JPH08111124A - Anisotropically conductive adhesive film - Google Patents
Anisotropically conductive adhesive filmInfo
- Publication number
- JPH08111124A JPH08111124A JP6245030A JP24503094A JPH08111124A JP H08111124 A JPH08111124 A JP H08111124A JP 6245030 A JP6245030 A JP 6245030A JP 24503094 A JP24503094 A JP 24503094A JP H08111124 A JPH08111124 A JP H08111124A
- Authority
- JP
- Japan
- Prior art keywords
- curing agent
- layer
- adhesive film
- conductive adhesive
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えば液晶ディスプレ
イと回路基板とを電気的，機械的に接続するための異方
導電性接着剤フィルムに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive adhesive film for electrically and mechanically connecting a liquid crystal display and a circuit board, for example.
【０００２】[0002]
【従来の技術】回路基板に液晶ディスプレイ等の電子部
品を接続する方法としては、半田付け法や異方導電性接
着剤フィルムを用いる方法等が挙げられる。しかし、回
路がファインピッチである場合、半田付けだと選択性が
悪く接続部同士でブリッジが生じてしまう虞れがあるこ
とから、異方導電性接着剤フィルムを用いる方法の方が
有利である。2. Description of the Related Art As a method for connecting an electronic component such as a liquid crystal display to a circuit board, there are a soldering method and a method using an anisotropic conductive adhesive film. However, when the circuit has a fine pitch, the use of an anisotropic conductive adhesive film is more advantageous because the selectivity may be poor and soldering may cause a bridge between the connection parts when soldering. .
【０００３】異方導電性接着剤フィルムとは、ウレタ
ン，ポリエステル，クロロプレン等の熱可塑性樹脂ある
いはエポキシ等の熱硬化性樹脂に、導電性粒子としてニ
ッケル，金，ハンダ等の金属粒子、またはプラスチック
ポリマ球状粒子に金等の導電層をコーティングした金属
被覆プラスチック粒子を均一に分散混入させ、この混合
物を、ポリエチレンテレフタレート（ＰＥＴ）等の剥離
フィルム上に、フィルム形成してなるものである。The anisotropic conductive adhesive film is a thermoplastic resin such as urethane, polyester, chloroprene or a thermosetting resin such as epoxy, and metal particles such as nickel, gold or solder as conductive particles, or a plastic polymer. Metal-coated plastic particles in which spherical particles are coated with a conductive layer such as gold are uniformly dispersed and mixed, and the mixture is formed into a film on a release film such as polyethylene terephthalate (PET).
【０００４】この異方性導電性樹脂によって配線基板と
電子部品とを接続するには、当該異方導電性接着剤フィ
ルムを、配線基板と電子部品の接続端子同士の間に介在
させ、熱を印加しつつ上下から圧力をかける。すると、
フィルム内の導電性粒子が上下につぶれ、接続端子に対
して面接触したかたちになる。その結果、配線基板と液
晶ディスプレイの接続端子同士が電気的に接続された状
態で一体固定されることになる。In order to connect the wiring board and the electronic component with the anisotropic conductive resin, the anisotropic conductive adhesive film is interposed between the connection terminals of the wiring substrate and the electronic component to generate heat. Apply pressure from above and below while applying. Then
The conductive particles in the film are crushed up and down and come into surface contact with the connection terminals. As a result, the wiring board and the connection terminals of the liquid crystal display are integrally fixed in a state of being electrically connected.
【０００５】このような異方導電性接着剤フィルムのう
ちでは、樹脂に熱硬化性樹脂を用いる熱硬化性タイプの
ものが接続信頼性に優れることから、主流を占めている
のが現状である。Of these anisotropic conductive adhesive films, thermosetting type adhesives which use a thermosetting resin as the resin are mainly used because of their excellent connection reliability. .
【０００６】この熱硬化性タイプの異方導電性樹脂は、
樹脂及び導電性粒子の他に、樹脂を硬化させるための硬
化剤が含有される。この硬化剤としては、保存中に硬化
反応が進行してしまうのを抑える都合上、硬化剤として
潜在性硬化剤を用いることが例えば特開昭６２−１４１
０８３号公報に提案されている。This thermosetting type anisotropic conductive resin is
In addition to the resin and the conductive particles, a curing agent for curing the resin is contained. As the curing agent, a latent curing agent is preferably used as the curing agent in order to prevent the curing reaction from proceeding during storage, for example, JP-A-62-141.
It is proposed in Japanese Patent Publication No. 083.
【０００７】潜在性硬化剤とは、硬化剤が被膜で被覆さ
れてマイクロカプセル状になされているものであり、常
温では不溶であるが、熱を加えることにより被膜内から
硬化剤が溶出し、瞬時に硬化反応が開始されるようにな
されたものである。The latent curing agent is a microcapsule in which the curing agent is coated with a coating and is insoluble at room temperature, but the curing agent is eluted from the coating by heating, The curing reaction is instantly started.
【０００８】[0008]
【発明が解決しようとする課題】ところで、以上のよう
な熱硬化性タイプの異方導電性接着剤フィルムで接続を
行う場合、樹脂を短時間で硬化させ、接続に要する時間
を節約するには、熱圧着温度を１６０〜２００℃と比較
的高い温度に設定する必要がある。By the way, in the case of connecting with the above-mentioned thermosetting type anisotropic conductive adhesive film, in order to cure the resin in a short time and save the time required for the connection, It is necessary to set the thermocompression bonding temperature to a relatively high temperature of 160 to 200 ° C.
【０００９】しかし、熱圧着温度をこのように高く設定
すると、その温度による液晶ディスプレイや回路基板へ
与えるダメージが問題になってくる。また、熱膨張等に
よって寸法精度も損なわれ、特に回路がファインピッチ
である場合、影響が大きい。However, if the thermocompression bonding temperature is set to such a high value, the damage to the liquid crystal display and the circuit board due to the temperature becomes a problem. In addition, the dimensional accuracy is impaired due to thermal expansion and the like, which has a great influence particularly when the circuit has a fine pitch.
【００１０】このため、比較的低い圧着温度でも硬化反
応が進行する速硬化性の硬化剤や樹脂の検討もなされて
いる。しかし、一般に知られている速硬化性の硬化剤や
樹脂は、混合すると５分以内でゲル化する。このため、
この樹脂と硬化剤の混合物を、剥離フィルム上に塗布，
乾燥してフィルム化しようとしても、乾燥のための熱に
よって、硬化反応が進行し製品とすることができない。For this reason, studies have been made on fast-curing curing agents and resins in which the curing reaction proceeds even at a relatively low pressure bonding temperature. However, generally known quick-curing curing agents and resins gel within 5 minutes when mixed. For this reason,
Apply this mixture of resin and curing agent on the release film,
Even if an attempt is made to dry and form a film, the curing reaction proceeds due to the heat for drying, and the product cannot be obtained.
【００１１】そこで、本発明はこのような従来の実情に
鑑みて提案されたものであり、速硬化性の硬化剤や樹脂
を用いることが可能であり、熱圧着温度を比較的低く設
定した場合でも、短時間で接続が行える異方導電性接着
剤フィルムを提供することを目的とする。Therefore, the present invention has been proposed in view of such a conventional situation, and it is possible to use a quick-curing curing agent or resin, and when the thermocompression bonding temperature is set relatively low. However, it is an object to provide an anisotropic conductive adhesive film that can be connected in a short time.
【００１２】[0012]
【課題を解決するための手段】上述の目的を達成するた
めに、本発明の異方導電性接着剤フィルムは、熱硬化性
樹脂を主成分とする主剤層と、硬化剤を主成分とする硬
化剤層とが、隔離層を介して積層され、主剤層，硬化剤
層または隔離層のいずれかに導電性粒子が含有されてい
ることを特徴とするものである。In order to achieve the above-mentioned object, the anisotropic conductive adhesive film of the present invention comprises a main agent layer containing a thermosetting resin as a main component and a curing agent as a main component. A curing agent layer is laminated via an isolation layer, and conductive particles are contained in any of the main agent layer, the curing agent layer or the isolation layer.
【００１３】また、隔離層の厚みが、０．５〜３０μｍ
であることを特徴とするものである。The thickness of the isolation layer is 0.5 to 30 μm.
It is characterized by being.
【００１４】さらに、隔離層は、その圧着温度よりもガ
ラス転位点Ｔｇの低い樹脂層であることを特徴とするも
のである。Further, the isolation layer is characterized by being a resin layer having a glass transition point Tg lower than the pressure bonding temperature thereof.
【００１５】本発明の異方導電性接着剤フィルムは、図
１に示すように、熱硬化性樹脂を主成分とする主剤層１
と、硬化剤を主成分とする硬化剤層２とが、隔離層３を
介して積層され、主剤層１，硬化剤層２または隔離層３
のいずれかに導電性粒子４が含有されて構成されてい
る。As shown in FIG. 1, the anisotropic conductive adhesive film of the present invention comprises a base material layer 1 containing a thermosetting resin as a main component.
And a curing agent layer 2 containing a curing agent as a main component are laminated via an isolation layer 3 to form a main agent layer 1, a curing agent layer 2 or an isolation layer 3.
The conductive particles 4 are contained in any of the above.
【００１６】このような構成の異方導電性接着剤フィル
ムを製造するには、例えばポリエチレンテレフタレート
（ＰＥＴ）等の剥離フィルム上に、熱硬化性樹脂よりな
る主剤塗料を塗布，乾燥して主剤層を形成し、次いで樹
脂を主成分とする隔離塗料を塗布，乾燥して隔離層を形
成する。そして、この隔離層上に、さらに、硬化剤を主
成分とする硬化剤塗料を塗布，乾燥して硬化剤層を形成
する。In order to manufacture the anisotropic conductive adhesive film having such a constitution, for example, a main coating material made of a thermosetting resin is applied on a release film such as polyethylene terephthalate (PET) and dried to form a main coating layer. Is formed, and then an isolation paint having a resin as a main component is applied and dried to form an isolation layer. Then, a curing agent paint containing a curing agent as a main component is further applied onto the isolation layer and dried to form a curing agent layer.
【００１７】このように、この異方性導電性接着剤フィ
ルムは、熱硬化性樹脂と硬化剤とを混合する工程なしで
製造され、製品となる前に熱硬化性樹脂と硬化剤とが接
触することがない。このため、硬化剤や熱硬化性樹脂と
して速硬化性のものを用いても、製造工程で硬化反応が
進行し、製品が製造できなくなるといった事がない。ま
た、熱硬化性樹脂と硬化剤とが隔離層によって隔離され
た構成であるので、保存中に硬化反応が進行してしまう
こともなく、十分な保存性が得られる。したがって、速
硬化性の硬化剤や熱硬化性樹脂を用いることが可能であ
る。As described above, the anisotropic conductive adhesive film is manufactured without the step of mixing the thermosetting resin and the curing agent, and the thermosetting resin and the curing agent are brought into contact with each other before being made into a product. There is nothing to do. Therefore, even if a quick-curing agent or thermosetting resin is used, the curing reaction does not proceed in the manufacturing process and the product cannot be manufactured. Moreover, since the thermosetting resin and the curing agent are separated by the isolation layer, the curing reaction does not proceed during storage, and sufficient storage stability can be obtained. Therefore, it is possible to use a quick-curing curing agent or a thermosetting resin.
【００１８】このような構成の異方導電性接着剤フィル
ムによって配線基板と電子部品とを接続するには、当該
異方導電性接着剤フィルムを、配線基板と電子部品の接
続端子同士の間に介在させ、熱を印加しつつ上下から圧
力をかける。すると、異方導電性接着剤フィルムの隔離
層が溶融し、ここで初めて主剤層と硬化剤層とが接触す
る。そして、これら主剤層の熱硬化性樹脂と硬化剤層の
硬化剤とが熱溶融し、硬化反応が進行する。一方、フィ
ルム内の導電性粒子は、圧着力によって上下につぶれ、
接続端子に対して面接触したかたちになる。その結果、
配線基板と液晶ディスプレイの接続端子同士が電気的に
接続された状態で一体固定されることになる。In order to connect the wiring board and the electronic component with the anisotropic conductive adhesive film having such a structure, the anisotropic conductive adhesive film is placed between the connection terminals of the wiring substrate and the electronic component. Pressure is applied from above and below while applying heat and applying heat. Then, the isolation layer of the anisotropic conductive adhesive film is melted, and the main agent layer and the curing agent layer come into contact with each other for the first time. Then, the thermosetting resin of the main agent layer and the curing agent of the curing agent layer are melted by heat, and the curing reaction proceeds. On the other hand, the conductive particles in the film are crushed up and down by the pressure force,
It makes a surface contact with the connection terminal. as a result,
The wiring board and the connection terminals of the liquid crystal display are integrally fixed in a state of being electrically connected.
【００１９】ここで、この異方導電性フィルムでは、硬
化剤や熱硬化性樹脂として速硬化性のものを用いること
が可能であり、そのような材料を用いることにより、例
えば１００℃以下の比較的低い圧着温度でも硬化反応が
速やかに進行し、圧着温度による配線基板や電子部品へ
のダメージを抑えながら圧着時間の短縮化が図れるよう
になる。In this anisotropically conductive film, it is possible to use a quick-curing agent or a thermosetting resin as a curing agent or a thermosetting resin. By using such a material, for example, comparison at 100 ° C. or lower is possible. The curing reaction proceeds rapidly even at a relatively low pressure bonding temperature, and the pressure bonding time can be shortened while suppressing damage to the wiring board and electronic components due to the pressure bonding temperature.
【００２０】なお、主剤層に用いる熱硬化性樹脂として
は、エポキシ樹脂が用いられる。エポキシ樹脂には、Ｅ
Ｐ１００９（油化シェルエポキシ社製，商品名）、ＤＴ
６１３（大都産業社製，商品名）があり、このうちＤＴ
６１３は速硬化性のエポキシ樹脂である。これらエポキ
シ樹脂はそれ単独で用いても２種類以上を混合して用い
ても良い。An epoxy resin is used as the thermosetting resin used for the base material layer. E for epoxy resin
P1009 (Yukaka Shell Epoxy Co., trade name), DT
613 (manufactured by Daito Sangyo Co., Ltd.), of which DT
613 is a fast-curing epoxy resin. These epoxy resins may be used alone or in combination of two or more.
【００２１】また、硬化剤層に用いる硬化剤には、速硬
化性硬化剤としてＡＦ０２０（ＢＦ3 系硬化剤；大都産
業社製，商品名）、Ｄ１０１（ポリアミン系硬化剤；大
都産業社製，商品名）、ＤＳＸ１４６０（ポリアミン系
硬化剤；ヘンケル社製，商品名）、バーサミンＦ１９
（変成アミン系硬化剤；ヘンケル社製，商品名）、バー
サミン３６８（変成アミン系硬化剤；ヘンケル社製，商
品名）、ＱＸ２０（芳香族チオエーテル系硬化剤；油化
シェルエポキシ社製，商品名）、ＱＸ１１（芳香族チオ
エーテル系硬化剤；油化シェルエポキシ社製，商品
名）、Ｂ００２Ｗ（芳香族チオエーテル系硬化剤；油化
シェルエポキシ社製，商品名）等が挙げられる。これら
硬化剤も単独使用，混合使用のいずれでも良い。As the curing agent used in the curing agent layer, AF020 (BF 3 type curing agent; manufactured by Daito Sangyo Co., Ltd., trade name), D101 (polyamine type curing agent; manufactured by Daito Sangyo Co., Ltd., Trade name), DSX1460 (polyamine curing agent; manufactured by Henkel, trade name), Versamine F19
(Modified amine curing agent; manufactured by Henkel, trade name), Versamine 368 (modified amine curing agent; manufactured by Henkel, trade name), QX20 (aromatic thioether curing agent; manufactured by Yuka Shell Epoxy Co., trade name) ), QX11 (aromatic thioether-based curing agent; manufactured by Yuka Shell Epoxy Co., trade name), B002W (aromatic thioether-based curing agent; manufactured by Yuka Shell Epoxy Co., trade name) and the like. These curing agents may be used alone or in combination.
【００２２】なお、硬化剤層と主剤層の厚さは、０．５
〜３０μｍが適当である。これら各層の厚さが余り薄過
ぎると接続強度が不足し、逆に、厚過ぎると接続部分か
らフィルムがはみ出してしまう。The thickness of the hardener layer and the base material layer is 0.5.
-30 μm is suitable. If the thickness of each of these layers is too thin, the connection strength will be insufficient, and conversely, if it is too thick, the film will protrude from the connection portion.
【００２３】一方、主剤層と硬化剤層とを隔離する隔離
層としては、（１）成膜性があること、（２）１００℃
以下の圧着温度によって溶融するように、ガラス転位点
Ｔｇがその圧着温度よりも低いこと、（３）主剤層と硬
化剤層とを一体化でき、主剤層や硬化剤層に対する相溶
性が良いこと、といった条件を満たす樹脂を用いるのが
望ましい。そのような樹脂としては、例えばポリエステ
ル樹脂、ウレタン樹脂、フェノキシ樹脂等が挙げられ、
これらは単独あるいは２種類以上を混合して用いてもい
ずれでも良い。On the other hand, the separating layer for separating the main agent layer and the curing agent layer is (1) having film-forming properties, (2) 100 ° C.
The glass transition point Tg is lower than the pressure bonding temperature so that it melts at the following pressure bonding temperature, and (3) the main agent layer and the curing agent layer can be integrated, and the compatibility with the main agent layer and the curing agent layer is good. It is desirable to use a resin that satisfies the conditions such as. Examples of such resin include polyester resin, urethane resin, and phenoxy resin.
These may be used alone or in combination of two or more.
【００２４】この隔離層の厚さも、０．５〜３０μｍが
適当である。隔離層の厚さが０．５μｍ未満では、フィ
ルムに少しの応力がかけられただけでも当該隔離層が破
断し、十分な保存性が得られない。また、隔離層の厚さ
が３０μｍより厚い場合には、圧着した時に当該隔離層
が破断せず、エポキシ層と硬化剤層との接触、反応が生
じなくなる。The thickness of this isolation layer is also preferably 0.5 to 30 μm. When the thickness of the isolation layer is less than 0.5 μm, even if a slight stress is applied to the film, the isolation layer is broken and sufficient storage stability cannot be obtained. Further, when the thickness of the isolation layer is thicker than 30 μm, the isolation layer does not break when pressure-bonded, and contact and reaction between the epoxy layer and the curing agent layer do not occur.
【００２５】本発明の異方性導電性樹脂において、導電
性粒子が含有されるのは、主剤層，硬化剤層または隔離
層のいずれであっても良い。導電性粒子としては、ニッ
ケル，半田等の金属粒子、樹脂粒子に金，合金等の導電
性材料を被覆したもの等が挙げられる。In the anisotropic conductive resin of the present invention, the conductive particles may be contained in either the main agent layer, the curing agent layer or the isolation layer. Examples of the conductive particles include metal particles such as nickel and solder, resin particles coated with a conductive material such as gold and alloy, and the like.
【００２６】また、以上のような異方導電性接着剤フィ
ルムの製造方法は、その一例を先に説明したがこれに限
らない。たとえば、塗布の順序を、先の説明とは逆に硬
化剤塗料，隔離塗料，主剤塗料の順にしても良い。ま
た、ＰＥＴ等のフィルム上にそれぞれ主剤層，隔離層，
硬化剤層を形成しておき、ラミネート法によって１シー
トにしても良い。The method for producing the anisotropic conductive adhesive film as described above has been described with reference to an example thereof, but is not limited to this. For example, the order of application may be reversed from the above description in the order of the curing agent paint, the isolation paint, and the main component paint. Also, on the film such as PET, the main agent layer, the isolation layer,
A hardener layer may be formed in advance and laminated into one sheet.
【００２７】[0027]
【作用】熱硬化性樹脂を主成分とする主剤層と、硬化剤
を主成分とする硬化剤層とが、隔離層を介して積層さ
れ、主剤層，硬化剤層または隔離層のいずれかに導電性
粒子が含有されている異方導電性接着剤フィルムは、熱
硬化性樹脂と硬化剤とを混合する工程なしで製造され、
製品となる前に熱硬化性樹脂と硬化剤とが接触してしま
うことがない。このため、硬化剤や熱硬化性樹脂として
速硬化性のものを用いても、製造工程で硬化反応が進行
し、製品が製造できないといった事がない。また、熱硬
化性樹脂と硬化剤とが隔離層によって隔離された構成で
あるので、保存中に硬化反応が進行してしまうこともな
く、十分な保存性が得られる。A main agent layer containing a thermosetting resin as a main component and a curing agent layer containing a curing agent as a main component are laminated via an isolation layer, and the main agent layer, the curing agent layer or the isolation layer is provided. The anisotropic conductive adhesive film containing conductive particles is manufactured without a step of mixing a thermosetting resin and a curing agent,
The thermosetting resin and the curing agent do not come into contact with each other before being made into a product. Therefore, even if a quick-curing agent or a thermosetting resin is used, the curing reaction does not proceed in the manufacturing process and the product cannot be manufactured. Moreover, since the thermosetting resin and the curing agent are separated by the isolation layer, the curing reaction does not proceed during storage, and sufficient storage stability can be obtained.
【００２８】したがって、硬化剤や熱硬化性樹脂として
速硬化性のものを用いることが可能であり、そのような
材料を用いることにより、例えば１００℃以下の比較的
低い圧着温度範囲でも硬化反応が速やかに進行し、圧着
温度による配線基板や電子部品へのダメージを抑えなが
ら圧着時間の短縮化が図れるようになる。Therefore, it is possible to use a quick-curing agent as the curing agent or the thermosetting resin. By using such a material, the curing reaction can be performed even in a relatively low pressure bonding temperature range of, for example, 100 ° C. or less. The process proceeds promptly, and the pressure bonding time can be shortened while suppressing damage to the wiring board and electronic components due to the pressure bonding temperature.
【００２９】[0029]
【実施例】本発明の好適な実施例について実験結果に基
づいて説明する。EXAMPLES Preferred examples of the present invention will be described based on experimental results.
【００３０】本実施例では、３層構成の異方導電性接着
剤フィルムを作成し、その保存性，熱圧着性を評価し
た。In this example, an anisotropic conductive adhesive film having a three-layer structure was prepared, and its storability and thermocompression bonding property were evaluated.
【００３１】まず、２種類のエポキシ樹脂，ＥＰ１００
９（油化シェルエポキシ社製，商品名）とＤＴ６１３
（大都産業社製，商品名）を５０重量部ずつ混合し、こ
れに粒径５μｍの樹脂粒子にニッケル、金を被覆した導
電粒子を、５重量部添加することで主剤塗料を調製し
た。そして、この主剤塗料をＰＥＴ（ポリエチレンテレ
フタレート）上に塗布，乾燥することで厚さ１５μｍの
主剤層を形成した。First, two kinds of epoxy resin, EP100
9 (produced by Yuka Shell Epoxy Co., Ltd., product name) and DT613
(Manufactured by Daito Sangyo Co., Ltd., 50 parts by weight) was mixed, and 5 parts by weight of conductive particles obtained by coating resin particles having a particle diameter of 5 μm with nickel and gold were added to prepare a base coating composition. Then, this base material coating material was applied onto PET (polyethylene terephthalate) and dried to form a base material layer having a thickness of 15 μm.
【００３２】次に、この主剤層上に、ガラス転位点Ｔｇ
が４５℃のポリエステル樹脂（ユニチカ社製，商品名Ｕ
Ｅ３２１０）を１００重量部含有する隔離塗料を塗布，
乾燥して厚さ３μｍの隔離層を形成した。Next, a glass transition point Tg is formed on the base material layer.
Is 45 ° C polyester resin (manufactured by Unitika Ltd., product name U
E3210) applied with an isolation paint containing 100 parts by weight,
It was dried to form a 3 μm thick isolation layer.
【００３３】そして、この隔離層上に、フィルム形成剤
となるＹＰ５０（フェノキシ樹脂；東都化成社製，商品
名）と、硬化剤となるＡＦ０２０（ＢＦ3 系硬化剤；大
都産業社製，商品名）を混合した硬化剤塗料を塗布，乾
燥することで厚さ１５μｍの硬化剤層を形成し、異方導
電性接着剤フィルム（実施例フィルム）を作成した。On this isolation layer, YP50 (phenoxy resin; product name, manufactured by Tohto Kasei Co., Ltd.), which is a film forming agent, and AF020 (BF 3 type curing agent, product name, manufactured by Daito Sangyo Co., Ltd.), which is a curing agent. A hardener layer having a thickness of 15 μm was formed by applying a hardener coating containing a mixture of (1) and (4) to dry an anisotropic conductive adhesive film (Example film).
【００３４】以上のようにして作成された異方導電性接
着剤フィルムについて保存性を調べるとともに、温度１
００℃、圧力４０ｋｇｆ／ｃｍ2 の条件で、熱圧着を２
０秒間行い、硬化度，ピール強度及びはみ出し性を調べ
た。その結果を表１に示す。The storability of the anisotropic conductive adhesive film prepared as described above was examined, and the temperature was adjusted to 1
00 ° C., under a pressure of 40 kgf / cm 2, the thermocompression bonding 2
The test was performed for 0 seconds, and the curing degree, the peel strength and the protruding property were examined. Table 1 shows the results.
【００３５】なお、保存性は、熱圧着前の異方導電性接
着剤フィルムを温度４０℃のオーブン中に２０日間放置
した後、メチルエチルケトン（ＭＥＫ）に対する溶解性
を調べることで評価した。表中、◎，○，△，×はそれ
ぞれ以下の場合を表す。The storability was evaluated by allowing the anisotropically conductive adhesive film before thermocompression bonding to stand in an oven at a temperature of 40 ° C. for 20 days and then examining its solubility in methyl ethyl ketone (MEK). In the table, ◎, ○, △, × represent the following cases respectively.
【００３６】◎：フィルムがＭＥＫによって完全に溶解
する場合 ○：フィルムがＭＥＫによってほぼ溶解する場合 △：溶解は生じないが、フィルムがポロポロくずれる状
態になる場合 ×：フィルムが溶解せず、フィルム状を維持する場合
（ゲル化） 硬化度は、異方導電接着剤フィルムを熱圧着した後、Ｍ
ＥＫに対する溶解性を調べることで評価した。表中、
◎，○，△，×はそれぞれ以下の場合を表す。⊚: When the film is completely dissolved by MEK ◯: When the film is almost dissolved by MEK Δ: When dissolution does not occur, but the film is in a state where it falls apart ×: The film does not dissolve and is in a film form When maintaining the (gelation) degree of cure, after thermocompression bonding the anisotropic conductive adhesive film, M
It was evaluated by examining the solubility in EK. In the table,
◎, ○, △, × represent the following cases respectively.
【００３７】◎：フィルムが溶解せず、フィルム状を維
持する場合 ○：フィルムがほとんど溶解せず、フィルム状をほぼ維
持する場合 △：溶解は生じないが、フィルムがポロポロくずれる状
態になる場合 ×：フィルムが溶解し、ＭＥＫが白濁する場合 ピール強度は、引張り試験機（オリエンチック社製，商
品名ＵＣＴ−２．５Ｔ）を用い、以下の条件で測定し
た。⊚: When the film does not dissolve and maintains the film shape. ○: When the film hardly dissolves and almost maintains the film shape. Δ: When dissolution does not occur, but the film is in a state where it falls apart × : When the film dissolves and MEK becomes cloudy Peel strength was measured under the following conditions using a tensile tester (manufactured by Oriental Co., trade name UCT-2.5T).
【００３８】被着体：２５μｍユーピレックス基材 １
８μｍＣｕ ０．２ｍｍピッチ１５０本パターン／ＩＴ
Ｏベタガラス 測定方法：９０°ピール 測定条件：２５℃ また、表中、◎，○，△，×はそれぞれ以下の場合を表
す。Substrate: 25 μm Upilex substrate 1
8μm Cu 0.2mm pitch 150 patterns / IT
O Solid glass Measuring method: 90 ° peel Measuring condition: 25 ° C Further, in the table, ⊚, ○, Δ and × represent the following cases, respectively.
【００３９】◎：ピール強度が１０００ｇ／ｃｍ以上で
ある場合 ○：ピール強度が５００ｇ／ｃｍ以上１０００ｇ／ｃｍ
未満である場合 △：ピール強度が２００ｇ／ｃｍ以上５００ｇ／ｃｍ未
満である場合 ×：ピール強度が２００ｇ／ｃｍ未満である場合 はみ出し性は、圧着部からはみ出したフィルムのはみ出
し量ｘを測定することで評価した。表中、◎，○，△，
×はそれぞれ以下の場合を表す。⊚: When the peel strength is 1000 g / cm or more ◯: The peel strength is 500 g / cm or more and 1000 g / cm
When the peel strength is less than: Δ: When the peel strength is 200 g / cm or more and less than 500 g / cm ×: When the peel strength is less than 200 g / cm The squeeze-out property is to measure the squeeze-out amount x of the film squeezed out from the pressure-bonded portion. It was evaluated by. In the table, ◎, ○, △,
X represents the following cases, respectively.
【００４０】◎：はみ出し量ｘがｘ＝０ｍｍである場合 ○：はみ出し量ｘが０ｍｍ＜ｘ≦１ｍｍである場合 △：はみ出し量ｘが１ｍｍ＜ｘ≦３ｍｍである場合 ×：はみ出し量ｘが３ｍｍ＜ｘである場合 また、比較として１層中に熱硬化性樹脂，硬化剤，導電
性粒子が含有されている，従来のタイプの異方導電性接
着剤フィルム〔ＣＰ７１３１（膜厚２５μｍ）；比較例
フィルム〕についても同様にして、保存性及び熱圧着後
の硬化度，ピール強度，はみ出し性を調べた。その結果
も表１に併せて示す。なお、比較例フィルムについて
は、参考のため温度１７０℃、圧力４０ｋｇｆ／ｃ
ｍ2 、圧着時間２０秒間の条件で熱圧着を行った場合に
ついても評価を行った。⊚: When the protrusion amount x is x = 0 mm ◯: When the protrusion amount x is 0 mm <x ≦ 1 mm Δ: When the protrusion amount x is 1 mm <x ≦ 3 mm ×: The protrusion amount x is 3 mm In case of <x Also, as a comparison, a conventional type anisotropic conductive adhesive film [CP7131 (thickness 25 μm); containing thermosetting resin, curing agent and conductive particles in one layer; comparison [Example film], the storage stability, the degree of cure after thermocompression bonding, the peel strength, and the protruding property were similarly examined. The results are also shown in Table 1. In addition, about the comparative example film, the temperature is 170 ° C. and the pressure is 40 kgf / c for reference.
The evaluation was also performed when thermocompression bonding was performed under the conditions of m 2 and a compression time of 20 seconds.
【００４１】[0041]
【表１】 [Table 1]
【００４２】表１からわかるように、単層構成の比較例
フィルムは、熱圧着温度が１７０℃であれば良好な熱圧
着が行えるが、熱圧着温度が１００℃と低くなると、硬
化度，ピール強度が不十分になり良好な圧着が行われな
い。As can be seen from Table 1, the comparative example film having a single-layer structure can perform good thermocompression bonding at a thermocompression bonding temperature of 170 ° C., but when the thermocompression bonding temperature is as low as 100 ° C., the degree of cure and peeling can be improved. The strength is insufficient and good crimping cannot be performed.
【００４３】一方、３層構成の実施例フィルムは、速硬
化性の硬化剤を用いているが十分な保存性が得られてお
り、また熱圧着温度が１００℃であっても、十分な硬化
度，ピール強度が得られる。On the other hand, the example film having a three-layer structure has a sufficient curing property even though it uses a fast-curing curing agent, and is sufficiently cured even when the thermocompression bonding temperature is 100 ° C. Degree and peel strength can be obtained.
【００４４】このことから、異方導電性接着剤フィルム
を、熱硬化性樹脂よりなる主剤層，隔離層，硬化剤層の
３層で構成すると、硬化剤として速硬化性のものを用い
ることが可能になり、１００℃程度の圧着温度であって
も十分に圧着が行えるようになることがわかった。From this, when the anisotropic conductive adhesive film is composed of three layers of the main agent layer, the isolation layer and the curing agent layer made of a thermosetting resin, it is possible to use a curing agent having a rapid curing property. It has been found that it becomes possible to perform sufficient pressure bonding even at a pressure bonding temperature of about 100 ° C.
【００４５】３層構成の異方導電性接着剤フィルムの層
厚の検討 主剤層，隔離層，硬化剤層の厚さを表２に示すように変
えたこと以外は実施例フィルムと同様にして異方導電性
接着剤フィルム（実験例フィルム１〜実験例フィルム
９） Three-layered anisotropically conductive adhesive film layer
Examination of Thickness Anisotropic conductive adhesive film (Experimental example film 1-Experimental example film) similar to the example film except that the thicknesses of the main agent layer, the isolation layer, and the curing agent layer were changed as shown in Table 2. 9)
【００４６】[0046]
【表２】 [Table 2]
【００４７】以上のようにして作成された異方導電性接
着剤フィルムについて、上述と同様にして保存性を調べ
るとともに、温度１００℃、圧力４０ｋｇｆ／ｃｍ2 の
条件で熱圧着を２０秒間行い、硬化度，ピール強度及び
はみ出し性を調べた。評価結果を表３に示す。The anisotropic conductive adhesive film prepared as described above was examined for storability in the same manner as described above, and thermocompression bonding was performed for 20 seconds under conditions of a temperature of 100 ° C. and a pressure of 40 kgf / cm 2 . The degree of cure, the peel strength and the protruding property were examined. The evaluation results are shown in Table 3.
【００４８】[0048]
【表３】 [Table 3]
【００４９】表３からわかるように、まず主剤層や硬化
剤層の厚さが比較的薄い実験例フィルム８ではピール強
度が不足する。逆にこれらの厚さが比較的厚い実験例フ
ィルム９では、硬化度やピール強度は優れているが圧着
部分からフィルムがはみ出してしまう。圧着部分からの
フィルムのはみ出しを抑えながら、十分な接続強度を得
るには、主剤層や硬化剤層の厚さは０．５〜３０μｍが
適当である。As can be seen from Table 3, the peel strength is insufficient in the experimental example film 8 in which the thickness of the base material layer and the curing agent layer is relatively small. On the contrary, in the experimental example film 9 having a relatively large thickness, although the curing degree and the peel strength are excellent, the film protrudes from the pressure-bonded portion. In order to obtain sufficient connection strength while suppressing the protrusion of the film from the pressure-bonded portion, the thickness of the main agent layer and the curing agent layer is preferably 0.5 to 30 μm.
【００５０】一方、隔離層の厚さが比較的薄い実験例フ
ィルム６では、保存中に硬化反応が進行してしまい保存
性が悪い。逆に、この厚さが比較的厚い実験例フィルム
７では、圧着に際して硬化反応が十分に進行せず、硬化
度，ピール強度が不足する。保存性を確保しながら、十
分な接着強度を確保するには、隔離層の厚さは０．５〜
３０μｍが適当である。On the other hand, in the experimental example film 6 in which the thickness of the isolation layer is relatively thin, the curing reaction proceeds during storage and the storage stability is poor. On the contrary, in the experimental example film 7 having a relatively large thickness, the curing reaction does not proceed sufficiently during the pressure bonding, and the curing degree and the peel strength are insufficient. In order to secure sufficient adhesive strength while ensuring storage stability, the thickness of the isolation layer is 0.5-
30 μm is suitable.
【００５１】[0051]
【発明の効果】以上の説明からも明らかなように、本発
明の異方導電性接着剤フィルムは、熱硬化性樹脂を主成
分とする主剤層と、硬化剤を主成分とする硬化剤層と
が、隔離層を介して積層され、主剤層，硬化剤層または
隔離層のいずれかに導電性粒子が含有されているので、
硬化剤や熱硬化性樹脂として速硬化性のものを用いた場
合でも製造工程や保存中に硬化反応が進行してしまうと
いったことがない。As is apparent from the above description, the anisotropic conductive adhesive film of the present invention comprises a base material layer containing a thermosetting resin as a main component and a curing agent layer containing a curing agent as a main component. And are laminated via an isolation layer, and conductive particles are contained in either the main agent layer, the curing agent layer or the isolation layer,
Even when a fast-curing curing agent or thermosetting resin is used, the curing reaction does not proceed during the manufacturing process or storage.
【００５２】したがって、硬化剤，熱硬化性樹脂として
速硬化性のものを用いることが可能であり、そのような
材料を用いることにより、例えば１００℃以下の比較的
低い圧着温度範囲でも高速圧着がなされ、圧着温度によ
る配線基板や電子部品へのダメージを抑えながら圧着時
間の短縮化を図ることが可能である。Therefore, it is possible to use a quick-curing agent as the curing agent or the thermosetting resin, and by using such a material, high-speed pressure bonding can be performed even in a relatively low pressure bonding temperature range of, for example, 100 ° C. or less. Therefore, it is possible to shorten the crimping time while suppressing the damage to the wiring board and the electronic components due to the crimping temperature.
【図１】本発明を適用した異方導電性接着剤フィルムの
１例を示す概略断面図である。FIG. 1 is a schematic sectional view showing an example of an anisotropic conductive adhesive film to which the present invention is applied.
１ 主剤層 ２ 硬化剤層 ３ 隔離層 1 Main agent layer 2 Curing agent layer 3 Isolation layer
Claims (3)
硬化剤を主成分とする硬化剤層とが、隔離層を介して積
層され、 主剤層，硬化剤層または隔離層のいずれかに導電性粒子
が含有されていることを特徴とする異方導電性接着剤フ
ィルム。1. A base material layer containing a thermosetting resin as a main component,
An anisotropic conductive material characterized in that a curing agent layer containing a curing agent as a main component is laminated via an isolation layer, and conductive particles are contained in either the main agent layer, the curing agent layer or the isolation layer. Adhesive film.
ることを特徴とする請求項１記載の異方導電性接着剤フ
ィルム。2. The anisotropic conductive adhesive film according to claim 1, wherein the isolation layer has a thickness of 0.5 to 30 μm.
位点Ｔｇの低い樹脂層であることを特徴とする請求項１
記載の異方導電性接着剤フィルム。3. The isolation layer is a resin layer having a glass transition point Tg lower than the pressure bonding temperature of the isolation layer.
The anisotropic conductive adhesive film described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6245030A JPH08111124A (en) | 1994-10-11 | 1994-10-11 | Anisotropically conductive adhesive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6245030A JPH08111124A (en) | 1994-10-11 | 1994-10-11 | Anisotropically conductive adhesive film |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006141929A Division JP4896585B2 (en) | 2006-05-22 | 2006-05-22 | Connection method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08111124A true JPH08111124A (en) | 1996-04-30 |
Family
ID=17127539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6245030A Withdrawn JPH08111124A (en) | 1994-10-11 | 1994-10-11 | Anisotropically conductive adhesive film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08111124A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08148211A (en) * | 1994-11-25 | 1996-06-07 | Hitachi Chem Co Ltd | Connection member and structure and method for connecting electrode using the same |
| US6309502B1 (en) | 1997-08-19 | 2001-10-30 | 3M Innovative Properties Company | Conductive epoxy resin compositions, anisotropically conductive adhesive films and electrical connecting methods |
| CN100414649C (en) * | 1997-02-27 | 2008-08-27 | 精工爱普生株式会社 | Connecting structure, liquid crystal device, electronic equipment, and anisotropic conductive adhesive agent and a manufacturing method thereof |
| US7553890B2 (en) * | 1997-03-31 | 2009-06-30 | Hitachi Chemical Company, Ltd. | Circuit-connecting material and circuit terminal connected structure and connecting method |
| US7629056B2 (en) | 1997-03-31 | 2009-12-08 | Hitachi Chemical Company, Ltd. | Circuit-connecting material and circuit terminal connected structure and connecting method |
| JP2017098077A (en) * | 2015-11-24 | 2017-06-01 | デクセリアルズ株式会社 | Anisotropic conductive film and connection method |
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| JPH04292942A (en) * | 1991-03-20 | 1992-10-16 | Toyobo Co Ltd | Film for laminating onto metal plate, laminated metal plate and metal container |
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1994
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| JPS5290561A (en) * | 1976-01-24 | 1977-07-29 | Nitto Electric Ind Co Ltd | Heat-curable sealing materials |
| JPS6389584A (en) * | 1986-10-02 | 1988-04-20 | Shin Etsu Polymer Co Ltd | Anisotropic ally conductive adhesive film |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08148211A (en) * | 1994-11-25 | 1996-06-07 | Hitachi Chem Co Ltd | Connection member and structure and method for connecting electrode using the same |
| CN100414649C (en) * | 1997-02-27 | 2008-08-27 | 精工爱普生株式会社 | Connecting structure, liquid crystal device, electronic equipment, and anisotropic conductive adhesive agent and a manufacturing method thereof |
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