JPH08236970A - Portable power unit - Google Patents

Abstract

PURPOSE: To make a portable power unit to be readily maintained and inspected and to prevent the malfunction of a control circuit by providing prescribed heat generating components which are electrically connected to a non-heat generating component on the surface of a heat radiating body faced to one of two areas where the non-heat generating component are provided. CONSTITUTION: A space is formed of a front panel 2, rear panel 3, left side cover 4, and right side cover. Heat generating components 61, such as a high-frequency transformer 13, high-frequency unit 31, coupling coil 65 for generating high frequency, etc., are provided in a lower area formed in the space by a middle chassis 1. In addition, non-heat generating components 2 and power semiconductor module 11 which is heat generating components are provided in an upper area 64, with the module 11 being mounted on a heat sink 12 for cooling. The module 11 is prescribed heat generating components which are electrically connected to the non-heat generating components.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to, for example, an arc welding machine, a plasma arc cutting machine, a charger, and a portable power supply device for precious metal plating.

[0002]

2. Description of the Related Art The conventional portable power supply device described above is designed to rectify a commercial power supply, switch it at a high frequency, rectify it again via a high frequency transformer, and then output it. The circuit consists of a main circuit (heating component) including a switching circuit and a high-frequency transformer, and a control circuit (non-heating component) that detects the output current or output voltage and controls the switching transformer on the primary side based on the detected value. ,,. In such a power supply device, a large transformer or large choke is not required, so
In particular, there is an advantage that the main circuit can be downsized.

However, in the above-mentioned power supply device, the number of electric parts used increases and the circuit becomes complicated. Therefore, a heat-generating component and a non-heat-generating component may be provided in a mixed manner, and in such a case, the heat received from the heat-generating component may cause the control circuit (non-heat-generating component) to malfunction.

[0004] Therefore, the applicant is Japanese Patent Publication No. 3-46556.
The inventor of the small electronic device disclosed in the publication.
This small electronic device, as shown in FIG.
The back plate 52 and the back plate 52 are coupled to each other through a plurality of bars 54, and a printed circuit board 55 on which heat-generating components (main circuit) and non-heat-generating components (control circuit) are mounted is provided on the upper surfaces of these bars 54 to generate heat. In this structure, the radiation fins 58 are provided at the boundary between the region 56 where the components are mounted and the region 57 where the non-heat generating components are mounted. With this configuration, it is possible to prevent the heat generated by the heat-generating component from being transmitted to the control circuit by the radiation fins 58, and as a result, it is possible to prevent malfunction of the control circuit due to heating.

[0005]

However, in the conventional device shown in FIG. 14, the printed circuit board 55 is provided with the heavy radiation fins 58, so that the printed circuit board 55 may be damaged. is there. Particularly, when the device shown in FIG. 14 is a portable device, the printed circuit board 5
There is a high possibility that the product will be damaged due to strong impact on the product.

Since the heat-generating component (main circuit) and the non-heat-generating component (control circuit) mounted on the printed circuit board 55 are separated by the radiation fins 58, the heat-generating component and the non-heat-generating component are electrically connected by wiring. When connecting physically, the wiring needs to be provided so as to bypass the heat radiation fin 58. Therefore, there is a problem that the wiring becomes long and the loss of the wiring becomes large. Further, when the wiring becomes long, the wiring inductance becomes large and noise is easily received, which causes a problem that the snubber circuit becomes large.

The present invention provides a portable power supply device having a strong structure and a small size, relatively easy to maintain and inspect, a control circuit does not easily malfunction, and a snubber circuit can be relatively small. With the goal.

[0008]

According to a first aspect of the present invention, there are provided a first side plate and a second side plate which are spaced apart from each other and substantially parallel to each other, and the first side plate and the second side plate. Are arranged so as to be substantially orthogonal to both of these side plates, and have a first end and a second end that are formed at positions opposed to each other, and the first end has a first end. A middle chassis that is coupled to a substantially central portion of the side plate and has a second end portion coupled to a substantially central portion of the second side plate to couple the first side plate and the second side plate to each other and has an opening. A radiator provided so as to close the opening of the middle chassis and to radiate heat to one of the two regions formed by being partitioned by the middle chassis, and the heat radiated from the radiator. And a heat-generating component provided on the surface of the radiator facing the one area, and the two areas. A portable power supply device comprising: a non-heating component provided on the surface of the middle chassis facing the other region; and a non-heating component facing the other region of the two regions where the non-heating component is provided. A predetermined heat-generating component electrically connected to the non-heat-generating component is provided on the surface of the radiator.

According to a second aspect of the present invention, in the portable power supply device of the first aspect, the predetermined heat generating component includes a power semiconductor element including a power switching element, and a drive circuit for the power switching element. It is characterized by being a power semiconductor module.

According to a third aspect of the present invention, in the portable power supply device of the second aspect, the non-heat generating component includes a main printed circuit board on which main circuit components are mounted, and the main terminals of the power semiconductor module and the main circuit board. The printed circuit board and the printed circuit board are provided close to each other and electrically connected to each other.

According to a fourth aspect of the present invention, in the portable power supply device of the second aspect, the non-heat generating component includes a main printed circuit board on which a main circuit component is mounted, and the main printed circuit board serves as terminal fixing means. A through hole provided in the main printed circuit board is provided near the terminal fixing means, the main printed circuit board is provided close to the power semiconductor module, and the main terminal of the power semiconductor module is provided in the through hole. It is characterized in that the main terminal and the main printed circuit board are electrically connected to each other by being inserted and coupled to and fixed to the terminal fixing means.

[0012]

According to the portable power supply device of the first to fourth inventions, a predetermined heat-generating component such as a power semiconductor module, which is electrically connected to the non-heat-generating component, is provided in the region where the non-heat-generating component is provided. With this configuration, the predetermined heat generating component and the non-heat generating component can be arranged close to each other. Therefore, it is possible to shorten the length of the terminal or the wiring that electrically connects the two. As a result, the wiring inductance can be reduced.

A predetermined heat-generating component such as a power semiconductor module is provided on the surface of the heat radiator, and the heat generated by the predetermined heat-generating component (power semiconductor module or the like) is absorbed by the heat radiator and the heat is not absorbed. Since the heat is emitted to the area where the heat-generating component is not provided, the heat generated by the predetermined heat-generating component can be prevented from being transferred to the area where the non-heat-generating component (control circuit) is provided.

Further, since the heat-generating components other than the predetermined heat-generating components such as the power semiconductor module and the non-heat-generating components are partitioned by the middle chassis and the radiator, the heat generated by the heat-generating components is the non-heat-generating component. The heat generated by the heat generating component can be absorbed by the radiator, and the absorbed heat can be released to the region where the non-heat generating component is not provided. Therefore, it is possible to prevent the heat generated by the heat-generating components other than the predetermined heat-generating components such as the power semiconductor module from being transferred to the region where the non-heat-generating components (control circuit) are provided.

Further, since the first side plate, the second side plate and the middle chassis have an H-shaped structure, they are hard to be deformed by a force such as compression, pulling, bending, etc. received from all directions, and the structure is strong. .

Since the radiator for radiating the heat generated by the heat generating component is provided in the middle chassis, the weight of the radiator can be received by the middle chassis.

According to the portable power supply device of the third invention, the main printed circuit board, which is a non-heat generating component, and the main terminal of the power semiconductor module, which is a predetermined heat generating component, are provided close to each other, and both are electrically connected. Since they are connected, the length of the main terminal that electrically connects them can be shortened, and the wiring inductance can be reduced.

According to the portable power supply device of the fourth aspect of the invention, the main terminal is mainly connected to electrically connect the main terminal of the power semiconductor module, which is a predetermined heat-generating component, and the terminal fixing means of the main printed circuit board. Since it is inserted into the through hole provided in the printed circuit board, it is not necessary to detour the main terminal to the outer edge portion of the main printed circuit board. The inductance can be reduced.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the portable power supply device according to the present invention is applied to a portable power supply device for a plasma arc cutting machine will be described with reference to the drawings. FIG. 1 is an exploded perspective view showing a mounted state of this portable power supply device. 10 to 13
FIG. 4A is a right side view, a front view, a rear view and a plan view of a portable power supply device. 1, 1 is a middle chassis, 2 is a front panel (first side plate), 3 is a rear panel (second side plate), 4 is a left side cover (third side plate), 5 is a right side cover ( It is a fourth side plate).

As shown in FIG. 1, the middle chassis 1 is formed in a rectangular frame shape that is long in the front-rear direction, and has an opening 1a at the center, which is slightly smaller than a cooling heat sink (heat radiator) 12 to be described later. However, behind the opening 1a (on the rear panel 3 side), there is provided a recess 1g into which an upper portion of a cooling fan 14 described later is fitted. Also, the front end face 1 of the middle chassis 1
The left and right ends (first ends) of h and the left and right ends (second ends) of the rear end face 1i extend in parallel with each other and extend backward and forward, respectively. (See FIG. 5), and the outer surface of the distal end portion of each of these extension portions 1j is
Engaging projections 1k are provided in a protruding manner (in FIG. 1, four extension parts 1
Three of the j appear. ). Further, as shown in FIG. 5, a groove 1m is provided on the front end face and the rear end face so that the extended portion 1j can be easily bent inward.

In FIG. 5A, when the front panel 2 is viewed from the front, the engaging protrusion 1k located on the right side of the middle chassis 1 has an engaging edge 2e of an insertion hole 2d formed in the front panel 2. 5 is a cross-sectional view showing a state in which the
(C) is a side view showing a state in which the engaging protrusion 1k is engaged with the insertion hole 2d. As shown in FIGS. 5A and 5C,
With the engagement protrusion 1k engaged with the insertion hole 2d, the front edge, the rear edge, the upper edge, and the lower edge of the engagement protrusion 1k contact the corresponding inner edges of the insertion hole 2d. Engagement protrusion 1k
And an insertion hole 2d is formed. The front edge, the rear edge, the upper edge, and the lower edge of the insertion hole 2d are the engaging edges 2e. The outer side surface 1n of the extended portion 1j is also in contact with the side edge of the insertion hole 2d. Further, the remaining three sets of the engaging projections 1k and the insertion holes 2d are also formed in the same manner as shown in FIGS. 5A and 5C, and detailed description thereof will be omitted.

With this structure, when the pair of engaging projections 1k provided on the front end surface of the middle chassis 1 are engaged with the pair of insertion holes 2d provided on the front panel 2, the middle chassis 1 and the front panel 2 are separated from each other. The positional relationship is fixed with respect to each other, and they are combined. Similarly, when the pair of engaging projections 1k provided on the rear end surface of the middle chassis 1 are engaged with the pair of insertion holes 2d provided on the rear panel 3, the middle chassis 1 and the rear panel 3 have a positional relationship with each other. Fixed and combined. When removing the front panel 2 or the rear panel 3 from the middle chassis 1, for example, the engaging protrusion 1k shown in FIG. 5A may be pushed inward with a finger to remove the engaging protrusion 1k from the insertion hole 2d. (Fig. 5
(See (b) and (d)). At this time, since the extension portion 1j (middle chassis 1) is made of synthetic resin, it is elastically deformed inward by the pressing force of a finger, so that the engaging convex portion 1k can be easily removed from the insertion hole 2d.

As shown in FIG. 1, the front panel 2 has at its bottom two output terminals 2f, 2f of this power supply device.
A total of three openings 2g for attaching one output part 2c as a gas outlet are provided. On the contrary,
As shown in FIG. 1, the rear panel 3 has one opening 3 for attaching an input portion 3c such as a gas inlet to the lower portion.
d is provided. That is, the shape is different in that the front panel 2 is provided with three openings 2g, whereas the rear panel 3 is provided with one opening 3d, and the other shapes are the same. Is. That is, the front panel 2 and the rear panel 3 are both vertically long rectangular plate-like bodies, and for example, an opening 2a for mounting an operation printed circuit board 21 to be described later on each upper portion, a plurality of passages 2b for cooling air. , Through holes 2d are provided, and these openings 2
The positions and shapes of a, the passage 2b, and the insertion hole 2d are the same.

The left side cover 4 is, as shown in FIG.
The vertical cross-sectional shape is approximately U-shaped. Right side cover 5
(Not shown in FIG. 1. See FIGS. 10 to 13.)
Are symmetrical with the left side cover 4 and have the same shape. Therefore, when the two left and right side covers 4 and 5 are connected to each other by screws as shown in FIG. 11, a cross-sectional shape becomes a rectangular tube shape. As shown in FIG. 1, a pair of ridges 4a are provided on the inner surface of each of the left and right side covers 4 and 5 and are spaced apart from each other and parallel to the cylinder direction. As shown, the upper edge 1 of the left side surface of the middle chassis 1 is provided between the pair of left protrusions 4a.
p and the lower edge 1q are sandwiched, and a pair of right side ridges 4
The upper edge 1p and the lower edge 1q of the right side surface of the middle chassis 1 are sandwiched between a and 4a, thereby firmly supporting the middle chassis 1 so as not to move upward or downward. Further, as shown in FIG. 1, the left and right side covers 4,
Two recesses 4c are provided between the protrusions 4a which are parallel to each other and between the protrusions 4a, and each recess 4c includes a positioning protrusion 1r provided on the left side surface or the right side surface of the middle chassis 1. It is possible to fit and position the middle chassis 1 with respect to the side covers 4 and 5.

Further, as shown in FIG. 1, support convex portions 4d are provided on the inner surfaces of the rear portions of the left and right side covers 4 and 5 (the right side cover 5 is omitted in FIG. 1). Yes,
Only the support protrusion 4d provided on the left side cover 4 is shown. ), As shown in FIG. 6, the support protrusion 4d contacts the lower surface of the cooling fan 14 fitted into the recess 1g provided in the middle chassis 1, and supports the cooling fan 14 so as not to come off from the recess 1g. ing.

As shown in FIG. 1, the left and right side covers 4, 5 are provided with grips 4f formed on the upper side of the left and right side covers 4, 5 in a combined state. The portable power supply device can be carried by holding the handle 4f by hand. A notch 4g is provided at the base end portion of the handle 4f, and a pair of hook portions 4h for hooking the annular portions 6a formed at both ends of the shoulder strap band 6 are provided.
Is provided. The portable power supply device can be carried around by hanging the band 6 on the shoulder. Then, a total of four screw insertion holes 4i are formed in the upper and lower portions of the left and right side covers 4 and 5, respectively, in order to connect them to each other.

The left and right side covers 4, 5 are
A tubular portion having a quadrangular cross-sectional shape is formed in a state of being connected to each other, and projecting edges 4j, 4k are provided inside the front and rear openings of the tubular portion. These ridges 4
j and 4k are engaged with the outer peripheral edges of the front panel 2 and the rear panel 3 which are fitted in the respective opening portions to close the respective opening portions, and are firmly fixed so that the front panel 2 or the rear panel 3 does not come out. It has the function of locking.

Next, the heat generating component 61 provided on the lower surface of the middle chassis 1 and the non-heat generating component 62 provided on the upper surface of the middle chassis 1 shown in FIG. 1 will be described. That is, in the space formed by the front panel 2, the rear panel 3, the left and right side covers 4, 5 shown in FIG. 1 and the like, the lower region 63 shown in FIG. Is provided with a heating component 61 such as a high frequency transformer 13, a high frequency unit 31, and a high frequency generating coupling coil 65. In the upper area 64, the non-heat-generating component 62 and the power semiconductor module 11 that is a heat-generating component are provided.

The power semiconductor module 11 is internally wired with a rectifier diode, a power switching element such as a power transistor, a power semiconductor element including a flywheel diode, and a drive circuit for the switching element. The power semiconductor module 11, which is the heat generating component, is attached to the upper surface (upper region) of the cooling heat sink 12, and the cooling heat sink 12
Is fixed to the lower surface of the middle chassis 1 with screws so as to close the opening 1a. The cooling heat sink is a radiator fin or the like, and is the radiator according to claim 1. The power semiconductor module 11 is a predetermined heat generating component electrically connected to the non-heat generating component according to claim 1. However,
Instead of the power semiconductor module 11 or in addition to the power semiconductor module 11, another heat generating component that is electrically connected to the non-heat generating component may be provided on the upper surface of the cooling heat sink 12. The high frequency transformer 13 has a mounting portion 1 on the upper portion.
3a, which is fastened and fixed to the lower surface of the middle chassis 1 with screws. The high frequency unit 31 is attached to the lower surface of the cooling heat sink 12, and the coupling coil 65 is connected to the high frequency transformer 13.

As shown in FIG. 1, the non-heat generating component 62 has a control printed circuit board 16 on which control components are mounted, and the control printed circuit board 16 is attached, and main circuit components such as smoothing capacitors are provided. The main printed circuit board 15 and the like mounted therein. This main printed circuit board 15
Are fastened to the plurality of bosses 1c provided on the upper surface of the middle chassis 1 with screws.

As shown in FIG. 1, on the upper surface of the power semiconductor module 11, two sets of four main terminals 11a each, that is, a total of eight main terminals 11a are arranged parallel to each other and upward. It is extended and projected. And these main terminals 1
1a is inserted into through holes (oblong holes) 15b and 15b (one through hole 15b appears in FIG. 1) provided in the main printed circuit board 15 corresponding to each set. In the inserted state, as shown in the side view of FIG. 7, the respective tip portions thereof are connected to the terminal fixing means 15a provided along the through hole 15b on the upper surface of the main printed circuit board 15. As shown in FIGS. 7 and 8, the screws 11b are connected to the main terminal 1 by connecting the tip portions of the respective main terminals 11a to the respective terminal fixing means 15a.
It is carried out by inserting it into a small hole provided at the tip of 1a and screwing it into a screw hole provided in the terminal fixing means 15a to tighten it. The terminal fixing means 15a are electrically connected to the smoothing capacitor provided on the main printed board 15. Therefore, the power semiconductor module 11 and the smoothing capacitor are electrically connected via each main terminal 11a and each terminal fixing means 15a. Although the leading end of the main terminal 11a is fastened and fixed to the terminal fixing means 15a with the screw 11b, it may be electrically connected by means other than this.
For example, a conventionally known plug and outlet may be used, or a connector may be used for connection.

Further, as shown in FIGS. 1, 7 and 8, on the upper surface of the power semiconductor module 11, eight control terminals 11c are provided so as to extend in parallel with each other and extend upward. There is. Then, these control terminals 11c are inserted through through holes provided in the auxiliary printed circuit board 80 corresponding to each terminal 11c, and in the inserted state, as shown in FIG. , Auxiliary printed circuit board 80
It is electrically connected to the printed wiring. The printed wiring of the auxiliary printed circuit board 80 is electrically connected to the control printed circuit board 16 via the connector 81, the relay flat cable 82, and the connector 83. In this way, the eight control terminals 1 of the power semiconductor module 11 are
1c and the control printed circuit board 16 are electrically connected.

Reference numeral 21 shown in FIG. 1 is an operating printed circuit board. The operation pudding board 21 is connected to the control printed board 16 via a flexible electric wire 66, and is equipped with a switch 21a, an indicator lamp, and an output adjuster. The operating printed circuit board 21 has the operating cover 2
2 and 2 are fastened with screws so as to cover the opening 2a of the front panel 2. Reference numeral 23 shown in FIG. 1 is a power input fixed insulating plate. This power input fixed insulating plate 23
Is equipped with power input components such as a power cable 67 and a power switch 68, and is fastened with screws so as to cover the opening 3a of the rear panel 3. Reference numeral 24 shown in FIG. 1 denotes a gas electromagnetic valve (which is connected to the input portion 3c such as a gas inlet) for opening and closing the flow path of the working gas used for plasma arc, for example. One opening of the electromagnetic valve 24 for gas is connected to a supply source of the working gas, and the other opening is a gas outlet provided in the front panel 2 via a joint and a pipe (not shown). Output section 2c
Connected with.

According to the portable power supply device configured as described above, as shown in FIG. 2 (right side view of front panel 2, rear panel 3 and middle chassis 1), front panel 2, rear panel 3 and middle Since the chassis 1 has an H-shaped structure, it is hard to be deformed by a force such as compression, pulling, bending, etc., which the power supply device receives from any direction, and the structure is strong. That is, the portable power supply device often receives an impact during transportation, but it is possible to prevent damage to the heat generating component 61 (including the power semiconductor module 11) and the non-heat generating component 62 due to such impact. .

Since the heat generating component 61 and the non-heat generating component 62 are separated by the middle chassis 1 and the cooling heat sink 12, the heat generating component 61 (for example, the high frequency unit 3).
It is possible to make it difficult for the heat generated in 1) to be transmitted to the non-heat generating component 62, and thereby to prevent malfunction of the non-heat generating component 62 (for example, the main printed circuit board 15) due to heat. Further, since the cooling heat sink 12 for radiating the heat generated by the heat generating component 61 can be provided in the middle chassis 1, the main printed circuit board 15 and the like are not damaged by the weight of the cooling heat sink 12.

Further, as shown in FIG. 1, the heat generating component 61 can be exposed on the lower surface of the middle chassis 1, and
Since the non-heat generating component 62 can be exposed on the upper surface of the middle chassis 1, the left and right side covers 4, 5 are provided.
By removing one or both of them, all circuits and parts can be easily checked, maintained, and inspected.
Further, since the heat generating component 61 and the non-heat generating component 62 are provided by utilizing both the upper surface and the lower surface of the middle chassis 1, the heat generating component and the non-heat generating component are connected to each other like the conventional device shown in FIG. As compared with the configuration provided on the upper surface of 54, the middle chassis 1 can be made smaller, which allows the entire apparatus to be made smaller. And like this,
Since the heat-generating components 61 and the like are provided by utilizing both surfaces of the middle chassis 1, it is possible to widen the intervals between the components, which allows easy assembly of the components and fastening and fixing with screws.

Then, the lower region 6 provided with the heat-generating component 61.
3 and the upper region 64 provided with the non-heat generating component 62 are partitioned by the cooling heat sink 12 and the middle chassis 1, so that the heat generating component 6 other than the power semiconductor module 11 is provided.
It is possible to prevent the heat generated by No. 1 (the heat-generating component 61 provided in the region 63) from being transmitted to the region 64 in which the non-heat-generating component 62 is provided. Then, the heat generated by the heat-generating components 61 such as the power semiconductor module 11 and the high frequency transformer 13 is absorbed by the cooling heat sink 12 and radiated to the lower region 63. The semiconductor module 1 for heat and power released from the cooling heat sink 12
The heat directly emitted from the heat generating component 61 other than 1 is cooled by the cooling fan 14. That is, when the cooling fan 14 is driven, external cool air flows in from the passage 2b of the front panel 2, takes away heat generated by the heat-generating component 61, and flows out of the portable power supply device from the passage 2b of the rear panel 3. To do. As a result, malfunction of the non-heat generating component 62 due to heat can be prevented.

The power semiconductor module 11 which is a heat generating component is provided in the upper region 64 where the non-heat generating component 62 is provided.
Is provided in contact with the cooling heat sink 12, the heat generated by the power semiconductor module 11 can be radiated to the lower region 63 by the cooling heat sink 12. Therefore, the heat generated by the power semiconductor module 11 is hardly released to the upper region 64, and as a result, the non-heat generating component 62 does not malfunction due to the heat generated by the power semiconductor module 11.

Furthermore, since the power semiconductor module 11 which is a heat generating component is provided in the region 64 where the non-heat generating component 62 is provided, the power semiconductor module 11 and the main printed circuit board 15 which is the non-heat generating component 62. The control printed circuit board 16 and the like can be arranged close to each other. Therefore, the main terminal 11 for electrically connecting the two
It is possible to shorten the lengths of a, the control terminal 11c, and the flat cable 82. As a result, the wiring inductance can be reduced and the generation of noise can be reduced, so that the snubber circuit of the power semiconductor module 11 can be reduced in size.

The main terminal 11a of the power semiconductor module 11 and the terminal fixing means 15a of the main printed board 15 are provided.
Since the main terminal 11a is inserted into the through hole 15b provided in the main printed board 15 in order to electrically connect the main terminal 11a and the main terminal 11a, it is not necessary to bypass the main terminal 11a to the outer edge portion of the main printed board 15. The length of the main terminal 11a can be shortened by the amount that the main terminal 11a is not detoured, whereby the wiring inductance and the snubber circuit of the power semiconductor module 11 can be made extremely small. Since the terminal fixing means 15a is provided, the work of connecting the main terminal 11a can be easily performed.

Further, the front panel 2, the middle chassis 1 and the rear panel 3 are connected by engaging the insertion holes 2d provided in the front panel 2 and the rear panel 3 with the engaging projections 1k of the middle chassis 1. In this configuration, one panel or both panels can be removed from the middle chassis 1 by removing the engaging convex portion 1k from the insertion hole 2d. That is, the panels 2, 3 without using tools or the like
Assembling and disassembling the middle chassis 1 can be performed very easily.

Furthermore, since the upper edge 1p and the lower edge 1q of the corresponding side surfaces of the middle chassis 1 are sandwiched between the protrusions 4a and 4a provided on the left and right side covers 4 and 5, and supported, Right and left side covers 4, 5 without using tools
Assembling and disassembling the middle chassis 1 can be performed very easily. The middle chassis 1 can be reliably fixed to the left and right side covers 4 and 5 by the protrusions 4a.

Then, the heat generating component 61 and the non-heat generating component 62.
The middle chassis 1 provided with is firmly supported by the protrusions 4a provided on the left and right side covers 4 and 5, and the upper portions of the left and right side covers 4 and 5. This is a configuration in which a handle 4f is provided on the. Therefore,
When the portable power supply device is lifted by gripping the handle 4f, the extension part 1j as the connecting part between the front panel 2 or the rear panel 3 and the middle chassis 1 is not given a certain weight or more. It is possible to prevent the extension portion 1j from being damaged. Further, even when the portable power supply device is suspended by hanging the shoulder strap band 6 on the shoulder, the extension portion 1j does not receive a certain weight or more.

Further, the heat generating component 6 is provided by the cooling fan 14.
Since the heat generated by No. 1 and the heat released by the cooling heat sink 12 can be released to the outside, the heat generating component 6
First, it is possible to prevent overheating of the non-heat generating component 62. Then, the cooling fan 14 is provided with the concave portion 1g and the supporting convex portion 4
It can be securely fixed by d. Further, since the cooling fan 14 is fixed by engaging the concave portion 1g and the supporting convex portion 4d, the cooling fan 14 can be fixed and attached to the middle chassis 1 extremely easily without using a tool or the like. It can also be removed.

However, the portable power supply device of the above embodiment is
Applied for plasma arc cutting machine, arc welding machine,
It can be applied to chargers or precious metal plating.
Further, the present invention can be applied to a portable power supply device that can be used for both a plasma arc cutting machine and an arc welding machine.

In the above embodiment, as shown in FIG. 2, the heat generating component 61 is provided on the lower surface side of the middle chassis 1 and the non-heat generating component 62 is provided on the upper surface side thereof, but as shown in FIG. On the upper surface side of the chassis 1, heat generating parts 61 and related parts such as the cooling fan 14 are provided, and on the lower surface side, the non-heat generating parts 6 are provided.
It is possible to adopt a configuration in which two are provided.

In the above-described embodiment, as shown in FIG. 1, the middle chassis 1 is provided in parallel with the horizontal direction when the power supply device is erected, but the configuration is such that the middle chassis 1 is provided in parallel with the vertical direction. can do.

In the above embodiment, as shown in FIG. 7, eight control terminals 1 of the power semiconductor module 11 are used.
1c and the control printed circuit board 16 are electrically connected via the printed wiring of the auxiliary printed circuit board 80, the connector 81, the relay flat cable 82, and the connector 83. As shown in FIG. 80, the connector 81, the relay flat cable 82, and the connector 83 are omitted, and the tips of the eight control terminals 11c of the power semiconductor module 11 are inserted into the eight through holes 16a provided in the control printed circuit board 16. Insert each, control terminal 1
The tip of 1c and the printed wiring of the control printed circuit board 16 may be electrically coupled by the solder 16b. With this configuration, the control terminal 11c and the control printed circuit board 16 can be electrically directly connected to each other, whereby the length of the electric wiring connecting them can be shortened. As a result, the wiring inductance can be reduced and the generation of noise can be reduced.

[0049]

According to the portable power supply device of the first to fourth aspects of the invention, the predetermined heat generating component such as the power semiconductor module is provided in the region where the non-heat generating component is provided. The heat-generating component and the non-heat-generating component can be arranged close to each other. Therefore, it is possible to shorten the length of the terminal or the wiring that electrically connects the two.
As a result, the wiring inductance can be reduced and the generation of noise can be reduced, so that there is an effect that the snubber circuit of a predetermined heat-generating component such as a power semiconductor module can be downsized.

A predetermined heat-generating component such as a power semiconductor module is provided on the surface of the heat-dissipating member, and the heat-dissipating member absorbs the heat generated by the predetermined heat-generating component so that the non-heat-generating component is not provided. Since the heat is emitted to the area, it is possible to prevent the non-heat generating component (control circuit) from malfunctioning due to the heat generated by the predetermined heat generating component.

Further, since the heat-generating components other than the predetermined heat-generating components such as the power semiconductor module and the non-heat-generating components are partitioned by the middle chassis and the radiator, the heat generated by the heat-generating components is the non-heat-generating component. Can be made hard to be transmitted to the area where the heat-generating component is provided, and the heat generated by the heat-generating component is absorbed by the radiator, and the absorbed heat is released to the region where the non-heat-generating component is not provided. So
There is an effect that it is possible to prevent a malfunction due to heat of the non-heat generating component (control circuit).

Further, since the first side plate, the second side plate and the middle chassis have an H-shaped structure, they are hard to be deformed by a force such as compression, pulling, bending, etc. received from all directions, and the structure is strong. There is an effect. That is, the portable power supply device often receives an impact during transportation, but it is possible to prevent damage to the heat generating component and the non-heat generating component due to such impact.

Since a radiator for releasing the heat generated by the heat-generating component can be provided in the middle chassis, the printed circuit board 55 may be damaged by the weight of the radiator as in the device shown in FIG. There is no.

Further, the heat generating component can be provided so as to be exposed on the back surface (or the front surface) of the middle chassis, and the non-heat generating component can be provided so as to be exposed on the front surface (or the back surface) of the middle chassis. The effect that all circuits and parts can be easily checked, maintained, and inspected. Further, since the heat generating component and the non-heat generating component are provided by utilizing both the front surface and the back surface of the middle chassis, the heat generating component (not shown) like the device shown in FIG.
Also, as compared with the configuration in which the non-heat generating component (not shown) is provided only on the upper surface of the crosspiece 54, there is an effect that the middle chassis can be made smaller, which makes it possible to make the entire device smaller. . In this way, since the heat generating parts etc. are provided by using both sides of the middle chassis, it is possible to widen the intervals between the parts, which makes it easy to assemble the parts and tighten and fix them with screws. The effect is that it can be done.

According to the portable power supply device of the third invention, the main printed circuit board which is a non-heat generating component and the main terminal of the power semiconductor module which is a predetermined heat generating component are provided close to each other, and both are electrically connected. Since they are connected, the length of the main terminal that electrically connects them can be shortened.
As a result, the wiring inductance can be made extremely small, and the snubber circuit of the power semiconductor module can be made extremely small.
Further, since the length of the main terminal can be set to a length suitable for the connecting work, there is also an effect that the connecting work can be facilitated.

According to the portable power supply device of the fourth invention, the main terminals are mainly connected to electrically connect the main terminals of the power semiconductor module, which is a predetermined heat-generating component, to the terminal fixing means of the main printed circuit board. Since it is inserted into the through hole provided in the printed circuit board, it is not necessary to bypass the main terminal to the outer edge portion of the main printed circuit board. Therefore, the length can be shortened as much as the main terminal is not bypassed. The inductance and the snubber circuit of the power semiconductor module can be made extremely small. Further, since the terminal fixing means is provided, there is also an effect that the work of connecting the main terminals can be facilitated.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a mounted state of a portable power supply device according to an embodiment of the present invention.

FIG. 2 is a side view showing an H structure formed by the front panel, the middle chassis and the rear panel of the embodiment.

FIG. 3 is a side view showing another example of the H structure of the front panel, the middle chassis and the rear panel in which the heat generating component of the embodiment is provided in the upper region and the non-heat generating component is provided in the lower region.

FIG. 4 is a front view of a front panel, a middle chassis, and a rear panel of the embodiment.

FIG. 5A is a cross-sectional view showing an engagement state between the engagement protrusion of the embodiment and the engagement edge of the insertion hole, and FIG. 5B is a relation between the engagement protrusion and the insertion hole of the embodiment. A sectional view showing a non-engagement state with a mating edge,
(C) is a side view showing the engagement state of the engagement protrusion of the embodiment and the engagement edge of the insertion hole, and (d) is the engagement protrusion of the embodiment and the engagement edge of the insertion hole. It is a side view which shows a non-engagement state.

FIG. 6 is a vertical cross-sectional view showing a mounted state of the cooling fan of the embodiment.

FIG. 7 is an enlarged side view showing a connection state between the main terminals of the power semiconductor module of the embodiment and the terminal fixing means of the main printed board.

FIG. 8 is a plan view of FIG.

FIG. 9 is an enlarged side view showing another embodiment of the connection structure between the control terminals of the power semiconductor module and the control printed board.

FIG. 10 is a right side view of the portable power supply device according to the embodiment.

FIG. 11 is a front view of the portable power supply device according to the embodiment.

FIG. 12 is a rear view of the portable power supply device according to the embodiment.

FIG. 13 is a plan view of the portable power supply device according to the embodiment.

FIG. 14 is an exploded perspective view showing a mounting state of a conventional power supply device.

[Explanation of symbols]

 1 Middle Chassis 1a Opening 1k Engagement Projection 2 Front Panel (First Side Plate) 2e Engagement Edge 3 Rear Panel (Second Side Plate) 4 Left Side Cover (Third Side Plate) 4a Projection 4d Support Projection 4f Handle 4h Hook 5 Right side cover (4th side plate) 11 Power semiconductor module 11a Main terminal 12 Cooling heat sink (radiating fin) 14 Cooling fan 15 Main printed board 15a Terminal fixing means 15b Through hole 61 Heat generating component 62 Non Heat generating component 63 Lower region 64 Upper region 69 Upper first main body mold 70 Lower first main body mold 71 First fitting mold 72 Second fitting mold 75 Upper second body mold Mold 76 Lower second body mold

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kenzo Dangami 2-14-3 Awaji, Higashiyodogawa-ku, Osaka City, Osaka Prefecture Sansha Electric Manufacturing Co., Ltd. (72) Inventor Seiji Tanaka 2 Awaji, Higashiyodogawa-ku, Osaka 14th-3rd Sansan Electric Co., Ltd.

Claims (4)

[Claims] 1. A first side plate and a second side plate, which are spaced apart from each other and arranged substantially parallel to each other, and between these first side plate and second side plate, both of these side plates are substantially orthogonal to each other. And has a first end portion and a second end portion that are formed at positions opposite to each other, and the first end portion is coupled to the substantially central portion of the first side plate and An end portion of the second side plate is connected to a substantially central portion of the second side plate to connect the first side plate and the second side plate to each other, and a middle chassis having an opening and an opening of the middle chassis are closed. In addition, the radiator provided so as to radiate heat to one of the two regions formed by being partitioned by the middle chassis, and the one facing the one region from which heat is radiated from the radiator. The heat-generating component provided on the surface of the radiator and the middle chassis facing the other of the two regions. Non-heat generating parts provided on the surface of the chassis,
A portable power supply device including: a predetermined power source electrically connected to the non-heating component on a surface of the heat radiator facing the other region of the two regions where the non-heating component is provided. A portable power supply device having a heat-generating component. 2. The portable power supply device according to claim 1, wherein the predetermined heat generating component includes a power semiconductor element including a power switching element, and a drive circuit for the power switching element. A portable power supply device, which is a semiconductor module. 3. The portable power supply device according to claim 2, further comprising a main printed circuit board on which the non-heat generating component is mounted with a main circuit component, the main terminal of the power semiconductor module and the main printed circuit board. A portable power supply device characterized in that the power supply devices are provided close to each other and are electrically connected to each other. 4. The portable power supply device according to claim 2, wherein the non-heat generating component includes a main printed circuit board on which a main circuit component is mounted, and the main printed circuit board includes terminal fixing means and terminal fixing. A through hole provided in the main printed circuit board in the vicinity of the means, the main printed circuit board is provided close to the power semiconductor module, and the main terminal of the power semiconductor module is inserted into the through hole. A portable power supply device, characterized in that the main terminal and the main printed circuit board are electrically connected to each other by being fixed to the terminal fixing means.