JPH08273781A - Chip part packaging socket - Google Patents

Abstract

PURPOSE: To package an additional part in response to the demand of the functional change, functional expansion or the like of electronic equipment, and easily change a chip part. CONSTITUTION: When chip parts 6 and 8 are housed within a housing 1, the electrodes 9a and 9b of the part 8 come in contact with socket terminals 3a and 3b on the bottom of the housing 1, thereby keeping electrical continuity between the parts 6 and 8. Also, when the socket terminals 3a and 3b are soldered to a set of pads on a printed circuit board, a plurality of the chip parts 6 and 8 can be mounted thereon.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component mounting socket for mounting a chip component on a printed circuit board.

[0002]

2. Description of the Related Art Various components are mounted on a printed circuit board used in electronic equipment in accordance with the function of the electronic equipment. One of them is that the outer shape is a rectangular parallelepiped.
In addition, there is a chip component having electrodes on both ends along the surface.
When mounting such chip parts on a printed circuit board,
Conventionally, pads are formed on a printed circuit board so that one set of pads corresponds to one chip component, electrodes of chip components are placed on the pads, and electrodes and pads are soldered, The chip parts were mounted on the printed circuit board.

[0003]

However, in such a conventional technique, even if it is desired to add a mounting component on the printed circuit board in order to meet the demand for changing the function or expanding the function of the electronic device, the printed circuit board cannot be mounted. Since there is a limitation in the component mounting area of (1), it is impossible to add mounted components, and there is a problem that higher density mounting is extremely difficult.

Further, when confirming the capacitance and resistance value of the capacitors such as capacitors and resistors actually mounted on the printed circuit board, the chip components must be soldered on the printed circuit board. Therefore, when it is necessary to change the mounted components, it is necessary to remove the solder, and there is also a problem that the change work is troublesome.

[0005]

SUMMARY OF THE INVENTION The present invention has been made to solve these problems, and therefore the present invention has a rectangular parallelepiped outer shape and has electrodes on both ends along the surface. A chip component mounting socket for mounting a chip component on a printed circuit board, a housing having a size capable of accommodating a plurality of chip components, and a plurality of housings provided at both ends of a bottom surface of the housing and accommodated in the housing. Socket terminals that contact electrodes of at least one of the chip components and are soldered to a set of pads on a printed circuit board, and are provided on two opposing inner surfaces of the housing and housed in the housing. A short-circuiting terminal having a spring property for sandwiching the chip parts by being pressed against electrodes of the chip parts of the plurality of chip parts to be sandwiched. That.

[0006]

According to the present invention having such a structure, when a plurality of chip parts are housed in the housing, the electrodes of at least one chip part are brought into contact with the socket terminals on the bottom surface of the housing to be electrically conducted, and each chip part is electrically connected. Since the components are sandwiched and fixed by the short-circuiting terminals, and at least one of the short-circuiting terminals electrically connects the chip components to each other, soldering the socket terminals to one set of pads of the printed board, It becomes possible to mount a plurality of chip components on one set of pads on the printed circuit board.

Therefore, according to this, when the mounting components on the printed circuit board are added in response to the request for changing the function or expanding the function of the electronic device, the chip components functionally compatible with each other are collectively printed by the chip component mounting socket. By mounting on the board, it is possible to mount additional components, and it is possible to perform higher density mounting. Also, when confirming the capacitor capacity and resistance values of chip components such as capacitors and resistors actually mounted on the printed circuit board, use this chip component mounting socket to mount the chip components on the printed circuit board. It can be mounted, and even if it is necessary to change the mounted parts, it is possible to replace the chip parts by removing them from the housing and storing new chip parts without removing the solder, making it easy to change chip parts. It becomes possible to do.

[0008]

An embodiment will be described below with reference to the drawings. FIG. 1 is a perspective view showing a first embodiment of a chip component mounting socket according to the present invention. In the drawing, reference numeral 1 denotes a housing of a chip component mounting socket whose upper surface is an opening surface, which is formed by an insulator to a size capable of accommodating a plurality of chip components to be described later. A U-shaped opening 2 cut in the vertical direction is provided.

Reference numerals 3a and 3b denote a pair of socket terminals provided at both ends of the bottom surface of the housing 1 in the longitudinal direction, and the front and back surfaces thereof are exposed to the inner surface and the outer surface of the housing 1. Reference numerals 4a and 4b denote a pair of short-circuiting terminals having elasticity and conductivity, which are each formed in an inverted U shape. By embedding about one side half around the curved surface portion in the housing 1, the length of the housing 1 is increased. It is arranged inside the facing surface in the direction.

5a and 5b are insulating component fixing springs, which are reverse U-shaped like the short-circuiting terminals 4a and 4b.
The housing 1 is formed in a letter shape, and by embedding about one side half around the curved surface part in the housing 1, the housing 1
Are arranged on the inner side of the facing surfaces in the lateral direction. Here, the component fixing springs 5a and 5b are formed to have a width narrower than that of the short-circuiting terminals 4a and 4b, so that the component fixing springs 5a and 5b are located on both sides of the opening 2.
It is provided as a pair.

Reference numerals 6 and 8 denote rectangular parallelepiped chip parts mounted on a printed circuit board (not shown) by the chip part mounting sockets made of the above-mentioned components, and here, two chip parts having different thicknesses are shown. These chip parts 6 and 8 are electric parts such as capacitors and resistors that are commercially available, and electrodes 7a and 7b along the outer shape 5 are provided at both ends of one chip part 6, respectively. The electrodes 9a and 9 along the outer surface 5 are also provided at both ends of the other chip component 8.
b is provided.

Next, the operation of the first embodiment having the above structure will be described with reference to FIGS. 2 is a plan view showing a state in which the chip component 6 is horizontally stacked on the chip component 8 and inserted into the housing 1, and FIG.
-A line sectional view, FIG. 4 is a BB line sectional view of FIG. 2, FIG. 5 is a plan view showing a state in which the chip component 6 and the chip component 8 are laterally overlapped and inserted into the housing 1, and FIG. CC of FIG.
FIG. 7 is a sectional view taken along line D-D in FIG.

First, as shown in FIG. 1, the chip parts 6 and 8 are laid horizontally and stacked vertically, or the chip parts 6 and 8 are erected horizontally to be stacked horizontally. Insert into the housing 1. Here, as shown in FIGS. 2 to 4, the chip component 6 is replaced by the chip component 8
When the chips 7 are horizontally stacked and inserted into the housing 1, the electrodes 7a and 7b of the chip part 6 and the electrodes 9a and 9b of the chip part 8 are pressed against the short-circuiting terminals 4a and 4b, respectively. And the chip component 8 are electrically conducted, and the electrodes 9a and 9b of the chip component 8 are brought into contact with the socket terminals 3a and 3b provided on the bottom surface of the housing 1 to be electrically conducted, so that the chip component 6 is also a socket. Terminal 3
It is electrically connected to a and 3b.

At this time, the chip parts 6 and 8 are sandwiched by short-circuit terminals 4a and 4b having spring properties at both ends in the longitudinal direction, and further, the chip parts 6 and 8 are arranged on both sides of the body part in the lateral direction. Since it is sandwiched by the component fixing springs 5a and 5b, the chip components 6 and 8 are held in the housing 1 in a state where they are securely fixed to the front, rear, left and right. On the other hand, as shown in FIGS.
In the case where the chips 7 are erected vertically and inserted in the housing 1 in the lateral direction, the electrodes 7a and 7b of the chip component 6 and the electrodes 9a and 9b of the chip component 8 are pressed against the short-circuiting terminals 4a and 4b, respectively, and electrically connected. To the socket terminal 3a,
3b is also in contact with each other and electrically connected.

At this time, both longitudinal ends of the chip component 6 and the chip component 8 are further sandwiched by the short-circuiting terminals 4a and 4b having a spring property, and the chip components 6 and 8 have a body portion in the lateral direction. Since they are sandwiched by the component fixing springs 5a and 5b in the direction in which they are in close contact with each other, the chip components 6 and 8 are held in the housing 1 in this state as well while being securely fixed to the front, rear, left and right.

Whether the chip components 6 and 8 are laid horizontally and vertically stacked or whether the chip components 6 and 8 are vertically laid horizontally is determined according to the type and application of the chip components 6 and 8. Just decide. Further, the chip component 6 and the chip component 8 can be arranged in parallel or in series by inserting them into the housing 1 as described above, and for example, a bypass capacitor or the like can be constituted.

Chip component 6 on a printed circuit board (not shown)
To mount the chip component 8, the housing 1 is arranged such that the socket terminals 3a and 3b on the bottom surface thereof are mounted on a pair of pads formed on the printed circuit board, and the socket terminals 3a and 3b and the pads are soldered. The above-described insertion of the chip component 6 and the chip component 8 into the housing 1 is performed by attaching the socket terminals 3a, 3 of the housing 1.
It may be before or after the soldering of b with the pad of the printed circuit board.

By doing so, the chip component 6
And the chip component 8 are socket terminals 3a, 3 of the housing 1.
Since it is connected to the circuit of the printed circuit board through b and a set of pads of the printed circuit board, it is possible to mount a plurality of chip components 6 and 8 on the printed circuit board without expanding the mounting area. When replacing one or both of the chip component 6 and the chip component 8, the U-shaped opening 2 provided in the housing 1 is used to sandwich the chip component 6 or the chip component 8 with tweezers or the like, and the housing is lifted up. It is only necessary to insert a new chip component into the housing 1 after taking it out from the device 1. Since it can be replaced without removing the solder, it is possible to easily add or change the chip component.

When both the chip component 6 and the chip component 8 are exchanged, the chip component to be newly inserted into the housing 1 may be different in size from the chip component 6 and the chip component 8. That is, in this embodiment, the housing 1
Short-circuiting terminals 4a and 4b and a component fixing spring 5
Since each of a and 5b is elastically deformable, it is possible to cope with a change in the size of the chip component within the range of these elastic deformations, and it has versatility.

FIG. 8 is a perspective view showing a second embodiment of the present invention. In this embodiment, two socket terminals 3c and 3b are provided at one end of the housing 1 in the longitudinal direction, socket electrode terminals 3b are provided at the other end, and spring and conductivity are provided on one of the longitudinal facing surfaces of the housing 1. Two short-circuiting terminals 4c and 4b having a socket are provided, and the other short-circuiting terminal 4b is provided. The socket terminals 3c and 3b have front and back surfaces exposed on the inner surface and the outer surface of the housing 1, respectively. The terminals 4c and 4b are each formed in an inverted U shape, and are attached to the housing 1 by embedding approximately one side half around the curved surface portion in the housing 1.

The other structure is the same as that of FIG. Further, 10 and 12 are rectangular parallelepiped chip parts similar to those shown in FIG. 1, and electrodes 11a, 13a and 11b, 13b along the outer shape 5 surface are provided at both ends of each chip part. The thickness is within the width of the short-circuit terminals 4c and 4b. Next, the operation of the second embodiment having the above configuration will be described with reference to FIGS.

In this embodiment, the chip parts 10 and 12 are stood upright and are inserted into the housing 1 so as to be aligned in parallel with a space therebetween in the lateral direction.
FIG. 10 is a plan view showing a state in which the components are laterally aligned and inserted into the housing 1 as described above, and FIG. 10 is a cross-sectional view taken along line EE of FIG.
FIG. 11 is a sectional view taken along line FF in FIG. As shown in these figures, when the chip component 10 and the chip component 12 are laterally aligned and inserted into the housing 1, the electrodes 11a and 11b of the chip component 6 and the electrodes 9a and 9b of the chip component 12 are The short-circuit terminals 4b, 4c, and 4d are respectively contacted, and the socket terminals 3b, 3c, and 3d are contacted to be electrically conducted.

At this time, the chip component 10 and the chip component 12 have spring-like short-circuiting terminals 4b, 4c and 4d.
It is sandwiched by and held in the housing 1 in a fixed state. As a circuit configuration in this embodiment, a Thevenin termination circuit, an RC termination circuit or the like can be considered.

To mount the chip parts 10 and 12 on the printed circuit board, the housing 1 is mounted on the bottom surface of the socket terminals 3b,
3c and 3d are arranged so as to be mounted on a set of three pads formed on the printed circuit board.
It is carried out by soldering pads c and 3d to the chip parts 10 and 12 in the housing 1 described above.
Is inserted into the socket terminals 3b, 3c, 3d of the housing 1.
Similar to the first embodiment, it may be before or after soldering with the pad of the printed circuit board.

By doing so, the chip component 1
0 and the chip component 12 are socket terminals 3 of the housing 1.
The chip components 10 and 12 can be mounted on the printed circuit board by connecting to the circuit of the printed circuit board via b, 3c, 3d and the pads on the printed circuit board, without increasing the mounting area. . In this case, the component fixing springs 5a and 5b are used for the chip component 10 and the chip component 1, respectively.
Although it does not contribute to the fixing of the chip component 2, the chip component 10 and the chip component 12 can be vertically stacked and inserted into the housing 1. Therefore, in that case, the chip component 10 and the chip component 1
It will contribute to the fixation of 2.

When replacing one or both of the chip component 6 and the chip component 8, the U-shaped opening 2 provided in the housing 1 is used to sandwich the chip component 6 or the chip component 8 with tweezers or the like, and After lifting and taking out from the housing 1, a new chip component can be inserted into the housing 1 and can be replaced without removing the solder, so that the chip component can be easily added or changed.

When both the chip component 10 and the chip component 12 are replaced, the chip component newly inserted into the housing 1 is the chip component 1 for the same reason as in the first embodiment.
It is possible to insert a chip having a size different from that of 0 and the chip component 12. The present invention is not limited to the above embodiment. For example, in the first and second embodiments, the housing 1
Two chip parts 6 and 8 or 10 and 12 are inserted in the inside, but it is also possible to insert three or more chip parts.

Further, in the second embodiment, the socket terminals 3c, 3 are provided at one end of the bottom surface of the housing 1 in the longitudinal direction.
d is provided, and correspondingly, 2 is provided on one of the longitudinal facing surfaces.
Although the short-circuit terminals 4c and 4d are provided, three or more socket terminals and short-circuit terminals are provided,
It is also possible to insert three or more chip parts.

[0029]

As described above, the chip component mounting socket according to the present invention has a housing having a size capable of accommodating a plurality of chip components, and a plurality of housings provided at both ends of the bottom surface of the housing and accommodated in the housing. Socket terminals that contact electrodes of at least one of the chip components and are soldered to a set of pads on a printed circuit board, and are provided on two opposing inner surfaces of the housing and housed in the housing. As a configuration including a short-circuiting terminal having a spring property for sandwiching the chip parts by being pressed against the electrodes of the chip parts of the plurality of chip parts,
When a plurality of chip components are housed in the housing, the electrodes of at least one chip component come into contact with the socket terminals on the bottom surface of the housing for electrical conduction, and each chip component is sandwiched and fixed by the short-circuit terminals. At the same time, since at least one short-circuiting terminal electrically connects the chip components to each other, soldering the socket terminals to one set of pads on the printed circuit board results in one set of pads on the printed circuit board. On the other hand, it becomes possible to mount a plurality of chip components.

Therefore, according to this, when mounting components on the printed circuit board are added in response to demands for changing functions or expanding functions of electronic equipment, chip components functionally compatible with each other are collectively printed by the chip component mounting socket. By mounting on the board, it is possible to mount additional components, and it is possible to achieve higher density mounting. Also, when confirming the capacitor capacity and resistance values of chip components such as capacitors and resistors actually mounted on the printed circuit board, use this chip component mounting socket to mount the chip components on the printed circuit board. It can be mounted, and even if it is necessary to change the mounted parts, it is possible to replace the chip parts by removing them from the housing and storing new chip parts without removing the solder, making it easy to change chip parts. The effect that it becomes possible is also obtained.

[Brief description of drawings]

FIG. 1 is a perspective view showing a first embodiment of the present invention.

FIG. 2 is a plan view showing the operation of the embodiment shown in FIG.

3 is a cross-sectional view taken along the line AA of FIG.

FIG. 4 is a sectional view taken along line BB in FIG.

FIG. 5 is a plan view showing the operation of the first embodiment.

6 is a cross-sectional view taken along the line CC of FIG.

FIG. 7 is a sectional view taken along line DD of FIG. 5;

FIG. 8 is a perspective view showing a second embodiment of the present invention.

FIG. 9 is a plan view showing the operation of the second embodiment.

10 is a cross-sectional view taken along the line EE of FIG.

11 is a sectional view taken along line FF of FIG.

[Explanation of symbols]

 1 Housing 2 Open Part 3a, 3b, 3c, 3d Socket Terminal 4a, 4b, 4c, 4d Shorting Terminal 5a, 5b Component Fixing Spring 6 Chip Component 7a, 7b Electrode 8 Chip Component 9a, 9b Electrode 10 Chip Component 11a, 11b electrode 12 chip parts 13a, 13b electrode

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Nobuhiro Kawamata 1-7-12 Toranomon, Minato-ku, Tokyo Oki Electric Industry Co., Ltd.

Claims (4)

[Claims] 1. A chip component mounting socket for mounting a chip component, the outer shape of which is formed in a rectangular parallelepiped shape, and having electrodes along the surfaces at both ends, on a printed circuit board, capable of accommodating a plurality of chip components. A housing having a size, and provided on both ends of the bottom surface of the housing, contacting an electrode of at least one chip component among a plurality of chip components housed in the housing, and soldering to a set of pads on a printed circuit board. A socket terminal to be attached and a short-circuiting terminal provided on two opposing inner surfaces of the housing and having a spring property to press the electrodes of the chip components of the plurality of chip components housed in the housing to sandwich the chip components. A socket for mounting chip parts, characterized in that 2. The chip component according to claim 1, wherein an opening for taking out the chip component from the housing is provided on two opposing surfaces of the housing, which are different from the two surfaces provided with the short-circuiting terminals. Mounting socket. 3. The chip according to claim 1, wherein one of a plurality of socket terminals provided on both ends of the bottom surface of the housing is provided and a plurality of short-circuit terminals are provided on two inner surfaces facing the housing. Component mounting socket. 4. The component fixing spring for sandwiching and fixing a body portion of a chip component on two inner surfaces opposite to each other, which is different from the two surfaces on which the short-circuit terminals are provided, of the housing. Socket for mounting chip components.