JPH07290527A - Peeling method for optical disc board and taking out apparatus - Google Patents

Abstract

PURPOSE:To obtain a uniform optical disc board having no warpage by blowing peeling air from a bore of the board to a close contact surface of the board with a stamper and releasing the board from the stamper. CONSTITUTION:The method for peeling an optical disc board takes out the board molded in a cavity by filling resin in the cavity from molds. The methods comprises the steps of first releasing only a board mirror surface side while an information surface side of the board 1 remains brought into close contact with a stamper 4, and then blowing releasing airs 7, 7a from a bore of the board 1 toward a close contact surface to release the stamper 4 at the contact surface of the board 1 with the stamper 4. It is preferable to move an ejector sleeve 6 for a cut punch 8 and a molded form protruding to a position slightly reverse to the molded form protruding direction from the stamper surface. Thus, the entire surface of the form is uniform without generating warpage.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for separating an optical disk substrate, which is molded by filling a resin into a mold, and removing the optical disk substrate from the stamper.

[0002]

2. Description of the Related Art In recent years, various types of optical disks such as rewritable type and write-once type have come to be used as new information recording media. These optical disk substrates are usually molded by injection molding. The method of releasing the optical disk substrate from the mold is generally performed by mechanically ejecting by the ejector sleeve 6 and blowing the peeling air 7 between the contact surfaces of both as shown in FIG.

However, peeling between the mold and the optical disk substrate,
In particular, since the stamper surface for preliminarily transferring information pits and track grooves to the optical disk substrate and the optical disk substrate are not peeled off smoothly over the entire surface, distortion of the substrate shape, deformation of the transferred pits, abnormal transfer, etc. occur. .

The reason for the deformation of the pits is due to the way of peeling between the optical disk substrate 1 and the stamper 4. That is, as shown in FIG. 4, the protrusion of the ejector sleeve 6 causes the peeling to proceed from the inner peripheral portion to the outer peripheral portion, so that the boundary portion A of the portion that is already in close contact with the stamper 4 and the portion that has been peeled off is a fulcrum. This is because the optical disk substrate 1 is warped, and a force B pulling toward the center acts on the boundary portion A. In addition, the method of peeling, which proceeds while curving at the boundary A, adversely affects the mechanical characteristics of the optical disc substrate, and when the warped optical disc substrate tries to return to its original shape due to its elasticity, it collides with the stamper or There is also a risk of recontacting and causing abnormal transcription.

In order to suppress this phenomenon, it is general to eject the ejector sleeve 6 and blow the peeling air 7 between the optical disc substrate 1 and the stamper 4 so that the both are peeled off in a constant state over the entire surface. However, since the slit C serving as a peeling air blowing port is provided outside the inner diameter of the optical disc substrate and is arranged so that the peeling air hits the optical disc substrate 1 perpendicularly, the peeling air 7 blown from here is Is a peeling air 7a that helps the uniform peeling while suppressing the warping of the substrate.
Not only is the peeling air 7b having a function of significantly deteriorating the warp, but also the peeling air 7c which simply goes out from the inner diameter portion of the optical disk substrate 1.

Therefore, pit deformation and abnormal transfer are suppressed,
It is very difficult to suppress the ejector sleeve 6 and the peeling air so as to improve the mechanical characteristics of the optical disk substrate 1.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and is a method and apparatus for separating an optical disk substrate and a stamper that are uniform over the entire surface and do not warp due to the separation from the stamper. It is an object of the present invention to obtain an optical disk substrate having good mechanical characteristics without substrate deformation, pit deformation, abnormal transfer and the like.

[0008]

According to the present invention, firstly, in a method of taking out an optical disk substrate having a cavity filled with a resin and molded from a mold, first, the information surface side of the optical disk substrate is brought into close contact with a stamper. While leaving the mirror surface side of the substrate as it is, the peeling air is blown into the contact surface between the optical disk substrate and the stamper from the inner diameter portion of the optical disk substrate toward the contact surface, and the optical disk substrate is pressed against the stamper. An optical disk substrate peeling method for peeling from an optical disc substrate is provided.

Further, according to the present invention, secondly, in the above-mentioned first optical disk substrate separating method, the cut punch and the ejector sleeve for ejecting the molded product are slightly ejected from the stamper surface at the time of blowing air for the separation. An optical disk substrate peeling method for moving the optical disk substrate to a position opposite to the direction is provided.

According to the present invention, thirdly, in the above-mentioned first optical disk substrate separating method, after the separating air is blown, the optical disk substrate is lifted from the stamper until the entire optical disk substrate is separated from the stamper. There is provided an optical disk substrate peeling method for peeling while keeping the amount constant.

Further, according to the present invention, fourthly, in the optical disk substrate take-out device for taking out the optical disk substrate by adsorbing a plurality of portions of the inner peripheral portion of the optical disk substrate in close contact with the stamper by the substrate suction pads, Between the support parts of the suction pads, there is an air chamber for storing peeling air, a discharge valve for blowing the peeling air into the air chamber, and an air chamber attached to the air chamber in the air chamber. There is provided an optical disk substrate take-out device in which peeling air blowing means provided with a supply valve for adjusting pressure is arranged.

Further, according to the present invention, fifthly, in the fourth optical disk substrate take-out device, a seal for sealing around the inner diameter of the optical disk substrate is provided at a tip end portion of an air pipe through which peeling air flows from the air chamber. There is provided an optical disk substrate take-out device in which a member is provided, the air pipe is slidable in the vertical direction with respect to the optical disk substrate, and the air chamber is connected via an elastic body.

According to the present invention, sixthly, in the fourth optical disk substrate take-out device, a non-contact displacement sensor for monitoring the amount of lift of the optical disk substrate from the stamper is arranged in the vicinity of each suction pad. In addition, there is provided an optical disk substrate take-out device in which an actuator for controlling the floating amount is provided on the substrate suction pad support portion.

Furthermore, according to the present invention, seventhly, in the fifth optical disk substrate take-out device, the elastic modulus of the elastic body provided between the air pipe and the air chamber has a supporting portion of the substrate suction pad. There is provided an optical disk substrate takeout device having an elastic modulus smaller than that of an actuator provided in the optical disc substrate.

[0015]

In the peeling method of the optical disk substrate of the present invention, the peeling air is blown from the inner diameter portion of the optical disk substrate in the direction of pressing the optical disk substrate toward the stamper side, and then spreads in the direction of close contact between the optical disk substrate and the stamper. Go. Therefore, when the peeling air spreads between the optical disk substrate and the stamper, the optical disk does not warp and flows smoothly from the inner diameter portion to the outer peripheral portion. Therefore, the above-mentioned substrate deformation, pit deformation, and abnormal transfer do not occur in the obtained optical disk substrate.

In the second method, the cut punch and the ejector sleeve recede and a space is formed between the optical disk substrate and the ejector sleeve. Therefore, peeling air spreads from this space between the substrate and the stamper, and peels. Is started smoothly and more effectively.

In the third method, after the peeling air is blown into the optical disc substrate, the optical disc substrate is peeled while maintaining a constant lift amount from the stamper until the entire optical disc substrate is peeled from the stamper. The uniform peeling is performed from the outer peripheral portion to the outer peripheral portion, and in particular, the deformation of the inner peripheral portion that peels before the outer peripheral portion is suppressed.

The optical disk substrate take-out device of the fourth aspect of the present invention complies with a conventional take-out device using a substrate suction pad. However, peeling air having an air chamber is provided between the support portions of the substrate suction pad. The pressure adjusting valve provided in the air chamber and the supply valve provided in the air supply path always maintain the optimum pressure, and the influence of the pulsation generated on the pressurized air supply source side. It is possible to provide air at an appropriate pressure that does not receive pressure.

In the optical disk substrate take-out device described in the fifth aspect, the peeling air blowing means described in the fourth aspect is provided with a seal portion for sealing the periphery of the inner diameter portion of the optical disk substrate on the front surface of the air chamber. Peripheral seal can prevent peeling air from leaking to the outside,
The peeling can be performed more effectively.

In the sixth embodiment of the optical disk substrate take-out device, a non-contact displacement sensor for monitoring the amount of lift of the optical disk substrate from the stamper is arranged in the vicinity of each of the suction pads, and an actuator for controlling the amount of lift is provided. As a result, the floating amount is held constant, and uniform peeling is performed from the inner peripheral portion to the outer peripheral portion.

In the seventh embodiment of the optical disk substrate take-out device, the elastic modulus between the seal portion and the air chamber is made smaller than that of the substrate suction pad support portion, so that the optical disk substrate in a good floating state is excessively moved by the sealing mechanism. Since it is not pressed, deformation of the pad can be prevented as a result.

[0022]

EXAMPLES The present invention will be specifically described below with reference to examples.

FIG. 1 is a view showing a state in which the optical disk substrate take-out device of the present invention is sucked onto a substrate which is in close contact with the stamper surface. FIG. 2 is an enlarged view of the substrate suction portion of FIG. More specifically, FIGS. 1 and 2 show that after the cavity is filled with resin and molded, only the mirror surface side of the optical disk substrate 1 is released, and then the sprue 2 is removed by the protrusion of the ejector pin 9, The state where the arm of the take-out device 3 according to the present invention extends to the front surface of the optical disc substrate 1, the inner peripheral portion of the substrate is adsorbed by the adsorption pad 12, and the periphery of the inner diameter portion of the optical disc substrate 1 is sealed by the sealing member 11 is shown. There is. At this time, the ejector sleeve 6, the cut punch 8 and the ejector pin 9 are slightly separated from the surface of the stamper 1 by the mold 1.
0, the slit C is formed between the ejector sleeve 6 and the optical disk substrate 1.

In FIG. 1, the sprue 2 is removed by projecting the ejector pin 9 before the optical disk substrate 1 is picked up by the take-out device 3, but the sprue 2 is left as it is in the mold as shown in FIG. 3 showing a conventional example. The sprue 2 may be taken out together with the optical disk substrate 1 while leaving it on the 10 side. However, in that case, since it is necessary to attach the sprue holding mechanism as shown in 14 of FIG. 1 to the arm of the take-out device 3, the peeling air blowing means provided in the take-out device 3 becomes complicated.

Next, how the optical disk substrate 1 and the stamper 4 are separated will be described with reference to FIG. The peeling air 7 stored in the air chamber 13 provided in the take-out device 3 is blown out by opening the discharge valve 15 of the air chamber 13, and the ejector sleeve 6, the cut punch 8, and the ejector pin 9 are retracted inside. The slit C formed between the optical disc substrate 1 and the optical disc substrate 1 spreads between the optical disc substrate 2 and the stamper 4 to separate them.

The peeling air 7 stored in the air chamber 13 is always optimized by a pressure adjusting valve (not shown) provided in the air chamber 13 and a supply valve 17 opened and closed at an appropriate time. The pressure is kept at the same time, and at the same time, the influence of pulsation generated in the pressurized air supply source is avoided.

At this time, the inner diameter portion of the optical disk substrate 1 is completely sealed from the outside by the seal member 11, and the ejector sleeve 6, the cut punch 8, the ejector pin 9 and the stamper inner peripheral retainer 5 are respectively sealed. All the spaces between them are O-rings (for example, 1 in Fig. 2).
Since it is sealed by 6), the peeling air 7 is entirely used for effective peeling between the optical disk substrate 1 and the stamper 4 without leaking to the outside (7 in FIG. 2).
a).

Further, when the optical disk substrate 1 is separated from the stamper 4, the actuator 18 provided on the support portion of the suction pad 12 operates so that the amount of floating from the stamper 4 is maintained at an appropriate minute height d. . At this time, the floating amount of the optical disc substrate 1 from the stamper 4 is set near the suction pad 12, for example,
It is measured by a non-contact type change sensor 20 such as an optical sensor. Further, if the non-contact type displacement sensor 20 is provided for each suction pad 12 and each actuator 18 is operated, it is possible to perform uniform peeling while suppressing the variation in the amount of lifting in the circumferential direction.

As a result, the distance between the peeled optical disk substrate 1 and the stamper 4 is constant with a very small width d, so that the amount of warpage of the optical disk substrate 1 is suppressed to a small level, and at the same time, the boundary portion A between the stamper 4 and the separated portion is formed. The generated force B that is pulled in the direction of the center is also suppressed to a small value, and the deformation of the transfer pit can be prevented.

Keeping the gap between the optical disk substrate 1 and the stamper 4 constant at the same time suppresses the warp of the optical disk substrate 1 and improves the mechanical characteristics of the optical disk substrate 1. Further, since the optical disk substrate 1 is prevented from colliding with or re-contacting the stamper 4, there is an effect of preventing abnormal transfer.

On the other hand, the position of the air chamber 13 is changed by an attached actuator 19 in synchronization with the floating position of the optical disk substrate 1 at the time of peeling. This prevents the generation of stress by the suction pad 12 that presses the inner diameter portion of the optical disk substrate 1 with the suction support portion of the optical disc substrate 1 as a fulcrum against the stamper 4 and the distortion of the substrate due to the stress.

Further, the peeling air pipe provided with the seal member 11 at the tip and the air chamber 13 are slidable with each other, and an elastic member such as a spring having a smaller elastic modulus than the actuator 18 of the substrate suction pad 12 is provided between them. The body 21 is interposed. With such a structure, it is possible to prevent an excessive impact from being generated between the seal member 11 and the inner diameter portion of the substrate at the time of adsorbing the substrate, and to prevent the force of the suction pad 12 from supporting the inner diameter portion of the seal member 11 at the time of peeling the substrate. Then, the generation of the force pressing against the stamper 4 side is prevented, and the inner diameter portion of the substrate is reliably sealed by pressing the inner diameter portion of the substrate with an appropriate amount of force.

When the peeling of the optical disk substrate 1 from the stamper 4 progresses in this way and the entire peeling is completed, the peeling air 7a comes out from the outer diameter portion, and the flow rate of the peeling air 7 rapidly increases. Increase to.

Therefore, the flow rate of the peeling air 7 is monitored in advance, the change in the flow rate is detected to judge the completion of the peeling, and the optical disk substrate 1 is immediately taken out. According to this method, although the substrate shape and the transfer pit are deformed because the substrate is forcibly taken out while the part of the substrate is still in close contact with the stamper, and conversely, the entire substrate is already peeled off, In order to keep the gap between the optical disk substrate 1 and the stamper 4 forcibly constant, the peeling air 7 warps and deforms from the outer peripheral portion, or the stamper 4 collides with or re-contacts to cause abnormal transfer. It is possible to prevent the optical disc substrate from being taken out in an optimum state.

[0035]

As described above, according to the optical disc substrate peeling method of the present invention, since the peeling air is blown from the inner diameter portion of the optical disc substrate toward the close contact direction between the substrate and the stamper, the substrate is warped. It does not cause a peeling state that would cause it to return. As a result, it is possible to prevent defects such as substrate deformation, pit deformation, and abnormal transfer caused by conventional peeling. Further, the peeling air can be blown in from the inner diameter portion of the substrate, and at the same time, the cut punch and the ejector sleeve can be retracted, so that the peeling can be started more smoothly and effectively. Furthermore, by peeling the optical disk substrate while keeping the amount of floating from the stamper constant, it is possible to perform uniform peeling from the inner peripheral portion to the outer peripheral portion.

Further, according to the optical disk substrate take-out device of the present invention, the air can be blown at the optimum pressure by the action of the air chamber for blowing the peeling air. Moreover, the peeling air, which is provided on the front surface of the air chamber and seals around the inner diameter of the optical disk substrate, can prevent the peeling air from leaking to the outside, so that the peeling can be performed more effectively.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a state in which an optical disk ejecting device according to the present invention is applied.

FIG. 2 is an explanatory diagram showing a part of FIG. 1 in an enlarged manner.

FIG. 3 is an explanatory diagram showing a state in which a conventional optical disk take-out device is applied.

FIG. 4 is an explanatory diagram showing a situation when a conventional optical disk take-out device is used.

[Explanation of symbols]

 1 Optical Disc Substrate 2 Sprue 3 Take-out Device 4 Stamper 6 Ejector Sleeve 7, 7a, 7b, 7c Peeling Air 8 Cut Punch 9 Ejector Pin 10 Mold 11 Sealing Member 12 Adsorption Pad 13 Air Chamber 15 Discharge Valve 16 O-ring 17 Supply Valve 18, 19 Actuator 20 Displacement sensor 21 Elastic body A Boundary B Force pulled toward the center C Slit d Small height

Claims (7)

[Claims] 1. In a method of taking out an optical disk substrate having a cavity filled with a resin and molded from a mold, first, only the mirror surface side of the substrate is released from the mold while the information surface side of the optical disk substrate is in close contact with the stamper. An optical disk substrate peeling method in which peeling air is blown into the contact surface between the optical disk substrate and the stamper from the inner diameter portion of the optical disk substrate toward the contact surface direction to separate the optical disk substrate from the stamper. 2. An optical disk substrate peeling method according to claim 1, wherein the cut punch and the ejector sleeve for ejecting the molded product are slightly moved from the stamper surface to a position opposite to the ejection direction of the molded product when the air for peeling is blown. . 3. The optical disk substrate peeling method according to claim 1, wherein after the peeling air is blown into the optical disk substrate, the optical disk substrate is peeled while keeping the amount of floating from the stamper constant until the entire optical disk substrate is peeled from the stamper. . 4. An optical disk substrate take-out device for picking up an optical disk substrate by sucking a plurality of inner peripheral portions of an optical disk substrate in close contact with a stamper with a substrate suction pad, and peeling between the supporting portions of the plurality of suction pads. An air chamber for storing the working air is provided, a discharge valve for blowing the peeling air is provided in the air chamber, and a supply valve for adjusting the pressure in the air chamber is provided in the air supply passage attached to the air chamber. An optical disk substrate take-out device provided with a peeling air blowing means. 5. A seal member is provided at the tip of an air pipe through which peeling air flows from the air chamber to seal around the inner diameter of the optical disc substrate, and the air pipe is slidable in a direction perpendicular to the optical disc substrate. The optical disk substrate takeout device according to claim 4, wherein the air chamber is connected to the air chamber via an elastic body. 6. A non-contact displacement sensor for monitoring the amount of lift of the optical disk substrate from the stamper is arranged in the vicinity of each suction pad, and an actuator for controlling the amount of lift is provided on the substrate suction pad support portion. The optical disk substrate takeout device according to claim 4. 7. The optical disk substrate take-out device according to claim 5, wherein the elastic modulus of the elastic body provided between the air pipe and the air chamber is smaller than the elastic modulus of the actuator provided in the support portion of the substrate suction pad.