JPH0730060A - Structure of both-sided hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To enable a both-sided hybrid integrated circuit device wherein electronic parts are buried in an insulating synthetic resin board to be lessened in manufacturing cost, width, and weight. CONSTITUTION:Electronic parts 3 and 4 are so buried in an insulating synthetic resin board 2 as to make the connecting terminals of the electronic parts 3 exposed out of the surface of the insulating synthetic resin board 2 and the connecting terminals of the electronic parts 4 exposed out of the rear side of the resin board 2, and electric patterns 6 and 7 are formed on both the front and rear side of the resin board 2 so as to electrically interconnect the electronic parts 3 and 4 together.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a plurality of electronic parts,
The present invention relates to a double-sided hybrid integrated circuit device in which a plurality of electronic components are provided on each of the front and back surfaces, among hybrid integrated circuit devices that are electrically connected and integrated.

[0002]

2. Description of the Related Art In a conventional double-sided hybrid integrated circuit device, a plurality of electronic components are mounted by soldering on both front and back surfaces of an insulating substrate made of glass epoxy resin or ceramic, and the electronic components are connected to each other. Was electrically connected by wiring patterns formed in advance on both the front and back surfaces of the insulating substrate. However, since this is by soldering, the mounting density of electronic components (mounted per unit area) The number of electronic components that can be manufactured is low, and
There has been a problem that a heat load is applied during soldering of electronic components and, moreover, the total thickness is increased by using the insulating substrate.

Therefore, Japanese Patent Laid-Open No. 4-28 as prior art.
Japanese Patent No. 3987 discloses a first insulating synthetic resin substrate formed by embedding a plurality of electronic components so that a part of connection terminals of each electronic component is exposed on the surface, and a plurality of electronic components. And a second insulating synthetic resin substrate, which is embedded so that a part of the connecting terminals in each electronic component is exposed on the surface, are laminated in two layers with an adhesive, A double-sided hybrid integrated circuit device has been proposed in which an electric circuit pattern for electrically connecting the electronic components to each other is formed on the surface.

According to this structure, since soldering to each electronic component is not required, the mounting density of the electronic component can be improved, the heat load on the electronic component can be eliminated, and the insulating substrate is not used. It has the advantage that it can be made thin.

[0005]

However, in the double-sided hybrid integrated circuit device of the prior art, a plurality of electronic components are buried and a first insulation composite is formed by forming an electric circuit pattern for each electronic component. Since a resin substrate and a plurality of electronic components are embedded in the same manner, and a second insulating synthetic resin substrate on which an electric circuit pattern for each electronic component is formed is adhered in two layers with an adhesive. However, there is a problem in that not only the cost required for the production is increased, but also the total thickness cannot be made sufficiently thin.

In the double-sided hybrid integrated circuit device according to the above-mentioned prior art, a double insulation composite is provided between the electric circuit pattern on the first insulating synthetic resin substrate and the electric circuit pattern on the second insulating synthetic resin substrate. The structure is such that it is electrically conducted in the through hole formed in the resin substrate (through hole), and since electronic parts cannot be provided between the both electric circuit patterns,
There is also a problem that the mounting density of electronic components cannot be further improved.

According to the present invention, when a hybrid integrated circuit device in which a plurality of electronic components are embedded in an insulating synthetic resin substrate is a double-sided type, the manufacturing cost thereof can be reduced and the thickness can be further reduced. Is the first technical issue. The second technical problem is to achieve the first technical problem and further improve the packaging density.

[0008]

In order to achieve this first technical object, the present invention provides a plurality of electronic parts in an insulating synthetic resin substrate, and a part of each electronic part. The connection terminals are embedded on the surface of the insulating synthetic resin substrate so that the connection terminals of the other electronic components are exposed on the back surface of the insulating synthetic resin substrate, respectively, and on the front and back surfaces of the insulating synthetic resin substrate. ,
An electric circuit pattern for electrically connecting the electronic components to each other is formed.

Further, in order to achieve the second technical object, the present invention provides a plurality of electronic components in an insulating synthetic resin substrate, and a connecting terminal in some of the electronic components. Is embedded in the front surface of the insulating synthetic resin substrate so that the connecting terminals of the other electronic components are exposed at the back surface of the insulating synthetic resin substrate, and is a double-terminal type having connecting terminals on both left and right end surfaces. The electronic component is embedded so that both connection terminals of the two-terminal type electronic component are exposed on both the front and back surfaces of the insulating synthetic resin substrate, while the electronic components are embedded on both the front and rear surfaces of the insulating synthetic resin substrate. An electric circuit pattern for electrically connecting the parts to each other is formed.

[0010]

[Operation] With this configuration, a plurality of electronic components electrically connected to the electric circuit pattern on the surface of the insulating synthetic resin substrate and the insulating synthetic resin substrate are provided in one insulating synthetic resin substrate. Since it is possible to simultaneously embed a plurality of electronic components electrically connected to the electric circuit pattern on the back surface of the device, the manufacturing process is performed in the same manner as in the above-mentioned prior art. After embedding the parts, this can be significantly simplified compared to the case where these are laminated in two layers.

Moreover, a plurality of electronic parts electrically connected to the electric circuit pattern on the front surface of the insulating synthetic resin substrate and a plurality of electronic parts electrically connected to the electric circuit pattern on the back surface of the insulating synthetic resin substrate. Since the component and the component can be close to each other in the thickness direction of the insulating synthetic resin substrate, the total thickness can be made thinner than in the case of the prior art.

In particular, with the structure described in claim 2, the insulating synthetic resin substrate is provided between the electric circuit pattern on the front surface of the insulating synthetic resin substrate and the electric circuit pattern on the back surface of the insulating synthetic resin substrate. It is possible to dispose the both-terminal-type electronic component embedded in the above-mentioned two-terminal-type electronic component in a state where the both-terminal-type electronic component is electrically connected to both of the both electric circuit patterns.

[0013]

Therefore, according to the present invention, when the hybrid integrated circuit device in which a plurality of electronic components are embedded in the insulating synthetic resin substrate is made into a double-sided type, the manufacturing cost can be greatly reduced. At the same time, it has the effect that the overall thickness can be greatly reduced, and the size and weight can be reduced.

According to the second aspect, in addition to the above effects, there is an effect that the mounting density can be further improved.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 8 show a hybrid integrated circuit device 1 according to the first embodiment. In this figure, reference numeral 2 indicates an insulating synthetic resin substrate such as an epoxy resin, a polyester resin, an acrylic resin, a polyurethane resin or a silicon resin, and an electronic component such as an IC having a lead terminal 4a in the insulating synthetic resin substrate 2. 4 and a plurality of electronic components 3 such as chip resistors having terminals 3a, the lead terminals 3a and the terminals 4a of the electronic components 3 and 4 are
The insulating synthetic resin substrate 2 is embedded so as to be separately exposed on both the upper surface and the lower surface of the insulating synthetic resin substrate 2, and the connecting terminals 5a, 5 are formed on the left and right end surfaces of the insulating synthetic resin substrate 2.
One or more of the two-terminal type electronic component 5 such as a resistor provided with b is connected to both terminals 5a,
One terminal 5a of the 5b is on the upper surface of the insulating synthetic resin substrate 2, and the other terminal 5b is on the insulating synthetic resin substrate 2.
Are buried so as to be exposed on the lower surface of each.

On the other hand, on both the upper surface and the lower surface of the insulating synthetic resin substrate 2, the electronic components 3 and 4 are electrically connected to each other and the two terminal-type electronic components 5 are electrically connected to each other. The electric circuit patterns 6 and 7 for forming are formed. Further, reference numeral 8 indicates a lead terminal made of a metal plate formed by bending the base end portion 8a into an appropriate shape such as glasses as shown in FIG. 3, and the base end portions 8a of the plurality of lead terminals 8 are formed. In the insulating synthetic resin substrate 2 in the base end portion 8a.
Is partially embedded in the insulating synthetic resin substrate 2 so as to be exposed on both the upper surface and the lower surface of the insulating synthetic resin substrate 2.
7, the extension portions 6a and 7a extending to the exposed portion of the base end portion 8a of the lead terminal 8 are provided.

The reference numerals 9 and 10 denote insulating cover coats which cover the entire electric wiring patterns 6 and 7 and the extended portions 6a and 7a thereof. With this configuration, a plurality of electronic components 3 electrically connected to the electric circuit pattern 6 on the upper surface of the insulating synthetic resin substrate 2 and the insulating synthetic resin substrate are provided in one insulating synthetic resin substrate 2. Two
A plurality of electronic components 4 electrically connected to the electric circuit pattern 7 on the lower surface of the insulating resin substrate 2 can be simultaneously embedded, and a plurality of electronic components 4 electrically connected to the electric circuit pattern 6 on the upper surface of the insulating synthetic resin substrate 2. 3 electronic components,
Electric circuit pattern 7 on the lower surface of the insulating synthetic resin substrate 2
The plurality of electronic components 4 electrically connected to each other can be close to each other in the thickness direction of the insulating synthetic resin substrate 2.

The insulating synthetic resin substrate 2 is provided between the electric circuit pattern 6 on the upper surface of the insulating synthetic resin substrate 2 and the electric circuit pattern 7 on the lower surface of the insulating synthetic resin substrate 2.
It is possible to dispose the both-terminal type electronic component 5 buried in the above-mentioned two-terminal type electronic component 5 in a state of being electrically connected to both of the both electric circuit patterns 6 and 7.

The hybrid integrated circuit device 1 according to the first embodiment is preferably manufactured by the method described below. That is, first, as shown in FIG. 4, an upper molding box A1 and a lower molding box A2 which are formed in an open upper surface type are used, and an adhesive is applied to the inner bottom surface of the upper molding box A1. After applying layer B1, this adhesive layer B
1, the plurality of electronic components 3 are mounted at predetermined positions so that a part of the terminals 3a of each electronic component 3 is in contact with the adhesive layer B1, while the lower molding box A2 is formed. After applying the adhesive layer B2 on the inner bottom surface of
The plurality of electronic components 4 and both-terminal type electronic components 5 are arranged on the adhesive layer B2 so that a part of the lead terminal 4a or the terminal 5b of each of the electronic components 4 and 5 comes into contact with the adhesive layer B2. And the plurality of lead terminals 8 are mounted at the predetermined positions so that the base end portions 8a of the respective lead terminals 8 come into contact with the adhesive layer B2.

Next, the two box bodies A1 and A2 are matched with each other as shown in FIG. Then, the other terminal 5a of each of the two-terminal type electronic components 5 and the base end portion 8a of the lead terminal 8 come into close contact with the adhesive layer B1 of the upper molding box A1. Insulating synthetic resin is injected into the interior of A1 and A2 in a liquid state from an injection port A3 and cured. Then, the insulating synthetic resin is die-cut from both the boxes A1 and A2, as shown in FIG. Resin substrate 2
Various electronic components 3 in the insulating synthetic resin substrate 2.
Molding is performed with the bases 4 and 5 and the base end 8a of the lead terminal 8 buried.

Then, the upper and lower surfaces of the insulating synthetic resin substrate 2 are each treated to remove the adhesive,
As shown in FIG. 7, after the metal layers C1 and C2 are formed by sputtering or the like, the both metal layers C1 and C2 are subjected to a photo-etching treatment, so that the both electric circuit patterns 6 are formed as shown in FIG. , 7 or by screen-printing a conductive paste to form the both electric circuit patterns 6, 7. At the same time when the electric circuit patterns 6 and 7 are formed, the extension portions 6a and 7a of the electric circuit patterns 6 and 7 are formed.

Then, by applying the cover coats 9 and 10, the hybrid integrated circuit device 1 as shown in FIG. 1 is obtained. In the first embodiment, the lead terminals 8 can be provided on both left and right sides of the hybrid integrated circuit device 1, and
The lead terminals 8 correspond to the electric circuit pattern 6 on the upper surface of the insulating synthetic resin substrate 2, and the insulating synthetic resin substrate 2
It may be configured separately from the lower surface of the electric circuit pattern 7.

FIG. 9 shows a hybrid integrated circuit device 11 according to the second embodiment. This second embodiment is
A plurality of other electronic components 3'and 4'are mounted on both electric circuit patterns 6 and 7 in the hybrid integrated circuit device 1 according to the first embodiment. That is, the insulating layers D1 and D2 are formed on the surfaces of the electric circuit patterns 6 and 7 on the upper and lower surfaces of the insulating synthetic resin substrate 2, and the electric circuit patterns 6 and 7 are formed on the surfaces of the insulating layers D1 and D2. Second electric circuit patterns 6 ', 7'which are electrically connected to each other are formed, and a plurality of other electronic parts 3', 4'are provided for the second electric circuit patterns 6 ', 7'.
After mounting the electronic components 3'and 4 ', the electronic components 3'and 4'are embedded in the second insulating synthetic resin substrates 2a and 2b formed on the upper and lower surfaces of the insulating synthetic resin substrate 2, respectively. According to this configuration, Since the electronic components can be mounted in a four-layer structure, the hybrid integrated circuit device 11 can be further densified.

Then, in manufacturing the hybrid integrated circuit device 11 according to the second embodiment, up to FIG.
As in the first embodiment, as shown in FIG. 10, on the surfaces of both electric circuit patterns 6 and 7 on the upper and lower surfaces of the insulating synthetic resin substrate 2, a second electric layer is formed via insulating layers D1 and D2. Circuit patterns 6'and 7'are formed, and then, as shown in FIG. 11, electronic components 3'and 4'are respectively attached to the second electric circuit patterns 6'and 7'with conductive adhesive or the like. Then, as shown in FIG. 12, all of them are sandwiched between an upper molding box A1 'and a lower molding box A2'.

Next, the insulating synthetic resin in a liquid state is injected into both the boxes A1 'and A2', and the injection port A is provided in each of them.
By injecting from 3 ', A3 "and hardening,
A method of molding the second insulating synthetic resin substrates 2a and 2b can be adopted. In the second embodiment, the electronic components may be mounted in a three-layer structure by eliminating one of the second insulating synthetic resin substrates 2a and 2b.

[Brief description of drawings]

FIG. 1 is a vertical sectional front view of a hybrid integrated circuit device according to a first embodiment of the present invention.

FIG. 2 is a perspective view of the hybrid integrated circuit device according to the first embodiment of the present invention.

FIG. 3 is a perspective view of a lead terminal used in the first embodiment.

FIG. 4 is a diagram showing a first state in the case of manufacturing the hybrid integrated circuit device according to the first embodiment.

FIG. 5 is a diagram showing a second state in the case of manufacturing the hybrid integrated circuit device according to the first embodiment.

FIG. 6 is a diagram showing a third state in the case of manufacturing the hybrid integrated circuit device according to the first embodiment.

FIG. 7 is a diagram showing a fourth state in the case of manufacturing the hybrid integrated circuit device according to the first example.

FIG. 8 is a diagram showing a modification of the hybrid integrated circuit device according to the first embodiment.

FIG. 9 is a vertical sectional front view of a hybrid integrated circuit device according to a second embodiment of the present invention.

FIG. 10 is a diagram showing a first state in the case of manufacturing the hybrid integrated circuit device according to the second embodiment.

FIG. 11 is a diagram showing a second state in the case of manufacturing the hybrid integrated circuit device according to the second embodiment.

FIG. 12 is a diagram showing a third state in the case of manufacturing the hybrid integrated circuit device according to the second embodiment.

[Explanation of symbols]

1,11 Hybrid integrated circuit device 2,2a, 2b Insulated synthetic resin substrate 3,4,3 ', 4' Electronic component 5 Double terminal type electronic component 6,7,6 ', 7' Electric circuit pattern 8 Lead terminal 8a Lead Base end of terminal

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location H01L 23/50 W

Claims (2)

[Claims] 1. A plurality of electronic components are provided in an insulating synthetic resin substrate, connection terminals of some electronic components of the electronic components are provided on the surface of the insulating synthetic resin substrate, and other electronic components are provided. While the connection terminals are embedded so as to be exposed on the back surface of the insulating synthetic resin substrate,
A structure of a double-sided hybrid integrated circuit device, wherein electric circuit patterns for electrically connecting the electronic components to each other are formed on both front and back surfaces of the insulating synthetic resin substrate. 2. A plurality of electronic components are provided in an insulating synthetic resin substrate, connection terminals of some electronic components among the electronic components are provided on the surface of the insulating synthetic resin substrate, and other electronic components are provided. The connecting terminals in the embedded synthetic resin substrate are embedded so as to be exposed on the back surface of the insulating synthetic resin substrate respectively, and the two-terminal type electronic component having the connecting terminals on the left and right end faces is provided. While being embedded so as to be exposed on both the front and back surfaces of the insulating synthetic resin substrate, on the front and back surfaces of the insulating synthetic resin substrate, an electric circuit pattern for electrically connecting the electronic components to each other, respectively. A structure of a double-sided hybrid integrated circuit device characterized by being formed.