JPH08229674A - Production of flux coating material and flux coating device - Google Patents

Abstract

PURPOSE: To shorten drying time by reducing a particle size of sprayed liquid flux so as to form uniform thin film and reduce water content in flux coated film. CONSTITUTION: The device has a spray nozzle 1 by which the liquid flux having water for solvent is sprayed and coated as fog on a printed circuit board, this spray nozzle 1 is heated to about 100 deg.C to 200 deg.C through a temp. controller 2 by a heater.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a flux coating product by applying flux to an article to be coated such as a printed circuit board, and a flux coating product by the method for producing a flux coating product. The present invention relates to a flux coating device suitable for performing.

[0002]

2. Description of the Related Art Conventionally, when mass-producing soldering work for a printed circuit board, prior to the soldering work,
Liquid flux is applied to the printed circuit board.

The above liquid flux is a solution of natural pine resin (water white rosin) in an organic solvent such as isopropyl alcohol.
Contains about%.

It is necessary to apply a certain amount of the flux to the printed circuit board in a uniform thickness and continuously.

Conventionally, a flux applying device has been used for applying flux to a printed circuit board. As this flux applying device, as shown in FIG. 5, a foaming fluxer having a foaming tube 126 into which compressed air is fed is used.

[0006] In this foaming fluxer, compressed air is sent into the inner hole 127 of the foaming tube 126.
The foam tube 126 is formed with innumerable small holes toward the peripheral side from the inner hole 127. Therefore, the compressed air is blown out as a fine air flow around the foam tube 126.

The foam tube 126 is used as the container 123.
It is immersed in a liquid flux 124 filled therein. A substantially cylindrical former fin 125 is disposed above the foam tube 126.

When the air flow is blown out from the foam tube 126 to the peripheral side, the liquid flux 124 is foamed into a foam shape, and is pushed up in the former fin 125. Then, the bubbles 128 of the liquid flux 124 overflow to the upper end of the former fin 125.

The printed circuit board 114 is indicated by an arrow a in FIG.
As shown by, the liquid flux 124 is applied to the printed circuit board 114 when it passes through the bubbles 128.

Further, conventionally, as a flux applying apparatus, as shown in FIG. 6, a spray fluxer having a spray nozzle 101 for atomizing and spraying the liquid flux has been used.

The spray nozzle 101 has an outer casing 11.
It is arranged within 0. The outer housing 110 has a carry-in hole 111 for carrying the printed circuit board 114 into the outer housing 110 and a carry-out hole 112 for carrying out the printed circuit board 114 from the outer housing 110 on both sides. Is formed to be located. Further, an exhaust hole 113 is formed on the upper surface of the outer casing 110.

In this spray fluxer, as shown by an arrow b in FIG.
Compressed air is sent. In addition, the spray nozzle 101
The liquid flux is sent to the liquid as shown by the arrow c in FIG.

The feed amount of the compressed air and the liquid flux to the spray nozzle 101 is controlled by the control circuit 1.
Controlled by 03.

When the printed circuit board 114 is carried into the outer casing 110 through the carry-in hole 111,
The transfer device (belt conveyor device) 105 disposed in the outer casing 110 extends from the vicinity of the carry-in hole 111 to the vicinity of the carry-out hole 112, and the spray nozzle 101 of the spray nozzle 101 is directed toward the carry-out hole 112. It is transported through the upper part.

The conveying device 105 has a pair of two endless belts 116 wound around a pair of supporting rollers 108 and 109. This endless belt 11
The printed circuit board 114 is mounted on the substrate 6 with only the both side portions supported.

A rotary driving force is transmitted from a motor (driving device) 106 to one of the supporting rollers 108 and 109 through an endless driving belt 107. That is, the endless belts 11 are driven by the driving force of the motor 106.
6 is fed between the support rollers 108 and 109 to convey the printed circuit board 114.

In this spray fluxer, the printed circuit board 114 is atomized and ejected from the spray nozzle 101 when it is transported by the transport device 105 and passes over the spray nozzle 101. The liquid flux 122 is sprayed and the liquid flux 122 is applied.

[0018]

By the way, in recent years, it has been desired to use a liquid flux containing no organic solvent in consideration of the influence on the global environment as the above liquid flux.

As the liquid flux containing no organic solvent, a water-based flux is used in which water is used as a solvent and pine resin is saponified and dissolved in this solvent. This water-based flux contains about 85% water as a solvent.

When the flux is applied to the printed circuit board 114 by using the water-based flux in the flux applying apparatus as described above, the flux cannot be applied with a stable film thickness.

That is, since the water-based flux has poor foaming and defoaming properties, it cannot be applied using the foaming fluxer as described above.

Even when the spray flux is used, since the water-based flux does not have volatility, the coating amount on the printed circuit board 114 becomes excessive, and thin and uniform coating cannot be performed.

When a water-based flux is applied using the spray flux, the water-based flux does not have volatility, so it takes a long time to dry, and the flux transport device and other prints are used. There is a risk of redeposition on the substrate and contamination of the inside of the outer casing by the flux.

Therefore, the present invention has been proposed in view of the above situation, and a liquid flux containing water as a solvent is used to form a uniform thin coating film on an object to be coated such as a printed circuit board. And a method for producing a flux coating product capable of reducing the water content in the coating film and shortening the drying time before the next step such as soldering. It is an object of the present invention to provide a flux coating device that coats flux.

[0025]

In order to solve the above problems and achieve the above objects, a method for producing a flux coating product according to the present invention comprises spraying a liquid flux containing water as a solvent through a spray nozzle. A method for producing a flux coating product, which comprises applying the liquid flux to an object to be coated, wherein the spray nozzle is heated and the liquid flux is jetted.

Further, according to the present invention, in the method for producing a flux coated product, the coated product is heated before the liquid flux is coated.

The method for producing a flux coating material according to the present invention is a method for producing a flux coating material, in which a liquid flux containing water as a solvent is sprayed through a spray nozzle to apply the liquid flux to an object to be coated. Therefore, the object to be coated is heated and the liquid flux is jetted.

The flux applying apparatus according to the present invention comprises a spray nozzle for spraying a liquid flux containing water as a solvent to apply the liquid flux to an object to be coated, and spray nozzle heating means for heating the spray nozzle. The spray nozzle heating means is configured to heat the spray nozzle when the spray nozzle ejects the liquid flux.

Further, the present invention provides the above-mentioned flux coating apparatus with a coating object heating means for heating the coating object before the liquid flux is coated.

The flux coating apparatus according to the present invention comprises a spray nozzle for spraying a liquid flux containing water as a solvent to apply the liquid flux to an object to be coated, and an object heating means for heating the object to be coated. The above-mentioned object heating means is configured to heat the object to be coated before the liquid flux is applied.

[0031]

In the method for producing a flux-coated product according to the present invention, the liquid nozzle is sprayed with a liquid flux containing water as a solvent to apply the liquid flux to an object to be coated. The particle size of the flux is reduced, a thin coating film can be formed and applied, and the water content in the liquid flux coating film is reduced.

In addition, in the method for producing a flux-coated article, if the article to be coated is heated before the liquid flux is coated, a thin coating film can be formed and coated, and the flux can be formed. The drying time of the coating film can be shortened.

Then, in the method for producing a flux-coated article according to the present invention, a liquid flux containing water as a solvent is sprayed onto the article to be coated through a spray nozzle to apply the liquid flux to the article to be coated. Since the object to be coated is heated before the coating, a thin coating film can be formed and applied, and the drying time of the flux coating film can be shortened.

The flux applying apparatus according to the present invention comprises a spray nozzle for spraying a liquid flux containing water as a solvent to apply the liquid flux to an object to be coated, and spray nozzle heating means for heating the spray nozzle. The spray nozzle heating means heats the spray nozzle when the spray nozzle sprays the liquid flux, so that the particle size of the liquid flux is reduced and a thin coating film is formed and applied. It is possible to reduce the water content in the flux coating film.

Further, in the above flux applying device,
When an object heating means for heating the object before the liquid flux is applied is provided, it becomes possible to form and apply a thin coating film, and the flux coating drying time is shortened. can do.

The flux coating apparatus according to the present invention comprises a spray nozzle for spraying a liquid flux containing water as a solvent to apply the liquid flux to an object to be coated, and an object heating means for heating the object to be coated. Since the coating object heating means heats the coating object before the liquid flux is applied, it is possible to form and apply a thin coating film, and the drying time of the flux coating film. Shorten.

[0037]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments of the present invention will be described below with reference to the drawings.

The flux coating apparatus according to the present invention is shown in FIG.
As shown in (1), it has a spray nozzle 1 for atomizing a liquid flux and ejecting it, and is configured as a spray fluxer.

The liquid flux applied by this flux applying device is a water-based flux obtained by saponifying natural pine resin (water white rosin) with water as a solvent and dissolving it in this solvent. This water-based flux contains about 85% water as a solvent.

The spray nozzle 1 is arranged in the outer casing 10. The outer casing 10 has a carry-in hole 11 for carrying in the printed circuit board 14 to be coated into the outer casing 10, and a carry-out hole 12 for carrying out the printed circuit board 14 from the outer casing. , Are formed on both sides. In addition, the exhaust hole 13 is provided on the upper surface of the outer casing 10.
Are formed. As shown by the arrow E in FIG. 1, the air inside the outer casing 10 is exhausted to the outside from the exhaust hole 13 by an exhaust device (not shown).

In this spray fluxer, compressed air is sent to the spray nozzle 1 as indicated by arrow B in FIG. The liquid flux is sent to the spray nozzle 1 as indicated by an arrow C in FIG.

The feed amounts of the compressed air and the liquid flux to the spray nozzle 1 are controlled by the control circuit 3.

As shown in FIG. 2, the spray nozzle 1 has a flux supply pipe 18 to which the liquid flux is supplied and a compressed air supply pipe 19 to which the compressed air is supplied.
And have. The spray nozzle 1 is supplied with the liquid flux from the flux supply pipe 18 as shown by an arrow C in FIG. 2, and as shown by an arrow B in FIG.
By supplying the compressed air from the compressed air supply pipe 19, as shown by an arrow D in FIG. 2, the compressed air and the liquid flux are atomized and ejected from the spray holes 20 and 21 on the upper end side. To do.

The printed circuit board 14 is inserted into the outer casing 1 from the carry-in hole 11 as shown by an arrow A in FIG.
When it is carried into the inside 0, the carry-out device 12 (belt conveyor device) 5 disposed in the outer casing 10 extends from the vicinity of the carry-in hole 11 to the vicinity of the carry-out hole 12 and the carry-out hole 12 is carried out.
And is conveyed through the upper portion of the spray nozzle 1.

The conveying device 5 has a pair of two endless belts 16 wound between a pair of supporting rollers 8 and 9 rotatably supported in the outer casing 10. The printed circuit board 1 is mounted on the endless belt 16.
4 is placed with both side portions being supported. That is, the printed circuit board 14 placed on the endless belt 16 has its lower surface portion excluding both side portions facing downward.

A rotational driving force is transmitted from a motor (driving device) 6 to one of the supporting rollers 8 and 9 through an endless driving belt 7. That is, by the driving force of the motor 6, the endless belts 16 are moved to the support rollers 8,
The printed circuit board 14 is conveyed by being operated to feed the printed circuit board between 9 and 9.

A position sensor 15 for detecting the printed circuit board 14 placed on the endless belt 16 is disposed above the conveying device 5. This position sensor 15
Is configured to have, for example, an optical sensor element, and detects that the printed circuit board 14 has been transported to a predetermined position by the transport device 5.

The detection output of the position sensor 15 is sent to the control circuit 3. Based on the detection output sent from the position sensor 15, the control circuit 3 supplies the compressed air and the liquid flux to the spray nozzle 1 while the printed circuit board 14 is passing over the spray nozzle 1. .

That is, in this flux coating device, the printed circuit board 14 is atomized by the spray nozzle 1 and jetted when it is transported by the transport device 5 and passes above the spray nozzle 1. The liquid flux 22 is sprayed and the liquid flux 22 is applied.

As shown in FIG.
As shown in, a heater 17 serving as a spray nozzle heating means is attached. This heater 17
By being controlled by the temperature controller 2, the spray nozzle 1 is heated to a predetermined temperature within a range of about 100 ° C to 250 ° C.

On the lower side of the transfer device 5, there is provided a preheating device 4 which serves as a heating means for the object to be coated.
The preheating device 4 is controlled by the temperature controller 2 to heat the printed circuit board 14 before being coated with the liquid flux 22 to a predetermined temperature of about 100 ° C.

In this flux applying device, when the liquid flux 22 is applied to the printed board 14, the printed board 14 is preheated to about 100 ° C. by the preheating device 4.
Further, in the flux applying device, the spray nozzle 1 causes the liquid flux 2 on the printed circuit board 14.
When applying 2, the spray nozzle 1 is heated to a predetermined temperature of about 100 ° C. to 250 ° C. by the heater 17.

When the liquid flux is applied to the printed circuit board 14 by the flux applying apparatus according to the present invention configured as described above, the application is performed by the steps according to the method for producing a flux applied material according to the present invention. You can

That is, in this flux coating device, the spray nozzle 1 sprays the liquid flux while being heated by the heating P and the like 17.

In this flux applying device, the printed circuit board 14 is heated by the preheating device 4 before the liquid flux is applied.

3 and 4 in the flux-coated printed circuit board, which is a flux-coated product manufactured by the method for manufacturing a flux-coated product according to the present invention.
As shown in (3), the coating amount was reduced and a thin uniform flux coating film was formed. That is, in the state where only the spray nozzle 1 is heated, as shown in FIG. 3, when the temperature of the spray nozzle 1 is between 100 ° C. and 200 ° C. It was 2 g or less, and a coating film with good uniformity was formed.

In this experiment, the printed board 14 is a 240 mm × 190 mm glass epoxy board, and the carrying speed of the carrying device 5 is 1 (m / m).
in). The coating amount is the total amount of the liquid flux coated on the printed circuit board. The above spray nozzle 1
The pressure of the compressed air supplied to the
It goes for about a second.

The temperature of the spray nozzle 1 is set between the boiling point of water (100 ° C.) and the temperature at which pine resin itself may be chemically decomposed (altered) (250 ° C. or higher). It is desirable to do.

Further, the temperature of the spray nozzle 1 is set to 2
When the heating of the printed circuit board 14 by the preheating device 4 is also performed at a temperature of 00 ° C., if the temperature of the printed circuit board 14 is set to about 100 ° C. as shown in FIG. The coating amount of the liquid flux on the substrate 14 is about 0.2 g, and a coating film with good uniformity is formed.

Also in this experiment, the printed board 14 is a 240 mm × 190 mm glass epoxy board, and the carrying speed of the carrying device 5 is 1 (m / m).
in). The coating amount is the total amount of the liquid flux coated on the printed circuit board. The above spray nozzle 1
The pressure of the compressed air supplied to the
It goes for about a second.

In the present invention, the article to be coated is not limited to the above-mentioned printed board, but may be an electronic element.

[0062]

As described above, in the method for producing a flux coating material according to the present invention, the spray nozzle for spraying the liquid flux with water as a solvent to apply the liquid flux to the coating object is heated. I decided to leave it.

Therefore, in this method for producing a flux-coated product, the particle size of the liquid flux is reduced, a thin coating film can be formed and applied, and the water content in the flux coating film is reduced.

In addition, in the method for producing a flux coated product, if the coated product is heated before being coated with the liquid flux, a thin coating film can be formed and coated, and the flux can be formed. The drying time of the coating film can be shortened.

Then, in the method for producing a flux-coated article according to the present invention, a liquid flux containing water as a solvent is sprayed onto the article to be coated through a spray nozzle to apply the liquid flux to the article to be coated. Before applying, the article to be coated was heated. Therefore, in this method for producing a flux coating product, a thin coating film can be formed and applied, and the drying time of the flux coating film can be shortened.

The flux applying apparatus according to the present invention comprises a spray nozzle for spraying a liquid flux containing water as a solvent to apply the liquid flux to an object to be coated, and spray nozzle heating means for heating the spray nozzle. The spray nozzle heating means heats the spray nozzle when the spray nozzle ejects the liquid flux.

Therefore, in this flux coating device, the spray nozzle heating means makes it possible to reduce the particle size of the liquid flux and form a thin coating film for coating, thereby reducing the water content in the flux coating film. .

Further, in the above flux applying device,
When an object heating means for heating the object before the liquid flux is applied is provided, it becomes possible to form and apply a thin coating film, and the flux coating drying time is shortened. can do.

The flux applying apparatus according to the present invention comprises a spray nozzle for spraying a liquid flux containing water as a solvent to apply the liquid flux to an object to be coated, and an object heating means for heating the object to be coated. The heating means for heating an object to be coated heats the object to be coated before the liquid flux is applied.

Therefore, in this flux coating device, the coating object heating means can form and coat a thin coating film and shorten the drying time of the flux coating film.

That is, according to the present invention, a liquid flux containing water as a solvent can be applied to an object to be coated such as a printed circuit board while forming a uniform thin coating film.
(EN) A method for manufacturing a flux coating product capable of reducing the water content in a coating film to shorten the drying time before the next step such as soldering, and a flux coating device for applying a flux by this manufacturing method for a flux coating product. What can be provided.

[Brief description of drawings]

FIG. 1 is a side view showing a partially broken configuration of a flux coating apparatus according to the present invention for carrying out a method for producing a flux coated article according to the present invention.

FIG. 2 is a side view showing a configuration of a spray nozzle that is a main part of the flux coating device.

FIG. 3 is a first graph showing a flux coating amount in a printed circuit board manufactured by the above-described method for manufacturing a flux coated product.

FIG. 4 is a second graph showing the amount of flux applied to a printed circuit board manufactured by the method for manufacturing a flux coated product.

FIG. 5 is a side view showing a structure of a conventional flux coating device with a part thereof broken away.

FIG. 6 is a side view showing another example of the configuration of a conventional flux coating device with a part thereof broken away.

[Explanation of symbols]

 1 Spray Nozzle 4 Preheating Device 14 Printed Circuit Board 17 Heater

Claims (6)

[Claims] 1. A method of manufacturing a flux coating product, comprising spraying a liquid flux containing water as a solvent through a spray nozzle to apply the liquid flux to an object to be coated, wherein the spray nozzle is heated. A method for producing a flux-coated product, which comprises spraying the liquid flux. 2. The flux coating method according to claim 1, wherein the article to be coated is heated before the liquid flux is coated. 3. A method for producing a flux coating product, comprising spraying a liquid flux containing water as a solvent through a spray nozzle to apply the liquid flux to the coating target, wherein the coating target is heated. A method for producing a flux-coated product, which comprises spraying the liquid flux. 4. A spray nozzle for spraying a liquid flux containing water as a solvent to apply the liquid flux to an object to be coated, and a spray nozzle heating means for heating the spray nozzle. The spray nozzle heating means comprises: A flux applying device configured to heat the spray nozzle when the spray nozzle ejects the liquid flux. 5. The flux applying apparatus according to claim 4, further comprising an object heating means for heating the object before the liquid flux is applied. 6. A heating method for heating an object to be coated, comprising: a spray nozzle for spraying a liquid flux using water as a solvent to apply the liquid flux to the object to be coated; and a heating means for heating the object to be coated. The means is a flux coating device which heats an object to be coated before the liquid flux is coated.