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JPH08124916A - Multi-chamber vacuum heat treatment system - Google Patents

Multi-chamber vacuum heat treatment system

Info

Publication number
JPH08124916A
JPH08124916A JP28614094A JP28614094A JPH08124916A JP H08124916 A JPH08124916 A JP H08124916A JP 28614094 A JP28614094 A JP 28614094A JP 28614094 A JP28614094 A JP 28614094A JP H08124916 A JPH08124916 A JP H08124916A
Authority
JP
Japan
Prior art keywords
chamber
substrate
heat treatment
vacuum
lock chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP28614094A
Other languages
Japanese (ja)
Inventor
Yoji Takagi
庸司 高木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOUYOKO KAGAKU KK
Toyoko Kagaku Co Ltd
Original Assignee
TOUYOKO KAGAKU KK
Toyoko Kagaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOUYOKO KAGAKU KK, Toyoko Kagaku Co Ltd filed Critical TOUYOKO KAGAKU KK
Priority to JP28614094A priority Critical patent/JPH08124916A/en
Publication of JPH08124916A publication Critical patent/JPH08124916A/en
Pending legal-status Critical Current

Links

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)

Abstract

PURPOSE: To shorten the time required for heat treatment and to enhance the productivity by stacking a plurality of substrate conveying cases vertically in multistage in a load-lock chamber thereby decreasing the number of times for changing the inside of the load-lock chamber from atmospheric state to vacuum state or vice versa. CONSTITUTION: A plurality of substrate processing chambers 2 and load-lock chambers 4 are disposed around a chamber 1 for conveying a substrate to or from each substrate processing chamber 2 through gate valves 6'. In such system, a plurality of substrate conveying cases 8 are stacked in multistage movably up and down in the load-lock chamber 4. For example, a cassette stage 12 is mounted on a vacuum bellows 11 formed movably up and down in the load-lock chamber 4 and the substrate conveying cases 8 are mounted in two stage on the top and bottom faces of the cassette stage 12. The cassette stage 12 can be driven up and down even in the vacuum by expanding and contracting the bellows 11.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、半導体若しくは液晶
デイスプレイ製造装置に係り、詳記すれば、処理装置前
室となるロ−ドロックチャンバ内を、大気圧から真空及
び真空から大気圧にする回数を少なくして生産性を向上
させた複数チャンバ熱処理装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor or liquid crystal display manufacturing apparatus. More specifically, the number of times a load lock chamber, which is a front chamber of a processing apparatus, is changed from atmospheric pressure to vacuum and from vacuum to atmospheric pressure. The present invention relates to a multi-chamber heat treatment apparatus in which the productivity is reduced by reducing the amount of heat.

【0002】[0002]

【従来の技術】従来、この種真空プロセス装置の前室と
なるロ−ドロックチャンバ4は、図4に示すように、基
板搬送チャンバ1に、ゲートバルブ6′を介して設置さ
れ、該ロ−ドロックチャンバ4内には、カセット台12
上に、基盤運搬用ケ−ス(カセット)8が上下動自在に
1個だけしか収納できないようになっていた。従って、
1つの基盤運搬用ケ−スが収納できる枚数分の基板を処
理する毎に、大気圧→真空及び真空→大気圧の操作をし
なければならなかったが、この操作が累積するとかなり
の長時間になるので、生産性が上がらない問題があっ
た。
2. Description of the Related Art Conventionally, as shown in FIG. 4, a load lock chamber 4, which is a front chamber of a vacuum process apparatus of this type, is installed in a substrate transfer chamber 1 through a gate valve 6 ', A cassette table 12 is provided in the drock chamber 4.
On top of that, only one case (cassette) 8 for transporting the substrate can be vertically moved so that only one case can be stored. Therefore,
Every time the number of substrates that can be stored in one board transport case was processed, the atmospheric pressure → vacuum and vacuum → atmospheric pressure operations had to be performed, but if this operation is accumulated, it will take a considerably long time. Therefore, there was a problem that productivity did not increase.

【0003】[0003]

【発明が解決しようとする課題】この発明は、ロ−ドロ
ックチャンバを大気圧→真空及び真空→大気圧にする回
数を減らすことによって所要時間を著しく短縮し、生産
性を向上させた複数チャンバ熱処理装置を提供すること
を目的とする。
SUMMARY OF THE INVENTION The present invention reduces the number of times the load lock chamber is changed from atmospheric pressure to vacuum and vacuum to atmospheric pressure, thereby significantly shortening the time required and improving the productivity. The purpose is to provide a device.

【0004】[0004]

【課題を解決するための手段】上記目的に沿う本発明の
構成は、各基板処理チャンバへ基板を出し入れする基板
搬送チャンバの周りにゲ−トバルブを介して複数の基板
処理チャンバとロ−ドロックチャンバを設けた複数チャ
ンバ真空熱処理装置に於いて、前記ロ−ドロックチャン
バ内に、複数個の基盤運搬用ケ−スを縦方向に多段に設
置したことを特徴とする。
SUMMARY OF THE INVENTION The structure of the present invention, which meets the above-mentioned object, has a plurality of substrate processing chambers and a load lock chamber via a gate valve around a substrate transfer chamber for loading and unloading substrates into and from each substrate processing chamber. In a multi-chamber vacuum heat treatment apparatus provided with a plurality of substrates, a plurality of cases for transporting substrates are installed in a vertical direction in multiple stages in the load lock chamber.

【0005】[0005]

【実施例】次に、本発明の実施例を図面に基づいて説明
する。図1は、本発明の実施例を示す平面図である。基
板搬送チャンバ1は、搬送作業中常に真空状態に保た
れ、処理基板7を基板搬送ロボット3によって、ロ−ド
ロック(前室)チャンバ4と、基板処理チャンバ2,
2′との間を搬送するようになっている。尚、処理基板
7の処理中は、ゲ−トバルブ6は、閉となっている。
Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a plan view showing an embodiment of the present invention. The substrate transfer chamber 1 is always kept in a vacuum state during the transfer operation, and the processed substrate 7 is loaded by the substrate transfer robot 3 into a load lock chamber 4 and a substrate processing chamber 2.
It is designed to be transported between 2 '. The gate valve 6 is closed during the processing of the processing substrate 7.

【0006】図2に示すように、基板搬送チャンバ1
に、ゲ−トバルブ6′を介して接続されているロ−ドロ
ックチャンバ4内には、上下動自在に形成された真空ベ
ロ−ズ11上に、カセット台12が載置され、カセット
台12の底面と上面上には、それぞれ基盤運搬用ケ−ス
8,8′が2段に載置されている。カセット台12は、
真空ベロ−ズ11を伸縮させることによって、真空中で
も上下に駆動させることができるようになっている。ロ
−ドロックチャンバ4には、基盤運搬用ケ−ス8,8′
をロ−ドロックチャンバ4内に出し入れする開口が形成
され、ハッチ5を上昇させることによって、該開口を閉
じ、ハッチ5を下降させることによって、該開口を開く
ようになっている。
As shown in FIG. 2, the substrate transfer chamber 1
In the load lock chamber 4 connected through the gate valve 6 ', the cassette table 12 is mounted on the vacuum bellows 11 which is vertically movable. On the bottom surface and the top surface, two cases of substrate transport cases 8 and 8'are placed. The cassette stand 12 is
By expanding and contracting the vacuum bellows 11, it can be driven up and down even in a vacuum. In the load lock chamber 4, there are cases 8 and 8'for carrying the substrate.
Is formed in and out of the load lock chamber 4, and the hatch 5 is raised to close the opening, and the hatch 5 is lowered to open the opening.

【0007】ロ−ドロックチャンバ4の下端には、排気
口9が接続され、該排気口9は、ポンプ(図示せず)に
接続され、ロ−ドロックチャンバ4内を真空状態に維持
し得るようになっている。図中13は、ガスフイルタ−
であり、ロ−ドロックチャンバ4内を常圧に戻す場合
に、窒素などの不活性ガスを濾過して、ロ−ドロックチ
ャンバ4内に導入するようになっている。カセット台1
2は、上下の板体14,14′間の外周に、等間隔に4
本のロッド15を立設した構造となっており、板体1
4,14′上に基盤運搬用ケ−ス8,8′を支持し得る
ようになっている。カセット台12を上下動させて、基
盤運搬用ケ−ス8,8′をロ−ドロックチャンバ4内に
移送し、基盤運搬用ケ−ス8,8′内の基板を基板搬送
チャンバ1に、移送し得るようになっている。尚、基盤
運搬用ケ−スを三段に積層する場合は、カセット台12
は、板体を3枚使用し、その間にロッドを立設した構造
とすれば良い。
An exhaust port 9 is connected to the lower end of the load lock chamber 4, and the exhaust port 9 is connected to a pump (not shown) so that the inside of the load lock chamber 4 can be maintained in a vacuum state. It has become. In the figure, 13 is a gas filter.
When the pressure inside the load lock chamber 4 is returned to normal pressure, an inert gas such as nitrogen is filtered and introduced into the load lock chamber 4. Cassette stand 1
2 is 4 at equal intervals on the outer periphery between the upper and lower plates 14, 14 '.
The structure is such that a book rod 15 is erected, and the plate body 1
It is adapted to support a substrate carrying case 8, 8'on 4, 14 '. The cassette table 12 is moved up and down to transfer the substrates 8 and 8'for transferring the substrates into the load lock chamber 4, and the substrates in the cases 8 and 8'for transferring the substrates are transferred to the substrate transfer chamber 1. It can be transported. In addition, when stacking the cases for transporting the substrate in three layers, the cassette base 12
May have a structure in which three plate bodies are used and rods are erected between them.

【0008】図3に示すように、ベロ−ズ11の下端に
は、ロッド16に連結したロッド17が回動自在に連結
され、ロッド17は、エルエムガイドのようなリニアガ
イド10を使用し、モ−タ22によって上下動させるよ
うになっている。即ち、図3に示すように、ロッド16
に水平に連結したロッド17の先端のベ−ス18を、モ
−タ22によってベルト23とプ−リ24を介して回転
するボ−ルネジ21によって、レール19上を上下動さ
せるようになっている。ロッド17を上下動させ得るな
ら、例えばボ−ルネジ21の代わりにエアシリンダ−を
使用する他の機構であっても差し支えないが、上記した
ように、ボ−ルネジを回転させるリニア機構を使用する
ことによって、精度の良い上下動を達成することができ
る。
As shown in FIG. 3, a rod 17 connected to a rod 16 is rotatably connected to the lower end of the bellows 11, and the rod 17 uses a linear guide 10 such as an L-M guide. The motor 22 is adapted to move up and down. That is, as shown in FIG.
The base 18 at the tip of the rod 17 connected horizontally to the rail 19 is moved up and down on the rail 19 by a ball screw 21 rotated by a motor 22 via a belt 23 and a pulley 24. There is. If the rod 17 can be moved up and down, for example, another mechanism using an air cylinder instead of the ball screw 21 may be used, but as described above, a linear mechanism for rotating the ball screw is used. By doing so, it is possible to achieve accurate vertical movement.

【0009】ロ−ドロックチャンバ4内の真空ベロ−ズ
11は、本発明の実施例に於いては、上下動だけでな
く、一定角度回動し得るようになっている。これは、カ
セット台12を、ハッチ5に平行な状態から、図1に示
すように、六角形の基板搬送チャンバ1の辺20に平行
な状態にして、ロボット3によって、基板をスム−ズに
移送するためである。図3に示すように、ベロ−ズ11
の下端に連設されたロッド16を、エアシリンダ−21
によって、矢印に示すように、両方向に一定角度回転し
得るようになっている。
In the embodiment of the present invention, the vacuum bellows 11 in the load lock chamber 4 can move not only up and down but also by a fixed angle. This is because the cassette table 12 is changed from the state parallel to the hatch 5 to the side 20 of the hexagonal substrate transfer chamber 1 as shown in FIG. 1, and the robot 3 smoothly moves the substrate. This is for transfer. As shown in FIG.
The rod 16 connected to the lower end of the air cylinder 21
As a result, as shown by the arrow, it can rotate in both directions by a certain angle.

【0010】[0010]

【作用】本発明によれば、ロ−ドロックチャンバ内に基
板運搬用ケ−スを複数段縦に配置しているので、多数の
基板を収容できるから、従来、基板運搬用ケ−スを1個
使用する毎に、大気圧→真空及び真空→大気圧を繰り返
していた回数を大幅に減らすことができる。
According to the present invention, since a plurality of substrate carrying cases are vertically arranged in the load lock chamber, a large number of substrates can be accommodated. It is possible to greatly reduce the number of times that atmospheric pressure → vacuum and vacuum → atmospheric pressure are repeated each time each piece is used.

【0011】[0011]

【効果】本発明によれば、従来、1基板運搬用ケ−スを
1個使用する毎に、大気圧→真空及び真空→大気圧を繰
り返していた回数を大幅に減らすことができ、それに費
やしていた時間を短縮できるので、作業時間を大幅に短
縮することができるから、実際の生産ラインに於いて、
大幅に生産性を高めることができる。
According to the present invention, it is possible to significantly reduce the number of repetitions of atmospheric pressure → vacuum and vacuum → atmospheric pressure each time one case for transporting one substrate is used. Since the working time can be shortened, the working time can be drastically shortened.
The productivity can be greatly increased.

【0012】[0012]

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例を示す平面図である。FIG. 1 is a plan view showing an embodiment of the present invention.

【図2】図1の縦断面図である。FIG. 2 is a longitudinal sectional view of FIG.

【図3】図2の一部破断A−A′矢視図である。FIG. 3 is a partially broken AA ′ arrow view of FIG. 2;

【図4】従来のロ−ドロックチャンバの断面図である。FIG. 4 is a cross-sectional view of a conventional load lock chamber.

【符号の説明】[Explanation of symbols]

1 基板搬送チャンバ 2,2′ 基板処理チャンバ 3 基板搬送ロボット 4 ロ−ドロックチャンバ 6,6′ ゲ−トバルブ 7 処理基板 8,8′ 基板搬送用ケ−ス 11 真空ベロ−ズ 1 Substrate Transfer Chamber 2, 2'Substrate Processing Chamber 3 Substrate Transfer Robot 4 Load Lock Chamber 6, 6'Gate Valve 7 Processed Substrate 8, 8'Substrate Transfer Case 11 Vacuum Bellows

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】各基板処理チャンバへ基板を出し入れする
基板搬送チャンバの周りにゲ−トバルブを介して複数の
基板処理チャンバとロ−ドロックチャンバを設けた複数
チャンバ真空熱処理装置に於いて、前記ロ−ドロックチ
ャンバ内に、複数個の基盤運搬用ケ−スを、上下動自在
に縦方向に多段に設置したことを特徴とする複数チャン
バ熱処理装置。
1. A multi-chamber vacuum heat treatment apparatus in which a plurality of substrate processing chambers and a load lock chamber are provided around a substrate transfer chamber for loading and unloading a substrate into and from each substrate processing chamber through a gate valve. A multi-chamber heat treatment apparatus in which a plurality of substrate transport cases are installed in a vertical direction in multiple stages in a vertical direction in a drock chamber.
【請求項2】前記複数個の基盤運搬用ケ−スを、上下動
自在に形成した真空ベロ−ズ上に、カセット台を介して
多段に設置してなる請求項1に記載の複数チャンバ熱処
理装置。
2. The multi-chamber heat treatment according to claim 1, wherein the plurality of substrate carrying cases are installed in multiple stages via a cassette table on a vacuum bevel which is vertically movable. apparatus.
【請求項3】前記カセット台を、基盤運搬用ケ−スを載
置する板体の間に、ロッドを立設するように構成してな
る請求項2に記載の複数チャンバ熱処理装置。
3. The multi-chamber heat treatment apparatus according to claim 2, wherein the cassette base is constructed such that a rod is erected between plate bodies on which a case for transporting a substrate is placed.
【請求項4】前記真空ベロ−ズを、モ−タによりボ−ル
ネジを回転させることによるリニア機構によって上下動
させてなる請求項2に記載の複数チャンバ熱処理装置。
4. A multi-chamber heat treatment apparatus according to claim 2, wherein said vacuum bellows is moved up and down by a linear mechanism by rotating a ball screw by a motor.
【請求項5】前記真空ベロ−ズを、両方向に一定角度回
動し得るように形成してなる請求項1に記載の複数チャ
ンバ熱処理装置。
5. The multi-chamber heat treatment apparatus according to claim 1, wherein the vacuum bellows are formed so as to be rotatable by a predetermined angle in both directions.
JP28614094A 1994-10-27 1994-10-27 Multi-chamber vacuum heat treatment system Pending JPH08124916A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28614094A JPH08124916A (en) 1994-10-27 1994-10-27 Multi-chamber vacuum heat treatment system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28614094A JPH08124916A (en) 1994-10-27 1994-10-27 Multi-chamber vacuum heat treatment system

Publications (1)

Publication Number Publication Date
JPH08124916A true JPH08124916A (en) 1996-05-17

Family

ID=17700460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28614094A Pending JPH08124916A (en) 1994-10-27 1994-10-27 Multi-chamber vacuum heat treatment system

Country Status (1)

Country Link
JP (1) JPH08124916A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100345304B1 (en) * 2000-10-12 2002-07-25 한국전자통신연구원 Apparatus for perpendicular-type ultra vacuum chemical vapor deposition
KR100449273B1 (en) * 1997-08-26 2004-11-26 삼성전자주식회사 an apparatus and a method for semiconductor production
KR20050067751A (en) * 2003-12-29 2005-07-05 동부아남반도체 주식회사 Elevator rotation device and rotation method of loadlock chamber
WO2011120385A1 (en) * 2010-03-30 2011-10-06 东莞宏威数码机械有限公司 Substrate load-lock device
US10971382B2 (en) 2018-07-16 2021-04-06 Samsung Electronics Co., Ltd. Loadlock module and semiconductor manufacturing apparatus including the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100449273B1 (en) * 1997-08-26 2004-11-26 삼성전자주식회사 an apparatus and a method for semiconductor production
KR100345304B1 (en) * 2000-10-12 2002-07-25 한국전자통신연구원 Apparatus for perpendicular-type ultra vacuum chemical vapor deposition
KR20050067751A (en) * 2003-12-29 2005-07-05 동부아남반도체 주식회사 Elevator rotation device and rotation method of loadlock chamber
WO2011120385A1 (en) * 2010-03-30 2011-10-06 东莞宏威数码机械有限公司 Substrate load-lock device
US10971382B2 (en) 2018-07-16 2021-04-06 Samsung Electronics Co., Ltd. Loadlock module and semiconductor manufacturing apparatus including the same
US11501987B2 (en) 2018-07-16 2022-11-15 Samsung Electronics Co., Ltd. Loadlock module and semiconductor manufacturing apparatus including the same

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