JPH07297563A - Electronic part - Google Patents

Abstract

PURPOSE:To provide a packaged electronic part at low cost, and also to prevent an external electrode from short circuit. CONSTITUTION:A metal film 6 is provided on the aperture edge of a case 1, a cover 9 is adhered to the metal film 6 through solder 10 which is a conductive bonding agent, and a groove 1d, which faces to the aperture edge of the case 1, is formed on the outer circumferential surface of the case 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component containing a device in a case.

[0002]

2. Description of the Related Art FIG. 4 shows a conventional electronic component.

Reference numeral 1 denotes a ceramic case, in which an element 2 such as a high frequency component is mounted by being attached with an adhesive 3 in the case 1. This element 2 is electrically connected to an external electrode 5 by an aluminum wire 4. A Kovar ring 7 is brazed to the ring-shaped sealing metal film 6 on the opening edge of the case 1, and a metallic lid 8 is hermetically joined by welding or the like.

[0004]

In the above configuration,
The Kovar ring 7 is required for packaging. However, the Kovar ring 7 is expensive, and welding is required to join it to the lid 8, which further increases the cost.

Therefore, an object of the present invention is to package without using a joining method by welding using a Kovar ring.

[0006]

In order to achieve this object, the present invention provides a first metal film on the opening edge of the case, and a conductive adhesive is provided on the first metal film. The lid is adhered, and a groove facing the opening edge of the case is formed on the outer peripheral surface of the case.

[0007]

With the above structure, the first member provided on the opening edge of the case
Since the lid can be adhered to the metal film of with a conductive adhesive such as inexpensive solder, it is easy to reduce the cost, and the surplus conductive adhesive spread by pressing the lid flows into the groove. Therefore, this excess conductive adhesive will not accidentally flow down to the external electrode portion to cause a short circuit or the like.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. 1 is a front view in which a left half of an electronic component according to an embodiment of the present invention is cross-sectioned, FIG. 2 is a plan view thereof, and FIG. 3 is a front view in which a lid and a case are separated, but which is the same as FIG. 4 of a conventional example. The parts are given the same numbers.

In FIGS. 1, 2, and 3, reference numeral 9 denotes a metal lid which can be soldered, and a solder 10 having a melting point of 260 ° C. or higher is provided in a film form on the entire lower surface thereof as a sealing material. . 1 is a multilayer substrate 1a made of alumina, a frame 1
A square or rectangular case is formed by stacking b and 1c, and an element 2 such as a high-frequency component in the KHz band to the MHz band is mounted therein by an adhesive 3. In this state, the element 2 and the external electrode 5 are connected via the bonding wire 4. The external electrodes 5 are all drawn out to the four sides of the case 1. A ring-shaped metal film 6 is provided on the upper surface of the opening edge of the case 1. Further, each corner of the case 1 is provided with an arcuate groove 1d, which reaches the upper and lower ends of the case 1. Further, each groove 1d also has a metal film 6a, which is connected to the metal film 6. The lid 9 is bonded onto the metal film 6 on the opening edge of the case 1 via the solder 10 to achieve packaging and shielding. At this time, the metal films 6 and 6a are formed by plating tungsten, nickel, and gold in order, and the uppermost gold promotes the sliding of the solder, so that it is spread when the lid 9 is pressed against the case 1. The surplus solder 10 will flow down into the groove 1d along the metal films 6 and 6a. Therefore, it is possible to prevent a short circuit or the like of the external electrode 5 due to the excess solder 10.

[0010]

As described above, according to the present invention, the first metal film is provided on the opening edge of the case, and the lid is bonded onto the first metal film via the conductive adhesive, and the case is formed. A groove facing the opening edge of the case is formed on the outer peripheral surface of the.

With the above arrangement, the lid can be adhered to the first metal film provided on the opening edge of the case with a conductive adhesive such as inexpensive solder, which facilitates cost reduction.
Moreover, since the surplus conductive adhesive spread by pressing the lid flows into the groove, the surplus conductive adhesive may inadvertently flow down to the external electrode portion to cause a short circuit or the like. There will be nothing.

[Brief description of drawings]

FIG. 1 is a front view in which a left half of an electronic component according to an embodiment of the present invention is sectioned.

FIG. 2 is a plan view of FIG.

FIG. 3 is a front view in which a lid and a case according to an embodiment of the present invention are separated.

FIG. 4 is a front view in which the left half of the conventional example is sectioned.

[Explanation of symbols]

 1 case 1d groove 2 element 5 external electrode 9 lid 10 solder

Claims (3)

[Claims] 1. A case having an open top surface, an element housed in the case, an external electrode electrically connected to the element and drawn out of the case, and an opening on an upper surface of the case. A lid attached thereto, a first metal film is provided on an opening edge of the case, and the lid is adhered to the first metal film via a conductive adhesive, and an outer peripheral surface of the case Is an electronic component having a groove facing the opening edge of the case. 2. The second metal film is provided on the case-side surface of the lid, and the second metal film and the first metal film are adhered to each other via a conductive adhesive. Electronic components. 3. The electronic component according to claim 1, wherein the case has a square shape or a rectangular shape, and a groove is formed in each corner portion.