JPH08170062A - One-pack type adhesive for forming electronic circuit board - Google Patents

Abstract

PURPOSE: To provide a one-pack type adhesive for forming electronic circuits and exhibiting stable viscosity even after the storage over a long period. CONSTITUTION: This adhesive contains an epoxy resin, a latent curing agent, an inorganic filler, a thixotropic agent and a storage stabilizing agent. The amounts of the latent curing agent, the inorganic filler and the thixotropic agent are 30-80 pts.wt., 5-40 pts.wt. and 3-30 pts.wt. based on 100 pts.wt. of the epoxy resin in total, respectively. When the storage stabilizing agent is composed of an amide wax and an acryl-modified tetrafunctional glycidylamine, the amount of the former compound is 3-15 pts.wt. and that of the latter compound is 2-15 pts. wt. The storage stabilizing agent may be fibrous calcium carbonate (2-18 pts.wt.), carbon black (0.5-8 pts.wt.) or diethylenetriamine powder (1-20 pts.wt.).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a one-component type electronic circuit board forming device for fixing an electronic component to an insulating substrate when the electronic component is mounted on the insulating substrate to form the electronic circuit substrate. It relates to an adhesive.

[0002]

2. Description of the Related Art Heretofore, there has been proposed a one-component adhesive for forming an electronic circuit board, which comprises an epoxy resin, a latent curing agent, an inorganic filler, a thixotropic agent and an organic pigment.

[0003]

However, since the viscosity of such an adhesive changes during storage for a long period of time, the viscosity and the application conditions must be readjusted each time the adhesive is applied to the insulating substrate. There was the annoyance that it wouldn't happen.

Therefore, an object of the present invention is to provide a one-part adhesive for forming an electronic circuit board, which does not change in viscosity even after being stored for a long time.

[0005]

According to the present invention, in order to achieve the above-mentioned object, an epoxy resin, a latent curing agent, an inorganic filler, a thixotropic agent and a storage stabilizer are contained,
30-80 parts by weight of the latent curing agent, 5-40 parts by weight of the inorganic filler, and 100 parts by weight of the total amount of the epoxy resin,
There is provided a one-component adhesive for forming an electronic circuit board, characterized in that the thixotropic agent is 3 to 30 parts by weight.

The storage stabilizer comprises amide wax and acryl-modified tetrafunctional glycidyl amine, and the amide wax is 3 to 3 parts by weight with respect to 100 parts by weight of the total amount of the epoxy resin.
15 parts by weight of acrylic-modified 4-functional glycidylamine is 2
It can be configured to be ˜15 parts by weight.

The storage stabilizer may be composed of fibrous calcium carbonate, and the fibrous calcium carbonate may be 2 to 18 parts by weight with respect to 100 parts by weight of the total amount of the epoxy resin.

The storage stabilizer may be made of carbon black, and the amount of carbon black may be 0.5 to 8 parts by weight with respect to 100 parts by weight of the total amount of the epoxy resin.

Further, the storage stabilizer may be composed of diethylenetriamine powder, and 1 to 20 parts by weight of diethylenetriamine powder may be used with respect to 100 parts by weight of the total amount of the epoxy resin.

[0010]

Since the one-component adhesive according to the present invention contains a storage stabilizer, it is possible to prevent the viscosity from changing even if it is stored for a long time. In particular, the storage stabilizer is composed of amide wax and acryl-modified tetrafunctional glycidyl amine, and the amide wax is 3 to 15 parts by weight and the acryl-modified tetrafunctional glycidyl amine is 2 to 15 parts by weight with respect to 100 parts by weight of the total amount of the epoxy resin. In some cases, or when the storage stabilizer is composed of fibrous calcium carbonate and the total amount of epoxy resin is 2 to 18 parts by weight of fibrous calcium carbonate, or when the storage stabilizer is composed of carbon black. , Carbon black is 0.5 to 100 parts by weight of the total amount of epoxy resin.
If the amount is 8 parts by weight, or if the storage stabilizer is diethylenetriamine powder and the total amount of epoxy resin is 1 to 20 parts by weight of diethylenetriamine powder, the storage period is about one month. However, the change in viscosity can be remarkably prevented.

[0011]

EXAMPLES Next, examples of the present invention will be described together with comparative examples.

The compounding ratios in the first to fourth examples of the present invention are shown in Table 1, and the compounding ratios in the first to eighth comparative examples are shown in Table 2.

[0013]

[Table 1]

[0014]

[Table 2]

Epoxy resin A in Tables 1 and 2
Is Epicoat 806L (produced by Yuka Shell Epoxy Co., Ltd.)
(Bisphenol F type epoxy resin). Epoxy resin B
Is Epicoat 828 (produced by Yuka Shell Epoxy Co., Ltd.) (bisphenol A type epoxy resin). The curing agent is Fujicure FXE1000 (manufactured by Fuji Kasei Co., Ltd.) (aminoureide-based latent curing agent). The filling agent is Mistron CB (manufactured by Japan Mistron Co., Ltd.) (silane coupling treated talc). The thixotropic agent is Aerosil R202 (manufactured by Nippon Aerosil Co., Ltd.)
(Silicone-coupling anhydrous silica). The storage stabilizer A is Disparlon A603-20X (produced by Kusumoto Kasei Co., Ltd.) (fatty acid amide wax type). Storage stabilizer B is
TETRAD-XM (manufactured by Mitsubishi Gas Chemical Co., Inc.) (acrylic modified tetrafunctional glycidyl amine). Storage stabilizer C is Whiskal (manufactured by Maruo Calcium Co.) (fibrous calcium carbonate). Storage stabilizer D is carbon microbead ICB
-0510 (manufactured by Nippon Carbon Co., Ltd.) (carbon black). Storage stabilizer E is H9506 (manufactured by Nippon Ciba Geigy) (diethylenetriamine powder). The pigment is Carmine 6B (manufactured by Dainippon Ink and Chemicals, Inc.).

Adhesives were prepared by thoroughly mixing the respective components (units are parts by weight) of Examples 1 to 4 shown in Table 1 and Comparative Examples 1 to 8 shown in Table 2 with respect to the storage stability and initial stage. The viscosity was judged. The determination results are shown in Table 3. In the determination of storage stability, the case where the viscosity of the adhesive after storage for 30 days in a constant temperature bath at 30 ° C. is 0.8 to 1.2 times the initial viscosity is “OK”, and the others are “NG”. did. In addition, in determining the initial viscosity, an E-type 3 ″ cone viscometer was used and the temperature was 30 ° C.
Viscosity at a rotational speed of 0.5 (rpm) at an ambient temperature of 6
If it is within 00000 [cps], it is regarded as “OK”,
Other than that was set to "NG".

[0017]

[Table 3]

Referring to Tables 1 to 3, 2 parts by weight of the storage stabilizer A (based on 100 parts by weight of the total amount of the epoxy resin).
The same applies hereinafter), Comparative Example 1 containing 1 part by weight of Storage Stabilizer B is inferior in storage stability to Example 1 containing 5 parts by weight of Storage Stabilizer A and 3 parts by weight of Storage Stabilizer B, and thus storage stability Comparative Example 2 containing 20 parts by weight of the agent A and 20 parts by weight of the storage stabilizer B,
It can be seen that the initial viscosity is inferior to that of Example 1.
In addition, Comparative Example 3 containing 1 part by weight of the storage stabilizer C is inferior in storage stability to Example 2 containing 6 parts by weight of the storage stabilizer C, and Comparative Example 4 containing 20 parts by weight of the storage stabilizer C It can be seen that the initial viscosity is inferior to that of Example 2. Also,
Comparative Example 5 in which the storage stabilizer D was 0.2 part by weight was inferior in storage stability to Example 3 in which the storage stabilizer D was 1.5 parts by weight, and Comparative Example 5 in which the storage stabilizer D was 10 parts by weight. 6 is inferior in initial viscosity to Example 3. In addition, Comparative Example 7 containing 0.5 parts by weight of the storage stabilizer E was inferior in storage stability to Example 4 containing 5 parts by weight of the storage stabilizer E, and Comparative Example 7 containing 22 parts by weight of the storage stabilizer E. 8 is inferior in initial viscosity to Example 4.

Based on the cases shown in Tables 1 to 3, further tests were carried out to find the permissible critical value of the storage stabilizer by changing the composition ratio variously. As a result, the amount of amide wax was less than 3 parts by weight, and the acryl wax was less than 3 parts by weight. When the amount of modified glycidyl amine is less than 2 parts by weight, the amount of fibrous calcium carbonate is less than 2 parts by weight, the amount of carbon black is less than 0.5 part by weight, and the amount of diethylenetriamine powder is less than 1 part by weight, It was found that it was difficult to obtain the effect of preventing viscosity change satisfactorily. Further, amide wax exceeds 15 parts by weight, acrylic modified tetrafunctional glycidyl amine exceeds 15 parts by weight, fibrous calcium carbonate exceeds 18 parts by weight, carbon black exceeds 8 parts by weight, and diethylenetriamine powder is used. It was found that the viscosity of the adhesive becomes too high when the amount exceeds 20 parts by weight.

[0020]

As described above, according to the present invention, the addition of the storage stabilizer makes it possible to obtain an epoxy one-component adhesive which exhibits a stable viscosity even when the adhesive is stored for a long time. .

In particular, when amide wax (3 to 15 parts by weight) and acrylic modified tetrafunctional glycidyl amine (2 to 15 parts by weight) are used as the storage stabilizer, or when fibrous calcium carbonate (2 to 18 parts by weight) is used as the storage stabilizer. Storage stability when using carbon black (0.5 to 8 parts by weight) as the storage stabilizer or when using diethylenetriamine powder (1 to 20 parts by weight) as the storage stabilizer. It is possible to obtain an epoxy-based one-component adhesive having excellent properties and initial viscosity, and it is possible to efficiently manufacture a high-quality electronic circuit board.

Claims (5)

[Claims] 1. An epoxy resin, a latent curing agent, an inorganic filler, a thixotropic agent and a storage stabilizer are contained, and the latent curing agent is 30 to 80 relative to 100 parts by weight of the total amount of the epoxy resin.
Parts by weight, 5 to 40 parts by weight of the inorganic filler, 3 parts of the thixotropic agent
A one-component adhesive for forming an electronic circuit board, characterized in that it is from 30 to 30 parts by weight. 2. A storage stabilizer comprising an amide wax and an acryl-modified tetrafunctional glycidyl amine, wherein the amide wax is 3 per 100 parts by weight of the total amount of the epoxy resin.
The one-part adhesive for forming an electronic circuit board according to claim 1, wherein the acrylic modified tetrafunctional glycidyl amine is 2 to 15 parts by weight. 3. The one-part liquid for forming an electronic circuit board according to claim 1, wherein the storage stabilizer is made of fibrous calcium carbonate, and the fibrous calcium carbonate is 2 to 18 parts by weight with respect to 100 parts by weight of the total amount of the epoxy resin. Adhesive. 4. The one-component adhesive for forming an electronic circuit board according to claim 1, wherein the storage stabilizer comprises carbon black, and the total amount of the epoxy resin is 0.5 to 8 parts by weight with respect to 100 parts by weight of the carbon black. Agent. 5. The one-part adhesive for forming an electronic circuit board according to claim 1, wherein the storage stabilizer comprises diethylenetriamine powder, and 1 to 20 parts by weight of diethylenetriamine powder is used with respect to a total amount of 100 parts by weight of the epoxy resin.