JPH08250882A - Electronic device - Google Patents

Abstract

PURPOSE: To prevent performance of an electronic module from dropping by detecting a form wherein cooling performance for the electronic module of an array can be maintained or generation of clog even if foreign matters mixed into a piping system for some causes have clogged in a narrow site of a flow path such as a joint. CONSTITUTION: In order to bypass flat plate flow paths of adjacent cooling plates 2, a flexible bypass joint 6 of a bellows type is provided in the vicinity of an exit of the cooling flat plate by means of coupler connection for example, so that the bypass joints 6 of the adjacent cooling plates 2 are connected to each other.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plurality of electronic modules having a heating element that requires cooling,
Arranged vertically and horizontally at a predetermined interval, to place a cooling plate in the gap between each row of the electronic modules to indirectly cool the electronics module, and to distribute the liquid refrigerant to each row cooling plate. In an electronic device composed of a manifold and a cooling plate and a joint for connecting the manifold, an electronic module in the row fails due to overheating due to clogging occurring in the cooling plate in one row or a small number of rows. It relates to means for preventing this.

[0002]

2. Description of the Related Art FIG. 5 (a) is a plan view showing a conventional electronic device, and FIG. 5 (b) is a view showing a cross section CC in the conventional electronic device shown in FIG. 5 (a). In the figure, 1 is an electronics module, 2 is a cooling plate for indirectly cooling the electronics module with a liquid, 3 is a manifold for distributing and collecting the liquid refrigerant to the cooling plate, and 4 is a manifold and cooling. Joints 5 for connecting the boards are boards for exchanging electric signals with the electronic module and distributing and supplying electric power.

Conventional electronic equipment is constructed as described above,
The liquid refrigerant is distributed to the cooling plate 2 via the joint 4 after being distributed in the manifold 3, and is recovered in the manifold 3 via the joint 4 after cooling the electronic module.

[0004]

In the conventional electronic equipment as described above, since it is necessary to arrange the electronic modules at a predetermined interval as a functional condition, the cooling which becomes the flow path of the liquid refrigerant is required. There is a space constraint that the plate can be configured, and due to this hardware constraint, the flow path shape inside the joint tends to be narrow like an orifice. Therefore, foreign matter mixed in the piping system of the refrigerant including this electronic device for any reason is likely to cause clogging at the joints, and the cooling plate of the clogged row has a sufficient flow path for cooling the electronics module. There is a risk that it will not be possible and that performance may be deteriorated or that it may malfunction due to overheating. In addition, since multiple cooling plates are arranged, even if one or a small number of them are clogged, there is no noticeable abnormal tendency in the external piping system, and there is no risky risk. Met.

The present invention has been made in order to solve the above problems, and when foreign matter mixed in a piping system for some reason causes clogging in a narrow portion of a flow path such as a joint, (EN) An electronic device that can maintain the cooling performance of an electronic module in a row or an electronic device that can detect the occurrence of clogging and prevent deterioration of the performance of the electronic module.

[0006]

The electronic device according to the first embodiment of the present invention uses a flexible bypass joint of a bellows type by a coupler connection, for example, in order to bypass the flat plate passages of the adjacent cooling plates. The bypass joints of adjacent cooling plates are connected to each other by being provided in the vicinity of the inlet / outlet of the flat plate portion.

Further, in the electronic equipment according to the second embodiment of the present invention, a temperature sensor is mounted in the vicinity of the heating element in one of the electronics modules of each row, the temperature abnormality of the row is detected, and the abnormality signal is sent via the connector. It is possible to recognize the occurrence of an abnormality by transmitting the signal to the board and take action such as stopping the operation.

Further, in the electronic apparatus according to the third embodiment of the present invention, the dynamic pressure detecting port and the static pressure detecting port of the liquid refrigerant flowing inside the joint are provided in the joints of each row, and the dynamic pressure detecting port and the static pressure detecting port are provided therein. By installing a differential pressure sensor that detects the differential pressure between the detection ports, the presence or absence of clogging is detected based on the presence or absence of the differential pressure, and the abnormal signal is transmitted to the board via the signal transmission wiring to recognize the abnormal state. It is possible to take measures such as stopping the operation.

The electronic equipment according to the fourth embodiment of the present invention is provided with pressure detection ports at both inlet and outlet side joints of each row cooling plate, and a differential pressure sensor for detecting the liquid refrigerant differential pressure between the inlet and outlet joints for each row. By installing a sensor, detecting the occurrence of clogging based on the occurrence of differential pressure, and recognizing the occurrence of abnormalities by transmitting an abnormal signal to the board via the signal transmission wiring, it is possible to take measures such as stopping operation. Is.

[0010]

According to the first embodiment of the present invention, when foreign matter mixed in the piping system for some reason causes clogging in the minority row joint, the flow passage supplied from the manifold to the cooling plate is cut off. Since all the adjacent cooling plates are connected by a bypass joint, this bypass joint functions as a manifold, and redistributing is possible so that the flow paths in each row are balanced. Also, because there are no hardware restrictions on the flow path of the bypass joint, it is possible to ensure that the flow path area does not become clogged. Also, because it is a flexible type and it is a coupler connection, it is easy to attach and detach. Becomes Furthermore, when the number of rows that have been clogged increases, the resistance of the device gradually increases, so it is possible to detect externally as a high pressure abnormality or a flow rate reduction abnormality.

Further, according to the second embodiment of the present invention, the cooling performance of the electronic module gradually deteriorates and the temperature of the heating element inside the electronic module rises. Is detected and an abnormal signal is transmitted to the board through the connector, the abnormal occurrence is recognized, and it is possible to take measures such as stopping the operation.

Furthermore, according to the third embodiment of the present invention, when clogging occurs in the minority row joint and the flow rate of the cooling plate in the row is extremely reduced, the joint internal liquid to be generated at a predetermined flow rate. Since the dynamic pressure of the refrigerant decreases, the differential pressure sensor detects this, and an abnormal signal is transmitted to the substrate via the signal transmission wiring to recognize the abnormal occurrence, and it is possible to take measures such as stopping the operation.

According to the fourth embodiment of the present invention, when clogging occurs in the minority row joint and the flow rate of the cooling plate in the row is extremely reduced, the liquid refrigerant between the inlet and outlet joints should be generated at a predetermined flow rate. Since the differential pressure decreases, the differential pressure is detected by the differential pressure sensor, and the abnormal signal is transmitted to the substrate through the signal transmission wiring to recognize the abnormal occurrence, and it is possible to take measures such as stopping the operation.

[0014]

【Example】

Example 1. 1 (a) is a plan view showing a first embodiment of the present invention, and FIG. 1 (b) is a view showing a cross section AA in the plan view of the first embodiment shown in FIG. 1 (a). In the figure, 1 is an electronic module, 2 is a cooling plate, 3 is a manifold, and 6 is a bypass joint. As shown in the figure, it is attached to the cooling plate by welding, bonding, etc., and has a flexible structure such as a bellows, and connection is easy. It consists of a removable coupler connection.

In the first embodiment shown in FIG. 1, the cooling plate 2 in each row has its flow passage bypassed by the bypass joint 6, so that even if the joint is clogged, the bypass joint 6 is operated by the manifold. By performing the function of 3, it is possible to balance the flow rate of all rows and prevent a decrease in flow rate of the clogging row.

Example 2. 2A is a bird's-eye view showing the second embodiment of the present invention, and FIG. 2B is a view showing a cross-section BB in the bird's-eye view of the second embodiment shown in FIG. 2A. In the figure, 7 is a heating element, 8 is a temperature sensor, 9 is a connector, and 13 is a lead wire.

In the second embodiment shown in FIG. 2, when the flow rate of the cooling plate decreases due to clogging, the temperature of the heating element 7 gradually rises. This is detected by the temperature sensor 8 and the lead is read. By transmitting an abnormal signal to the board through the line 13 and the connector 9, it is possible to recognize the occurrence of clogging and take measures such as stopping the operation.

Example 3. 3 is a diagram showing a third embodiment of the present invention, in which 2 is a cooling plate, 3 is a manifold,
Reference numeral 4 is a joint, 5 is a substrate, 10 is a dynamic pressure detection port, 11 is a static pressure detection port, 12 is a differential pressure sensor, and 13 is a lead wire.

In the third embodiment shown in FIG. 3, the dynamic pressure and the static pressure of the internal liquid refrigerant are constantly detected at the dynamic pressure detecting port 10 and the static pressure detecting port 11 of the joint 4, and the flow rate is reduced due to clogging. Occurs, the dynamic pressure decreases and the difference from the static pressure decreases, so this is detected by the differential pressure sensor 12, and an abnormal signal is transmitted to the substrate 5 via the lead wire 13 to cause clogging. It becomes possible to take action such as stopping the operation by recognizing.

Example 4. FIG. 4 is a view showing Embodiment 4 of the present invention, in which 2 is a cooling plate, 3 is a manifold,
4 is a joint, 5 is a substrate, 12 is a pressure sensor, 13 is a lead wire, and 14 is a pressure detection port.

In the fourth embodiment shown in FIG. 4, the differential pressure of the internal liquid refrigerant is constantly detected at the pressure detecting port 14 of the inlet / outlet side joint 4 of the cooling plate 2, and the difference in which the flow rate decreases due to clogging is generated. Since the pressure decreases, this is detected by the differential pressure sensor 12, and an abnormal signal is transmitted to the substrate 5 via the lead wire 13 to recognize the occurrence of clogging, and it is possible to take measures such as stopping the operation. .

In the above description, the present invention has been described with respect to an electronic device in which an electronic module requiring cooling is arranged, but it goes without saying that the present invention can also be applied to an apparatus having a plurality of rows of distribution pipes.

[0023]

Since the present invention is configured as described above, it has the following effects.

According to the first embodiment of the present invention, when foreign matter mixed in the piping system is clogged at the minority row joint for some reason, the flow path supplied from the manifold to the cooling plate is cut off. Since the adjacent cooling plates are connected by all bypass joints, this bypass joint functions as a manifold and can be redistributed so that the flow rate of each row is balanced. Further, when the number of rows that have been clogged increases, the resistance of the device gradually increases, and therefore it is possible to detect externally as a high pressure abnormality or a flow rate reduction abnormality.

According to the second embodiment of the present invention, the cooling performance of the electronic module gradually deteriorates due to the clogging and the temperature of the heating element inside the electronic module rises, but the temperature sensor in the vicinity has a level capable of preventing the performance deterioration. By detecting this and transmitting an abnormal signal to the substrate through the lead wire and the connector, it is possible to recognize the occurrence of the abnormal condition and take measures such as stopping the operation.

According to the third embodiment of the present invention, when the flow rate of the cooling plate is extremely reduced due to clogging, the dynamic pressure of the liquid refrigerant inside the joint is reduced. By transmitting an abnormal signal to the substrate via the line, it is possible to recognize the occurrence of abnormality and take measures such as stopping the operation.

According to the fourth embodiment of the present invention, when the flow rate of the cooling plate is extremely decreased due to clogging, the differential pressure of the liquid refrigerant between the inlet and outlet joints is decreased, and this is detected by the pressure sensor to detect the lead wire. It is possible to recognize the occurrence of an abnormality by transmitting an abnormality signal to the board via the device and take action such as stopping the operation.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing a first embodiment of the present invention.

FIG. 2 is a sectional view of an electronic module showing a second embodiment of the present invention.

FIG. 3 is a partial view showing a third embodiment of the present invention.

FIG. 4 is a partial view showing a fourth embodiment of the present invention.

FIG. 5 is a configuration diagram showing a conventional electronic device.

[Explanation of symbols]

1 Electronics Module, 2 Cooling Plate, 3 Manifold, 4 Joint, 5 Board, 6 Bypass Joint, 7 Heating Element, 8 Temperature Sensor, 9 Connector, 10 Dynamic Pressure Detection Port, 11 Static Pressure Detection Port, 12 Pressure Sensor, 13 Lead Line, 14 Pressure detection port.

Claims (4)

[Claims] 1. A plurality of electronic modules which are provided with heating elements that require cooling and are arranged in a grid at predetermined intervals, and between each row of electronic modules for indirectly liquid cooling the electronic modules. Adjacent to each other in an electronic device composed of a cooling plate arranged in a gap, a manifold for distributing a liquid refrigerant to each of the row cooling plates, and a joint for connecting the cooling plate and the manifold. An electronic device, comprising: a bypass joint provided in the vicinity of the inlet / outlet of the cooling plate flat plate portion so as to bypass the flat plate passages of the cooling plate. 2. The electronic device according to claim 1, wherein a temperature sensor is provided near a heating element for a specific one of the electronic modules in each row. 3. A dynamic pressure detecting port and a static pressure detecting port of the liquid refrigerant provided in a joint connecting the manifold and the cooling plates of each row, and a differential pressure between the dynamic pressure detecting port and the static pressure detecting port. The electronic device according to claim 1, further comprising a differential pressure sensor that controls the electronic pressure. 4. A pressure detecting port provided on both inlet and outlet side joints of each row cooling plate, and a differential pressure sensor for detecting a liquid refrigerant differential pressure between the inlet and outlet joints for each row. Item 1. The electronic device according to item 1.