconductor chip cooling device capable of intake and exhaust in arbitrary directions.

[0009]

DISCLOSURE OF THE INVENTION The inventor of the present invention has considered reducing the size of a motor and a fan in a cooling device in order to solve the problem that the fan is large. Then, the inventors have invented a cooling structure that produces an effective cooling effect by using a small motor and a fan. That is, the heat dissipation fins are used to form the flow paths in consideration of the flow of the cooling airflow, so that the cooling can be efficiently performed even with a small air volume.

That is, the cooling device for electronic parts of the present invention is capable of directly blowing the cooling gas in a desired direction with a heat radiation fin having a gas flow passage so that the cooling gas can flow. And a motor equipped with a fan for generating a cooling air flow installed in the flow path. Further, in the present invention, the upper portion of the flow path is open.

More specifically, an electronic component cooling device according to the present invention is an electronic component cooling device having a radiation fin, wherein the radiation fin is in contact with a radiation surface of the electronic component, and a base plate is provided. A fin wall provided on the side opposite to the electronic component of the base plate and having a cooling flow channel formed therebetween, and provided in the cooling flow channel, and having a rotation axis along the flow channel direction, A small motor with a fan attached to the end of the rotary shaft is provided, and the upper part of the cooling flow path is wholly or partially open.

A plurality of cooling channels are formed, and one or more fans and small motors can be mounted on each cooling channel. First fin walls are formed substantially parallel to each other on the base plate, and a first fin wall is formed between the first fin walls.
One or more second fin walls having a shorter length than the fin wall are formed, and the rear end of the motor to which the fan is attached can be fixed to the end of the second fin wall.

A plurality of fin walls are formed substantially parallel to each other on the base plate, and one or more fin walls are provided at the end portions of the cooling passages.
A motor is installed, and a fan driven by this motor is installed on the rotating shaft of the motor so as to come out of the cooling passage. It can also be configured so that the wind is blown into.

[0014]

In the cooling device for electronic parts of the present invention, the fin walls of the radiating fins are formed so as to secure the flow path of the cooling gas,
A motor equipped with a fan is installed in the cooling gas passage to forcibly suck and exhaust the cooling gas. Therefore, since the cooling airflow in the desired direction is directly generated by the fan in the cooling flow path, and the cooling airflow efficiently flows along the flow path,
The entire semiconductor chip can be cooled efficiently.

Further, the electronic component cooling apparatus of the present invention performs forced cooling by causing a cooling gas to flow along the flow path formed by the fin walls. Therefore, the directions of intake and exhaust can be determined in any direction by the direction of the fin wall. Further, in the cooling device according to the present invention, since the cooling flow path is of the open type, the cooling efficiency is further improved.

[0016]

First Embodiment First, a cooling device 10 according to the embodiment shown in FIG. 1 will be described. As shown in FIG. 1, the cooling device 10 of the first embodiment.
Is mounted on the surface of the semiconductor chip 2 and has a radiation fin 12. The radiating fins 12 are the base plate 1
8 and a fin wall 20, and a stripe-shaped cooling flow path 15 is formed between the fin walls. Cooling channel 15
A small motor 14 and a small fan 16 rotatably driven by a rotation shaft of the small motor 14 are arranged at both ends of the motor.
The rotation direction of the motor 14 arranged at one end of the cooling flow path 15 and the rotation direction of the motor 14 arranged at the other end are opposite to each other.
By rotating, the wind is generated in the direction of the arrow shown in FIG. 1 (direction along the cooling passage 15).

The radiating fin 12 including the base plate 18 and the fin wall 20 is formed by molding aluminum, copper, copper tungsten alloy, aluminum nitride or the like. The motor 14 that drives the fan 16 is, for example, a fin wall 20.
Small diameter stepping motor that can be stored between, or D
A C brushless motor is suitable, and a small stepping motor is used in this embodiment. Further, the motor 14 and / or the fan may be manufactured on the wall or the bottom of the cooling flow path 15 by using a micromachining technique.

In this embodiment, the cooling passages 15 formed between the fin walls 20 are all open upward.
The width of the cooling flow path 15 is not particularly limited, but is 4.2 to
About 10 mm is preferable. In such a cooling device 10,
By rotating the motor 14 at one end in the direction of intake by the fan 16 and rotating the motor 14 at the other end in the direction of exhaust, a cooling airflow in the direction of the arrow is generated in the cooling flow path 15. To do. The cooling airflow is the cooling channel 1
The heat is absorbed by the fin wall 20 while flowing through the semiconductor chip 5, and the semiconductor chip 2 is cooled.

As described above, according to the cooling device 10 of the first embodiment, the fan 1 provided between the fin walls has a height and a volume which are almost the same as those of the normal radiation fins.
The semiconductor chip 2 can be forcibly cooled by generating a cooling air flow by the motor 14 equipped with 6. That is, the cooling device of the present embodiment does not require the fan 6 portion while having a cooling capacity equal to or higher than that of the cooling mechanism according to the related art shown in FIG.

Second Embodiment A cooling device 10a for electronic parts according to this embodiment shown in FIG.
Is to be mounted on the surface of a semiconductor chip (not shown) and has a radiation fin 12a. Radiation fin 1
2a has a base plate 18a and a fin wall 20a,
An approximately swastika-shaped cooling channel 15a is formed between the fin walls 20a. A small fan 16 and a small motor 14 for driving the small fan 16 are arranged at the four ends of the cooling flow path 15a. The rotation directions of the motors 14 arranged at the four ends of the cooling flow path 15a are all preferably the same, and the rotation of the fan 16 by the motor 14 causes the fan 16 to be sucked into the cooling flow path 15a or the cooling direction. Air is generated in the direction of discharging from the flow channel 15a.

Also in this embodiment, the radiation fin 12a including the base plate 18a and the fin wall 20a is made of aluminum.
It is made by molding copper, copper tungsten alloy, aluminum nitride, etc. The motor 14 that drives the fan 16 is, for example, a small-diameter stepping motor that can be housed between the fin walls 20a or a DC brushless motor. In this embodiment, a small stepping motor is used. Also, these motors 14 and / or fans are
The wall or the bottom of the cooling channel 15a may be manufactured using a micromachining technique.

In this embodiment, all the cooling channels 15a formed between the fin walls 20a are open upward. The width of the cooling channel 15a is not particularly limited,
It is preferably about 4.2 to 10 mm. Such a cooling device 1
At 0a, the motor 14 is rotated in the direction of intake or exhaust by the fan 16 so that the cooling flow path 15
A cooling airflow is generated in a. While the cooling airflow flows through the cooling flow path 15a, heat is absorbed by the fin wall 20a and the semiconductor chip is cooled.

The cooling device 10a according to the second embodiment of the present invention also has the same operation as that of the first embodiment. Third Embodiment As shown in FIG. 3, an electronic component cooling device 10b according to the present embodiment is mounted on the surface of a semiconductor chip (not shown) and has a heat radiation fin 12b. The heat dissipation fin 12b has a base plate 18b and a fin wall 20b, and the meandering cooling flow path 15b is provided between the fin walls 20b.
Is formed. A small fan 16 and a small motor 14 for driving the small fan 16 are arranged at both ends of the cooling flow path 15b. The rotation directions of the motors 14 arranged at both ends of the cooling flow path 15b are preferably opposite to each other.
In the cooling flow path 15b, the motor 14 attached to one end rotates in the direction in which the fan 16 inhales, and the motor 14 attached to the other end rotates in the direction in which the fan 16 exhausts. The wind is generated along the direction.

Also in this embodiment, the radiation fins 12b composed of the base plate 18b and the fin wall 20b are made of aluminum.
It is made by molding copper, copper tungsten alloy, aluminum nitride, etc. As the motor 14 for driving the fan 16, for example, a small diameter stepping motor or a DC brushless motor that can be housed between the fin walls 20b is suitable, and in this embodiment, a small stepping motor is used. In this embodiment, the motor 14 is attached to the circuit board 24 provided on a part of the fin wall 15b.

In this embodiment, the cooling flow passages 15b formed between the fin walls 20b are all open upward. The width of the cooling channel 15b is not particularly limited,
It is preferably about 4.2 to 10 mm. Such a cooling device 1
At 0b, by rotating the motor 14, a cooling airflow is generated in the cooling flow path 15b. While the cooling airflow flows through the cooling flow path 15b, heat is absorbed by the fin wall 20b and the semiconductor chip is cooled.

The cooling device 10b of the third embodiment of the present invention also has the same operation as that of the first embodiment. Fourth Embodiment An electronic component cooling device 10c according to a fourth embodiment shown in FIG.
This is a modified example of the embodiment shown in FIG. 1, and the cooling channel is an open type cooling device, and the description of the configuration common to the embodiment shown in FIG. 1 will be omitted and the different portions will be described.

As shown in FIG. 4, the cooling device 1 of the present embodiment.
0c has a radiation fin 12c. Heat dissipation fin 12
c is the first fin wall portion 20c on the base plate 18c.
, And the second fin walls 20c 'are alternately arranged in a grid pattern, and cooling channels 15c are formed between these walls.

The second fin wall 20c 'corresponds to the first fin wall 2
It is formed to be shorter than 0c ', and a recess 26 communicating with two adjacent flow paths 15c is formed at the end of the fin 20c'. A fan 16c and a motor 14c for driving the fan 16c are mounted in each recess 26. Motor 14c
Is composed of, for example, a flat motor, and the rear end of the motor 14c is fixed to the end of the second fin wall 20c 'by a mounting member or the like.

In this embodiment, the fan 16c rotatably driven by the motor 14c sends (or draws) air into the two adjacent flow paths 15c. As a modification of this embodiment, between the first fin walls 20c,
By providing two or more second fin walls 20c 'and arranging the motor and fan in the resulting recesses, it is possible to blow (or draw) air with two fans into the two or more flow paths 15c. You can also do it.

As yet another modification, this fin 20
A fin lid may be provided on c and 20c 'to at least partially close the upper portion of the flow path 15c. Device 10c of this embodiment
Since it is an open type, the cooling efficiency is further improved, and there is no fan provided for each flow path of the fins.
It is possible to reduce the number of parts and improve the mounting workability.

[0031] will be described an electronic component cooling device 10d of the fifth embodiment of the fifth embodiment the present invention with reference to FIGS. The electronic component cooling device 10d of the fifth embodiment is a modification of the embodiment shown in FIG. 1, and is a cooling device in which the flow path having no fin lid is an open type.
The description of the configuration common to the embodiment shown in will be omitted, and different parts will be described.

As shown in FIG. 5, the cooling device 1 of the present embodiment.
0d has a radiation fin 12d. Heat dissipation fin 12
d, a plurality of fin walls 20d are provided on the base plate 18d.
Are alternately arranged in a grid pattern, and cooling channels 15d are formed between these wall portions. A motor 14d for driving the fan 16d is attached to the end of every other flow path 15d. The motor 14d is composed of, for example, a small stepping motor, and is placed on a holding shelf 34 formed to project from the fin wall 20d forming the flow path 15d in a substantially right angle direction, as shown in FIG. . The holding shelf 34 has a width that does not completely separate the flow path 15d.
It projects from near the center of d. This holding shelf 34
May be formed continuously in the longitudinal direction of the fin wall 20d, but may be formed intermittently only in the motor mounting portion and is integrally formed with the fin wall 20d.

Electric power is supplied to each motor 14d from the motor drive board 30 through the lead wire 32. The motor drive board 30 is arranged on the wall 20d so as to bridge the tops of the adjacent fin walls 20d. In the example shown in FIG. 5, the motor drive board 30 is provided for each motor 14d, but a single motor drive board is arranged and fixed on the top of the fin wall 20d, and electric power is supplied to each motor 14d from there. It can also be configured to do so. Further, the motor drive board 30 can also be configured so as to also serve as a fin lid.

In the present embodiment, the fan 16d which is rotationally driven by the motor 14d is arranged outside the fin wall 20d, that is, outside the radiating fin 12d. Moreover,
The outer diameter of the fan 16d is formed to be larger than the width of the flow passage 15d (however, it is not necessary to be larger than the flow passage), and not only the flow passage in which the motor 14d is arranged but also the adjacent flow Wind is also blown to the road.

Since the apparatus 10d of the present embodiment is of the open type, the cooling efficiency is further improved, and a fan is not provided for each flow path of the fin 20d, so that the number of parts is reduced and the mounting workability is improved. Can be achieved. Also,
The motor 14d is not held only by the drive board 30, but is mainly held by the holding shelf 34, so that the holding is reliable, the vibration is small, and the noise is small. Also,
The motor 14d is not only placed on the holding shelf 34, but can be fixed by a mounting bracket or the like.

The present invention is not limited to the first to fifth embodiments, and various modifications can be made. For example, the wall surfaces defining the respective flow paths of the cooling device are all flat plate-shaped wall surfaces in the above-mentioned embodiments, but the wall surfaces are not limited to this and may be wall surfaces of various shapes. For example, an uneven wall surface or a corrugated louver fin wall surface may be used.

By using such a wall surface, the surface area is increased and the cooling efficiency can be improved.

[0038]

As described above, according to the cooling device for electronic parts of the present invention, since the small motor having the small fan is installed between the fin walls, it further projects above the heat radiation fin. Forced cooling can be done without the need to install a normal fan. Therefore, the height of the cooling device can be reduced and the volume can be reduced.

Further, in the cooling device for electronic parts of the present invention, the cooling gas is sucked in and the endothermic gas is discharged in accordance with the direction of the intake / exhaust ports formed in the radiation fins. Therefore, the cooling gas can be sucked in from any direction and the endothermic gas can be discharged in any direction by using the radiation fins having appropriate flow paths and openings depending on the surroundings of the semiconductor chip. it can.

Further, in the cooling device according to the present invention, since the cooling flow path is of the open type, the cooling efficiency is further improved.

[Brief description of drawings]

FIG. 1 is a perspective view of a cooling device for electronic components according to a first embodiment.

FIG. 2 is a perspective view of a cooling device for electronic parts according to a second embodiment.

FIG. 3 is a perspective view of a cooling device for electronic parts according to a third embodiment.

FIG. 4 is a perspective view of a cooling device for electronic parts according to a fourth embodiment.

FIG. 5 is a perspective view of a cooling device for electronic parts according to a fifth embodiment.

6 is a sectional view taken along line VI-VI in FIG.

FIG. 7 is a diagram illustrating a conventional cooling method.

[Explanation of symbols]

 2 ... Semiconductor chip 10, 10a-10d ... Cooling device 12, 12a-12d ... Radiating fin 14, 14c, 14d ... Motor 15, 15a-15d ... Flow path 16 ... Fan 18, 18a-18d ... Base plate 20, 20a-. 20d, 20c '... Fin wall 24 ... Circuit board 26 ... Recess 30 ... Motor drive board 32 ... Lead wire 34 ... Holding shelf

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Keiji Shirata 1-297 Kitabukuro-cho, Omiya-shi, Saitama Mitsubishi Materials Corporation Mechatronics / Production System Development Center

Claims (4)

[Claims] 1. A cooling device for an electronic component having a radiating fin, wherein the radiating fin is provided on a base plate that abuts a radiating surface of the electronic component, and is provided on a side opposite to the electronic component of the base plate to cool between them. A fin wall having a flow passage formed therein, and a small motor provided in the cooling flow passage, having a rotary shaft along the flow passage direction, and having a fan attached to the rotary shaft end. A cooling device for electronic components, in which the upper part of the cooling flow path is opened in whole or in part. 2. The cooling device for an electronic component according to claim 1, wherein a plurality of cooling channels are formed, and at least one fan and a small motor are mounted in each cooling channel. 3. A first fin wall is formed substantially parallel to the base plate, and a second fin wall having a length shorter than that of the first fin wall is formed between the first fin walls. The cooling device for an electronic component according to claim 1, wherein the rear end of the motor, to which the fan is attached, is fixed to the end of the second fin wall formed as described above. 4. A plurality of fin walls are formed substantially parallel to each other on the base plate, and the fin walls are formed at the ends of every other cooling passage.
A motor is installed, and a fan driven by this motor is installed on the rotating shaft of the motor so as to come out of the cooling passage. The cooling device for an electronic component according to claim 3, wherein the cooling device is configured to blow air.