JPH08262103A - Method for re-sorting ic circulated with ic carrier in auto-handler - Google Patents
Method for re-sorting ic circulated with ic carrier in auto-handlerInfo
- Publication number
- JPH08262103A JPH08262103A JP7091795A JP9179595A JPH08262103A JP H08262103 A JPH08262103 A JP H08262103A JP 7091795 A JP7091795 A JP 7091795A JP 9179595 A JP9179595 A JP 9179595A JP H08262103 A JPH08262103 A JP H08262103A
- Authority
- JP
- Japan
- Prior art keywords
- sorting
- carrier
- unit
- ics
- handler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】この発明は、IC搬送器が内部循
環するオートハンドラの再選別方法についてのものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of re-sorting an auto handler in which an IC carrier internally circulates.
【0002】[0002]
【従来の技術】次に、この発明に係わるオートハンドラ
の構成を図3により説明する。図3アはオートハンドラ
の平面図であり、図3イは正面図である。図3の10は
IC搬送器、11は供給部、12は予熱部、13は測定
部、14は分類部、15は収容部である。また、20は
トレイ、21は供給ローダ、22〜24は収容ローダ、
25は待機部である。2. Description of the Related Art Next, the structure of an auto handler according to the present invention will be described with reference to FIG. 3A is a plan view of the auto handler, and FIG. 3A is a front view. In FIG. 3, 10 is an IC carrier, 11 is a supply unit, 12 is a preheating unit, 13 is a measuring unit, 14 is a sorting unit, and 15 is a housing unit. Further, 20 is a tray, 21 is a supply loader, 22 to 24 are accommodating loaders,
Reference numeral 25 is a standby unit.
【0003】図3では、IC1Aが複数搭載されたトレ
イ20は供給ローダ21に50枚搭載される。供給ハンド
31は供給ローダ21の最上段のトレイ20からIC1
Aを供給部11のIC搬送器10に逐次移送する。供給
部11のIC搬送器10への搬送動作が完了すると、移
動機構40が水平に移動し、トレイ20内のIC1Aの
有無を検出する。空のトレイ20は移動機構40で搬送
され、待機部25に収納される。In FIG. 3, 50 trays 20 each having a plurality of ICs 1A mounted thereon are mounted on a supply loader 21. The supply hand 31 starts from the uppermost tray 20 of the supply loader 21 to the IC 1
A is sequentially transferred to the IC carrier 10 of the supply unit 11. When the feeding operation of the supply unit 11 to the IC carrier 10 is completed, the moving mechanism 40 horizontally moves to detect the presence or absence of the IC 1A in the tray 20. The empty tray 20 is transported by the moving mechanism 40 and stored in the standby unit 25.
【0004】供給部11のIC搬送器10は予熱部12
に移動し、IC搬送器10内のIC1Aが一定時間加熱
される。一定時間経過後、IC搬送器10は測定部13
に移動し、IC1Aが試験される。なお、図3は高温ハ
ンドラであり、予熱部12と測定部13は高温槽に内蔵
される。低温ハンドラの場合は、予熱部12は予冷部と
なり、予冷部と測定部は低温槽に内蔵される。The IC carrier 10 of the supply unit 11 has a preheating unit 12
Then, the IC 1A in the IC carrier 10 is heated for a certain period of time. After a certain period of time, the IC carrier 10 is measured by the measuring unit 13
, And IC1A is tested. 3 is a high temperature handler, and the preheating unit 12 and the measuring unit 13 are built in a high temperature tank. In the case of the low temperature handler, the preheating unit 12 is a precooling unit, and the precooling unit and the measuring unit are built in the low temperature tank.
【0005】IC1Aが試験完了後のIC搬送器10は
分類部14に移動する。分類部14では、試験結果と予
め設定された分類条件にしたがって、収容ハンド32は
IC1Aを収容ローダのトレイ20に分類移載する。空
のIC搬送器10は供給部11に戻る。After the IC 1A completes the test, the IC carrier 10 moves to the sorting section 14. In the classifying unit 14, the accommodating hand 32 classifies and transfers the IC 1A onto the tray 20 of the accommodating loader in accordance with the test results and preset classification conditions. The empty IC carrier 10 returns to the supply unit 11.
【0006】図3では、収容ローダは3つ用意されてい
る。第1の収容ローダ22はICが収容されるのトレイ
20が50枚搭載可能であるが、IC1A1が収容不足の
場合は、既に空であることが確認されたトレイ20を待
機部25から供給する。第2の収容ローダ23には、待
機部25から空のトレイ20が移載される。第3の収容
ローダ24には空のトレイ20が複数段搭載される。第
3の収容ローダ24はIC1Aを例えば、グレード別に
分類するときに使用される。第3の収容ローダ24のト
レイ20は収容部15に移動し、収容ハンド32でIC
1Aが収納され、第3の収容ローダ24に戻る。In FIG. 3, three storage loaders are prepared. The first accommodating loader 22 can mount 50 trays 20 for accommodating ICs, but when the IC 1A1 is insufficiently accommodating, the tray 20 confirmed to be empty is supplied from the standby unit 25. . The empty tray 20 is transferred from the standby unit 25 to the second storage loader 23. A plurality of empty trays 20 are mounted on the third storage loader 24. The third accommodating loader 24 is used, for example, when classifying the IC 1A by grade. The tray 20 of the third accommodating loader 24 moves to the accommodating portion 15 and the accommodating hand 32 moves the IC.
1A is stored and the operation returns to the third storage loader 24.
【0007】次に、図3に示されるIC搬送器が内部循
環するオートハンドラの制御方法を図4の機能ブロック
図により説明する。図4の1は図3で説明されるオート
ハンドラ、2はICテスタ、3は制御部である。Next, the control method of the auto handler in which the IC carrier shown in FIG. 3 internally circulates will be described with reference to the functional block diagram of FIG. Reference numeral 1 in FIG. 4 is an auto handler described in FIG. 3, 2 is an IC tester, and 3 is a control unit.
【0008】図4では、測定部13から試験開始要求信
号2AがICテスタ2に送信されると、ICテスタ2は
測定部13のIC1Aを試験する。測定部13のIC搬
送器10内のIC1Aは、例えば32個のIC1Aが並列
測定される。試験終了後、ICテスタ2は試験終了信号
2Bを測定部13に送信する。In FIG. 4, when the test start request signal 2A is transmitted from the measuring section 13 to the IC tester 2, the IC tester 2 tests the IC 1A of the measuring section 13. As for the IC1A in the IC carrier 10 of the measuring unit 13, for example, 32 IC1A are measured in parallel. After the test is completed, the IC tester 2 sends a test end signal 2B to the measuring unit 13.
【0009】ICテスタ2は試験終了信号2Bを送信す
るとともに、前記IC1Aの測定データ2Cを制御部3
に送出する。前記測定データ2Cは制御部3の選別手段
3Aに入力される。制御部3内の選別条件3Bには、I
C1Aを選別する選別条件が予め設定されており、制御
部3は測定データ2Cと選別条件3Bを比較する。The IC tester 2 sends a test end signal 2B and sends the measurement data 2C of the IC 1A to the control unit 3.
Send to. The measurement data 2C is input to the selection unit 3A of the control unit 3. The selection condition 3B in the control unit 3 includes I
The selection condition for selecting C1A is preset, and the control unit 3 compares the measurement data 2C with the selection condition 3B.
【0010】前記比較結果にしたがって、制御部3は分
類部14での選別を指令する。前記選別指令にしたがっ
て、分類部14では、個々のIC1Aが収容ローダ22
〜24に分類収納される。なお、制御部3では、図示さ
れないCPUによって動作が指令される。例えば、オー
トハンドラ1の内部動作は制御部3から指令されるが、
この発明と係わらない動作については、説明を省略す
る。According to the comparison result, the control unit 3 commands the sorting in the sorting unit 14. In accordance with the selection command, in the classification unit 14, each IC 1A is stored in the loading loader 22.
They are classified and stored in ~ 24. In the control unit 3, an operation is instructed by a CPU (not shown). For example, although the internal operation of the auto handler 1 is instructed by the control unit 3,
Descriptions of operations not related to the present invention will be omitted.
【0011】[0011]
【発明が解決しようとする課題】図4では、分類された
ICの中で不良品として分類されたICを再選別する場
合がある。例えば、1ロットにおける歩どまりが想定す
る歩どまりと異なる場合に、不良品のICを収容するこ
とに設定した収容ローダから、トレイ20を引き出し、
前記トレイ20を供給ローダ21に搭載する。In FIG. 4, an IC classified as a defective product may be re-sorted among the classified ICs. For example, when the yield in one lot is different from the expected yield, the tray 20 is pulled out from the accommodating loader set to accommodate defective ICs,
The tray 20 is mounted on the supply loader 21.
【0012】この発明は、IC搬送器が内部循環するオ
ートハンドラにおいて、収容ローダから供給ローダにト
レイを再搭載することなく、前記オートハンドラ内部で
再選別する方法を提供することを目的とする。It is an object of the present invention to provide a method of re-sorting inside the auto handler without reloading the tray from the storage loader to the supply loader in the auto handler in which the IC carrier is internally circulated.
【0013】[0013]
【課題を解決するための手段】この目的を達成するた
め、この発明は、供給部11ではIC搬送器10にIC
1Aが逐次供給され、前記IC搬送器10は測定部13
に移動してIC1Aが試験され、試験完了後の前記IC
搬送器10は分類部14に移動し、前記分類部14では
前記試験結果に基づき前記IC搬送器10内のIC1A
を分類してIC1Aを複数のトレイ20に分類移載し、
前記IC搬送器10は供給部11に移動するIC搬送器
が循環するオートハンドラであって、オートハンドラ1
の制御部3は少なくとも選別手段3Aと再選別判定手段
3Cをもち、選別手段3Aは測定後のIC1Aを選別す
る選別条件3Bが設定され、再選別判定手段3Cは測定
後のICを再選別する再選別条件3Dが設定され、選別
手段3Aには測定後のIC搬送器10の個々のIC1A
の測定データ2Cが送出され、選別手段3Aが選別条件
3Bと測定データ2Cを比較し、選別手段3Aが不良品
と判定したIC1Aの測定データ2Cは再選別判定手段
3Cに送出され、再選別判定手段3Cは再選別条件3D
と前記測定データ2Cを比較し、再選別判定手段3Cは
前記不良判定ICをIC搬送器10に保留する第1の指
令と、前記不良判定ICを不良品ICを収容指定のトレ
イ20に移載する第2の指令の内、いずれかを指令す
る。In order to achieve this object, according to the present invention, an IC is mounted on an IC carrier 10 in a supply section 11.
1A is sequentially supplied, and the IC carrier 10 is supplied to the measuring unit 13
IC1A is tested by moving to
The carrier 10 moves to the classification unit 14, and the classification unit 14 uses the IC 1A in the IC carrier 10 based on the test result.
IC1A is sorted and transferred to a plurality of trays 20,
The IC carrier 10 is an auto handler in which the IC carrier moving to the supply unit 11 circulates.
Control section 3 has at least sorting means 3A and re-sorting determination means 3C, sorting means 3A is set with sorting condition 3B for sorting IC 1A after measurement, and re-sorting determination means 3C re-sorts IC after measurement. The re-sorting condition 3D is set, and the individual ICs 1A of the IC carrier 10 after the measurement are set in the sorting means 3A.
Measurement data 2C is sent, the sorting means 3A compares the sorting condition 3B with the measurement data 2C, and the sorting means 3A sends the measurement data 2C of the IC 1A judged as defective to the re-sorting determination means 3C for re-sorting determination. Means 3C is re-sorting condition 3D
And the measurement data 2C are compared with each other, and the re-sorting determination means 3C transfers a first instruction to hold the defect determination IC in the IC carrier 10 and the defect determination IC to the tray 20 designated to accommodate the defective product IC. One of the second commands to be executed.
【0014】[0014]
【作用】この発明は、オートハンドラを動作する制御部
に、選別手段と、再選別判定手段、測定後のICを選別
する選別条件と、測定後のICを再選別する再選別条件
を予め備えている。再選別判定手段で再選別指定された
ICは分類部においてIC搬送器に保留され、前記IC
搬送器は供給部に移動し、再試験されるので、再選別の
工程が短縮できる。According to the present invention, the control unit for operating the autohandler is provided with the selecting means, the re-selecting judging means, the selecting condition for selecting the IC after measurement, and the re-selecting condition for re-selecting the IC after measurement. ing. The ICs that have been re-sorted by the re-sorting determination means are held in the IC carrier in the sorting unit,
Since the carrier moves to the supply unit and is retested, the re-sorting process can be shortened.
【0015】[0015]
【実施例】次に、この発明による構成を図1の実施例に
より説明する。図1の3Cは再選別判定手段、3Dは再
選別条件であり、その他は図4と同じものである。すな
わち、図1は図4の制御部3に再選別判定手段3Cと再
選別条件3Dを追加したものである。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the structure according to the present invention will be described with reference to the embodiment of FIG. Reference numeral 3C in FIG. 1 is a re-sorting determination means, 3D is a re-sorting condition, and the others are the same as those in FIG. That is, in FIG. 1, the re-sorting determination means 3C and the re-sorting condition 3D are added to the control unit 3 of FIG.
【0016】図1では、選別手段3Aが選別条件3Bと
測定データ2Cを比較し、選別手段3Aが不良品と判定
したIC1Aの測定データ2Cは再選別判定手段3Cに
送出される。再選別判定手段3Cは再選別条件3Dと前
記測定データ2Cを比較し、再選別判定手段3Cは前記
不良判定ICをIC搬送器10に保留する第1の指令
と、前記不良判定ICを不良品ICを収容指定のトレイ
20に移載する第2の指令の内、いずれかを指令する。
なお、ここでいう再選別条件とは、測定データ2Cと比
較される設定データの他に、不良品判定が2度目のとき
は不良ICとみなすという設定条件も含まれる。In FIG. 1, the sorting means 3A compares the sorting condition 3B with the measurement data 2C, and the measurement data 2C of the IC 1A determined by the sorting means 3A to be a defective product is sent to the re-sorting determination means 3C. The re-sorting determination unit 3C compares the re-sorting condition 3D with the measurement data 2C, and the re-sorting determination unit 3C stores the defect determination IC in the IC carrier 10 as a first command and the defect determination IC as a defective product. Any one of the second commands for transferring the IC to the tray 20 designated to be accommodated is commanded.
It should be noted that the re-sorting condition mentioned here includes not only the setting data to be compared with the measurement data 2C but also the setting condition to regard as a defective IC when the defective product is judged for the second time.
【0017】次に、この発明の実施例の動作を図2のフ
ローチャートにより説明する。図2のステップ101で
は、供給ハンド31は供給ローダ21のトレイ20から
供給部11に位置するIC搬送器10へIC1AをN個
移載する。この場合、再選別すべき不良品のIC1Aが
IC搬送器10に残存しているときは、供給ハンド31
は前記IC1Aの収容個所を避けてIC1Aを移載す
る。The operation of the embodiment of the present invention will be described below with reference to the flow chart of FIG. In step 101 of FIG. 2, the supply hand 31 transfers N ICs 1A from the tray 20 of the supply loader 21 to the IC carrier 10 located in the supply unit 11. In this case, when the defective IC 1A to be re-sorted remains in the IC carrier 10, the supply hand 31
Moves the IC1A while avoiding the accommodation place of the IC1A.
【0018】ステップ102では、N個供給完了したI
C搬送器10は予熱部12へ移動する。ステップ103
では、前記IC搬送器10は測定部13へ移動する。ス
テップ104では、ICテスタ2に対し、ICの試験開
始を要求する。In step 102, N pieces of I have been supplied.
The C carrier 10 moves to the preheating unit 12. Step 103
Then, the IC carrier 10 moves to the measuring unit 13. In step 104, the IC tester 2 is requested to start the IC test.
【0019】ステップ105では、ICテスタ2はオー
トハンドラ1に試験終了信号を送出する。ステップ10
6では、ICテスタ2は測定データ2Cを選別手段3A
に送出する。At step 105, the IC tester 2 sends a test end signal to the auto handler 1. Step 10
In 6, the IC tester 2 selects the measurement data 2C from the selection means 3A.
Send to.
【0020】ステップ107では、選別手段3Aは測定
データ2Cと選別条件3Bを比較し、分類すべき収容ロ
ーダを指令する。ステップ108で、不良品と判定され
るICが無いときは、ステップ109に進み、不良品と
判定されるICが有るときは、ステップ110に進む。
ステップ109では、収容ハンド32はステップ107
の指令にしたがい、ICを所定の収容ローダに移載す
る。In step 107, the sorting means 3A compares the measurement data 2C with the sorting conditions 3B and gives an instruction for the storage loader to be sorted. If there is no IC that is determined to be defective in step 108, the process proceeds to step 109, and if there is an IC that is determined to be defective, the process proceeds to step 110.
In step 109, the storage hand 32 moves to step 107.
The IC is transferred to a predetermined accommodating loader in accordance with the command.
【0021】ステップ110では、選別手段3Aは測定
データ2Cを再選別判定手段3Cに送出する。ステップ
111では、再選別判定手段3Cは測定データ2Cと再
選別条件3Dを比較する。ステップ112で、再選別の
必要がある場合は、ステップ113に進み、再選別する
必要がないと判定された場合は、ステップ109の前段
に戻る。At step 110, the sorting means 3A sends the measurement data 2C to the re-sorting determination means 3C. In step 111, the re-sorting determination means 3C compares the measurement data 2C with the re-sorting condition 3D. In step 112, if re-sorting is necessary, the process proceeds to step 113, and if it is determined that re-sorting is not necessary, the process returns to the previous stage of step 109.
【0022】ステップ113では、再選別判定手段3C
はICをIC搬送器10に保留するよう指令する。ステ
ップ114では、前記保留ICを搭載したIC搬送器は
供給部11で移動し、初期のステップに戻る。全ての分
類作業が終了した時点で、一連の作業が終了する。At step 113, the re-sorting judging means 3C
Instructs the IC carrier 10 to hold the IC. In step 114, the IC carrier on which the holding IC is mounted is moved by the supply unit 11, and the process returns to the initial step. When all classification work is completed, a series of work is completed.
【0023】[0023]
【発明の効果】この発明は、オートハンドラを動作する
制御部に、選別手段と、再選別判定手段、測定後のIC
を選別する選別条件と、測定後のICを再選別する再選
別条件を予め備えている。再選別判定手段で再選別指定
されたICは分類部においてIC搬送器に保留され、前
記IC搬送器は供給部に移動し、再試験されるので、再
選別の工程が短縮できる。According to the present invention, the control section for operating the auto-handler includes a sorting means, a re-sorting determination means, and an IC after measurement.
In advance, there are provided a selection condition for selecting and a re-selection condition for re-selecting the IC after measurement. The ICs that have been re-sorted by the re-sorting determination means are retained in the IC carrier in the sorting unit, and the IC carrier is moved to the supply unit and retested, so that the re-sorting process can be shortened.
【図1】この発明の実施例による機能ブロックの構成図
である。FIG. 1 is a configuration diagram of functional blocks according to an embodiment of the present invention.
【図2】この発明の動作を示すフローチャートである。FIG. 2 is a flowchart showing the operation of the present invention.
【図3】この発明に係わるオートハンドラの構成図であ
る。FIG. 3 is a configuration diagram of an auto handler according to the present invention.
【図4】従来技術による機能ブロックの構成図である。FIG. 4 is a configuration diagram of functional blocks according to a conventional technique.
1 オートハンドラ 1A IC 2 ICテスタ 2A 試験開始要求信号 2B 試験終了信号 2C 測定データ 3 制御部 3A 選別手段 3B 選別条件 3C 再選別判定手段 3D 再選別条件 10 IC搬送器 11 供給部 12 予熱部 13 測定部 14 分類部 15 収容部 20 トレイ 21 供給ローダ 22 収容ローダ 23 収容ローダ 24 収容ローダ 25 待機部 1 Auto Handler 1A IC 2 IC Tester 2A Test Start Request Signal 2B Test End Signal 2C Measurement Data 3 Controller 3A Sorting Means 3B Sorting Conditions 3C Resorting Judgment Means 3D Resorting Conditions 10 IC Conveyor 11 Supply Unit 12 Preheating Unit 13 Measurement Part 14 Sorting part 15 Storage part 20 Tray 21 Supply loader 22 Storage loader 23 Storage loader 24 Storage loader 25 Standby part
Claims (1)
され、前記IC搬送器は測定部に移動してICが試験さ
れ、試験完了後の前記IC搬送器は分類部に移動し、前
記分類部では前記試験結果に基づき前記IC搬送器内の
ICを分類してICを複数のトレイに分類移載し、前記
IC搬送器は前記供給部に移動するIC搬送器が循環す
るオートハンドラであって、 前記オートハンドラの制御部は少なくとも選別手段と再
選別判定手段をもち、 前記選別手段は測定後のICを選別する選別条件が設定
され、 前記再選別判定手段は測定後のICを再選別する再選別
条件が設定され、 前記選別手段には測定後のIC搬送器の個々のICの測
定データが送出され、 前記選別手段が前記選別条件と前記測定データを比較
し、 前記選別手段が不良品と判定したICの前記測定データ
は前記再選別判定手段に送出され、 前記再選別判定手段は前記再選別条件と前記測定データ
を比較し、 前記再選別判定手段は前記不良判定ICを前記IC搬送
器に保留する第1の指令と、前記不良判定ICを不良品
ICを収容指定のトレイに移載する第2の指令の内、い
ずれかを指令することを特徴とするIC搬送器が循環す
るオートハンドラの再選別方法。1. An IC is sequentially supplied to an IC carrier in a supply unit, the IC carrier is moved to a measuring unit to test the IC, and after the test is completed, the IC carrier is moved to a sorting unit, The sorting unit sorts the ICs in the IC carrier based on the test result, sorts and transfers the ICs to a plurality of trays, and the IC carrier is an auto handler in which the IC carrier moving to the supply unit circulates. The control unit of the auto handler has at least a sorting means and a re-sorting determination means, the sorting means sets sorting conditions for sorting the IC after measurement, and the re-sorting determination means re-sorts the IC after measurement. Re-sorting conditions for sorting are set, measurement data of individual ICs of the IC carrier after measurement are sent to the sorting means, the sorting means compares the sorting conditions with the measurement data, and the sorting means Defective product The measured data of the determined IC is sent to the re-sorting determination means, the re-sorting determination means compares the re-sorting condition with the measurement data, and the re-sorting determination means transfers the defect determination IC to the IC carrier. The IC carrier is circulated, and a first command to be stored in the IC storage device and a second command to transfer the defect determination IC to a tray designated to accommodate the defective product IC are automatically circulated. Handler re-screening method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7091795A JPH08262103A (en) | 1995-03-24 | 1995-03-24 | Method for re-sorting ic circulated with ic carrier in auto-handler |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7091795A JPH08262103A (en) | 1995-03-24 | 1995-03-24 | Method for re-sorting ic circulated with ic carrier in auto-handler |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH08262103A true JPH08262103A (en) | 1996-10-11 |
Family
ID=14036556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7091795A Pending JPH08262103A (en) | 1995-03-24 | 1995-03-24 | Method for re-sorting ic circulated with ic carrier in auto-handler |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH08262103A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5686834A (en) * | 1995-09-28 | 1997-11-11 | Ando Electric Co., Ltd. | Handling system |
JP2007040864A (en) * | 2005-08-04 | 2007-02-15 | Murata Mfg Co Ltd | Method and system for measuring/selecting characteristicelectronic component |
TWI498266B (en) * | 2014-08-07 | 2015-09-01 | ||
JP2017067591A (en) * | 2015-09-30 | 2017-04-06 | セイコーエプソン株式会社 | Electronic component conveyance device and electronic component inspection device |
-
1995
- 1995-03-24 JP JP7091795A patent/JPH08262103A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5686834A (en) * | 1995-09-28 | 1997-11-11 | Ando Electric Co., Ltd. | Handling system |
JP2007040864A (en) * | 2005-08-04 | 2007-02-15 | Murata Mfg Co Ltd | Method and system for measuring/selecting characteristicelectronic component |
JP4650152B2 (en) * | 2005-08-04 | 2011-03-16 | 株式会社村田製作所 | Method and apparatus for measuring and selecting characteristics of electronic components |
TWI498266B (en) * | 2014-08-07 | 2015-09-01 | ||
JP2017067591A (en) * | 2015-09-30 | 2017-04-06 | セイコーエプソン株式会社 | Electronic component conveyance device and electronic component inspection device |
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