[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

JPH08185714A - Conductive adhesive tape - Google Patents

Conductive adhesive tape

Info

Publication number
JPH08185714A
JPH08185714A JP33991094A JP33991094A JPH08185714A JP H08185714 A JPH08185714 A JP H08185714A JP 33991094 A JP33991094 A JP 33991094A JP 33991094 A JP33991094 A JP 33991094A JP H08185714 A JPH08185714 A JP H08185714A
Authority
JP
Japan
Prior art keywords
tape
base material
adhesive layer
conductive
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33991094A
Other languages
Japanese (ja)
Inventor
Junji Yokoyama
純二 横山
Yoshiji Hasegawa
美次 長谷川
Toshiharu Konishi
俊春 小西
Naoki Matsuoka
直樹 松岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP33991094A priority Critical patent/JPH08185714A/en
Publication of JPH08185714A publication Critical patent/JPH08185714A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Adhesive Tapes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

PURPOSE: To maintain stable electric conductivity in high-humidity atmosphere by providing a pressure-sensitive adhesive layer on one face of a base material, and providing conduction sections penetrating the adhesive layer and having terminal sections at the tips on the base material at desired intervals. CONSTITUTION: A pressure-sensitive adhesive layer 12 is provided on one face of the conducting tape base material 11 of a conducting adhesive tape main body 1, and conduction sections 110 penetrating the adhesive layer 12 and having terminal sections 111 at the tips are provided on the base material 11 at desired intervals. An auxiliary tape 2 has a pressure-sensitive adhesive layer 22 on one face of a tape base material 21, its tape width W2 is made wider than the width W1 of the tape main body 1, and the layer 22 is stuck to the surface of the base material 11 protrusively from both width ends of the main body 1. When the wide auxiliary tape 2 is stuck to the main body 1, the conduction stability in the high-temperature high-humidity environment can be guaranteed, and the reliability can be improved. The cut traces of drawing on the surface of the base material 11 are covered by the tape 2, and cut wounds of fingers at the time of sticking by hand can be surely excluded.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は長手方向並びに厚み方向
の両方向に導電性を有する導電性接着テ−プに関し、例
えば、二箇所に跨って貼着してその間を電気的に導通す
る場合に使用するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive adhesive tape having conductivity in both the longitudinal direction and the thickness direction, for example, in the case of sticking over two places and electrically conducting between them. Is what you use.

【0002】[0002]

【従来の技術】電気的導通、例えば、プリント配線基板
の接地、電子機器の外装シ−ルドケ−スの接地、TVブ
ラウン管の接地等においては、感圧接着方式の導電性接
着テ−プを貼着し、被貼着面と導電性接着テ−プの導電
性基材との間の電気的導通並びに同導電性基材の長手方
向電気的導通により接地をとることがある。かかる導電
性接着テ−プとして、本出願人においては、「金属箔と
該金属箔の片面に設けた感圧性接着剤層とからなり、前
記金属箔の接着剤層被覆側には前記接着剤層を貫通し且
つその先端に端子部を持つ所望間隔の導通部が設けられ
たもの」を既に提案した(実公昭63−46980号公
報)。
2. Description of the Related Art For electrical continuity, for example, grounding of a printed wiring board, grounding of an exterior shield case of an electronic device, grounding of a TV Braun tube, etc., a pressure-sensitive adhesive type conductive adhesive tape is applied. In some cases, grounding is performed by electrical conduction between the adhered surface and the conductive base material of the conductive adhesive tape and electrical conduction in the longitudinal direction of the conductive base material. As such a conductive adhesive tape, the applicant of the present invention states that "a metal foil and a pressure-sensitive adhesive layer provided on one side of the metal foil are provided, and the adhesive layer is coated on the adhesive layer side of the metal foil. Has been provided with a conducting portion penetrating the layer and having a terminal portion at the tip thereof at a desired interval "(Japanese Utility Model Publication No. 63-46980).

【0003】この導電性接着テ−プは、金属箔の片面に
感圧性接着剤層を設け、金属箔に感圧性接着剤層厚みよ
りも大きい絞り代で所望の間隔にて多数の突部を絞り成
形し、ついで、プレスでその突部先端を外側に平らに折
り曲げることによって製造でき、端子部の表面積を、電
気接触抵抗を低くするために広くするには、絞り代を大
きくし、感圧性接着剤層面に対する突部の突出高さを高
くし、突部先端の上記折曲代を大きくすることが有効で
ある。しかしながら、突部絞り代を大きくすると、突部
が孔開きとなり、この孔を通しての湿気・水分の侵入に
より端子部の電気的接触箇所の錆化が生じ易く、また、
金属箔表面に切り跡が付き、手貼りする際に手指が切傷
され易くなる。そこで、本発明者等においては、上記導
電性接着テ−プの金属箔表面をフィルムの貼着により保
護することを試みた。
In this conductive adhesive tape, a pressure-sensitive adhesive layer is provided on one side of a metal foil, and a large number of protrusions are formed on the metal foil at desired intervals with a drawing margin larger than the thickness of the pressure-sensitive adhesive layer. It can be manufactured by drawing and then bending the tip of the protrusion to the outside with a press.In order to widen the surface area of the terminal part to reduce the electrical contact resistance, increase the drawing allowance and pressure sensitivity. It is effective to increase the protrusion height of the protrusion with respect to the adhesive layer surface and increase the bending allowance at the tip of the protrusion. However, if the projection drawing allowance is increased, the projection becomes open, and the entry of moisture or water through the hole easily causes rusting at the electrical contact portion of the terminal.
Notches are formed on the surface of the metal foil, and the fingers are likely to be cut when hand-applied. Therefore, the present inventors tried to protect the surface of the metal foil of the conductive adhesive tape by sticking a film.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、本発明
者等の実験結果によれば、このような保護のもとでも、
多湿雰囲気では、上記端子部の接触箇所でのかなり著し
い電気抵抗の増大が避けられない。その原因としては、
上記導電性接着テ−プの貼着のための加圧に対し、金属
箔の導通部の圧縮弾性率が感圧性接着剤層の圧縮弾性率
に較べ相当に大であり、加圧力の多くが金属箔の導通部
にかかり、感圧性接着剤層と被貼着面との間に充分な接
触圧を作用させ難く、その結果、その接触界面のシ−ル
性が不充分となり、この接触界面からの湿気・水分の侵
入により端子部の電気的接触箇所の錆化が生じ易くなる
ためであると推定される。そこで、貼着した導電性接着
テ−プを粘着保護シ−トで完全に包囲して、その接触界
面からの湿気・水分の侵入防止を図ったところ、上記多
湿雰囲気下での電気抵抗の増大を効果的に抑制できた。
However, according to the experimental results of the present inventors, even under such protection,
In a high-humidity atmosphere, a considerable increase in electrical resistance at the contact portion of the terminal portion cannot be avoided. The cause is
With respect to the pressure applied for attaching the conductive adhesive tape, the compression elastic modulus of the conductive portion of the metal foil is considerably larger than that of the pressure-sensitive adhesive layer, and most of the pressing force is applied. It is difficult to apply a sufficient contact pressure between the pressure-sensitive adhesive layer and the surface to be adhered on the conductive portion of the metal foil, and as a result, the sealing property of the contact interface becomes insufficient, and this contact interface It is presumed that this is because rusting of electrical contact portions of the terminal portion is likely to occur due to intrusion of moisture and water from the inside. Therefore, when the adhered conductive adhesive tape was completely surrounded by an adhesive protection sheet to prevent the ingress of moisture and water from the contact interface, the increase of the electric resistance in the above humid atmosphere was observed. Could be effectively suppressed.

【0005】本発明の目的は、かかる実験結果を基礎と
して、導電性テ−プ基材の片面に感圧性接着剤層が設け
られ、上記基材に上記接着剤層を貫通し、かつその先端
に端子部を有する所望間隔の導通部が設けられてなる導
電性接着テ−プを改良し、多湿雰囲気下でも安定な電気
的導通性を維持することにある。
The object of the present invention is to build a pressure-sensitive adhesive layer on one side of a conductive tape substrate based on the results of such experiments, and to penetrate the adhesive layer on the substrate and to provide the tip thereof. Another object of the present invention is to improve a conductive adhesive tape in which conductive portions having terminal portions are provided at desired intervals to maintain stable electrical conductivity even in a humid atmosphere.

【0006】[0006]

【課題を解決するための手段】本発明に係る導電性接着
テ−プは、導電性テ−プ基材の片面に感圧性接着剤層が
設けられ、上記基材に上記接着剤層を貫通し、かつその
先端に端子部を有する所望間隔の導通部が設けられてな
る導電性接着テ−プ本体の上記基材の他面に、テ−プ基
材の片面に感圧性接着剤層を有する補助テ−プが上記導
電性接着テ−プ本体の巾両端より突出してその感圧性接
着剤層において貼り合わされていることを特徴とする構
成であり、補助テ−プのテ−プ基材には、クッション性
を有するものを使用することもできる。
A conductive adhesive tape according to the present invention has a pressure-sensitive adhesive layer provided on one surface of a conductive tape base material, and the base material penetrates the adhesive layer. And a pressure-sensitive adhesive layer on one surface of the tape base material on the other surface of the base material of the conductive adhesive tape body having a conductive portion at a desired interval with a terminal portion at its tip. The auxiliary tape has a constitution in which the auxiliary tape is projected from both ends of the width of the conductive adhesive tape main body and is bonded to the pressure-sensitive adhesive layer, and the tape base material of the auxiliary tape is provided. A material having a cushioning property can also be used as the material.

【0007】以下、図面を参照しつつ本発明に係る導電
性接着テ−プの構成を説明する。図1の(イ)は本発明
に係る導電性接着テ−プを示す説明図、図1の(ロ)は
図1の(イ)におけるロ−ロ断面図である。図1の
(イ)並びに図1の(ロ)において、1は導電性接着テ
−プ本体であり、導電性テ−プ基材11の片面に感圧性
接着剤層12が設けられ、その導電性テ−プ基材11に
は、通常、金属箔が使用され、該導電性テ−プ基材11
には、上記感圧性接着剤層12を貫通し、かつその先端
に端子部111を有する所望間隔の導通部110が設け
られている。この導通部の配置パタ−ンは、所謂、散点
パタ−スであり、例えば、図1の(イ)に示すように、
長手方向の配置間隔がaの列を間隔bで配列し、かつ互
いに隣合う列間において半ピッチずらし、aとbとをほ
ぼ等しくしたものを使用できる。2は補助テ−プであ
り、テ−プ基材21の片面に感圧性接着剤層22を有
し、そのテ−プ巾w2は上記導電性接着テ−プ本体1の
巾w1よりも広くされ、同導電性接着テ−プ本体1の導
電性テ−プ基材11の表面に、同本体1の巾両端より突
出して感圧性接着剤層22において貼り合わされてい
る。
The construction of the conductive adhesive tape according to the present invention will be described below with reference to the drawings. FIG. 1A is an explanatory view showing a conductive adhesive tape according to the present invention, and FIG. 1B is a sectional view taken along the line RO in FIG. In (a) of FIG. 1 and (b) of FIG. 1, 1 is a conductive adhesive tape body, and a pressure-sensitive adhesive layer 12 is provided on one surface of a conductive tape base material 11, and its conductive A metal foil is usually used as the conductive tape base material 11, and the conductive tape base material 11 is used.
Is provided with a conductive portion 110 penetrating the pressure-sensitive adhesive layer 12 and having a terminal portion 111 at the tip thereof at desired intervals. The arrangement pattern of the conducting portions is a so-called scattered pattern, and as shown in FIG.
It is possible to use a row in which rows having a longitudinal arrangement interval of a are arranged at an interval of b and the rows adjacent to each other are shifted by a half pitch so that a and b are substantially equal. Reference numeral 2 denotes an auxiliary tape, which has a pressure-sensitive adhesive layer 22 on one surface of the tape base material 21, and the tape width w 2 thereof is larger than the width w 1 of the conductive adhesive tape body 1 described above. The pressure sensitive adhesive layer 22 is attached to the surface of the conductive tape base material 11 of the conductive adhesive tape main body 1 so as to project from both width ends of the main body 1.

【0008】上記導通部111の加工には、ポンチ状の
オス型とダイスメス型とを用いて図2の(イ)に示すよ
うに、金属箔を底無しの筒状に絞り成形し(先端側ほ
ど、肉厚がやや薄くなる)、ついで、プレスで図2の
(ロ)に示すように筒部の先端部を外側に水平に折り曲
げて端子部に成形する方法、あるいは、図3の(イ)並
びに(ロ)に示すように、円錐状のオス型31と円錐孔
状のメス型32とを用い、金属箔をオス型で張出すと共
に図3の(ハ)に示すように、その張出し先端部をメス
型の底で押し曲げてかぎ型の端子部111に形成する方
法等を使用できる。上記の導電性テ−プ基材には、絞り
成形乃至は張出し成形に耐え得る延性を有する金属、例
えば、同、アルミニウム、銀、鉄、鉛等の金属箔が使用
される。上記の感圧性接着剤層には、アクリル系、ゴム
系、シリコン系等の汎用の感圧性接着剤層を使用でき
る。
In the processing of the conducting portion 111, a punch-shaped male die and a die female die are used to draw a metal foil into a bottomless tubular shape (as shown in FIG. , The wall thickness becomes a little thinner), and then the tip of the tubular part is horizontally bent outward as shown in (b) of FIG. 2 to form the terminal part, or (a) of FIG. In addition, as shown in (b), a conical male die 31 and a conical hole female die 32 are used to overhang the metal foil with the male die and, as shown in (c) of FIG. It is possible to use a method of forming a hook-shaped terminal portion 111 by bending the portion with a female bottom. For the above-mentioned conductive tape base material, a metal having ductility capable of withstanding drawing or stretch forming, for example, a metal foil of aluminum, silver, iron, lead or the like is used. As the pressure-sensitive adhesive layer, a general-purpose pressure-sensitive adhesive layer such as an acrylic type, a rubber type, or a silicon type can be used.

【0009】上記補助テ−プのテ−プ基材には、汎用の
ソリッドのプラスチックフィルム、例えば、ポリエステ
ルフィルム、ポリプロピレンフィルム等の外、後述する
ようにクッション性テ−プ、例えば、ポリエチレンやポ
リプロピレン等のポリオレフィン系フォ−ム、ウレタン
系フォ−ム、ネオプレンゴム系フォ−ム、ポリ塩化ビニ
ル系フォ−ム等も使用される。上記補助テ−プにおいて
は、導電性接着テ−プ本体の巾両端から突出された部分
の被貼着体への接着により、導電性接着テ−プ本体の導
電性テ−プ基材と被貼着体との接着界面に対するシ−ル
距離を高め、該接着界面への湿分・水分の侵入を抑制
し、同接触界面での端子部の電気的接触面の電気抵抗の
増大を防止する役目を果たし、突出巾は、通常、電性接
着テ−プ本体巾の0.15倍〜0.6倍とされる。
As the tape base material of the above-mentioned auxiliary tape, a general-purpose solid plastic film such as polyester film and polypropylene film, and cushioning tape such as polyethylene and polypropylene as will be described later are used. Polyolefin type foams, urethane type foams, neoprene rubber type foams, polyvinyl chloride type foams, etc. are also used. In the above-mentioned auxiliary tape, the portions of the conductive adhesive tape body protruding from both ends of the width are adhered to the adherend so that the conductive tape base body and the conductive tape base of the conductive adhesive tape body are covered. The seal distance to the adhesive interface with the adherend is increased, the ingress of moisture and water to the adhesive interface is suppressed, and the electrical resistance of the electrical contact surface of the terminal portion at the contact interface is prevented from increasing. It plays a role and the protrusion width is usually set to 0.15 to 0.6 times the width of the electro-adhesive tape body.

【0010】本発明に係る導電性接着テ−プにおいて
は、通常、セパレ−トテ−プを仮着した状態で取り扱
い、使用時にセパレ−トテ−プが剥離される。また、補
助テ−プのテ−プ基材表面に剥離処理(例えば、シリコ
−ン系あるいは、長鎖アルキル系の剥離処理)を施し、
巻回した状態で取り扱うこともできる。
In the electroconductive adhesive tape according to the present invention, the separate tape is usually handled in a state where the separate tape is temporarily attached, and the separate tape is peeled off during use. Further, the tape base material surface of the auxiliary tape is subjected to a peeling treatment (for example, a silicone-based or long-chain alkyl-based peeling treatment),
It can also be handled in a wound state.

【0011】本発明に係る導電性接着テ−プは、各種電
子機器の回路各部位での電気的導通、特に接地に使用さ
れ、図4の(イ)はその使用状態の説明図を、図4の
(ロ)は図4の(イ)におけるロ−ロ断面図をそれぞれ
示している。図4の(イ)並びに図4の(ロ)におい
て、4は被貼着体であり、電極部分41,41と絶縁部
分42とを備えている。Aは本発明に係る導電性接着テ
−プを示し、補助テ−プ2の巾両端突出部20,20並
びに導電性接着テ−プ本体1の導電性テ−プ基材11が
それぞれ感圧性接着剤層22並びに12により被貼着体
4に貼着され、電極41と導電性テ−プ基材11間の導
通部110による導通並びに導電性テ−プ基材1の長手
方向導通により電極41,41間が電気的に導通され、
且つ補助テ−プ2の巾両端突出部20と被貼着体4間の
感圧性接着剤層22による接着でシ−ルが増強されてい
る。なお、導電性接着テ−プAの両端は、通常の感圧性
接着テ−プ〔図4の(イ)の点線5で示されている)で
シ−ルすることができる。
The conductive adhesive tape according to the present invention is used for electrical continuity, especially grounding, in various circuit parts of various electronic devices. FIG. 4B shows a cross-sectional view taken along line 4B-B in FIG. In (a) of FIG. 4 and (b) of FIG. 4, 4 is an adherend, which includes electrode portions 41, 41 and an insulating portion 42. Reference numeral A denotes a conductive adhesive tape according to the present invention, in which the width-side protruding portions 20 and 20 of the auxiliary tape 2 and the conductive tape base material 11 of the conductive adhesive tape body 1 are pressure-sensitive. The electrodes are adhered to the adherend 4 by the adhesive layers 22 and 12, and are electrically connected by the conductive portion 110 between the electrode 41 and the conductive tape base material 11 and the conductive tape base material 1 in the longitudinal direction. 41 and 41 are electrically connected,
In addition, the seal is reinforced by the pressure sensitive adhesive layer 22 bonding between the protruding portions 20 at both ends of the width of the auxiliary tape 2 and the adherend 4. Both ends of the conductive adhesive tape A can be sealed with a normal pressure-sensitive adhesive tape [shown by a dotted line 5 in FIG. 4A).

【0012】本発明に係る導電性接着テ−プにおいて
は、近接貼着やクロス貼着を行っても、識別を容易に行
い得るように、補助テ−プのテ−プ基材または感圧性接
着剤層を着色することが好ましい。また、導電性接着テ
−プの形状を貼着部位の形状に応じて変えることがで
き、例えば、多点を共通の導電性接着テ−プで接地する
ために分岐状とすることができ、この場合、形状と着色
とによる識別を併用することも可能である。
In the conductive adhesive tape according to the present invention, the tape base material or the pressure-sensitive material of the auxiliary tape is used so that the identification can be easily performed even when the proximity adhesion or the cross adhesion is performed. It is preferable to color the adhesive layer. Further, the shape of the conductive adhesive tape can be changed according to the shape of the attachment site, and for example, it can be branched so that multiple points are grounded by a common conductive adhesive tape, In this case, the identification based on the shape and the color can be used together.

【0013】本発明に係る導電性接着テ−プにおいて
は、貼着した状態において外面が加圧される場合、例え
ば、図5に示すように、被貼着体4がブレ−ト5,5間
の隙間に挿入されたり、貼着導電性接着テ−プがプレ−
トカバ−で押付けられる場合、補助テ−プ2のテ−プ基
材21にクッション性のものを使用し、このクッション
の圧縮により発生する圧力を感圧性接着剤層12,22
の接着界面や端子部111の電気的接触界面に作用させ
ることができる。
In the conductive adhesive tape according to the present invention, when the outer surface is pressed in the adhered state, for example, as shown in FIG. It is inserted in the gap between the
In the case of pressing with a cover, a tape base material 21 of the auxiliary tape 2 having a cushioning property is used, and the pressure generated by the compression of the cushion is applied to the pressure sensitive adhesive layers 12, 22.
Can be made to act on the adhesive interface of or the electrical contact interface of the terminal portion 111.

【0014】[0014]

【作用】導通部110の胴部の断面積(平均値)を
1、弾性率をE1、導通部一箇に対する導電性接着テ−
プ本体1の感圧性接着剤層12の平面積をS2、同感圧
性接着剤層12の弾性率をE2とし、貼着のための加圧
力に対し導通部110の胴部に生じる圧縮応力をf1
感圧性接着剤層12に生じる圧縮応力をf2とすると、 f1/E1=f2/E2 が成立し、加圧力Fは、 F=f11+f22 であるから、導電性接着テ−プ本体1の感圧性接着剤層
12の圧縮応力f2は、 f2=F・E2/(E11+E22) で与えられる。従って、S1=0、すなわち、導電性テ
−プ基材11に導通部がない場合に較べ、導電性接着テ
−プ本体1の感圧性接着剤層12の圧縮応力f2が小と
なり、導電性テ−プ基材11に対する感圧性接着剤層1
2の単位面積当たりの被貼着体4に対する接着力が低く
なる。また、導通部110の端子部111の平面積をあ
る程度広くして端子部111と被貼着体4との充分な電
気的接触面積を確保する必要があり、この場合、相対的
に感圧性接着剤層12の被貼着体4に対する接触面積が
狭くなる。従って、導電性接着テ−プ本体1のみの場合
は、感圧性接着剤層12の接着力が低く且つ接着面積が
小であるために、導電性テ−プ基材11と被貼着体4と
の接着界面のシ−ル性が低く、多湿雰囲気下では、導通
部110の端子部111と被貼着体4との接触界面に湿
気・水分が侵入し、該接触界面が酸化されて電気抵抗が
増大するに至る。
The cross-sectional area (average value) of the body portion of the conductive portion 110 is S 1 , the elastic modulus is E 1 , and the conductive adhesive tape for one conductive portion is used.
Supposing the plane area of the pressure-sensitive adhesive layer 12 of the main body 1 to be S 2 and the elastic modulus of the pressure-sensitive adhesive layer 12 to be E 2 , the compressive stress generated in the body of the conducting portion 110 against the pressure applied for attachment. F 1 ,
If the compressive stress generated in the pressure-sensitive adhesive layer 12 is f 2 , then f 1 / E 1 = f 2 / E 2 holds, and the pressing force F is F = f 1 S 1 + f 2 S 2 , The compressive stress f 2 of the pressure-sensitive adhesive layer 12 of the conductive adhesive tape body 1 is given by f 2 = F · E 2 / (E 1 S 1 + E 2 S 2 ). Therefore, S 1 = 0, that is, the compressive stress f 2 of the pressure-sensitive adhesive layer 12 of the conductive adhesive tape body 1 becomes smaller than that in the case where the conductive tape base material 11 has no conductive portion. Pressure-sensitive adhesive layer 1 for conductive tape substrate 11
The adhesive force to the adherend 4 per unit area of 2 becomes low. In addition, it is necessary to widen the plane area of the terminal portion 111 of the conductive portion 110 to some extent to secure a sufficient electrical contact area between the terminal portion 111 and the adherend 4, and in this case, relatively pressure-sensitive adhesion is required. The contact area of the agent layer 12 with the adherend 4 is reduced. Therefore, in the case of only the conductive adhesive tape main body 1, since the adhesive force of the pressure-sensitive adhesive layer 12 is low and the adhesive area is small, the conductive tape base material 11 and the adherend 4 are adhered. In the high humidity atmosphere, the adhesive interface with and has a low sealing property, and in a humid atmosphere, moisture / water penetrates into the contact interface between the terminal portion 111 of the conducting part 110 and the adherend 4, and the contact interface is oxidized to cause electrical discharge. The resistance increases.

【0015】しかし、本発明においては、テ−プ基材2
1の片面に感圧性接着剤層22を有する補助テ−プ2を
導電性接着テ−プ本体1の巾両端より突出させてその感
圧性接着剤層22において貼り合わせてあり、その補助
テ−プ2の巾両端突出部20の被貼着体4との接着のた
めに導電性テ−プ基材1と被貼着体4との接着界面に対
するシ−ル距離を長くして導通部110の端子111部
と被貼着体4との接触界面への湿気・水分の侵入を抑制
でき、該接触界面での電気抵抗の増大をよく防止でき
る。この作用・効果は次に説明する実施例と比較例との
抵抗測定試験の対比からも確認できる。
However, in the present invention, the tape base material 2 is used.
An auxiliary tape 2 having a pressure-sensitive adhesive layer 22 on one side thereof is protruded from both ends of the width of the conductive adhesive tape body 1 and is bonded on the pressure-sensitive adhesive layer 22. In order to bond the protrusions 20 at both ends of the width of the tape 2 to the adherend 4, the seal portion is made longer by increasing the seal distance to the adhesive interface between the conductive tape base 1 and the adherend 4. It is possible to suppress the ingress of moisture and water into the contact interface between the terminal 111 part and the adherend 4, and it is possible to prevent an increase in the electrical resistance at the contact interface. This action / effect can be confirmed by comparing the resistance measurement tests of the example and the comparative example described below.

【0016】[0016]

【実施例】【Example】

〔実施例1〕JIS H 4160 1N30に規定される厚み50μ
mの軟質アルミニウム箔の片面に、厚み50μmのアク
リル系感圧性接着剤層(20℃での弾性率1kg/cm
2)を塗工し、図1の(イ)における間隔a、bが5m
mで、ポンチ外径が0.425mm、ダイス型内径が
0.5mmである絞り金型とプレスを用いて図2の
(ロ)に示す形状の導通部を形成し、このシ−トを巾1
2mmに切断して導電性接着テ−プ本体とし、厚み50
μmのポリエステルフィルムのテ−プ基材の片面に厚み
50μmの同上アクリル系感圧性接着剤層を塗工した巾
20mmの補助テ−プを同上導電性接着テ−プ本体に貼
り合せて導電性接着テ−プを得た。
[Example 1] Thickness 50μ specified in JIS H 4160 1N30
m soft aluminum foil on one side with a thickness of 50 μm acrylic pressure-sensitive adhesive layer (elastic modulus at 20 ° C. 1 kg / cm
2 ) is applied, and the distances a and b in (a) of Fig. 1 are 5m.
m, an outer diameter of the punch is 0.425 mm, an inner diameter of the die is 0.5 mm, and a press is used to form a conducting portion having a shape shown in (b) of FIG. 1
Cut to 2 mm to make a conductive adhesive tape body, thickness 50
A polyester film having a thickness of μm and a base material having a thickness of 50 μm coated with an acrylic pressure-sensitive adhesive layer having a thickness of 50 μm, and an auxiliary tape having a width of 20 mm, which is attached to the main body of the conductive adhesive tape, have conductivity. An adhesive tape was obtained.

【0017】〔実施例2〕補助テ−プのテ−プ基材に厚
み3mmのポリエチレン発泡体基材を使用した以外、他
の条件(導電性接着テ−プ本体、補助テ−プの巾、補助
テ−プの感圧性接着剤層等)は実施例1に同じとした。
[Example 2] Other conditions (conductive adhesive tape body, width of auxiliary tape) were used except that a polyethylene foam base material having a thickness of 3 mm was used as the tape base material of the auxiliary tape. The pressure-sensitive adhesive layer of the auxiliary tape, etc.) was the same as in Example 1.

【0018】〔実施例3〕JIS H 2101に規定される厚み
35μmのタフピッチ銅箔の片面に、厚み40μmの天
然ゴム系感圧性接着剤層(20℃での弾性率0.5kg
/cm2)を塗工し、図1の(イ)における間隔a、b
が5mmで、図3の(イ)における円錐形オス型31の
高さが150μm、内角が20度である絞り金型とプレ
スを用いて図3の(ハ)に示す形状の導通部110を形
成し、これを巾12mmに切断して導電性接着テ−プ本
体とし、厚み50μm、黄色着色のポリエステルフィル
ムのテ−プ基材の片面に厚み40μmの同上天然ゴム系
感圧性接着剤層を塗工した巾20mmの補助テ−プを同
上導電性接着テ−プ本体に貼り合せて導電性接着テ−プ
を得た。
Example 3 A 40 μm thick natural rubber pressure-sensitive adhesive layer (elastic modulus of 0.5 kg at 20 ° C.) is provided on one side of a 35 μm thick tough pitch copper foil specified in JIS H 2101.
/ Cm 2 ), and the intervals a and b in FIG.
Is 5 mm, the conical male die 31 in FIG. 3A has a height of 150 μm, and the internal angle is 20 degrees. Using a drawing die and a press, the conducting portion 110 having the shape shown in FIG. It is formed and cut into a width of 12 mm to form a conductive adhesive tape body, and a natural rubber pressure-sensitive adhesive layer having a thickness of 50 μm and a thickness of 40 μm is formed on one surface of a tape base material of a yellow colored polyester film. The coated auxiliary tape having a width of 20 mm was attached to the conductive adhesive tape body as above to obtain a conductive adhesive tape.

【0019】〔比較例1〕実施例1に対し、補助テ−プ
の巾と導電性接着テ−プの巾とを等しくし、補助テ−プ
の巾両端と導電性接着テ−プ本体の巾両端とを一致させ
た以外、実施例1に同じとした。 〔比較例2〕実施例3に対し、補助テ−プの巾と導電性
接着テ−プの巾とを等しくし、補助テ−プの巾両端と導
電性接着テ−プ本体の巾両端とを一致させた以外、実施
例3に同じとした。
[Comparative Example 1] Compared with Example 1, the width of the auxiliary tape and the width of the conductive adhesive tape are made equal to each other, and both ends of the width of the auxiliary tape and the main body of the conductive adhesive tape are compared. Same as Example 1 except that both ends of the width match. [Comparative Example 2] Compared with Example 3, the width of the auxiliary tape and the width of the conductive adhesive tape are made equal to each other, and the width ends of the auxiliary tape and the width ends of the conductive adhesive tape body are made equal to each other. Same as Example 3 except that

【0020】これの実施例品並びに比較例品について、
次の条件で抵抗値試験を行った。 〔試験条件〕絶縁フィルム条に二枚の銅箔を間隔を隔て
て配置し、これらの銅箔間に跨って試料の導電性接着テ
−プを貼着し、両銅箔にテスタ−のプロ−ブを当接して
抵抗値を測定することを、初期並びに温度60℃、相対
湿度90%の高温・高湿槽内168時間放置後のそれぞ
れについて行う。
Regarding the example product and the comparative example product,
A resistance value test was conducted under the following conditions. [Test conditions] Two copper foils are placed on the insulating film strip with a space between them, and the conductive adhesive tape of the sample is attached across these copper foils. The measurement of the resistance value is performed by contacting the blades with each other at an initial stage and after standing for 168 hours in a high temperature / high humidity tank having a temperature of 60 ° C. and a relative humidity of 90%.

【0021】各実施例品並びに比較例品のそれぞれにつ
いてこの試験を行ったところ、初期抵抗値については、
実施例品と比較例品との間に差は認められなかった。高
温・高湿槽内168時間放置後の抵抗値については、実
施例品では、何れにおいても、初期抵抗値との実質的な
差は認められなかったが、比較例品については初期抵抗
値の100〜200倍もの増加が認められた。
When this test was conducted for each of the example products and the comparative example products, the initial resistance value was as follows.
No difference was observed between the example product and the comparative example product. Regarding the resistance value after being left for 168 hours in the high temperature and high humidity tank, no substantial difference from the initial resistance value was observed in any of the example products, but in the comparative example product, the initial resistance value An increase of 100 to 200 times was observed.

【0022】[0022]

【発明の効果】本発明によれば、導電性テ−プ基材の片
面に感圧性接着剤層が設けられ、上記基材に上記接着剤
層を貫通し、かつその先端に端子部を有する所望間隔の
導通部が設けられてなる導電性接着テ−プに、このテ−
プ巾よりも広巾の感圧接着性補助テ−プを貼り合せるだ
けで、高温・多湿下での導通安定性を保証でき、信頼性
に優れた導電性接着テ−プを提供できる。また、導電性
テ−プ基材表面の絞り成形の切り跡が補助テ−プで覆わ
れているから、手貼り時での手指の切傷を確実に排除で
き、安全である。
According to the present invention, a pressure-sensitive adhesive layer is provided on one surface of a conductive tape base material, the base material penetrates the adhesive layer, and has a terminal portion at its tip. This tape is attached to a conductive adhesive tape provided with conducting portions at desired intervals.
By simply sticking a pressure-sensitive adhesive auxiliary tape having a width wider than that of the adhesive band, it is possible to guarantee the conduction stability under high temperature and high humidity and provide a highly reliable conductive adhesive tape. Further, since the traces of the draw forming on the surface of the conductive tape base material are covered with the auxiliary tape, it is possible to reliably eliminate the cuts on the fingers when the hand is stuck, which is safe.

【図面の簡単な説明】[Brief description of drawings]

【図1】図1の(イ)は本発明に係る導電性接着テ−プ
の一例を示す説明図、図1の(ロ)は図1の(イ)にお
けるロ−ロ断面図である。
1 (a) is an explanatory view showing an example of a conductive adhesive tape according to the present invention, and FIG. 1 (b) is a sectional view taken along the line of (i) in FIG.

【図2】図1に示す導電性接着テ−プの導通部の成形手
順を示す説明図である。
FIG. 2 is an explanatory view showing a procedure for forming a conductive portion of the conductive adhesive tape shown in FIG.

【図3】図3の(イ)並びに(ロ)は本発明に係る導電
性接着テ−プの上記とは別の導通部を成形するための型
を示す説明図、図3の(ハ)はその型で成形された導通
部を示す説明図である。
3 (a) and 3 (b) are explanatory views showing a mold for molding a conductive portion different from the above of the conductive adhesive tape according to the present invention, and FIG. 3 (c). [Fig. 3] is an explanatory view showing a conducting portion formed by the mold.

【図4】図4の(イ)は本発明に係る導電性接着テ−プ
の使用状態を示す説明図、図4の(ロ)は図4の(イ)
におけるロ−ロ断面図である。
4 (a) is an explanatory view showing a use state of the conductive adhesive tape according to the present invention, and FIG. 4 (b) is FIG. 4 (a).
FIG.

【図5】本発明に係る導電性接着テ−プの上記とは別の
使用状態を示す説明図である。
FIG. 5 is an explanatory view showing a usage state of the conductive adhesive tape according to the present invention which is different from the above.

【符号の説明】[Explanation of symbols]

1 導電性接着テ−プ本体 11 導電性テ−プ基材 12 感圧性接着剤層 110 導通部 111 端子部 2 補助テ−プ 21 テ−プ基材 22 感圧性接着剤層 DESCRIPTION OF SYMBOLS 1 Conductive adhesive tape main body 11 Conductive tape base material 12 Pressure sensitive adhesive layer 110 Conductive part 111 Terminal part 2 Auxiliary tape 21 Tape base material 22 Pressure sensitive adhesive layer

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 C09J 7/02 JLH H05K 3/32 B 8718−4E (72)発明者 松岡 直樹 大阪府茨木市下穂積1丁目1番2号 日東 電工株式会社内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical display location C09J 7/02 JLH H05K 3/32 B 8718-4E (72) Inventor Naoki Matsuoka Ibaraki City, Osaka Prefecture Hozumi 1-2, Nitto Denko Corporation

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】導電性テ−プ基材の片面に感圧性接着剤層
が設けられ、前記導電性テ−プ基材に上記接着剤層を貫
通し、かつその先端に端子部を有する所望間隔の導通部
が設けられてなる導電性接着テ−プ本体の上記基材の他
面に、テ−プ基材の片面に感圧性接着剤層を有する補助
テ−プが上記導電性接着テ−プ本体の巾両端より突出し
てその感圧性接着剤層において貼り合わされていること
を特徴とする導電性接着テ−プ。
1. A pressure-sensitive adhesive layer is provided on one surface of a conductive tape base material, the conductive tape base material is penetrated through the adhesive layer, and a terminal portion is provided at a tip thereof. An auxiliary tape having a pressure-sensitive adhesive layer on one surface of the tape base material is provided on the other surface of the base material of the conductive adhesive tape main body provided with conductive portions at intervals. -A conductive adhesive tape characterized in that it is protruded from both ends of the width of the tape body and is adhered to the pressure-sensitive adhesive layer.
【請求項2】補助テ−プのテ−プ基材がクッション性を
有する請求項1記載の導電性接着テ−プ。
2. The conductive adhesive tape according to claim 1, wherein the tape base material of the auxiliary tape has a cushioning property.
JP33991094A 1994-12-29 1994-12-29 Conductive adhesive tape Pending JPH08185714A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33991094A JPH08185714A (en) 1994-12-29 1994-12-29 Conductive adhesive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33991094A JPH08185714A (en) 1994-12-29 1994-12-29 Conductive adhesive tape

Publications (1)

Publication Number Publication Date
JPH08185714A true JPH08185714A (en) 1996-07-16

Family

ID=18331937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33991094A Pending JPH08185714A (en) 1994-12-29 1994-12-29 Conductive adhesive tape

Country Status (1)

Country Link
JP (1) JPH08185714A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008203448A (en) * 2007-02-19 2008-09-04 Seiko Instruments Inc Liquid crystal display device
EP2314650A1 (en) 2009-10-22 2011-04-27 Nitto Denko Corporation Electroconductive pressure-sensitive adhesive tape with separator
WO2011093214A1 (en) 2010-01-26 2011-08-04 日東電工株式会社 Conductive adhesive tape
WO2011108490A1 (en) 2010-03-03 2011-09-09 日東電工株式会社 Electrically conductive adhesive tape
EP2399968A2 (en) 2010-06-25 2011-12-28 Nitto Denko Corporation Electroconductive pressure-sensitive adhesive tape
WO2012042964A1 (en) * 2010-09-30 2012-04-05 日東電工株式会社 Electromagnetic wave shielding sheet for use in wireless power transmission
JP2012131921A (en) * 2010-12-22 2012-07-12 Nitto Denko Corp Conductive adhesive tape
EP2537905A2 (en) 2011-06-23 2012-12-26 Nitto Denko Corporation Conductive thermosetting adhesive tape
WO2013031500A1 (en) * 2011-08-30 2013-03-07 日東電工株式会社 Conductive adhesive tape
JP2013049764A (en) * 2011-08-30 2013-03-14 Nitto Denko Corp Conductive adhesive tape
JP2013049763A (en) * 2011-08-30 2013-03-14 Nitto Denko Corp Conductive adhesive tape

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008203448A (en) * 2007-02-19 2008-09-04 Seiko Instruments Inc Liquid crystal display device
EP2314650A1 (en) 2009-10-22 2011-04-27 Nitto Denko Corporation Electroconductive pressure-sensitive adhesive tape with separator
JP2011089022A (en) * 2009-10-22 2011-05-06 Nitto Denko Corp Electroconductive pressure-sensitive adhesive tape
WO2011093214A1 (en) 2010-01-26 2011-08-04 日東電工株式会社 Conductive adhesive tape
WO2011108490A1 (en) 2010-03-03 2011-09-09 日東電工株式会社 Electrically conductive adhesive tape
EP2399968A2 (en) 2010-06-25 2011-12-28 Nitto Denko Corporation Electroconductive pressure-sensitive adhesive tape
WO2012042964A1 (en) * 2010-09-30 2012-04-05 日東電工株式会社 Electromagnetic wave shielding sheet for use in wireless power transmission
JP2012079806A (en) * 2010-09-30 2012-04-19 Nitto Denko Corp Electromagnetic-wave shield sheet for wireless power transmission
JP2012131921A (en) * 2010-12-22 2012-07-12 Nitto Denko Corp Conductive adhesive tape
EP2537905A2 (en) 2011-06-23 2012-12-26 Nitto Denko Corporation Conductive thermosetting adhesive tape
WO2013031500A1 (en) * 2011-08-30 2013-03-07 日東電工株式会社 Conductive adhesive tape
WO2013031499A1 (en) * 2011-08-30 2013-03-07 日東電工株式会社 Conductive adhesive tape
JP2013049764A (en) * 2011-08-30 2013-03-14 Nitto Denko Corp Conductive adhesive tape
JP2013049763A (en) * 2011-08-30 2013-03-14 Nitto Denko Corp Conductive adhesive tape

Similar Documents

Publication Publication Date Title
CN100558294C (en) Waterproof bioelectrode
JPH08185714A (en) Conductive adhesive tape
JP2545518Y2 (en) Flat cable connection
US4698457A (en) Strippable shielded electrical cable assembly
US4000488A (en) Label alarm system
US4513170A (en) Strippable shielded electrical cable
JPH0429163B2 (en)
JP3992360B2 (en) Conductive adhesive tape
JPH10292155A (en) Electroconductive adhesive tape and its production
JP2005538520A (en) Sealing system for multi-terminal electrical connectors
US4623766A (en) Pressure-sensitive sheet material
JP5303302B2 (en) Insulation structure of temperature detection circuit body
JPH10224073A (en) Electromagnetic shielding packing
US3275486A (en) Method of removing insulating material from electrical conductors
CN204585975U (en) A kind of operator guards of gum
JP2607871Y2 (en) Flat cable
JP2010097866A (en) Terminal connection structure
CN218885182U (en) Sensor, battery package and car
JPS63127527A (en) Manufacture of electrolytic capacitor
JP2004336698A (en) Paste circuit, paste circuit sheet and manufacturing method of paste circuit sheet
CN103489849B (en) joint structure
KR200146015Y1 (en) Sheet shaped light emitting display device
JPH058822U (en) Electric cable and manufacturing method thereof
JP2001266658A (en) Ffc parts
CN111690329A (en) Battery gum pasting structure