JPH08165592A - Adhesive film for plating mask - Google Patents
Adhesive film for plating maskInfo
- Publication number
- JPH08165592A JPH08165592A JP30938994A JP30938994A JPH08165592A JP H08165592 A JPH08165592 A JP H08165592A JP 30938994 A JP30938994 A JP 30938994A JP 30938994 A JP30938994 A JP 30938994A JP H08165592 A JPH08165592 A JP H08165592A
- Authority
- JP
- Japan
- Prior art keywords
- film
- adhesive film
- plating
- printed circuit
- based elastomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 35
- 239000002313 adhesive film Substances 0.000 title claims abstract description 27
- -1 polypropylene Polymers 0.000 claims abstract description 21
- 239000004743 Polypropylene Substances 0.000 claims abstract description 20
- 229920001155 polypropylene Polymers 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 17
- 229920000098 polyolefin Polymers 0.000 claims abstract description 13
- 229920001971 elastomer Polymers 0.000 claims abstract description 11
- 239000000806 elastomer Substances 0.000 claims abstract description 10
- 239000012790 adhesive layer Substances 0.000 claims abstract 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 19
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 16
- 229920001577 copolymer Polymers 0.000 claims description 13
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 8
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 claims description 8
- 239000000178 monomer Substances 0.000 claims description 8
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 5
- 239000005977 Ethylene Substances 0.000 claims description 5
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 4
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 6
- 229920003048 styrene butadiene rubber Polymers 0.000 abstract description 6
- 229920006124 polyolefin elastomer Polymers 0.000 abstract description 4
- 239000000203 mixture Substances 0.000 abstract description 2
- 239000003522 acrylic cement Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 229920003051 synthetic elastomer Polymers 0.000 description 5
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Electroplating Methods And Accessories (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント基板、フレキ
シブル・プリント基板の接続端子部等を部分めっきする
ときに、非めっき部分をマスクするために用いるめっき
マスク粘着フィルムに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating mask adhesive film used for masking a non-plated portion when partially plating a printed circuit board, a connecting terminal portion of a flexible printed circuit board or the like.
【０００２】[0002]
【従来の技術】従来より、プリント基板、フレキシブル
・プリント基板の接続端子部等を部分的にめっきする方
法として、非めっき部に粘着フィルムを貼り付けてマス
クし、その後めっきする方法が一般に用いられている。
しかし、粘着フィルムを貼り付けるプリント基板、フレ
キシブル・プリント基板の表面には、先に形成した回路
の複雑な凹凸があるため、粘着フィルムはこの凹凸に追
従密着し、マスク部分へのめっき液浸入を防止する必要
がある。粘着フィルムの密着性が悪いと、めっき液の滲
み込みが発生し、めっき仕上がり精度が悪くなり、結果
的にプリント基板、フレキシブル・プリント基板の回路
の誤動作等の原因となる。このような用途に用いる粘着
フィルムとしては、軟質塩化ビニル系樹脂を支持体とし
た粘着フィルムが良好に用いられている。軟質塩化ビニ
ル系樹脂は、含有する可塑剤の量により、フィルム硬さ
を調整出来、また、回路表面への凹凸追従性の良好な柔
軟なフィルムを得ることが出来るためである。2. Description of the Related Art Conventionally, as a method of partially plating a printed circuit board, a connecting terminal portion of a flexible printed circuit board, etc., a method of attaching an adhesive film to a non-plated portion, masking it, and then plating is generally used. ing.
However, the printed circuit board to which the adhesive film is attached and the surface of the flexible printed circuit board have complicated irregularities of the circuit previously formed. Therefore, the adhesive film adheres closely to these irregularities to prevent the plating solution from entering the mask portion. It needs to be prevented. Poor adhesion of the pressure-sensitive adhesive film causes bleeding of the plating solution, resulting in poor plating finish accuracy, resulting in malfunction of the circuit of the printed circuit board or flexible printed circuit board. As the adhesive film used for such an application, an adhesive film having a soft vinyl chloride resin as a support is favorably used. This is because the soft vinyl chloride resin can adjust the film hardness depending on the amount of the plasticizer contained, and can obtain a flexible film having good conformability to unevenness on the circuit surface.
【０００３】[0003]
【発明が解決しようとする課題】一方、近年、塩化ビニ
ル系樹脂は焼却に際し、環境に悪影響を与えることが指
摘され、最終処分上の問題があり、ポリオレフィン系材
料への転換が求められている。そこで、ポリエチレン又
はポリプロピレンといったポリオレフィン系フィルムを
支持体とした粘着フィルムへの転換が検討されたが、支
持体の柔軟性に乏しいため、回路表面の凹凸への密着性
が悪く、めっき液の滲み込みが発生し、めっき仕上がり
精度が悪いという問題があり、回路表面が比較的平滑な
プリント基板、フレキシブル・プリント基板にしか使用
出来ないでいた。本発明は、上記した課題を解決するた
めになされたもので、プリント基板、フレキシブル・プ
リント基板の表面凹凸への密着性が良く、めっき液の滲
み込みが無く、めっき仕上がり精度の良いポリオレフィ
ン系のめっきマスク粘着フィルムを提供することを目的
とする。On the other hand, in recent years, it has been pointed out that vinyl chloride resins adversely affect the environment when incinerated, and there is a problem in final disposal, and conversion to polyolefin materials is required. . Therefore, conversion to an adhesive film using a polyolefin-based film such as polyethylene or polypropylene as a support was examined, but because the support is poor in flexibility, the adhesion to the unevenness of the circuit surface is poor and the plating solution seeps However, there was a problem that the plating finish accuracy was poor, and it could only be used for printed circuit boards and flexible printed circuit boards with a relatively smooth circuit surface. The present invention has been made in order to solve the above-mentioned problems, and has good adhesion to the surface irregularities of the printed circuit board and the flexible printed circuit board, does not seep into the plating solution, and has a good plating finish accuracy. An object is to provide a plating mask adhesive film.
【０００４】[0004]
【課題を解決するための手段】本発明は、ポリプロピレ
ン及びポリオレフィン系エラストマーを主成分とする樹
脂フィルムで、且つ１０％歪み時のフィルム引張り応力
が０．２０〜０．８０ｋｇ／cm2である支持体の片面に
粘着剤層を設けてなるめっきマスク粘着フィルムに関す
る。上記のように、本発明において用いられる支持体
は、ポリプロピレン及びポリオレフィン系エラストマー
を主成分とする樹脂フィルムであり、このようなフィル
ムはポリプロピレンとポリオレフィン系エラストマーと
を混合し、製膜することにより得ることが出来る。本発
明で用いられるポリプロピレン樹脂としては、必要に応
じエチレンモノマーや官能基を持ったモノマーを共重合
したものでもよい。The present invention relates to a resin film containing polypropylene and a polyolefin-based elastomer as main components, and having a film tensile stress of 0.20 to 0.80 kg / cm 2 at 10% strain. The present invention relates to a plating mask pressure-sensitive adhesive film having a pressure-sensitive adhesive layer provided on one surface of a body. As described above, the support used in the present invention is a resin film containing polypropylene and a polyolefin-based elastomer as main components, and such a film is obtained by mixing polypropylene and a polyolefin-based elastomer and forming a film. You can The polypropylene resin used in the present invention may be one obtained by copolymerizing an ethylene monomer or a monomer having a functional group, if necessary.
【０００５】また、オレフィン系エラストマーとして
は、スチレンとブタジエン又はスチレンとイソプレンの
二重結合を有するモノマーから誘導される共重合体、エ
チレンとプロピレンから誘導される共重合体、ポリイソ
ブチレン、ブチルゴム等があるが、特に、スチレンとブ
タジエン又はスチレンとイソプレンの二重結合を有する
モノマーから誘導される共重合体、エチレンとプロピレ
ンから誘導される共重合体が好適に用いられる。ここ
で、スチレンとブタジエン又はスチレンとイソプレンの
二重結合を有するモノマーから誘導される共重合体と
は、スチレン・ブタジエン共重合体、スチレン・イソプ
レン共重合体やこれらの水素添加物等があり、また、第
三成分としてマレイン酸の如く官能基を有するモノマー
等を共重合したものであってもよい。The olefin elastomers include copolymers derived from monomers having a double bond of styrene and butadiene or styrene and isoprene, copolymers derived from ethylene and propylene, polyisobutylene and butyl rubber. However, in particular, a copolymer derived from a monomer having a double bond of styrene and butadiene or a styrene and isoprene, and a copolymer derived from ethylene and propylene are preferably used. Here, the copolymer derived from a monomer having a double bond of styrene and butadiene or styrene and isoprene, there are styrene-butadiene copolymer, styrene-isoprene copolymer and hydrogenated products of these, Further, it may be a copolymer of a monomer having a functional group such as maleic acid as the third component.
【０００６】また、ここでエチレンとプロピレンから誘
導される共重合体とは、エチレン・プロピレン共重合体
やこれに第三成分としてブテンの如く二重結合を有する
モノマー等を共重合したものがある。更に、ポリプロピ
レンとエチレン・プロピレン共重合体を同時に重合する
ことにより得られる、所謂、リアクター・ブレンド法タ
イプのポリオレフィン樹脂でもよい。また、上記の支持
体には、必要に応じて、ポリオレフィン系樹脂フィルム
に一般に使用される酸化防止剤、滑剤、着色剤等の添加
剤を含んでもよい。更に、上記の支持体は、ポリプロピ
レンとポリオレフィン系エラストマーとの混合比率を調
整することにより、１０％歪み時のフィルム引張り応力
が０．２０〜０．８０ｋｇ／cm2にすることが必要とな
る。Here, the copolymer derived from ethylene and propylene includes an ethylene / propylene copolymer and a copolymer of a monomer having a double bond such as butene as a third component. . Further, a so-called reactor blend method type polyolefin resin obtained by simultaneously polymerizing polypropylene and an ethylene / propylene copolymer may be used. Further, the above-mentioned support may optionally contain additives such as an antioxidant, a lubricant and a colorant which are generally used for polyolefin resin films. Furthermore, the above-mentioned support needs to have a film tensile stress of 0.20 to 0.80 kg / cm 2 at 10% strain by adjusting the mixing ratio of polypropylene and a polyolefin elastomer.
【０００７】本発明の粘着フィルムを貼り付けるプリン
ト基板、フレキシブル・プリント基板の表面は、先に回
路を形成しているため、最大で５０μｍ程度の凹凸があ
る。この凹凸に密着するためには、貼り付け時に粘着フ
ィルムが容易に伸びて隙間なく密着し、その後、フィル
ムが収縮し浮き上がろうとする力を粘着フィルムの粘着
力で抑える必要がある。つまり、フィルム延伸時の応力
を出来るだけ小さくすることが必要となる。そこで、フ
ィルム引張り応力と粘着フィルム密着性との関係を検討
した結果、１０％歪み時のフィルム引張り応力が０．８
０ｋｇ／cm2以下であれば、浮きの発生はなく、密着性
が良好であることを見い出した。一方、粘着フィルムの
剥離時においては、出来るだけフィルムは硬くて伸び難
い方が剥離作業性が良好である。つまり、同様に１０％
歪み時のフィルム引張り応力との関係を検討すると０．
２０ｋｇ／cm2以上必要であることがわかった。なお、
上記の１０％歪み時のフィルム引張り応力は、ＪＩＳ
Ｋ−７１１３「プラスチックの引張り試験方法」に準じ
て測定した値である。The surface of the printed circuit board or the flexible printed circuit board to which the adhesive film of the present invention is attached has the unevenness of about 50 μm at the maximum because the circuit is formed first. In order to adhere to the irregularities, it is necessary that the adhesive film easily expands and adheres without a gap at the time of attachment, and then the force of the film shrinking and rising is suppressed by the adhesive force of the adhesive film. That is, it is necessary to reduce the stress when stretching the film as much as possible. Therefore, as a result of examining the relationship between the film tensile stress and the adhesive film adhesiveness, the film tensile stress at 10% strain was 0.8.
It was found that when it was 0 kg / cm 2 or less, no floating occurred and the adhesion was good. On the other hand, at the time of peeling the pressure-sensitive adhesive film, the workability is better when the film is as hard and hard to stretch as possible. That is, 10% as well
Examining the relationship with the tensile stress of the film during strain,
It was found that 20 kg / cm 2 or more is required. In addition,
The film tensile stress at 10% strain is JIS
It is a value measured according to K-7113 "Plastic tensile test method".
【０００８】支持体の厚さは特に制限はないが、約５０
〜１５０μｍのものが好適である。フィルム厚みが５０
μｍより薄いと、フィルムの十分な強度が得られず、フ
ィルムの剥離時にフィルムが伸びて剥離性が悪い、フィ
ルムが破れる等の問題が生じる。一方、フィルム厚みが
１５０μｍより厚いと、フィルムの凹凸追従性が低下
し、めっきの滲み込みが発生し易くなるといった問題が
生じる。本発明の粘着フィルムに用いる粘着剤には、一
般に用いられるアクリル系粘着剤、天然ゴム系粘着剤、
合成ゴム系粘着剤、シリコン系粘着剤等、及びこれらの
混合系粘着剤を用いることが出来、その厚みは通常１〜
２０μｍとすることが適当である。また、本発明の粘着
フィルムには、必要に応じて、支持体と粘着剤との密着
力を得るために、コロナ処理、プラズマ処理といった支
持体の表面処理、下塗り剤の塗布等を行っても構わな
い。The thickness of the support is not particularly limited, but is about 50.
It is preferably about 150 μm. Film thickness is 50
When the thickness is less than μm, sufficient strength of the film cannot be obtained, and when peeling the film, the film stretches to cause problems such as poor peelability and tearing of the film. On the other hand, when the film thickness is thicker than 150 μm, the unevenness followability of the film deteriorates, and the problem that plating bleeding easily occurs occurs. The pressure-sensitive adhesive used for the pressure-sensitive adhesive film of the present invention includes commonly used acrylic pressure-sensitive adhesives, natural rubber pressure-sensitive adhesives,
Synthetic rubber adhesives, silicone adhesives, and mixed adhesives thereof can be used, and the thickness thereof is usually 1 to
20 μm is appropriate. In addition, the pressure-sensitive adhesive film of the present invention may be subjected to surface treatment of the support such as corona treatment and plasma treatment, application of an undercoating agent, etc., in order to obtain adhesion between the support and the pressure-sensitive adhesive, if necessary. I do not care.
【０００９】[0009]
【作用】本発明の粘着フィルムの技術的ポイントは、プ
リント基板、フレキシブル・プリント基板の表面凹凸へ
の密着性が良く、めっき液の滲み込みがなく、めっき仕
上がり精度の良いポリオレフィン系粘着フィルムを得る
ことである。このため、ポリプロピレン及びポリオレフ
ィン系エラストマーを主成分とする樹脂フィルムで、且
つ１０％歪み時のフィルム引張り応力が０．２０〜０．
８０ｋｇ／cm2であるフィルム支持体を用いることによ
り、上記のめっきマスク粘着フィルムを得ることが出来
る。The technical point of the pressure-sensitive adhesive film of the present invention is to obtain a polyolefin-based pressure-sensitive adhesive film which has good adhesion to the surface irregularities of the printed circuit board and flexible printed circuit board, does not seep into the plating solution, and has good plating finish accuracy. That is. Therefore, a resin film containing polypropylene and a polyolefin-based elastomer as a main component and having a film tensile stress of 0.20 to 0.
The plating mask pressure-sensitive adhesive film can be obtained by using a film support having a weight of 80 kg / cm 2 .
【００１０】[0010]
【実施例】次に実施例を説明するが、本発明はこの実施
例に限定されるものではない。 実施例１ 重量で、ＭＦＲ７．５、密度０．９０ｇ／cm3のポリプ
ロピレン樹脂（住友化学工業(株)製、住友ノーブレンＦ
Ｌ６４１１Ａ）９０部及び水添スチレン・ブタジエン共
重合体（日本合成ゴム(株)製、ＤＹＮＡＲＯＮ１３２０
Ｐ）１０部を混合し、Ｔ型ダイス押出し機で厚さ６０μ
ｍのフィルムを製膜した。次に、溶剤で希釈したアクリ
ル系粘着剤を、乾燥後の厚さが５μｍとなるように塗布
乾燥することにより粘着フィルムを作製した。EXAMPLES Next, examples will be described, but the present invention is not limited to these examples. Example 1 By weight, a polypropylene resin having an MFR of 7.5 and a density of 0.90 g / cm 3 (Sumitomo Chemical Co., Ltd., Sumitomo Noblen F)
L6411A) and hydrogenated styrene / butadiene copolymer (manufactured by Japan Synthetic Rubber Co., Ltd., DYNARON 1320)
P) 10 parts are mixed and the thickness is 60 μm using a T-die extruder.
m film was formed. Then, an acrylic pressure-sensitive adhesive diluted with a solvent was applied and dried so that the thickness after drying was 5 μm to prepare a pressure-sensitive adhesive film.
【００１１】実施例２ 重量で、ＭＦＲ７．５、密度０．９０ｇ／cm3のポリプ
ロピレン樹脂（住友化学工業(株)製、住友ノーブレンＦ
Ｌ６４１１Ａ）７５部及び水添スチレン・ブタジエン共
重合体（日本合成ゴム(株)製、ＤＹＮＡＲＯＮ１３２０
Ｐ）２５部を混合し、Ｔ型ダイス押出し機で厚さ６０μ
ｍのフィルムを製膜し、実施例１と同様にして粘着フィ
ルムを作製した。 実施例３ 重量で、ＭＦＲ７．５、密度０．９０ｇ／cm3のポリプ
ロピレン樹脂（住友化学工業(株)製、住友ノーブレンＦ
Ｌ６４１１Ａ）５０部及び水添スチレン・ブタジエン共
重合体（日本合成ゴム(株)製、ＤＹＮＡＲＯＮ１３２０
Ｐ）５０部を混合し、Ｔ型ダイス押出し機で厚さ６０μ
ｍのフィルムを製膜し、実施例１と同様にして粘着フィ
ルムを作製した。Example 2 Polypropylene resin having a MFR of 7.5 and a density of 0.90 g / cm 3 by weight (Sumitomo Noblen F manufactured by Sumitomo Chemical Co., Ltd.)
L6411A) and hydrogenated styrene / butadiene copolymer (manufactured by Japan Synthetic Rubber Co., Ltd., DYNARON 1320)
P) 25 parts are mixed and the thickness is 60 μm using a T-type die extruder.
The film of m was formed into an adhesive film in the same manner as in Example 1. Example 3 By weight, a polypropylene resin having an MFR of 7.5 and a density of 0.90 g / cm 3 (Sumitomo Noblen F manufactured by Sumitomo Chemical Co., Ltd.)
L6411A) and hydrogenated styrene / butadiene copolymer (manufactured by Japan Synthetic Rubber Co., Ltd., DYNARON 1320)
P) 50 parts are mixed and the thickness is 60 μm using a T-type die extruder.
The film of m was formed into an adhesive film in the same manner as in Example 1.
【００１２】実施例４ 重量で、ＭＦＲ７．５、密度０．９０ｇ／cm3のポリプ
ロピレン樹脂（住友化学工業(株)製、住友ノーブレンＦ
Ｌ６４１１Ａ）２５部及び水添スチレン・ブタジエン共
重合体（日本合成ゴム(株)製、ＤＹＮＡＲＯＮ１３２０
Ｐ）７５部を混合し、Ｔ型ダイス押出し機で厚さ６０μ
ｍのフィルムを製膜し、実施例１と同様にして粘着フィ
ルムを作製した。 比較例１ ＭＦＲ７．５、密度０．９０ｇ／cm3のポリプロピレン
樹脂（住友化学工業(株)製、住友ノーブレンＦＬ６４１
１Ａ）をＴ型ダイス押出し機で厚さ６０μｍのフィルム
を製膜し、実施例１と同様にして粘着フィルムを作製し
た。 比較例２ ＭＦＲ２．０、密度０．９２３ｇ／cm3の低密度ポリエ
チレン樹脂をＴ型ダイス押出し機で厚さ６０μｍのフィ
ルムを製膜し、実施例１と同様にして粘着フィルムを作
製した。Example 4 Polypropylene resin having a MFR of 7.5 and a density of 0.90 g / cm 3 by weight (Sumitomo Noblen F manufactured by Sumitomo Chemical Co., Ltd.)
L6411A) and hydrogenated styrene / butadiene copolymer (manufactured by Japan Synthetic Rubber Co., Ltd., DYNARON 1320)
P) 75 parts are mixed and the thickness is 60 μm using a T-type die extruder.
The film of m was formed into an adhesive film in the same manner as in Example 1. Comparative Example 1 MFR 7.5, polypropylene resin having a density of 0.90 g / cm 3 (Sumitomo Chemical Co., Ltd., Sumitomo Noblene FL641)
1A) was formed into a film having a thickness of 60 μm with a T-type die extruder, and an adhesive film was produced in the same manner as in Example 1. Comparative Example 2 A low-density polyethylene resin having an MFR of 2.0 and a density of 0.923 g / cm 3 was formed into a film having a thickness of 60 μm with a T-type die extruder, and an adhesive film was produced in the same manner as in Example 1.
【００１３】上記した各実施例及び各比較例で得られた
粘着フィルムについて、１０％歪み時のフィルム引張り
応力を測定し、また、めっき試験を行った。引張り応力
はＪＩＳ Ｋ−７１１３「プラスチックの引張り試験方
法」に準じて測定した。めっき試験は、ガラスエポキシ
プリント基板（回路凹凸２５μｍ）に粘着フィルムを８
０℃に加熱したゴムロールで貼付速度２ｍ／分、貼付圧
力６ｋｇ／cm2で貼り付けた試験片を、６０℃に加温し
た硫酸水溶液（ＰＨ＝１）に３０分間浸漬し、その後水
洗いし、めっき液の滲み込みの有無を観察した。試験結
果を表１に示す。なお、表中、めっき試験において〇印
は結果が良好、×印は不良であることを示す。※印のも
のは、粘着フィルムの剥離時、フィルムが伸び、剥離作
業性が悪かったものである。With respect to the pressure-sensitive adhesive films obtained in the above Examples and Comparative Examples, the film tensile stress at 10% strain was measured, and a plating test was conducted. The tensile stress was measured according to JIS K-7113 "Plastic tensile test method". For the plating test, apply an adhesive film to the glass epoxy printed circuit board (circuit roughness 25 μm).
A test piece stuck at a sticking speed of 2 m / min and a sticking pressure of 6 kg / cm 2 with a rubber roll heated to 0 ° C. is dipped in a sulfuric acid aqueous solution (PH = 1) heated to 60 ° C. for 30 minutes, and then washed with water, The presence or absence of seepage of the plating solution was observed. Table 1 shows the test results. In the table, in the plating test, ◯ indicates that the result is good, and x indicates that the result is poor. Those marked with * have poor workability in peeling because the film stretched during peeling of the adhesive film.
【００１４】表１から明らかなように、支持体のポリプ
ロピレンとポリオレフィン系エラストマーとの混合比を
実施例２〜３のようにすることにより、１０％歪み時の
引張り応力を０．２０〜０．８０ｋｇ／cm2として、基
板の表面凹凸への密着性が良く、めっき液の滲み込みが
なく、剥離作業性の良好な粘着フィルムが得られる。実
施例１はポリプロピレンの量が多いためにめっき液の滲
み込みが見られ、反対に実施例４はポリプロピレンの量
が少なくて剥離作業性が悪い。As is apparent from Table 1, the tensile stress at 10% strain is 0.20 to 0.20 by setting the mixing ratio of polypropylene of the support to the polyolefin elastomer as in Examples 2 to 3. When it is set to 80 kg / cm 2 , an adhesive film having good adhesion to the surface irregularities of the substrate, no penetration of the plating solution, and good peeling workability can be obtained. In Example 1, since the amount of polypropylene was large, seepage of the plating solution was observed. On the contrary, in Example 4, the amount of polypropylene was small and the peeling workability was poor.
【００１５】[0015]
【表１】 [Table 1]
【００１６】[0016]
【発明の効果】本発明によれば、プリント基板、フレキ
シブル・プリント基板の表面凹凸への密着性が良く、め
っき液の滲み込みが無く、めっき仕上がり精度の良好な
ポリオレフィン系のめっきマスク粘着フィルムを得るこ
とが可能である。更に、本発明の粘着フィルムは、ポリ
プロピレン及びポリオレフィン系エラストマーを主成分
とするため、焼却処分における環境汚染の問題が発生し
難い特長を有し、環境問題が指摘されている従来の軟質
塩化ビニル系樹脂を支持体に用いた粘着フィルムに代わ
る優れためっきマスク粘着フィルムとして使用出来る。According to the present invention, there is provided a polyolefin-based plating mask pressure-sensitive adhesive film that has good adhesion to the surface irregularities of a printed circuit board or a flexible printed circuit board, does not seep into a plating solution, and has good plating finish accuracy. It is possible to obtain. Furthermore, since the adhesive film of the present invention contains polypropylene and a polyolefin-based elastomer as the main components, it has a feature that the problem of environmental pollution during incineration is unlikely to occur, and conventional soft vinyl chloride-based adhesives that have been pointed out to have environmental problems. It can be used as an excellent plating mask adhesive film that replaces the adhesive film using a resin as a support.
Claims (3)
ラストマーを主成分とする樹脂フィルムであり、且つ１
０％歪み時のフィルム引張り応力が０．２０〜０．８０
ｋｇ／cm2である支持体の片面に粘着剤層を設けてなる
めっきマスク粘着フィルム。1. A resin film containing polypropylene and a polyolefin-based elastomer as main components, and 1.
The film tensile stress at 0% strain is 0.20 to 0.80
A plating mask adhesive film in which an adhesive layer is provided on one surface of a support having a weight of kg / cm 2 .
して、スチレンとブタジエン又はスチレンとイソプレン
の二重結合を有するモノマーから誘導される共重合体で
ある請求項１記載のめっきマスク粘着フィルム。2. The plating mask pressure-sensitive adhesive film according to claim 1, wherein the polyolefin-based elastomer is a copolymer mainly derived from a monomer having a double bond of styrene and butadiene or styrene and isoprene.
して、エチレンとプロピレンから誘導される共重合体で
ある請求項１記載のめっきマスク粘着フィルム。3. The plating mask pressure-sensitive adhesive film according to claim 1, wherein the polyolefin-based elastomer is a copolymer mainly derived from ethylene and propylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30938994A JP3397913B2 (en) | 1994-12-14 | 1994-12-14 | Plating mask adhesive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30938994A JP3397913B2 (en) | 1994-12-14 | 1994-12-14 | Plating mask adhesive film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08165592A true JPH08165592A (en) | 1996-06-25 |
| JP3397913B2 JP3397913B2 (en) | 2003-04-21 |
Family
ID=17992428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30938994A Expired - Fee Related JP3397913B2 (en) | 1994-12-14 | 1994-12-14 | Plating mask adhesive film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3397913B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006348212A (en) * | 2005-06-17 | 2006-12-28 | Sekisui Chem Co Ltd | Masking adhesive tape |
| DE112008001439T5 (en) | 2007-05-29 | 2010-06-10 | Nippon Mektron, Ltd. | Method for coating a wiring board, and wiring board |
| JP2011026603A (en) * | 2009-03-18 | 2011-02-10 | Sekisui Chem Co Ltd | Surface treatment method for masking tape and wafer |
-
1994
- 1994-12-14 JP JP30938994A patent/JP3397913B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006348212A (en) * | 2005-06-17 | 2006-12-28 | Sekisui Chem Co Ltd | Masking adhesive tape |
| DE112008001439T5 (en) | 2007-05-29 | 2010-06-10 | Nippon Mektron, Ltd. | Method for coating a wiring board, and wiring board |
| DE112008001439B4 (en) | 2007-05-29 | 2021-09-02 | Nippon Mektron, Ltd. | Method for coating a wiring board and wiring board |
| JP2011026603A (en) * | 2009-03-18 | 2011-02-10 | Sekisui Chem Co Ltd | Surface treatment method for masking tape and wafer |
| JP2014210923A (en) * | 2009-03-18 | 2014-11-13 | 積水化学工業株式会社 | Masking tape and surface treatment method for wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3397913B2 (en) | 2003-04-21 |
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