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JPH08288171A - Metallized film capacitor - Google Patents

Metallized film capacitor

Info

Publication number
JPH08288171A
JPH08288171A JP9332795A JP9332795A JPH08288171A JP H08288171 A JPH08288171 A JP H08288171A JP 9332795 A JP9332795 A JP 9332795A JP 9332795 A JP9332795 A JP 9332795A JP H08288171 A JPH08288171 A JP H08288171A
Authority
JP
Japan
Prior art keywords
film
metallized
electrode
fuse
vapor deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9332795A
Other languages
Japanese (ja)
Inventor
Shigeo Okuno
茂男 奥野
Yoshimasa Takeda
喜正 竹田
Toshiyuki Nishimori
敏幸 西森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP9332795A priority Critical patent/JPH08288171A/en
Publication of JPH08288171A publication Critical patent/JPH08288171A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To provide a metallized film capacitor having a stable security function even in using a high voltage. CONSTITUTION: Metallized films formed with vapor-deposited film electrodes 11, 12 on one surface of a polypropylene film 13 are stacked so that a pair of vapor-deposited film electrodes 11, 12 face to each other via the polypropylene film 13, or an electrode lead-out part 15 is provided on both end surfaces of wound elements, and one of the pair of vapor-deposited film electrodes 11 is provided with a non-metal part 14 in a center part of film width and the other vapor-deposited film electrode 12 is provided in parallel with a plurality of metal film blocks around which a non-metal part 16 is provided, in the longitudinal direction. Thereby, a fuse part 17 is provided in a center part of film width, and in resitor values of the pair of vapor-deposited film electrodes 11, 12, values of a portion connecting with an electrode lead-out part 15 and a portion connecting with the fuse part 17 are lower than the other portions, whereby it is hard to generate thermal breakdown near the fuse part even in using a high voltage.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は力率改善用の電力用コン
デンサ、電気機器用のコンデンサ、各種電源回路用のコ
ンデンサ、及び通信機器等に使用される乾式の金属化フ
ィルムコンデンサに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power capacitor for power factor correction, a capacitor for electric equipment, a capacitor for various power supply circuits, and a dry metallized film capacitor used for communication equipment and the like.

【0002】[0002]

【従来の技術】従来、中央部に帯状非金属化部(マージ
ン)を有する金属化層と、両端部側に帯状非金属化部
(マージン)を有する金属化層とが対向した電極構成の
金属化フィルムコンデンサとして、実開平3−1047
19号、実開平3−14066号や実開平3−1225
27号などが知られている。この金属化フィルムコンデ
ンサは、一素子で通常の構成によるコンデンサを2個直
列接続した構造となり、使用電圧の高い用途においては
コンパクトな設計となることから実用化されてきてい
る。
2. Description of the Related Art Conventionally, a metal having an electrode structure in which a metallized layer having a strip-shaped non-metallized portion (margin) in the center and a metallized layer having strip-shaped non-metallized portions (margin) on both end sides face each other. Film capacitor
19, No. 3-14066, Kai-Kai 3-1225
No. 27 is known. This metallized film capacitor has a structure in which two capacitors each having a normal structure are connected in series in one element, and has been put into practical use because it has a compact design in applications where a high operating voltage is used.

【0003】図4にその金属化フィルムコンデンサの構
成を示しており、図において、誘電体フィルム1上に設
けた一方の電極2は幅方向の中央に帯状非金属化部3を
設けた構成とし、他方の電極4は両端沿辺部に帯状非金
属化部5と長尺方向を分断する非金属化部(図示せず)
と幅方向の中央にヒューズ部6を設けた構成とし、誘電
体フィルム1を介して前記二つの電極を巻回し、両端面
に金属溶射法により電極引出部7を設けている。
FIG. 4 shows the structure of the metallized film capacitor. In the figure, one electrode 2 provided on the dielectric film 1 has a band-shaped nonmetallized portion 3 provided at the center in the width direction. , The other electrode 4 is a non-metallized portion (not shown) that divides the strip-shaped non-metallized portion 5 in the longitudinal direction along both ends.
The fuse portion 6 is provided at the center in the width direction, the two electrodes are wound around the dielectric film 1, and the electrode lead-out portions 7 are provided on both end faces by the metal spraying method.

【0004】このような、蒸着による金属化層を電極と
した金属化フィルムコンデンサにおいて、金属化層とし
てアルミニウムと亜鉛またはアルミニウム−亜鉛の合金
による蒸着層が一般的に多く用いられている。そして、
アルミニウム、亜鉛、またはアルミニウム−亜鉛のどの
場合においても、蒸着膜抵抗の高い方が蒸着金属電極特
有の自己回復性能が高く、誘電体の耐圧設計が高められ
ることが知られている。
In such a metallized film capacitor having a metallized layer by vapor deposition as an electrode, a vaporized layer of aluminum and zinc or an aluminum-zinc alloy is generally used as the metallized layer. And
In any case of aluminum, zinc, or aluminum-zinc, it is known that the higher the deposited film resistance, the higher the self-recovery performance peculiar to the deposited metal electrode, and the higher the dielectric breakdown voltage design.

【0005】しかし、アルミニウム蒸着層の場合は、交
流電圧印加により経時的にコンデンサの静電容量が減少
する傾向にある。これは、蒸着アルミニウム層が局部的
に酸化アルミ化し電極としての機能を失うと考えられて
いる。このことはアルミニウム蒸着層膜の膜抵抗と大き
く関係し、膜抵抗が高くなると交流電圧印加によるコン
デンサの容量減少が大きくなるのである。従って、アル
ミニウム蒸着層を用いた金属化フィルムコンデンサでは
膜抵抗値が2〜8Ω/□の蒸着金属化層が一般的に使用
されている。
However, in the case of the aluminum vapor deposition layer, the electrostatic capacitance of the capacitor tends to decrease with the application of an AC voltage. It is considered that this is because the vapor-deposited aluminum layer locally becomes aluminum oxide and loses its function as an electrode. This is largely related to the film resistance of the aluminum vapor deposition layer film, and the higher the film resistance, the greater the decrease in the capacitance of the capacitor due to the application of the AC voltage. Therefore, in the metallized film capacitor using the aluminum vapor deposition layer, the vapor deposition metallization layer having a film resistance value of 2 to 8 Ω / □ is generally used.

【0006】亜鉛、アルミニウム−亜鉛の合金の場合
は、アルミニウム蒸着層の場合と異なり、交流電圧印加
時のコンデンサの容量減少は極めて少なく、膜抵抗を高
くすることにより誘電体の耐圧設計を向上することが可
能と考えられるのであるが、膜抵抗を高くすると、電極
となる蒸着層を流れる電流による発熱が起こり、誘電体
の熱劣化を促進するという問題が発生したり、コンデン
サ性能の一つである損失係数を増大する傾向にある。従
って、亜鉛またはアルミニウム−亜鉛の合金の蒸着層を
用いたコンデンサにおいて誘電体耐圧設計を向上させる
ための膜抵抗値としては8〜100Ω/□が限界と考え
られている。
In the case of zinc and an aluminum-zinc alloy, unlike the case of the aluminum vapor deposition layer, the capacitance decrease of the capacitor when an AC voltage is applied is very small, and the withstand voltage design of the dielectric is improved by increasing the film resistance. It is thought that it is possible to increase the film resistance, but when the film resistance is increased, heat is generated due to the current flowing through the vapor deposition layer that will serve as an electrode, which accelerates the thermal deterioration of the dielectric material, and is one of the reasons for capacitor performance. Some loss factors tend to increase. Therefore, it is considered that the film resistance value for improving the dielectric breakdown voltage design in a capacitor using a vapor deposition layer of zinc or an aluminum-zinc alloy is limited to 8 to 100 Ω / □.

【0007】ところで、アルミニウム蒸着層の場合も、
亜鉛、またはアルミニウム−亜鉛蒸着層の場合も、蒸着
金属化電極を外部に取り出すために、一般的に端部に金
属溶射を施し、金属溶射部との接続により電極導出を行
っており、この電極導出を確実に行うためには、蒸着層
の膜抵抗が低いことが必要である。電極導出部の端部側
の膜抵抗として1〜8Ω/□のものが多く使用されてい
る。
By the way, also in the case of an aluminum vapor deposition layer,
Also in the case of zinc or aluminum-zinc vapor deposition layer, in order to take out the vapor deposition metallized electrode to the outside, generally metal spraying is applied to the end part, and the electrode is led out by connection with the metal spraying part. The film resistance of the vapor deposition layer is required to be low in order to surely lead out. A film resistance of 1 to 8 Ω / □ is often used on the end side of the electrode lead-out part.

【0008】[0008]

【発明が解決しようとする課題】一方、この様な構成で
積層、巻回されたコンデンサ素子を樹脂モールドしてな
る金属化フィルムコンデンサにおいて、通常、ヒューズ
部の動作性は蒸着膜抵抗値に大きく関係し、コンデンサ
とした場合、電極対向部の膜抵抗値が低いと、ヒューズ
としての動作性が上がり、逆に膜抵抗値が高いと、ヒュ
ーズとしての動作性が下がる。
On the other hand, in a metallized film capacitor formed by resin-molding a capacitor element laminated and wound in such a structure, the operability of the fuse portion is usually large in the vapor deposition film resistance value. On the other hand, in the case of a capacitor, if the film resistance value of the electrode facing portion is low, the operability as a fuse is improved, and conversely, if the film resistance value is high, the operability as a fuse is deteriorated.

【0009】つまり、ヒューズを持つフィルムコンデン
サの自己回復性能で処理できない破壊が起こった場合、
まず破壊した箇所に自己回復性能が働き、蒸着膜電極に
電流が流れ、この電流が大きいとヒューズが切れる。そ
して、この蒸着膜電極が回路より開放され静電容量の減
少を起こす。蒸着膜抵抗値の高い蒸着膜電極は自己回復
性能に必要とするSHエネルギーが小さいので、ヒュー
ズに流れる電流は少なく、ヒューズの動作性は下がる。
よって蒸着膜抵抗の高いコンデンサは静電容量の減少が
小さく、蒸着膜抵抗が高いほど耐圧設計の良いコンデン
サができる。しかしながら、ヒューズはヒューズ部に流
れる電流のジュール熱によって溶断されるため、ヒュー
ズ部付近の蒸着膜抵抗が高いと、ヒューズ部の発熱が大
きく、ヒューズ部付近で熱破壊が発生してしまいやす
い。
In other words, when a self-healing performance of a film capacitor having a fuse causes a breakdown that cannot be processed,
First, the self-recovery function works on the broken portion, and a current flows through the vapor-deposited film electrode. Then, this vapor deposition film electrode is opened from the circuit and the capacitance is reduced. Since the vapor deposition film electrode having a high vapor deposition film resistance value requires a small SH energy for self-recovery performance, the current flowing through the fuse is small and the operability of the fuse is lowered.
Therefore, a capacitor having a high vapor deposition film resistance has a small decrease in electrostatic capacity, and a capacitor having a higher vapor deposition film resistance can have a better breakdown voltage design. However, since the fuse is blown by the Joule heat of the current flowing in the fuse portion, if the vapor deposition film resistance in the vicinity of the fuse portion is high, heat generation in the fuse portion is large, and thermal destruction tends to occur in the vicinity of the fuse portion.

【0010】従来の蒸着膜コンデンサはヒューズ部付近
の膜抵抗値と蒸着膜対向部の膜抵抗値が同じであるの
で、ヒューズ部付近の熱破壊を考慮して耐圧設計の高い
コンデンサを作ることができなかった。
Since the conventional evaporated film capacitor has the same film resistance value in the vicinity of the fuse portion and the film resistance value in the opposed portion of the evaporated film, it is possible to manufacture a capacitor having a high withstand voltage design in consideration of thermal destruction in the vicinity of the fuse portion. could not.

【0011】本発明はこのような課題に鑑みなされたも
ので、高電圧の使用時においても、安定した保安性を有
するヒューズ部を持つ金属化フィルムコンデンサを提供
することを目的とする。
The present invention has been made in view of the above problems, and an object of the present invention is to provide a metallized film capacitor having a fuse portion which has stable safety even when a high voltage is used.

【0012】[0012]

【課題を解決するための手段】この目的を達成するため
に本発明の金属化フィルムコンデンサは、誘電体フィル
ムの片面または、両面に電極を形成した金属化フィルム
を一対の電極が誘電体フィルムを介して対向するように
積層、または巻回した素子の両端面に電極引出部を設
け、前記一対の電極の一方はフィルム幅中央部に非金属
化部を備え、他方の電極は非金属化部を周設した金属膜
ブロックを前記フィルムの長尺方向に複数個並設するこ
とにより構成するとともに、フィルム幅中央部にヒュー
ズ部を備え、かつ前記一対の電極の抵抗値は電極引出部
に接する部分とヒューズ部に接する部分の値が、他の部
分と比較して低くなるように構成したものである。
In order to achieve this object, a metallized film capacitor of the present invention comprises a metallized film having electrodes formed on one side or both sides of a dielectric film, and a pair of electrodes is a dielectric film. Electrode lead-out portions are provided on both end faces of the element that are laminated or wound so as to face each other, one of the pair of electrodes has a non-metallized portion at the center of the film width, and the other electrode has a non-metalized portion. A plurality of metal film blocks surrounding the film are arranged side by side in the longitudinal direction of the film, and a fuse portion is provided at the center of the film width, and the resistance value of the pair of electrodes is in contact with the electrode lead portion. The value of the portion in contact with the fuse portion is lower than that of other portions.

【0013】[0013]

【作用】本発明は上記した構成により、蒸着膜電極対向
部の抵抗は高いので自己回復性能に優れるとともに、耐
電圧が高くなり、しかもヒューズ部付近の蒸着膜抵抗は
低いのでヒューズ部の溶断熱による熱破壊を起こすこと
はないものである。
According to the present invention, since the resistance of the vapor deposition film electrode facing portion is high, the self-recovery performance is excellent, and the withstand voltage is high, and the vapor deposition film resistance in the vicinity of the fuse portion is low. It does not cause thermal destruction due to.

【0014】[0014]

【実施例】以下、本発明の実施例1,2について図1、
図2、図3を参照しながら説明する。
EXAMPLES Examples 1 and 2 of the present invention will be described below with reference to FIG.
This will be described with reference to FIGS. 2 and 3.

【0015】(実施例1)図1、図2に示すように誘電
体フィルムとしての厚みが6μmの2枚のポリプロピレ
ンフィルム13のそれぞれの片面に、亜鉛である蒸着膜
電極11と蒸着膜電極12を形成して金属化フィルムと
する。この金属化フィルムを前記一対の蒸着膜電極1
1,12がポリプロピレンフィルム13を介して対向す
るように重ねて、巻回することにより素子を構成し、こ
の素子の両端面に電極引出部15を設けて金属化フィル
ムコンデンサとする。蒸着膜電極11はポリプロピレン
フィルム13の幅方向中央部に非金属化部14を有し、
対向する蒸着膜電極12はポリプロピレンフィルム13
の長尺方向に60mmごとにピッチ0.3mmで分割
し、電極引出部15と接しないよう両端部に非金属化部
16を設ける。ヒューズ部17は蒸着膜電極11の非金
属化部14と対向するように蒸着膜電極12の中央部に
設けている。更に、蒸着膜電極11の電極引出部付近1
8と、蒸着膜電極12のヒューズ部付近19の抵抗値は
他の蒸着膜電極部分より低くなるように構成している。
(Embodiment 1) As shown in FIGS. 1 and 2, on one surface of each of two polypropylene films 13 having a thickness of 6 μm as a dielectric film, a vapor deposition film electrode 11 and a vapor deposition film electrode 12 made of zinc were formed. To form a metallized film. This metallized film is applied to the pair of vapor deposition film electrodes 1
A metallized film capacitor is formed by stacking 1 and 12 so as to face each other with a polypropylene film 13 in between, and winding them to form an element, and providing electrode lead-out portions 15 on both end surfaces of the element. The vapor deposition film electrode 11 has a non-metallized portion 14 in the widthwise central portion of the polypropylene film 13,
The vapor deposition film electrodes 12 facing each other are polypropylene films 13
In the lengthwise direction, the metal is divided every 60 mm at a pitch of 0.3 mm, and nonmetallized portions 16 are provided at both ends so as not to contact the electrode lead-out portion 15. The fuse portion 17 is provided in the central portion of the vapor deposition film electrode 12 so as to face the non-metallized portion 14 of the vapor deposition film electrode 11. Further, in the vicinity 1 of the electrode lead-out portion of the vapor deposition film electrode 11.
8 and the resistance value of the vapor deposition film electrode 12 near the fuse portion 19 is lower than that of the other vapor deposition film electrode portions.

【0016】(実施例2)図3は両面蒸着型の金属化フ
ィルムコンデンサを示す。この金属化フィルムコンデン
サは、実施例1と同様のポリプロピレンフィルム13に
蒸着膜電極11と蒸着膜電極12を両面に設けて金属化
フィルムとし、他のポリプロピレンフィルム13を前記
金属化フィルムに重ねて巻回した素子の両端面に電極引
出部を設けたものである。そして、この金属化フィルム
コンデンサのヒューズ部、蒸着膜電極の抵抗値は実施例
1と同じように構成している。
(Embodiment 2) FIG. 3 shows a metallized film capacitor of double-sided vapor deposition type. In this metallized film capacitor, a polypropylene film 13 similar to that used in Example 1 is provided with a vapor deposition film electrode 11 and a vapor deposition film electrode 12 on both surfaces to form a metallized film, and another polypropylene film 13 is wound on the metallized film. An electrode lead-out portion is provided on both end faces of the turned element. The resistance value of the fuse portion and the vapor deposition film electrode of this metallized film capacitor is the same as that of the first embodiment.

【0017】以上のように構成されたコンデンサの特性
と従来のコンデンサの特性を以下に説明する。
The characteristics of the capacitor constructed as described above and the characteristics of the conventional capacitor will be described below.

【0018】図1の金属化フィルムを用いたものを試料
A、図2の金属化フィルムを用いたものを試料B、比較
用として金属溶射部、電極対向部、ヒューズ部付近の蒸
着膜抵抗値が一定の構成の金属化フィルムを用いたもの
を試料C、金属溶射部が他の蒸着膜より低い抵抗値の構
成の金属化フィルムを用いたものを試料Dとし、各々樹
脂ケースに入れエポキシ樹脂でモールドして乾式コンデ
ンサを作製した。これらのコンデンサは定格電圧600
V、C=10μFとし、(表1)に示す抵抗値の構成と
した。
A sample using the metallized film of FIG. 1 is a sample A, a sample using the metallized film of FIG. 2 is a sample B, and for comparison, a vapor-deposited film resistance value in the vicinity of the metal sprayed part, the electrode facing part and the fuse part. Is a sample C in which a metallized film having a constant composition is used, and a sample D in which a metal sprayed part has a resistance value lower than that of other vapor deposition films is a sample D. Then, a dry type capacitor was manufactured by molding. These capacitors have a rated voltage of 600
V and C = 10 μF, and the resistance values shown in (Table 1) were adopted.

【0019】[0019]

【表1】 [Table 1]

【0020】これらのコンデンサについて、周囲温度2
5℃でステップアップ昇圧による耐電圧試験、および8
0℃でJISに記載されている保安試験を行った。結果
を(表2)に示す。
The ambient temperature of these capacitors is 2
Withstand voltage test by step-up boosting at 5 ℃, and 8
The safety test described in JIS was performed at 0 ° C. The results are shown in (Table 2).

【0021】[0021]

【表2】 [Table 2]

【0022】なお、ステップアップ昇圧による耐電圧試
験は交流60Hzで400Vから50V/1Hrでステ
ップ昇圧し、静電容量減少が−20%となる電圧で比較
した。
In the withstand voltage test by step-up boosting, stepwise boosting was performed from 400 V to 50 V / 1 Hr at an alternating current of 60 Hz, and comparison was performed at a voltage at which the capacitance decrease was -20%.

【0023】これらの結果より本発明のコンデンサA,
Bは、耐電圧が高く、また保安性にも優れていることが
わかる。試料Cは電極対向部の膜抵抗値が低いため、S
Hエネルギーが大きくヒューズ溶断レベルが低い。また
試料Dはヒューズ部の膜抵抗値が高いため、耐圧レベル
は高いものの、保安性試験ではヒューズ溶断の際発生す
る熱が大きくヒューズ部付近の破壊に至ったと考えられ
る。
From these results, the capacitor A of the present invention,
It can be seen that B has a high withstand voltage and is excellent in safety. Since the sample C has a low film resistance value in the electrode facing portion, S
High H energy and low fuse blowing level. Further, since the sample D has a high film resistance value in the fuse portion and thus has a high withstand voltage level, it is considered that in the safety test, the heat generated when the fuse is blown was large and the vicinity of the fuse portion was destroyed.

【0024】なお、上記フィルムコンデンサでは、ヒュ
ーズ部の位置を蒸着膜中央部以外に設けることが可能で
ある。しかしながら、引出電極部付近にヒューズを施し
たフィルムコンデンサは、巻回した時ヒューズ部の締め
付けが弱いためヒューズの動作性が良くなく、容量減少
を起こしやすい。そのため、耐圧設計を向上するにはヒ
ューズは蒸着膜の中央部に設けることが良いと考えられ
る。
In the above film capacitor, the fuse portion can be provided at a position other than the central portion of the vapor deposition film. However, a film capacitor having a fuse in the vicinity of the extraction electrode portion is not good in operability of the fuse because the fuse portion is weakly tightened when wound, and the capacity is likely to decrease. Therefore, in order to improve the withstand voltage design, it is considered preferable to provide the fuse in the central portion of the vapor deposition film.

【0025】なお、上記実施例は一例であってフィルム
の厚みやフィルムの種類、蒸着金属、さらに分割のピッ
チ、ヒューズ部の幅、一分割でのヒューズ部の個数等は
この実施例に限定されるものではない。さらに長尺方向
を分断する分割は中央部にマージンを有する金属化層も
分割されてもよい。
The above embodiment is an example, and the thickness of the film, the kind of the film, the vapor-deposited metal, the pitch of division, the width of the fuse portion, the number of fuse portions in one division, etc. are limited to this embodiment. Not something. Further, the division that divides the longitudinal direction may also divide the metallized layer having a margin in the central portion.

【0026】[0026]

【発明の効果】以上の説明から明らかなように、本発明
は、ヒューズ部の蒸着膜抵抗値が他の電極対向部の蒸着
膜と比べ低く構成しているため、ヒューズ部の熱によっ
て熱破壊を生じることがなく、従来より高い電圧で使用
することが可能な金属化フィルムコンデンサを提供する
ことができる。さらに、蒸着膜抵抗値も従来通りの範囲
で構成できるため生産性も良好で歩留まりも非常に良い
という効果が得られる。
As is apparent from the above description, in the present invention, the resistance value of the vapor deposition film of the fuse portion is lower than that of the vapor deposition film of the other electrode facing portion, so that the heat destruction of the fuse portion causes thermal destruction. It is possible to provide a metallized film capacitor which can be used at a higher voltage than before without causing the above phenomenon. Further, since the resistance value of the vapor deposition film can be configured in the conventional range, it is possible to obtain the effect that the productivity is good and the yield is very good.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例による片面蒸着型金属化フィ
ルムコンデンサの断面図
FIG. 1 is a cross-sectional view of a single sided metallized film capacitor according to an embodiment of the present invention.

【図2】本発明の一実施例による片面蒸着型金属化フィ
ルムコンデンサの展開斜視図
FIG. 2 is an exploded perspective view of a single-sided evaporation type metallized film capacitor according to an embodiment of the present invention.

【図3】本発明の一実施例による両面蒸着型金属化フィ
ルムコンデンサの断面図
FIG. 3 is a sectional view of a double-sided vaporization type metallized film capacitor according to an embodiment of the present invention.

【図4】従来例の片面蒸着型金属化フィルムコンデンサ
の断面図
FIG. 4 is a cross-sectional view of a conventional single-sided evaporation type metallized film capacitor.

【符号の説明】[Explanation of symbols]

11 蒸着膜電極 12 蒸着膜電極 13 ポリプロピレンフィルム 14 非金属化部 15 電極引出部 16 非金属化部 17 ヒューズ部 11 Vapor-deposited film electrode 12 Vapor-deposited film electrode 13 Polypropylene film 14 Non-metallized part 15 Electrode extraction part 16 Non-metallized part 17 Fuse part

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 誘電体フィルムの片面または、両面に電
極を形成した金属化フィルムを一対の電極が誘電体フィ
ルムを介して対向するように積層、または巻回した素子
の両端面に電極引出部を設け、前記一対の電極の一方は
フィルム幅中央部に非金属化部を備え、他方の電極は非
金属化部を周設した金属膜ブロックを前記フィルムの長
尺方向に複数個並設した構成とするとともに、フィルム
幅中央部にヒューズ部を備え、かつ前記一対の電極の抵
抗値は電極引出部に接する部分とヒューズ部に接する部
分の値が、他の部分と比較して低くなるように構成した
金属化フィルムコンデンサ。
1. An electrode lead-out portion on both end faces of a device in which a metallized film having electrodes formed on one side or both sides of a dielectric film is laminated or wound so that a pair of electrodes face each other with the dielectric film interposed therebetween. One of the pair of electrodes is provided with a non-metallized portion in the central portion of the film width, and the other electrode is provided with a plurality of metal film blocks surrounding the non-metalized portion in parallel in the longitudinal direction of the film. In addition to the above structure, a fuse portion is provided at the center of the film width, and the resistance values of the pair of electrodes are set so that the values of the portion in contact with the electrode lead-out portion and the portion in contact with the fuse portion are lower than those in other portions. The metallized film capacitor configured in.
JP9332795A 1995-04-19 1995-04-19 Metallized film capacitor Pending JPH08288171A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9332795A JPH08288171A (en) 1995-04-19 1995-04-19 Metallized film capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9332795A JPH08288171A (en) 1995-04-19 1995-04-19 Metallized film capacitor

Publications (1)

Publication Number Publication Date
JPH08288171A true JPH08288171A (en) 1996-11-01

Family

ID=14079188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9332795A Pending JPH08288171A (en) 1995-04-19 1995-04-19 Metallized film capacitor

Country Status (1)

Country Link
JP (1) JPH08288171A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004034412A1 (en) * 2002-10-10 2004-04-22 Matsushita Electric Industrial Co., Ltd. Metallized film capacitor
WO2007139165A1 (en) 2006-05-31 2007-12-06 Soshin Electric Co., Ltd. Film capacitor
US7929271B2 (en) 2006-04-28 2011-04-19 Soshin Electric Co., Ltd. Film capacitor
JP2013219305A (en) * 2012-04-12 2013-10-24 Nichicon Corp Metalization film capacitor
JP2014011219A (en) * 2012-06-28 2014-01-20 Panasonic Corp Metalized film capacitor
CN105869884A (en) * 2016-04-08 2016-08-17 郑州航空工业管理学院 Anti-interference high-voltage metalized polypropylene film capacitor
WO2016181646A1 (en) * 2015-05-11 2016-11-17 パナソニックIpマネジメント株式会社 Metallized film capacitor
CN116089880A (en) * 2023-02-11 2023-05-09 重庆大学 Method and system for classifying initial self-healing types of metallized film capacitors

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004134561A (en) * 2002-10-10 2004-04-30 Matsushita Electric Ind Co Ltd Metallized film capacitor, smoothing capacitor for inverter using the same, and capacitor for automobile
US7027286B2 (en) 2002-10-10 2006-04-11 Matsushita Electric Industrial Co., Ltd. Metallized film capacitor
WO2004034412A1 (en) * 2002-10-10 2004-04-22 Matsushita Electric Industrial Co., Ltd. Metallized film capacitor
US7929271B2 (en) 2006-04-28 2011-04-19 Soshin Electric Co., Ltd. Film capacitor
JP4917092B2 (en) * 2006-05-31 2012-04-18 双信電機株式会社 Film capacitor
US8139341B2 (en) 2006-05-31 2012-03-20 Soshin Electric Co., Ltd. Film capacitor
WO2007139165A1 (en) 2006-05-31 2007-12-06 Soshin Electric Co., Ltd. Film capacitor
JP2013219305A (en) * 2012-04-12 2013-10-24 Nichicon Corp Metalization film capacitor
JP2014011219A (en) * 2012-06-28 2014-01-20 Panasonic Corp Metalized film capacitor
WO2016181646A1 (en) * 2015-05-11 2016-11-17 パナソニックIpマネジメント株式会社 Metallized film capacitor
CN105869884A (en) * 2016-04-08 2016-08-17 郑州航空工业管理学院 Anti-interference high-voltage metalized polypropylene film capacitor
CN116089880A (en) * 2023-02-11 2023-05-09 重庆大学 Method and system for classifying initial self-healing types of metallized film capacitors
CN116089880B (en) * 2023-02-11 2024-01-05 重庆大学 Method and system for classifying initial self-healing types of metallized film capacitors

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