JPH0738419B2 - Jig and device for sealing semiconductor package - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a jig and a device for sealing an optical coupling type semiconductor package such as a CCD, and more particularly to a continuous package formed on a frame by a glass. Or, it relates to a jig and a device for sealing with a cap such as plastic.

<Prior Art> In an optically coupled semiconductor hollow package such as a CCD, a cap made of glass or plastic is sealed on the upper surface of the package for optical input.

Most of the conventional semiconductor hollow packages are single packages, and the encapsulation method thereof is, for example, the method shown in FIG. 5 or FIG.

That is, as shown in FIG. 5, according to the method of sealing the package with a cap such as glass or plastic, after placing the adhesive and the cap or the cap with adhesive 2 on the hollow package 15 having leads, the package 15 Then, the cap 2 and the package 15 are sandwiched between the cap 2 and the clip 14 as shown in the figure, and a weight is applied between them.

Alternatively, as shown in FIG. 6, a main body 17 having a plurality of recesses for accommodating the adhesive 3 and the cap 2 and an upper lid 18 provided with a pressing portion facing the main body 17 are prepared, and are provided in the recesses. After the adhesive 3, the cap 2 and the package 15 are put in, the main body 17 and the upper lid 18 are combined as shown in the figure, and then the two are fixed by, for example, a U-shaped fastening tool 19, and then carried into a heating furnace Then, the adhesive 3 is melted and the semiconductor element is enclosed by the package 15 and the cap 2.

<Problems to be Solved by the Invention> However, the conventional encapsulation method has the following problems.

That is, in the continuous semiconductor hollow package sealing, in the clip method of FIG. 5, the positioning of the cap and the operation of the clip cannot be performed because the leads are in the longitudinal direction of the frame. Therefore, as shown in FIG. 5, a concave portion corresponding to the cap of the positioning jig 16 is formed at a position where the cap is fitted, but still it is very difficult to accurately position the cap.

Further, in the system shown in FIG. 6, the shapes of the main body 17 and the upper lid 18 are large and complicated, and the operability of the fastener 19 is also poor. Further, even when placed in a heating furnace, these heat capacities are so large that various handling becomes difficult and it is very difficult to press the cap accurately by engaging the rigid upper lid 18 and the main body 17 with each other. .

That is, in the conventional method for sealing a cap of a single package, workability is very poor in sealing a continuous semiconductor hollow package formed on a frame, and a cap displacement or a sealing shortage occurs. It is easy to do, and it has been a great obstacle to lowering the reliability of semiconductor products and improving the yield.

The present invention was devised in view of the above circumstances, and an object thereof is to provide a new and useful jig and device capable of eliminating the above-mentioned various drawbacks in the sealing operation of a semiconductor hollow package.

<Means for Solving the Problem> A semiconductor package sealing jig according to a first aspect of the present invention seals a transparent cap at a time on each surface of a plurality of continuous semiconductor packages formed on a frame. Which is a jig used for the above, wherein an upper plate having compression springs for pressing the respective back surfaces of the semiconductor package attached to the inner surface and a convex base for placing the cap respectively formed on the inner surface. A lower plate, a guide pin that is provided on the lower plate for aligning the cap and the semiconductor package, and is inserted into a hole formed on the frame of the semiconductor package; It is characterized in that it is provided with hooks provided on both sides and detachably fixing the upper plate and the lower plate with the semiconductor package interposed therebetween.

A semiconductor package sealing device according to a second aspect of the present invention uses a sealing jig according to the first aspect of the present invention to provide a transparent cap once on each surface of a plurality of continuous semiconductor packages formed on a frame. It has a basic structure of sealing on a slide guide, and a support base movably provided on the slide guide and a lower plate of the sealing jig which is provided on the upper surface of the support base and is the first invention. Guide pins for positioning, and a pair of guide plates that are arranged on both sides of the support base and that are openably and closably provided so as to cover or open the surface of the lower plate on the support base from both sides thereof. And the pair of guide plates are comb-shaped, and a space for guiding the position of the cap to be placed on the convex base of the lower plate is formed in a state where the pair of guide plates are closed. Is characterized by To have.

<Operation> First, the jig for sealing the semiconductor package will be described. Place the cap on the convex stand on the inner surface of the lower plate and apply the adhesive to the cap. Then, a plurality of semiconductor packages are placed on the inner surface of the lower plate. At this time, when the guide pin of the lower plate is inserted into the hole of the frame of the semiconductor package, the semiconductor package and the cap are aligned with each other. In this state, the upper plate is placed on the lower plate so as to sandwich the semiconductor package, and the both are fixed using hooks. In this state, the cap is pressed against the upper surface of the semiconductor package by the urging force of the compression spring attached to the upper plate.

Next, a semiconductor package sealing device will be described. When the lower plate is placed on the support base, the lower plate is positioned by the guide pins of the support base. After that, the pair of guide plates are opened. Then, since the pair of guide plates are comb-shaped, a space for guiding the position of the cap is formed when the guide plates are closed. When a cap is put in this space, the cap is placed on the convex base of the lower plate. Then, if necessary, the support base is moved along the slide guide to perform a microscopic inspection of the cap. Then, as described above, the semiconductor package is set on the lower plate and attached to the upper plate. Then, after opening the pair of guide plates to separate the sealing jig from the sealing device and then heating the sealing jig in a heating furnace or the like, the cap is bonded to the upper surface of the semiconductor package. The semiconductor package is sealed.

<Example> Hereinafter, an example according to the present invention will be described with reference to the drawings.

FIG. 1 is a partially cutaway front view of a sealing jig and a device when performing a sealing operation using a sealing jig and an assembly machine (device) according to the present invention, and FIG. 2 is the sealing jig. FIG. 3 is a plan view and a side view of the apparatus in a state where the apparatus is detached from the apparatus and put into a heating furnace.

In the figure, 1 is a lower plate, 2 is a cap, 4 is a continuous package in which a lead frame is enclosed, 5 is an upper plate, and 6 is an assembly machine.

The lower plate 1 has a cap 2 and an adhesive 3 placed thereon, and a convex base 1b having a square hole 1a for adsorption, and two (but not limited to) two for aligning with the continuous package 4. Package guide pins 1c, two holes 1d for aligning the lower plate 1 and a device 6 described later, and notches (not shown) for aligning the lower plate 1 and the upper plate 5 on the left and right sides. And a locking claw 1e with which a hook 5c described later is locked.

The upper plate 5 is a compression spring 5a for pressing each package.
And an upper plate guide pin 5b and a hook 5c for aligning and locking the upper plate 5 and the lower plate 1 on both sides. The compression spring 5a is provided coaxially with the square hole 1a corresponding to the square hole 1a.

Next, the configuration of the device 6 will be described. The device 6 is a base for mounting the lower plate 1 and is provided with a support base 7 that is movably provided by a slide guide 11, and is arranged on both sides of the support base 7 as shown in FIG. Guide plates 81, 82 provided so as to be openable and closable so as to cover or open the surface of the lower plate 1 set on 7 from both sides thereof.
It consists of and.

The support base 7 is provided with two lower plate guide pins 7a for positioning the lower plate 1, while a vacuum hole 71 for vacuum suction of the cap 2 through the square hole 1a of the lower plate 1 is formed. Has been done. Further, inside the support base 7, shaft guides 72a and 72b for restricting slide shafts 831a and 831b of guide plates 81 and 82 described later are provided, respectively.

The guide plate 81 has a comb shape as shown in FIG.
As shown in FIG. 4, the slide shaft 83a and the housing 8
4a and the opening / closing plate 85a are connected. Inside the housing 84a (the side facing the support base 7), the slide shaft 831a
Is provided, and when the opening / closing plate 85a is moved, the guide plate 81 moves in the horizontal direction with respect to the support base 7. Also, inside the housing 84a, the slide shaft 83a
A shaft guide 841a for restricting the above is provided. Therefore, the guide plate 81 also moves in the vertical direction. The same applies to the one guide plate 82. With such a configuration, the guide plates 81 and 82 can be freely opened and closed,
With this opened, it can escape from the continuous package 4 and the support base 7.

The housings 84a and 84b are urged by tension springs 86a and 86b and pulled toward the support base 7.
However, the housing 84a, 84b has a screw type stopper 87.
a and 87b are attached. These stoppers 87a, 87b
The tip of the abuts on the side surface of the support base 7. That is, the stopper
87a and 87b regulate while adjusting the distance between the opening and closing plates 84a and 84b when they are closed.

A spring 88a is provided between the guide plate 81 and the housing 84a. The guide plate 81a is biased upward by the spring 88a. A stopper 89a for the slide shaft 83a is provided at the bottom of the housing 84a. The stopper 89a restricts the height position of the guide plate 81a.
The same applies to the other guide plate 81b.

The vacuum hole 71 formed inside the support base 7 is connected to a pipe 14 led from a vacuum pump (not shown) (see FIG. 3). A vacuum solenoid valve 12 is connected in the middle of the pipe 13, and is individually operated by a switch 13.

Next, a method of handling the jig and the device of the present invention will be described.

First, when the opening / closing plates 85a and 85b are pinched and the space between them is narrowed, the two guide plates 81 and 82 are opened outward. Therefore,
The lower plate 1 is placed on the support base 7 so that the lower plate guide pins 7a, 7a fit into the guide holes 1d, 1d. Then the opening and closing plate 85
When the hands are released from a and 85b, the guide plates 81 and 82 are automatically closed by the urging force of the tension springs 86a and 86b. Since the guide plates 81 and 82 are comb-shaped, a space is formed as shown in FIG. 3 in the closed state. When the cap 2 is placed in this space, the cap 2 is placed on the convex base 1b of the lower plate 1. That is, the space formed when the guide plates 81 and 82 are closed is used to guide the position of the cap 2 to be placed on the convex base 1b of the lower plate 1. Here, the support base 7 is moved along the slide guide 11 as needed, and a microscope inspection is performed. It is also possible to fix the cap 2 by vacuum suction and clean the surface of the cap 2.

Next, the package guide pin 1 provided on the lower plate 1
According to c and 1c, the continuous package 4 on the frame is placed face down. Further, the upper plate 5 is placed so that the upper plate guide pins 5b, 5b are fitted into the notches provided on both sides of the lower plate 1, and the hooks 5c, 5c are locked by the locking claws 1e, 1e of the lower plate 1. Hold down. Finally, the open / close plates 85a and 85b are again pinched to expand the guide plates 81 and 82, and the set of sealing jigs is taken out.

<Effects of the Invention> As described above, according to the present invention, in the process of sealing a continuous semiconductor package formed on a frame, it is not necessary to sandwich a clip or handle a large jig. Is very simple and can contribute to the reduction of man-hours. In addition, the cap can be inspected and cleaned, and the weight can be made uniform over all products.

Further, since the cap and the package can be adhered in parallel to each other, stable sealing can be achieved, and thus productivity, reliability and quality can be improved.

[Brief description of drawings]

FIG. 1 is a partially cutaway front view of a sealing jig and a device when performing a sealing operation using a sealing jig and an assembly machine (device) according to the present invention, and FIG. 2 is the sealing jig. FIG. 3 is a plan view and FIG. 4 is a side view of the apparatus in a state where it is removed from the apparatus and put into a heating furnace, and FIGS. 5 and 6 are drawings showing a conventional sealing jig. 5 (a) and 5 (b) are external perspective views, FIG. 6 (a) is a sectional view, and FIG. 6 (b) is an external perspective view. 1 ... Lower plate 2 ... Cap 3 ... Adhesive 4 ... Continuous package 5 ... Upper plate 5a ... Compression spring 6 ... Assembly machine 7 ... Supporting stand

Claims (2)

[Claims] 1. A jig for sealing a semiconductor package, which is used for sealing a transparent cap on each surface of a plurality of continuous semiconductor packages formed on a frame at one time, wherein each back surface of the semiconductor package is a jig. The upper plate having compression springs for pressing the inner surface attached to the inner surface, the lower plate having the convex base for placing the cap formed on the inner surface, and the cap and the semiconductor package are aligned with each other. Guide pins that are provided on the lower plate for insertion into holes formed on the frame of the semiconductor package, and the upper plate that is provided on both sides of the upper plate and that sandwiches the semiconductor package. And a hook for detachably fixing the lower plate, and a jig for sealing a semiconductor package. 2. A semiconductor package for sealing, wherein a transparent cap is sealed at a time on each surface of a plurality of continuous semiconductor packages formed on a frame by using the sealing jig according to claim 1. In the apparatus, a support table movably provided on a slide guide, guide pins provided on the upper surface of the support table for positioning the lower plate, and arranged on both sides of the support table. And a pair of guide plates provided so as to be openable and closable so as to cover or open the surface of the lower plate on the support table from both sides thereof, the pair of guide plates having a comb shape. And a space for guiding the position of the cap to be placed on the convex base of the lower plate in a state where the pair of guide plates are closed. Equipment