JPH08187698A - Cutting device for collective wiring board - Google Patents

Abstract

PURPOSE: To prevent the concentrating stress in a child board part from occurrence by positioning a collective wiring board in an upper surface of a board loading table, copy operating a cutter along this cut guide groove, and cutting off a bridge piece of connecting the child board part of the collective wiring board and a waste board part. CONSTITUTION: In the first drive unit 4, by an output from a control part, a board loading table 6 is reciprocated to move in an X-axis direction from the initial position. In the second drive unit 8, a cutter unit 10 is reciprocated to move in a Y-axis direction. Further in the third drive unit 13, a cutter 15 is made to perform oscillating action. Accordingly, the cutter 15 makes copying action along a cut guide groove 23 of a collective wiring board 20. The cutter 15 respectively cuts a plurality of bridge pieces 24 arranged in the cut guide groove 23, to separate the collective wiring board 20 into a child board part 21 and a waste board part 22. As a result, concentrating stress in the child board part 21 in the vicinity of each bridge piece 24 can be prevented, and such as separating a wiring pattern formed in a main surface of the child board part 21 can be prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting device for a collective wiring board, and particularly to a child board portion which is an area where electric parts, electronic elements, etc. are mounted, and is cut and removed from this child board portion in a final step. The present invention relates to a collective wiring board cutting device suitable for cutting and separating the child board section and the stationary board section of a collective wiring board, which is a region called a so-called substrate section.

[0002]

2. Description of the Related Art A collective wiring board is mounted with mounting parts such as electric parts and electronic parts supplied from an automatic supply device in the process of being transferred by an automatic transfer device. A predetermined wiring pattern is formed by printing on the main surface of the collective wiring board in advance, and mounting components are mounted and soldered and fixed corresponding to the wiring pattern. The collective wiring board is composed of a child board portion which is an area where a predetermined wiring pattern is formed and mounting components are mounted, and a step board portion which is formed by framing the outer peripheral portion of the child board portion. Has been done.

The substrate section is a carrying section required when the collective wiring board is carried by the automatic carrying apparatus as described above.
It is provided as an area for forming a holding portion or a positioning portion. In addition, in order to avoid the inconvenience that the end portion of the board is damaged during transportation and the wiring pattern and the mounting part of the mounting component are damaged or damaged, It is provided as a region for protecting the part. Further, the step board portion is provided as a region for forming a product number, a terminal guide portion, or an external terminal portion when forming a wiring pattern. The step board portion is an area required in the manufacturing stage as described above, and when the assembled wiring board is incorporated into the device after the predetermined mounting components are mounted and the operation test is performed, Cut and separated.

In the collective wiring board, a guide groove for cutting and a perforation for dividing the child board portion and the steer board portion are formed in advance so that the child board portion and the steer board portion can be separated relatively easily. Has been done. The child board portion and the step board portion are usually integrated by a large number of bridge pieces provided in the cutting guide groove, and are cut and separated from these bridge pieces when incorporated in the device. .

[0005]

In the aggregated wiring board, the daughter board portion and the steer board portion are separated from each other by cutting the bridge piece by bending it or punching the steer board portion with, for example, a pressing device. Has been done.
Therefore, in the assembly wiring board, during the step of cutting the step board portion, a large stress is applied to the periphery of the bridge piece and is applied to the child board portion, so that the wiring pattern formed on the main surface is peeled and soldered. Inconvenience such as peeling, dropping or damage of the soldered portion of the mounted component may occur.

[0006] Further, the press machine requires a dedicated mold depending on the shape of the collective wiring board, is not versatile, and the cost burden of the mold is large, and the setup work for each collective wiring board having different specifications There was a problem that it was troublesome. Further, in the method of cutting the substrate part using this pressing device, since the finishing accuracy of the cut surface of the bridge piece is not ensured, additional work for deburring may be required depending on the specifications of the separated child board part. There were also points.

Therefore, according to the present invention, the child board portion and the step board portion are cut and separated along the cutting guide groove in a good condition without an excessive force being applied to the child board portion by an extremely simple operation. The present invention has been proposed for the purpose of providing a wiring board cutting device capable of performing the above.

[0008]

A wiring board cutting apparatus according to the present invention which achieves this object is divided into a base board and a step board section by a cutting guide groove provided on the base. A substrate mounting table having a mounting portion for mounting and fixing the assembled wiring substrate in a positioned state; and a first drive unit for reciprocating the substrate mounting table in a first direction along a base, A stand that is erected on the base with the substrate mounting table interposed therebetween, a cutter unit that includes a cutter supported by the stand and a cutter driving unit that drives the cutter, and a cutter unit that is provided along the stand with a first unit. A second drive unit that reciprocates in a direction orthogonal to the direction; a third drive unit that swings the cutter unit; and a cutter unit on the substrate mounting table. Configured to include a fourth drive unit for vertical movement relative location has been assembly wiring board, and a first drive unit to the control unit for controlling the fourth driving unit.

Further, the cutter is formed in a disk shape having a thickness dimension substantially equal to the groove dimension of the cutting guide groove provided on the collective wiring board.

[0010]

According to the apparatus for cutting an aggregated wiring board of the present invention having the above-described structure, the aggregated wiring board is placed in a state of being positioned on the placing portion of the substrate placing table, and The output drives the fourth drive unit to lower the cutter unit toward the collective wiring board. The cutter of the cutter unit is relatively engaged in the cutting guide groove that divides the sub board portion and the step board portion of the collective wiring board.
In the cutter, the board placement table on which the collective wiring board is placed is reciprocated in the X-axis direction by the first drive unit according to the output of the control unit, and the cutter unit is moved to the second position.
The drive unit reciprocates in the Y-axis direction and the third drive unit swings the head so as to follow the cutting guide groove and move along the cutting guide groove so as to be positioned in the cutting guide groove. The bridge pieces that connect to the substrate portion are cut to separate them. The collective wiring board
In this way, since the bridge piece is cut by the cutter, an excessive force is not applied to the child board portion,
It is possible to prevent inconveniences such as peeling of the wiring pattern formed on the main surface of the child board portion, breakage or drop of mounted electronic components, and peeling of the soldered portion.

[0011]

Embodiments of the present invention will be described in detail below with reference to the drawings. As shown in FIG. 1, the cutting apparatus 1 according to the embodiment includes a base 2, a stand member 3A and a stand member 3B standing upright on the base 2, and a substrate mounting on which a collective wiring board 20 is mounted. The table 6 and the cutter unit 10 are provided. The base 2 is installed horizontally on a workbench or the like, and a switch operation unit 18 is arranged at one corner on the front side. Although not described in detail, the switch operating unit 18 is provided with a start switch, a stop switch, and the like.

The base 2 is provided with a first drive unit 4 having a rectangular block body having an outer shape in the front-rear direction at the center thereof. Although not described in detail, the first drive unit 4 includes a pair of timing belts 5A that travel on both side surfaces, and a drive motor 5B that reciprocally drives these timing belts 5A. It is movably supported in the front-back direction of 2. In the first drive unit 4, the drive motor 5B is reciprocally driven by the output of a control unit (not shown), and constitutes a drive unit in the X-axis direction of the cutting device 1 as described later.

The substrate mounting table 6 has a flat ceiling surface 6A and guide portions 6B and 6C provided on both side surfaces at intervals slightly larger than the width of the drive unit 4 so that the sectional shape is downward U-shape. It is composed of a member having a shape. The substrate mounting table 6 includes the guide portions 6B and 6C and the drive unit 4
The drive units 4 are located on both side surfaces of and are combined so as to straddle the drive unit 4. These guide portions 6B and 6C
Both ends of the timing belt 5 </ b> A are fixed to each other. The board mounting table 6 is a ceiling surface 6A configured as a mounting portion for the collective wiring board 20 as described later.
Positioning pins 7 are provided near the four corners of each. In the substrate mounting table 6, the timing belt 5A is driven by the drive motor 5B,
It is moved in the front-rear direction with respect to the base 2 along the drive unit 4.

The stand members 3A and 3B are erected on the base 2 so as to face each other so as to sandwich the drive unit 4 therebetween. Between these stand members 3A, 3B, the second
The drive unit 8 is mounted in a beam shape. Although not described in detail, the second drive unit 8 includes a pair of timing belts 9A traveling on the side surface portion and a drive motor 9B reciprocatingly driving these timing belts 9A.
In the second drive unit 8, the drive motor 9B is reciprocally driven by the output of a control unit (not shown), and constitutes a drive unit in the Y-axis direction of the cutting device 1 as described later.

A cutter unit 10 is supported by the second drive unit 8. This cutter unit 10
The bracket 11, the guide member 12, the rotary cylinder unit 13, the cutter mounting portion 14, the cutter 15, the air cylinder 16 and the like are included. The guide member 12 is movably assembled along the side surface of the second drive unit 8, and both ends of the timing belt 9A are fixed. The bracket 11 is supported movably in the vertical direction with respect to the guide member 12 so as to face the base 2. This bracket 1
1, the rotary cylinder unit 13 is based on the output shaft 2
It is attached to the side.

The rotary cylinder unit 13 has a cutter attachment portion 14 attached to the tip of the output shaft. The rotary cylinder unit 13 is driven by the output from the control unit, and swings the cutter mounting unit 14 via the output shaft. Although not described in detail, the cutter attaching portion 14 is provided with a known chucking mechanism, and the cutter 15 is attached and detached. Therefore, the rotary cylinder unit 13 constitutes a third drive unit for swinging the cutter 15.

The cutter 15 is constructed by attaching, for example, a disk-shaped diamond cutting tool to the tip of the rotary shaft. The thickness of the diamond bite is substantially equal to the width of the cutting guide groove 23 of the collective wiring board 20 described later. The cutter 15 is driven by an air cylinder 16 driven by the output of a control unit (not shown). The air cylinder 16 moves the cutter mounting portion 14 in the vertical direction by sucking and discharging the driving air through the air pipe 17. The cutter 15 moves back and forth with respect to the cutting guide groove 23 of the collective wiring board 20 mounted on the mounting portion 6A of the substrate mounting table 6 by the vertical movement of the cutter mounting portion 14, as described later. . Therefore, the air cylinder 16 constitutes a fourth drive unit that drives the cutter 15 in the vertical direction, that is, the Z-axis direction.

In the cutter unit 10, when the drive motor 9B of the second drive unit 8 is driven by the output from the control section, the guide member 1 is passed through the timing belt 9A.
2 moves along the second drive unit 8 in the left-right direction in FIG. 1, that is, in the direction orthogonal to the moving direction of the substrate mounting plate 6. The cutter 15 is the guide member 1
The movement operation 2 causes the movement operation in the Y-axis direction. The cutter 15 is moved in the Z-axis direction via the cutter attachment portion 14 by the rotation cylinder unit 13 being driven by the output from the control unit and the output shaft rotating.

The cutting device 1 configured as described above is installed, for example, in the final step of the substrate transfer device, and the transferred integrated wiring board 20 is positioned and fixed on the board mounting portion 6A, and the sub board portion 21 is positioned. And the substrate substrate 22 are cut and separated. The collective wiring board 20 has a rectangular overall shape.
As shown in FIG. 3, the child board portion 21 having a predetermined shape is divided from the peripheral board portion 22 by the cutting guide groove 23. This collective wiring board 20 is subjected to a mounting process of mounting components, a soldering process, an operation test, and the like,
In the board assembling process for the apparatus, the child board section 21 and the stick board section 22 are cut and separated by the cutting apparatus 1 described above. The structure and handling of this collective wiring board 20 are the same as those of the conventional collective wiring board.

Although not shown, the child board portion 21 has, for example, a predetermined wiring pattern formed by printing on one main surface, and guide marks and specifications of the mounting position of the mounted component on the other main surface. . Further, the sub-board portion 21 is provided with through holes or mounting holes for mounting mounting components, and is assembled into an apparatus as a product board.

As shown in FIG. 2, the step board portion 22 is a region that surrounds the outer peripheral portion of the child board portion 21 over the entire circumference. Although not shown, for example, a product number or each terminal on the child board portion 21 side is formed. Electrode terminals for forming guide marks or wiring patterns, test terminals for operation tests, etc. are formed. Further, the step board portion 22 is provided with a positioning hole 25 at an appropriate position for positioning and mounting the automatic transfer device when automatically transferred between the above-mentioned steps.

As described above, the cutting guide groove 23 divides the sub-board portion 21 and the step-board portion 22 and divides the sub-board portion 2.
The outer shape of 1 is determined. Therefore, the cutting guide groove 23
May have a complicated shape depending on the external specifications of the child board portion 21. The subsidiary board portion 21 and the stationary board portion 22 are integrated by a large number of bridge pieces 24 left uncut so as to divide the cutting guide groove 23. These bridge pieces 24 maintain mechanical strength for the child board portion 21 and the step board portion 22 to be firmly integrated until the cutting step, and the child board portion 21 and the step board portion 22 are kept in the cutting step. It is provided at an appropriate position so that the part 22 and the part 22 can be easily cut.

The collective wiring board 20 is not limited to the shape shown in the drawing, but may be, for example, the cutting guide groove 23.
May be composed of so-called perforations. Further, the collective wiring board 20 may be one in which a plurality of child board portions are further formed by perforations or the like in the region divided by the cutting guide groove 23.

When the collective wiring board 20 is supplied to the cutting device 1, the positioning holes 25 provided in the step board portion 22 are engaged with the positioning pins 7, respectively, so that the mounting portion 6A of the substrate mounting table 6 is placed. It is placed with the positioning fixed on the top. In the cutting device 1, the specification information of the collective wiring board 20 to be cut, that is, the shape specification of the cutting guide groove 23 is input to the control unit. The input operation of the specification information is performed by inputting a ten-key pad generally adopted in machine tools and the like.

In the cutting device 1, based on the specification information of the collective wiring board 20 input to the control unit, the cutter unit 10 is cut from the origin position to the cutting guide groove 23 as described later.
Is moved along with, and the cutting operation of the bridge piece 24 is performed. The cutting device 1 controls so that the substrate mounting table 6 is returned to and stopped at a predetermined position (initial position) in the front-back direction of the base 2. The cutting device 1 positions and fixes the collective wiring board 20 on the mounting portion 6A of the substrate mounting table 6 stopped at the initial position, and then operates the start switch of the switch operating portion 18 so that the control portion from the control portion is operated. The output drives the second drive unit 8 to move the cutter unit 10 to the cutting start position of the collective wiring board 20.

In the cutter unit 10, when the rotary cylinder unit 13, which is the third drive unit, is driven by the output from the controller, the cutter 15 causes the collective wiring board 20 to move.
The cutting guide groove 23 is swung in the same direction. Further, the cutter unit 10 is lowered toward the collective wiring board 20 side by the operation of the air cylinder 16 which constitutes the fourth drive unit by the output from the control section, whereby the cutter 15 is cut by the cutting guide groove 23. Engages relative to.

The first drive unit 4 reciprocates the substrate mounting table 6 in the X-axis direction from the initial position according to the output from the controller. Further, the second drive unit 8 reciprocates the cutter unit 10 in the Y-axis direction. Further, the third drive unit 13 causes the cutter 15 to swing. Therefore, the cutter 15 follows the cutting guide groove 23 of the collective wiring board 20 by the operation based on the outputs of the control units of the first drive unit 4, the second drive unit 8 and the third drive unit 13. Operate. The cutter 15 cuts each bridge piece 24 provided in the cutting guide groove 23 in the process of following the cutting guide groove 23.

In the assembled wiring board 20, the cutter 15 is driven by the first drive unit 4, the second drive unit 8 and the third drive unit 13 to follow the cutting guide groove 23 for one round. All the bridge pieces 24 are cut to separate the child board portion 21 and the step board portion 22. Since the cutting device 1 cuts the bridge pieces 24 of the collective wiring board 20 by the cutter 15, stress concentration does not occur in the child board portion 21 near the bridge pieces 24.
Therefore, in the collective wiring board 20, it is possible to prevent inconveniences such as peeling of the wiring pattern formed on the main surface of the sub-board portion 21, damage or drop of mounted electronic components, and peeling of the soldered portion. . Further, since the cut surface of the bridge piece 24 of the child board portion 21 is in a good state, additional work for deburring is unnecessary.

The present invention is not limited to the cutting device 1 of the above-described embodiment, but can be variously developed with respect to the configuration of each part. For example, in the cutting device 1, the first driving unit 4 for moving the substrate mounting table 6 and the second driving unit 8 for moving the cutter unit 10 are driving motors 5B, 9B and a pair of timing belts 5A, 9A. However, it goes without saying that a precision feed mechanism such as a rack and a pinion may be adopted.

Further, the input operation of the shape specification of the cutting guide groove 23 to the control section is not limited to the above-mentioned ten-key input, but a method such as tape input or card input which is generally adopted in machine tools and the like can also be used. Adopted.

[0031]

As described in detail above, according to the apparatus for cutting an aggregated wiring board of the present invention, the aggregated wiring board is placed on the placing portion of the board placing table in a state where The cutter is moved along the cutting guide groove that divides the substrate portion and the steering substrate portion so as to cut the bridge piece that connects the child substrate portion and the steering substrate portion. Stress concentration on the child board near the bridge piece is prevented, and the wiring pattern formed on the main surface of the child board is peeled off, or the mounted electronic components are damaged, fallen off, or the soldered portion is peeled off. Such various inconveniences are prevented from occurring. In addition, since the separated and separated sub-substrate part can be obtained in a stable state, it is not necessary to carry out a re-operation test after cutting and separation, and since the cut surface of the bridge piece is in a good state, deburring is possible. No additional work is required.

Further, according to the cutting apparatus of the collective wiring board of the present invention, it is possible to cope with the collective wiring boards having different shape specifications without the need for mold replacement and the like, thereby reducing the die cost. The number of setup steps can be shortened.

[Brief description of drawings]

FIG. 1 is a perspective view of essential parts of a cutting device for a collective wiring board according to the present invention.

FIG. 2 is a plan view of a collective wiring board in which a product board section and a discarded board section are cut and separated by a cutting device.

[Explanation of symbols]

1 cutting device 2 base 3 stand 4 first drive unit (X-axis direction drive unit) for moving the substrate placing table 6 substrate placing table 7 positioning pins 8 second for moving the cutter unit Drive unit (Y-axis direction drive unit) 10 Cutter unit 13 Rotating cylinder unit that constitutes a third drive unit for swinging the cutter 14 Cutter mounting portion 15 Cutter 16 Cutter Fourth for driving vertically Air cylinder (Z-axis direction drive unit) that constitutes a drive unit 20 Assembly wiring board 21 Sub-board section 22 Stead board section 23 Cutting guide groove 24 Bridge piece 25 Positioning hole

Claims (2)

[Claims] 1. A substrate mounting device having a base and a mounting part for mounting and fixing the integrated wiring substrate, which is disposed on the base and is divided into a sub-substrate part and a step substrate part by a cutting guide groove, in a positioned state. A mounting table, a first drive unit that reciprocates the substrate mounting table in a first direction along the base, a stand erected on the base with the substrate mounting table interposed therebetween, A cutter unit including a supported cutter and cutter driving means for driving the cutter, a second drive unit for reciprocating the cutter unit along a stand in a direction orthogonal to the first direction, and a swinging motion of the cutter. A third drive unit for operating, a fourth drive unit for vertically moving the cutter unit with respect to the collective wiring board placed on the board placing table, The cutter of the unit is relatively engaged with the cutting guide groove of the collective wiring board, and the cutter unit and the substrate mounting table are moved to move the cutter along the cutting guide groove to move the cutter board and the step board portion. And a controller for controlling each of the first drive unit to the fourth drive unit so as to separate them from each other. 2. The cutting device for a collective wiring board according to claim 1, wherein the cutter is a disk-shaped cutter having a thickness dimension substantially equal to a groove dimension of a cutting guide groove provided on the wiring board.