JPH07240568A - Circuit board and its manufacture - Google Patents

Abstract

PURPOSE:To provide a manufacturing method of a circuit board in which a circuit layer is flattened by eliminating the protrusion of a conductor pattern and whose plating process is simplified. CONSTITUTION:An insulating material 6 is irradiated with an ultraviolet laser 7 through a first mask 10, the insulating material 6 is removed and worked, a recessed pattern 1 is formed, a second mask 11 is inserted, the ultraviolet laser 7 is irradiated, and a recessed pattern 1 having a different depth is worked. The recessed patterns 1 whose electric resistance is different due to their depth are formed in a one-layer insulating layer. Since electric charges 5 are accumulated in the worked parts due to the high photon energy of the ultraviolet laser 7 at this time, the worked parts are immersed in a metal catalytic solution, metals 4 adhere selectively to the worked parts only, and conductors 3 can be precipitated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board on which a semiconductor device or the like is mounted and a manufacturing method thereof, and more particularly to a circuit board having a conductor pattern or a conductive hole formed therein and a manufacturing method thereof.

[0002]

2. Description of the Related Art Generally, when a circuit board is manufactured, a resist material is applied on an insulating material, a pattern is formed on the insulating material by using light, and after that, plating nucleation is performed to perform electroless plating or electroless plating. A step of forming a conductor pattern of copper or the like by using both plating and electrolytic plating and then removing the resist material is used. Especially when manufacturing a multilayer substrate, after the step of removing the resist material, an insulating material such as polyimide is further applied to form a conductive hole by laser or other etching method, and these treatments are repeated to form several layers. To make a multi-layered structure of several tens of layers.

For example, FIG. 15 shows a publication "Electronic Materials, 5, 5".
4 (1990) ”is a cross-sectional view showing the method of manufacturing the conventional multilayer circuit board in the order of steps.
Is a conductive hole, 3 is a conductor such as nickel or copper, 6 is an insulating material such as polyimide, 4 is a plating nucleus such as palladium, 7
A is a laser for making a hole, 8 is a mask, 9 is a substrate such as silicon, 13 is a decomposed product generated by laser processing, 27 is light for exposing, 28 is a photosensitive resist material, and 101 is It is a convex pattern. FIG. 15A is a sectional view of the step of exposing and developing the resist material 28, FIG.
FIG. 15B is a sectional view of the step of attaching the plating nucleus 4.
15C is a sectional view of the step of forming the conductor 3, FIG.
Is a cross-sectional view of the step of removing the resist material 28, FIG.
15E is a cross-sectional view of the step of irradiating the second layer insulating material 6 with the laser 7A, FIG. 15F is a cross-sectional view of the step of filling the hole formed by the laser 7A with the conductor 3, and FIG. FIG. 8A) is a cross-sectional view showing a step of forming the substrate in multiple layers by repeating the above steps.

Next, the operation will be described. The insulating material 6 and the resist material 28 are applied on the substrate 9. The resist material 28 on the insulating material 6 is exposed by the light 27 through the mask 8 and developed. A desired pattern is formed on the mask 8, and the pattern width is changed when, for example, the electric resistance is changed (FIG. 15A). For example, the resist material 28 in the portion not covered with the mask 8 is removed and a pattern is formed. A plating nucleus 4 is attached on this (Fig. 1
5 (b)). The conductor 3 is deposited by electroless plating or by using both electroless plating and electrolytic plating (FIG. 15).
(C)). After that, the resist material 28 is removed, and the convex pattern 101 of the conductor of the first layer is formed. Here, by using the resist material 28, plating is prevented from being applied to a portion other than a desired portion (FIG. 15D). A second layer of insulating material 6 is applied onto the convex pattern 101, and the insulating material 6 is applied to a laser 7 by using a mask 8 having a desired pattern.
Irradiation with A (FIG. 15E). A hole is formed by the laser 7A, and the conductor 3 is embedded in the hole by plating or the like to form the conduction hole 2. When the laser 7A is irradiated, a decomposed product 13 is formed (FIG. 15 (f)). This decomposed product 13 is removed by washing (not shown). A multilayered substrate is formed by repeating the above steps such as coating the insulating material 6, forming the convex pattern 101 or holes, and filling the conductor 3 into the convex pattern 101 or holes by plating or the like (FIG. 1).
5 (g)).

Since the circuit board formed by such a process can form a large number of circuits in a small area, high density mounting becomes possible, and it is suitable for downsizing and speeding up of electronic devices, and thus vigorous development is possible. It is being advanced.

Regarding the plating process using an ultraviolet laser, the report of Shinna et al. (Appl.Phys.Lett.60 (21),
25 May 1992), the surface is roughened by irradiating with an ultraviolet laser, and the potential of the polymer surface changes, and by applying an appropriate metal catalyst in response to the potential change, It states that the catalyst can be adsorbed on the irradiated surface. For example, it has been reported that, by exposing the positively charged surface to ions and colloids of a metal catalyst having a negative charge by UV laser irradiation, the surface is activated and electroless plating becomes possible. However, changing the electric resistance value of the conductor pattern formed by irradiating with an ultraviolet laser,
No proposal has been made regarding a method of manufacturing a circuit board that facilitates multilayering.

Conventionally, before the step of forming the conductor 3 on the insulating material 6 by plating as shown in FIG.
It is always necessary to attach a metal as the plating nucleus 4 as shown in FIG. 15B, and the solution is adjusted in consideration of the easiness of reducing the metal. For example, FIG. 16 is an electroplating study group edition, plating textbook, published in September 1986, 2
It is a flowchart of the conventional electroless plating method shown on pages 33 to 235. In the figure, ST1 is a step of roughening the surface of the insulating material with a mixed solution of chromic acid and sulfuric acid, and ST2 is a step of removing the chromium on the surface. Step of removing, ST3 is step of adsorbing complex compound of palladium and tin on the surface, S
T4 is a step of removing tin and metallizing palladium, S
T5 is a step of forming a nickel layer.

Next, the operation will be described. First, for example, the surface of the insulating material is chemically roughened with a mixed liquid of chromic acid and sulfuric acid (ST1) and neutralized with concentrated hydrochloric acid to remove chromium on the surface (ST2). Then, a complex compound of palladium and tin is adsorbed on the surface of the insulating material by an aqueous solution in which palladium chloride, stannous chloride and concentrated hydrochloric acid are mixed (ST3),
Tin is removed by an accelerator such as sulfuric acid to metallize palladium to form a plating nucleus (ST4). PH consisting of nickel sulfate, sodium hypophosphite, and ammonium citrate
It is dipped in a mixed solution of about 8 to 9.5 to deposit and grow nickel on the surface of the insulating material to form plating by the nickel layer (ST5).

Further, in the step of embedding the metal of the conductor 3 in the finely formed holes as shown in FIG. 15 (f), electroless plating is generally used, and electroless plating is performed on the metal of the lower layer. A method of depositing a metal by reducing metal ions in the liquid to grow the metal is adopted.

According to such a method, when depositing a metal, a gas such as hydrogen is always generated along with the reduction reaction of metal ions. The generated gas rises along the side wall of the plating part, collects at the upper edge part, becomes a larger bubble and covers the upper part of the hole, and the phenomenon that the plating solution cannot enter the concave part occurs. FIG. 17 is a cross-sectional view showing a conventional plating process in a recess showing this phenomenon,
In the figure, 3 is a conductor, 4 is a plating nucleus, 6 is an insulating material, and 9
Is a substrate, and 24 is a bubble such as hydrogen. As shown in this figure, in the plating step, hydrogen is generated along with the reduction reaction of the metal ions, and hydrogen bubbles 24 are generated. Since the recesses are covered with the bubbles 24, it is impossible to plate the fine recesses or to fill the entire recesses. If the size of the recess is large, the gas can escape, but it is very difficult to plate fine holes and grooves.
The bubbles 24 could not be removed only by vibrating the substrate 9 and the liquid.

On the other hand, there were cases where a conductor could be formed in a relatively large concave portion without being obstructed by bubbles.
It was not possible to form conductors at the same height in more than one recess. FIG. 18 is a cross-sectional view showing a conventional plating process for recesses having different depths. In the figure, 3 is a conductor, 4 is a plating nucleus, 6 is an insulating material, 9 is a substrate, 102a is a shallow recess,
102b is a deep recess. FIG. 18A shows a shallow recess 1
02a is a cross-sectional view showing an example in which the conductor 3 is formed up to near the surface of the insulating material 6, and FIG. 18B is a cross-sectional view showing an example in which the conductor 3 is formed up to near the surface of the insulating material 6 in the deep recess 102b. is there. In FIG. 18A, the conductor 3 is formed up to the vicinity of the surface of the insulating material 6 in the shallow recess 102a, so that the deep recess 10 is formed.
2b, the conductor 3 is formed only partway, and the shallow recess 10
2a and the deep recess 102b have different conductor layer heights. In FIG. 18B, since the conductor 3 is formed up to the surface of the insulating material 6 in the deep recess 102b, the shallow recess 102a is excessively plated and grown. As described above, since it is not possible to advance the conductor growth in only one of the recesses, the conductor 3 cannot be formed at the same height in two or more recesses 102a and 102b having different depths.

Further, in the step of making a hole in the insulating material 6 with the laser 7 or the like as shown in FIGS. 15 (e) and 15 (f), the decomposed material 13 decomposed by the laser 7A or the like is the surface of the surrounding insulating material. Adhere to. In order to prevent the decomposed matter 13, a step of washing the decomposed matter 13, a step of pasting a cover material in advance, a step of applying a cover plate, and a step of peeling them off after processing are also adopted.

FIG. 19 shows a decomposed product 1 using a conventional cover material.
3A and 3B are cross-sectional views showing the adhesion preventing method of 3 in the order of steps, in which 6 is an insulating material, 7A is a laser, 8 is a mask, 9 is a substrate, 31 is a cover material, and 13 is a decomposed product. FIG. 19
19A is a sectional view of a step of irradiating the cover material 31 on the insulating material 6 with the laser 7A, and FIG. 19B is a sectional view of a step of removing the cover material 31 by the laser 7A.
19C is a cross-sectional view of a process of removing the insulating material 6 with the laser 7A while the decomposed product 13 is being generated, and FIG. 19D is a cross-sectional view of a process of removing the insulating material 6 with the laser 7A. 19E is a cross-sectional view showing the step of peeling the cover material.

Next, the operation will be described. The insulating material 6 is applied on the substrate 9. When the cover material 31 is laminated on the insulating material 6 and the laser 7A is radiated through the mask 8 on the insulating material 6 (FIG. 19A), the laser 7A will cover the cover material 3
1 is removed and transmitted (FIG. 19B). The polyimide generally used as the insulating material 6 is very laser
Since the absorption coefficient of A is high, the threshold energy density for removal is low, and the removal is performed by the laser light that has passed through the cover material 31. When the laser 7A removes the insulating material 6, the decomposed gas peels off the cover material 31, and the decomposed material 13 is embedded between the cover material 31 and the insulating material 6 (FIG. 19).
(C)). Decomposition product 1 even when the processing of insulating material 6 is completed
3 is between the cover material 31 and the insulating material 6 (see FIG. 19).
(D)). Then, the cover material 31 is peeled off from the insulating material 6 so that the decomposed material 13 is also removed (FIG. 19E).
However, since the decomposed material 13 enters between the insulating material 6 and the cover material 31 and is embedded in the insulating material 6, there are cases in which the decomposed material 13 cannot be removed even if it is washed after the cover material 31 is peeled off.

[0015]

Since the conventional circuit board is constructed and manufactured as described above, the steps of exposing and developing the resist material 28, attaching the plating nuclei 4 and the like are necessary. There are problems such as complexity,
When changing the electric resistance of the conductor pattern, it is necessary to change the pattern width, which causes a problem in that miniaturization is hindered. Further, since the conductor pattern is formed in the convex shape 101, when a multilayer substrate is manufactured, the convex portions of the conductor pattern of the lower layer affect the upper layer during the multi-layering process, and the protrusions are integrated to obtain the conductor. There are problems that the shape of the pattern collapses and the reliability decreases, and that a conductor pattern cannot be formed.

Further, only by modifying the surface of the polymer material by irradiating it with an ultraviolet laser, the surface potential differs depending on the material, and it is necessary to select a catalyst or an electroless plating solution, or the surface potential is insufficient. However, there is a problem in that some materials do not grow the desired conductor 3. In addition, since ordinary polymer materials are often positively charged, there are problems that the metal that is a cation cannot be directly attached and that the attachment speed is slow.

Further, since the holes are covered with the bubbles 24, there are problems that the fine recesses cannot be plated or the entire recesses cannot be filled. Further, there is a problem that the conductor 3 cannot be formed at the same height in two or more recesses 102a and 102b having different depths. Further, although a cleaning process is provided to remove the decomposed material 13 generated during the processing of the laser 7, there is a problem that the cleaning requires a long time. In addition, the decomposition product 1 on the insulating material 6
In order to prevent the adhesion of No. 3, the method of pasting the cover material 31 on the insulating material 6 in advance has been taken, but no measures have been taken to remove the cover material 31, There was a problem that the decomposition product 13 could not be completely removed.

The inventions of claims 1 and 3 have been made to solve the above-mentioned problems. The protrusion of the conductor pattern can be eliminated, excessive growth of plating can be prevented, and the circuit layer can be formed. It is an object of the present invention to provide a circuit board and a method of manufacturing the circuit board, which can be multilayered easily by being flattened.

It is an object of the present invention to provide a method of manufacturing a circuit board, which can simplify the plating process in addition to flattening the circuit layer.

According to the invention of claim 5, in addition to the fact that the circuit layer can be flattened and the plating process can be simplified, the electric resistance can be changed without changing the width of the conductor pattern, which enables miniaturization and further the formation of a conductive hole. An object of the present invention is to provide a circuit board which can be processed simultaneously with a circuit layer and can be simplified in the process, and a manufacturing method thereof.

According to the invention of claim 6, in addition to the fact that the circuit layer can be flattened and the plating process can be simplified, the electrical resistance can be changed by a simple process without largely changing the conductor pattern width, and miniaturization is possible. An object of the present invention is to provide a method of manufacturing a circuit board.

It is an object of the inventions of claims 2, 7 and 8 to provide a method of manufacturing a circuit board, in which a circuit layer can be planarized and a plating step is simplified to enable selective plating. .

The ninth aspect of the present invention provides a method for manufacturing a circuit board, which can flatten a circuit layer, simplify the plating process, and remove unnecessary substances such as decomposed products to improve reliability. With the goal.

According to the tenth aspect of the invention, in addition to the fact that the circuit layer can be flattened, the plating process can be simplified, unnecessary substances such as decomposed substances can be removed to improve reliability, and the decomposed substances can be made of resin and an insulating material. It is an object of the present invention to provide a method for manufacturing a circuit board, which is capable of preventing the circuit board from entering the interface.

It is an object of the inventions of claims 11 and 12 to provide a method of manufacturing a circuit board, which can simplify the plating process and improve the plating rate in addition to the fact that the circuit layer can be flattened.

It is an object of the inventions of claims 13 and 14 to provide a method of manufacturing a circuit board in which the circuit layer can be flattened and the board area can be reduced by plating even if the pattern is fine.

[0027]

A circuit board according to a first aspect of the present invention is characterized in that an insulating material is processed by removing a concave pattern or a hole to a desired depth, and a conductor is embedded in the concave pattern or the concave portion of the hole. There is something.

In the circuit board according to the invention of claim 2, concave patterns or holes are formed in the insulating material containing metal particles, and these concave portions are filled with a conductor.

In the method of manufacturing a circuit board according to a third aspect of the present invention, the concave pattern or hole is removed from the insulating material by plasma etching, and the metal is attached by utilizing the charge accumulated in the concave portion of the concave pattern or hole. Then, the conductor is embedded in the recess by electroless plating or by using electrolytic plating in combination.

In the method of manufacturing a circuit board according to a fourth aspect of the present invention, the insulating material is irradiated with an ultraviolet laser to remove the concave pattern or the hole, and the charge accumulated in the concave portion of the concave pattern or the hole is used. A conductor is made to adhere to the concave portion by adhering a metal and using electroless plating or further electrolytic plating.

In the method of manufacturing a circuit board according to a fifth aspect of the present invention, the insulating material is irradiated with an ultraviolet laser through a first mask having a first pattern to form a concave pattern or hole having a desired depth. The second mask having a second pattern different from the first pattern is used to irradiate the insulating material with an ultraviolet laser to form concave patterns or holes having different depths.

In the method of manufacturing a circuit board according to the sixth aspect of the present invention, the insulating material is irradiated with an ultraviolet laser at an energy density capable of obtaining a desired depth through a mask having a pattern width or hole diameter of a desired size. As a result, concave patterns or holes having different depths are formed by one irradiation.

In the method of manufacturing a circuit board according to a seventh aspect of the present invention, a gas containing metal is irradiated with an ultraviolet laser on an insulating material to remove concave patterns or holes, and the metal of gas is attached to the concave. It is a thing.

In the method for manufacturing a circuit board according to the present invention, an insulating material containing metal particles is irradiated with an ultraviolet laser to form a concave pattern or holes, and at the same time, the metal particles are exposed in the concave portions, and electroless electrolysis is performed. The conductor is embedded in the recess by plating or by using electrolytic plating in combination.

In the method for manufacturing a circuit board according to the invention of claim 9, a resin soluble in a solvent is applied on the insulating material, and an ultraviolet laser is irradiated to remove the resin and the insulating material to form a concave pattern. Alternatively, a hole is formed, a conductor is embedded in the recess by electroless plating or further electrolytic plating, and then the resin is dissolved in a solvent to remove unnecessary substances adhering to the resin surface.

According to a tenth aspect of the present invention, in a method for manufacturing a circuit board, a resin having an absorption coefficient of ultraviolet laser which is the same as or higher than that of an insulating material is applied onto the insulating material, and the ultraviolet laser is irradiated to insulate the resin from the resin. The material is removed to form a concave pattern or holes.

According to the eleventh aspect of the present invention, there is provided a method of manufacturing a circuit board, wherein an ultraviolet laser is irradiated while feeding a charged gas to form a concave pattern or hole, and at the same time, the concave portion is charged and metal is attached to the concave portion. The conductor is embedded in the recess by using electroless plating or further electrolytic plating.

According to a twelfth aspect of the present invention, in a method of manufacturing a circuit board, a resin is applied on an insulating material, and an ultraviolet laser is irradiated to form a concave pattern or holes in the resin and the insulating material.
The surface of the resin and the insulating material is charged by applying a DC voltage to this circuit board and discharging between the electrodes.

In the circuit board manufacturing method according to the thirteenth aspect of the present invention, in the plating step of filling the conductor in the recess formed in the insulating material, the bubbles installed by moving or vibrating the bar installed above the insulating material are removed. While depositing the conductor.

In the method for manufacturing a circuit board according to the fourteenth aspect of the present invention, the bar is the anode and the recess is the cathode, and the conductor is deposited.

[0041]

According to the circuit board of the first aspect of the present invention, since a concave pattern or hole is formed in the insulating material and is filled with the conductor, a layer without unevenness can be formed.

According to the circuit board of the second aspect of the present invention, when the insulating material containing the metal particles is irradiated with the ultraviolet laser, the concave pattern or the hole is processed, and at the same time, the metal particles are projected on the surface of the concave portion. It becomes possible to perform electroless plating by using as a nucleus and selectively deposit a conductor.

According to the method of manufacturing a circuit board in the third aspect of the present invention, since a concave pattern or hole is formed in the insulating material and the conductor is embedded, a layer without irregularities can be formed.

According to the method of manufacturing a circuit board in the fourth aspect of the present invention, since the insulating material is irradiated with the ultraviolet laser, positive or negative charges are accumulated in the concave portion and are immersed in the negative or positive metal catalyst liquid. By doing so, the metal can be adhered only to the recesses, which enables plating and allows the conductor to grow to the surface of the insulating material or to the vicinity of the surface to form a layer without unevenness.

According to the method of manufacturing a circuit board in the fifth aspect of the present invention, the insulating material is irradiated with the ultraviolet laser by using the first mask, and the second mask is further inserted or replaced, and the insulating material is irradiated with the ultraviolet laser. As a result, concave patterns or holes having different depths can be removed.

According to the method of manufacturing a circuit board in the sixth aspect of the present invention, the insulating material is formed by using an ultraviolet laser having an energy density capable of obtaining a desired depth using a mask having a pattern width or hole diameter of a desired size. Since the removing process is performed, the insulating material can be removed to a desired depth, and concave patterns or holes having different depths can be obtained by one irradiation.

According to the method of manufacturing a circuit board in the seventh aspect, when a gas containing a metal is irradiated with an ultraviolet laser, photolysis or thermal decomposition occurs, gas molecules are dissociated, and a metal component is liberated. Since the metal component is adsorbed in the concave portion to become a metal, this enables electroless plating and selectively deposits a conductor.

According to the method of manufacturing a circuit board in the invention of claim 8, when the insulating material containing the metal particles is irradiated with the ultraviolet laser, the concave pattern or the hole is processed and at the same time, the metal particles are projected on the surface of the concave portion. Therefore, electroless plating can be performed using this as a plating nucleus, and the conductor can be selectively deposited.

According to the method of manufacturing a circuit board of the ninth aspect of the invention, when an ultraviolet laser is applied to an insulating material coated with a solvent-soluble resin in advance, the resin and the insulating material are removed to form a concave pattern or A hole is formed. A metal can be attached to this recess by using the electric charge accumulated by the ultraviolet laser, and even when the desired electric charge cannot be accumulated by the ultraviolet laser, the plating nuclei can be formed by using the conventional plating nucleation step. , Without being limited to the material
Metals can be deposited. This allows electroless plating to form conductors, and since the resin dissolves in the solvent after the plating process, it is possible to remove the plating formed at locations other than the desired location when using the conventional plating nucleation method. Also, because the decomposed products generated when processed with an ultraviolet laser adhere to the resin instead of the insulating material,
The resin can be removed at the same time in the step of dissolving it in a solvent, and in the completed substrate, an unnecessary substance such as a decomposed product on the insulating material does not adhere and a layer having no unevenness can be formed.

According to the method of manufacturing a circuit board of the tenth aspect of the present invention, in the step of irradiating an ultraviolet laser to remove the resin and the insulating material, a resin having an absorption coefficient which is the same as or higher than that of the insulating material is used. The ultraviolet laser does not easily pass through the resin, and after the resin is removed, the ultraviolet laser reaches the insulating material and removes the insulating material, so the decomposed product enters the interface between the resin and the insulating material and the decomposed product remains outside the irradiated part. There is no. Further, if the resin is removed after the conductor is embedded, an unnecessary plating layer and unnecessary substances such as laser-decomposed products can be removed, and a layer without unevenness can be formed.

According to the method of manufacturing a circuit board in the invention of claim 11, when the ultraviolet laser is irradiated while feeding the charged gas, the concave pattern or the hole is removed in the insulating material, and at the same time, the electric charge is generated in the concave portion. It can accumulate and charge the recess. When this is brought into contact with a solution containing metal ions, the metal ions are reduced at a high rate to become metal. By using this attached metal, electroless plating becomes possible and a conductor can be formed. Further, when the charge is stable and sufficiently large, the metal ions in the electroless plating solution can be grown as they are.

According to the method of manufacturing a circuit board in the twelfth aspect of the invention, a concave pattern or a hole is formed in an insulating material coated with a resin by an ultraviolet laser, and then a DC voltage is applied to the circuit board to discharge between electrodes. By doing so, electrons are emitted from the negative electrode, and the surfaces of the resin and the insulating material are charged. Therefore, when a metal ion is brought into contact with this, the metal can be reduced to a metal at a stable and fast rate, and the metal can be attached.
By immersing this in an electroless plating solution, a conductor can be formed. If the charge is stable and sufficiently large, the metal ions in the electroless plating solution can be grown as they are.

According to the method of manufacturing a circuit board in the thirteenth aspect of the present invention, when plating is performed to fill the conductor in the recess formed in the insulating material, a gas such as hydrogen is generated by the reduction reaction that occurs in the plating solution. However, by vibrating or moving the bar installed on top of the insulating material, the gas can always escape from the surface of the insulating material, so that it is possible to prevent the growth of bubbles to cover the recess and prevent the plating solution from being deposited on the recess. Since it can be wrapped around, plating can be stably performed even in a fine portion.

According to the method for manufacturing a circuit board in the fourteenth aspect of the present invention, when plating is performed to embed the conductor in the recess formed in the insulating material, the bar installed above the insulating material for removing bubbles. Vibrate or move
When electrolytic plating is performed using the recess as the cathode and the bar as the anode,
When the metal grown in the recess serving as the cathode hits the bar serving as the anode, a current does not flow through the plating solution, and the plating does not grow any more. Therefore, excessive plating growth protruding from the surface of the insulating material can be prevented.

[0055]

【Example】

Example 1. An embodiment of the inventions of claims 1 and 3 will be described below with reference to the drawings. FIG. 1 is a cross-sectional view showing a circuit board and a method for manufacturing the same according to a first embodiment in the order of steps, in which 1 is a concave pattern, 1A is a conductor pattern, 2 is a conduction hole, 3 is a conductor, 4 is a plating nucleus. Metal, 6 is an insulating material, 8 is a mask, 9 is a substrate, 12 is resin, 27 is light, 2
Reference numeral 8 is a photosensitive resist material, and 29 is a metal serving as a mask. 1A is a sectional view of a step of exposing the photosensitive resist material 28, and FIG. 1B is a sectional view of a step of developing the photosensitive resist material 28 to form a desired pattern on the metal 29. 1 (c) is a cross-sectional view of a step of forming a concave pattern processing mask 29 by wet etching the metal 29, and FIG. 1 (d) shows the concave pattern 1 by dry etching, leaving only the portion covered with the metal 29. A cross-sectional view of the process, FIG. 1E shows a conductor pattern 1A in which a metal is grown to the surface of the insulating material 6 by electroless plating after forming a plating nucleus.
1F is a cross-sectional view of a step of removing the metal 3A formed on a portion other than a desired pattern by removing the resin 12, and FIG. 1 (g) is a cross-sectional view showing a step of forming a multilayer, and the second layer has a hole formed in the same step as described above and the recessed part of the hole is filled with a conductor 3 for conduction. The layer in which the hole 2 is formed, the third layer is the layer in which the conductor pattern 1A is formed in the same step as described above, and the fourth layer is the layer in which the conductive hole 2 to be a terminal is formed in the same step as described above. is there.

Next, the operation will be described. Insulating material 6, resin 12, metal 29, photosensitive resist material 28 on substrate 9
Are stacked. First, the resist material 28 is exposed to the light 27 through the mask 8 (FIG. 1A), and then the resist material 2 is exposed.
8 is developed to form a desired pattern on the metal 29 (FIG. 1 (b)), and further wet etching is performed to form the metal 29.
Is a mask used for processing the concave pattern 1 (FIG. 1C). Resin 1 that is not covered with metal 29 when dry-etched with, for example, oxygen plasma 1
2. The insulating material 6 is removed, only the portion covered with the metal 29 remains, and the concave pattern 1 is processed (FIG. 1D).
Next, after forming plating nuclei on the surface of the processed portion (recess),
The conductor 3 which is a metal is grown up to the surface of the insulating material 6 by electroless plating to form the conductor pattern 1A. At this time, the resin 12 coated on the insulating material 6 serves as a cover for protecting the insulating material 6 from the excessively formed metal 3A (see FIG. 1).
(E)). By removing the resin 12, the metal 3A formed on the portion other than the desired pattern is removed, and the formation of the first-layer conductor pattern 1A is completed. This layer has a uniform surface without irregularities (FIG. 1 (f)). The insulating material 6 is applied by the same process as described above to form a uniform layer having the conductive holes 2 connecting the layers, and then the insulating material 6 is applied by the same process as described above and the conductor pattern 1A is provided again. If a uniform layer is formed and then the insulating material 6 is applied by the same process as described above to form a uniform layer having the conductive holes 2 to serve as terminals, the surface of each layer is flat without unevenness. It is possible to stably manufacture a multilayered substrate without breaking. (FIG. 1 (g)).

In the step of forming the conductor 3 in the present invention (FIG. 1 (e)), in the step of using electroless plating, electroplating may be used after forming the thin conductor pattern 1A by electroless plating. The conductor 3 may be made of a material that conducts electricity, and is, for example, copper, nickel, chromium, silver, gold or the like. Examples of the solution containing the metal 4 serving as a plating nucleus include palladium chloride and the first chloride.
Although there is a catalyst solution containing both tin, an activator solution containing palladium chloride may be used after the sensitizing solution containing stannous chloride has been detreated. After being immersed in these solutions, unnecessary metals may be removed with an accelerator solution such as sulfuric acid, and palladium may be reduced to metallize. As the electroless plating solution, for example, nickel plating can be performed by using a mixed solution of nickel sulfate, sodium hypophosphite, and ammonium citrate having a pH of about 8 to 9.5.

The plating process may be stopped when the insulating material 6 has grown to the vicinity of the surface, but it may be grown excessively from the surface and removed by polishing or the like to eliminate the unevenness. Alternatively, it may be dissolved with an etching solution. The insulating material 6 may be a material having a good insulating property and easy to apply, but a polymer material such as polyimide or epoxy resin is generally used. An inorganic material such as ceramic may be used, or a green sheet made of an organic material and an inorganic material may be used. The metal mask 29 may be patterned so long as it is hard to be removed in the step of removing the insulating material 6 by dry etching, and aluminum or the like is used. However, if a general metal is used, the insulating material can be selectively used. Can be removed. Further, the resin 12 is not particularly removed when patterning the metal 29, and is not particularly limited as long as it is easily removed when the concave pattern 1 is processed and can be easily removed after the conductor 3 is formed. What was melt | dissolved with the solvent, a laminated film, etc. may be used.

Further, the method of manufacturing a circuit board according to the present invention can form a uniform layer having no irregularities, which is advantageous for forming a multilayer, but may be formed by only one layer.

Example 2. An embodiment of the invention of claim 4 will be described with reference to the drawings. 2A to 2C are cross-sectional views showing a method of manufacturing a circuit board according to a second embodiment in the order of steps.
Is an electric charge accumulated in the concave portion when the ultraviolet laser 7 is irradiated. FIG. 2A is a sectional view showing a step of irradiating the insulating material 6 through the mask 8 with an ultraviolet laser 7 to process the concave pattern 1, and FIG. 2B is a sectional view showing charges 5 accumulated in the processed portion (recess). 2 is a cross-sectional view showing the step of reducing the metal ions in the metal catalyst by using the metal and attaching the metal 4 to the processed portion.
(C) is a cross-sectional view showing a step of growing the deposited metal 4 to the surface of the insulating material 6 by electroless plating to form the conductor pattern 1A, which is a cross-sectional view in which formation of the first-layer conductor pattern 1A is completed, FIG. 2 (d) is a cross-sectional view showing a step of forming a multi-layer, and the second layer is a layer in which holes are formed by the same steps as described above and the recesses of the holes are filled with conductors 3 to form conductive holes 2. And
The third layer is a layer in which the conductor pattern 1A is formed in the same process as described above, and the fourth layer is a layer in which the conductive holes 2 to be terminals are formed in the same process as described above.

Next, the operation will be described. The insulating material 6 is applied on the substrate 9. First, the insulating material 6 is irradiated with the ultraviolet laser 7 through the mask 8. The insulating material 6 is a mask 8
By the ultraviolet laser 7 which is partially shielded and irradiated by
At the same time as the concave pattern 1 is processed, a positive charge 5 is accumulated due to high photon energy (FIG. 2).
(A)). When immersed in a metal catalyst solution having an opposite charge, the accumulated charge 5 causes the negative ions e ⁻ in the metal catalyst to be adsorbed to the processed portion, which immediately causes the metal ion M ^+.
Is reduced, and metal 4 is deposited only on the processed part (Fig. 2).
(B)). Electroless plating can be performed by using this metal 4 as a plating nucleus to grow the conductor 3 only on the concave pattern 1. When the conductor 3 is formed up to the vicinity of the surface of the insulating material 6, a uniform layer having the conductor pattern 1A and no irregularities is formed. This completes the first layer (Fig. 2
(C)). The insulating material 6 is applied by the same process as described above to form a uniform layer having the conduction hole 2 connecting the layers, and then the insulating material 6 is applied by the same process as described above and the conductor pattern 1A is provided again. If a uniform layer is formed, and then the insulating material 6 is applied by the same process as described above to form a uniform layer having the conductive holes 2 to be terminals, the surface of each layer is flat without unevenness. Thus, it is possible to stably manufacture a multilayered substrate (FIG. 2D).

In the present invention, the ultraviolet laser 7 may be irradiated onto the mask 8 which is in close contact with the insulating material 6.
The mask 8 separated from may be irradiated. Irradiation may be performed by using a transfer optical system in which a lens is provided between the mask 8 and the insulating material 6 to form an image. The solution to which the metal 4 is attached is, for example, a negatively charged aqueous solution of palladium colloid. Further, the ultraviolet laser 7 is not particularly limited, but an excimer laser having a low heat damage and capable of high quality removal, a short wavelength laser such as a YAG harmonic, or a short pulse laser is preferable. For example, when a KrF excimer laser is used, energy of several tens mJ / cm1 ² to several tens J / cm ² may be used to remove the insulating material 6 formed of polyimide.

Example 3. Another embodiment of the invention of claim 4 will be described with reference to the drawings. 3A to 3C are cross-sectional views showing a method of manufacturing a circuit board according to a third embodiment in the order of steps, wherein the second embodiment is used in the step of forming the metal mask 29 of the first embodiment. FIG. 3A is a cross-sectional view showing a step of irradiating an ultraviolet laser 7 to process the concave pattern 1 on the resin 12 provided on the insulating material 6, and FIG. 3C is a cross-sectional view showing a step of growing the deposited metal 4 to the surface of the resin 12 by electroless plating to form a mask of the metal 29, FIG.
FIG. 3D is a cross-sectional view showing a step of processing the concave pattern 1 by removing the resin 12 and the insulating material 6 by dry etching the insulating material 6, and FIG. 3E is an electroless method after forming a plating nucleus. FIG. 3F is a cross-sectional view showing the step of growing the conductor 3 to the surface of the insulating material 6 by plating to form the conductor pattern 1A. FIG. 3 (f) shows the metal 3A formed on the portion other than the desired pattern by removing the resin 12. 3 (g) is a cross-sectional view showing a step of removing the conductive pattern 1A of FIG.
Is a cross-sectional view showing a step of forming a multilayer, the second layer is a layer in which a hole is formed in the same step as described above and the recessed part of the hole is filled with a conductor 3 to form a conduction hole 2. The eye is a layer in which the conductor pattern 1A is formed in the same step as described above, and the fourth layer is a layer in which the conductive hole 2 to be a terminal is formed in the same step as described above.

Next, the operation will be described. The insulating material 6 is applied on the substrate 9, and the resin 12 is applied on the insulating material 6. The ultraviolet laser 7 is passed through the mask 8 and the resin 12
To irradiate. The ultraviolet laser 7 is partially shielded by the mask 8 to process the concave pattern 1 in the resin 12, and at the same time, the high photon energy causes the charge 5 to be accumulated in the processed portion (FIG. 3A). Using the accumulated charge 5, the metal 4 can be deposited only on the processed portion (FIG. 3B), electroless plating can be performed, and the metal mask 29 can be formed (FIG. 3).
(C)). In the first embodiment, the metal 29 is exposed to the resist material.
Although it is formed by development and wet etching, it is formed by ultraviolet laser 7 and electroless plating in this embodiment. When the resin 12 and the insulating material 6 are etched by oxygen plasma or the like using the metal 29 formed here, a concave pattern 1 is obtained (FIG. 3D), and plating nuclei are formed on this to form electroless plating. When the conductor 3 is formed up to the vicinity of the surface of the insulating material 6 (FIG. 3E) and the resin 12 coated on the insulating material 6 is removed, the metal 3A excessively formed on the resin 12 can also be removed. A uniform layer having no irregularities on which the pattern 1A is formed is formed (FIG. 3F).
The insulating material 6 is applied by the same process as described above to form a uniform layer having the conduction hole 2 connecting the layers, and then the insulating material 6 is applied by the same process as described above and the conductor pattern 1A is provided again. If a uniform layer is formed, and then the insulating material 6 is applied by the same process as described above to form a uniform layer having the conductive holes 2 to be terminals, the surface of each layer is flat without unevenness. It is possible to stably manufacture a multilayered substrate (FIG. 3 (g)).

Example 4. An embodiment of the invention of claim 5 will be described with reference to the drawings. 4A to 4C are cross-sectional views showing a method of manufacturing a circuit board according to a fourth embodiment in the order of steps.
0 is a first mask having a first pattern, 11 is a second mask having a second pattern, 102a is a shallow recess, and 102b is a deep recess. FIG. 4A shows an ultraviolet laser 7 through a first mask 10 having a first pattern.
Of the second mask 11 having a second pattern different from the first pattern of the first mask 10 is shown in FIG. 4B. And irradiating the insulating material 6 with an ultraviolet laser 7 to process the concave pattern 1 to form the concave portions 10 having different depths.
4A and 4B are cross-sectional views showing the steps of forming 2a and 102b.
(C) shows the metal 4 attached to the processed part and the attached metal 4
Is a cross-sectional view showing the step of growing the conductor pattern 1A by electroless plating to the surface of the insulating material 6, and FIG. 4D is a cross-sectional view showing the step of forming a multilayer. In the same process, the first mask 10 and the second mask 11
Is used to irradiate an ultraviolet laser 7 to process the concave pattern 1 and the holes, and then the concave portions thereof are filled with the conductor 3, and the third layer is a layer in which the conductive holes 2 to be terminals are formed.

Next, the operation will be described. The insulating material 6 is applied on the substrate 9. The insulating material 6 is irradiated with the ultraviolet laser 7 through the first mask 10 having the first pattern. The ultraviolet laser 7 is partially shielded by the first mask 10 to process the concave pattern 1 on the insulating material 6, and at the same time, accumulates the electric charge 5 in the processed portion by high photon energy (FIG. 4A). Further, by inserting a second mask 11 having a second pattern that covers the recesses reaching the desired depth in the above step and irradiating with an ultraviolet laser, a recessed pattern having recesses 102a and 102b of different depths. To process. In this embodiment, since the depths of the recesses are different, the electric resistance can be changed not by the pattern width but by the depth. At the same time, the electric charge 5 is accumulated in the processed portion (FIG. 4 (b)). Metal 4 is applied only to the machined part by using charge 5.
Since it can be deposited, the conductor 3 can be grown only in the concave portion by using this as a plating nucleus. Further, when a conductor is formed up to the vicinity of the surface of the insulating material 6, a layer having a uniform surface with no unevenness on which the conductor patterns 1A having different depths are formed is formed (FIG. 4C). The insulating material 6 is applied by the same process as the above, and the ultraviolet laser 7 is irradiated using the first mask 10 and the second mask 11 to form the concave pattern 1 and the holes, and the concave portions thereof are filled with the conductor 3. When a uniform layer having the pattern 1A and the conductive holes 2 is formed, and then an insulating material 6 is applied to form a uniform layer having the conductive holes 2 to serve as terminals, the surface of each layer is flat without unevenness. Therefore, it is possible to stably manufacture a multilayered substrate (FIG. 4D).

Example 5. An embodiment of the invention of claim 6 will be described with reference to the drawings. FIG. 5 is a cross-sectional view showing a method of manufacturing a circuit board according to a fifth embodiment in the order of steps.
Reference numeral 5 is a mask having a desired pattern width or hole diameter. FIG. 5A shows a mask 3 in which a pattern width is designed in advance on the insulating material 6 so as to obtain a desired depth.
5, a step of irradiating an ultraviolet laser 7 at a desired energy density, removing the insulating material 6 to a desired depth, processing the concave pattern 1 having concave portions having different depths, and charging the processed portion at the same time. FIG. 5B is a cross-sectional view showing a conductor pattern in which a metal 4 is attached to the processed portion by using the electric charge 5 accumulated in the processed portion and the conductor 3 is grown to the surface of the insulating material 6 by electroless plating. 1A is a cross-sectional view showing a step of forming 1A, which is a cross-sectional view in which formation of the first-layer conductor pattern 1A is completed,
FIG. 5C is a cross-sectional view showing a step of forming a multilayer,
The second layer is a layer in which an ultraviolet laser 7 is irradiated in the same process as described above to form a hole and then the hole is filled with a conductor 3 to form a conduction hole 2.

Next, the operation will be described. The insulating material 6 is applied on the substrate 9. When the insulating material 6 is irradiated with the ultraviolet laser 7 at a relatively low energy density through the mask 35 having a changed pattern width, the concave portion of the pattern becomes thin in the depth direction, and the depth does not advance even if the irradiation is repeated. It is possible to process concave patterns with different depths. That is, a concave pattern having different depths can be formed by one irradiation. The electric resistance can be changed by changing this depth. At the same time as the processing, the electric charge 5 is accumulated in the processed portion (FIG. 5A). Since the metal 4 is deposited only on the processed portion by utilizing the electric charge 5, the conductor 3 can be grown only on the concave pattern 1 by using this as a plating nucleus. Further, when the conductor is formed up to the vicinity of the surface of the insulating material 6, a uniform layer having no irregularities on which the conductor pattern 1A is formed is formed (FIG. 5B). Further, next, a uniform layer having the conduction holes 2 for connecting the layers, which is manufactured in the same manner as the above-described step, is formed, and when this is repeated, the surface of each layer is flat without unevenness, and a stable multilayer is formed. The manufactured substrate can be manufactured (FIG. 5C).

Further, since the plating according to the present invention is formed in the licking direction, it is difficult to stop it near the surface of the insulating material 6. Therefore, the plating is excessively grown from the surface and scraped by polishing or the like to eliminate unevenness. Good.

The pattern depth depends on the material, the width of the pattern, or the processing energy density. When polyimide is used as the insulating material 6, for example, the mask 35 is set to have a pattern width of 10 μm. By irradiating the ultraviolet laser 7 with an energy density of about 0.3 J / cm ² , a depth of about 10 microns is obtained and a mask 35 set to have a pattern width of 20 microns.
Is irradiated with the ultraviolet laser 7 at an energy density of about 0.3 J / cm ² , a depth of about 25 microns is obtained.

Example 6. An embodiment of the invention of claim 7 will be described with reference to the drawings. FIG. 6 is a cross-sectional view showing a method of manufacturing a circuit board according to a sixth embodiment in the order of steps.
2 is an organic gas containing a metal (a gas containing a metal),
33 is the decomposed organic component. In FIG. 6A, while flowing the metal-containing organic gas 32, the insulating material 6 is irradiated with the ultraviolet laser 7 through the mask 8 to process the concave pattern 1 and at the same time decompose the gas 32, Sectional drawing which shows the process of attaching 4 A of metal components to a process part, FIG.
(B) is a cross-sectional view showing a step of growing a metal to the surface of the insulating material 6 by electroless plating using the metal component 4A attached to the processed portion as a plating nucleus to form the conductor pattern 1A. FIG. 6 is a cross-sectional view in which formation of 1A is completed.
(C) is a cross-sectional view showing a step of forming a multilayer, the second layer is a layer in which holes are formed in the same step as described above and the holes are filled with conductors 3 to form conductive holes 2. The fourth layer is a layer in which the conductor pattern 1A is formed in the same process as described above, and the fourth layer is a layer in which the conductive holes 2 to be terminals are formed in the same process as described above.

Next, the operation will be described. The insulating material 6 is applied on the substrate 9. Organic gas containing metal 32
When the insulating material 6 is irradiated with the ultraviolet laser 7 through the mask 8 while introducing the above, the concave pattern 1 is formed on the insulating material 6. At this time, the molecules of the gas 32 are dissociated, and the organic component 3
3 and the metal component 4, the organic component 33 is vaporized, and the metal component 4A is adsorbed to the processed portion of the concave pattern 1 (FIG. 6).
(A)). Electroless plating is performed using this metal component 4A as a plating nucleus. Here, since the metal component 4A serves as a plating nucleus and enables electroless plating, the plating process is simplified. Furthermore, since the metal component 4A is adsorbed only on the processed portion of the concave pattern 1, the conductor 3 can be selectively grown only on the concave portion of the concave pattern 1. When the conductor 3 is formed up to the vicinity of the surface of the insulating material 6, a uniform layer having the conductor pattern 1A and no unevenness is formed (FIG. 6B). The insulating material 6 is applied by the same process as described above to form a uniform layer having the conduction hole 2 connecting the layers, and then the insulating material 6 is applied by the same process as described above and the conductor pattern 1A is provided again. A uniform layer is formed, and then, the insulating material 6 is applied by the same process as described above to form the conductive holes 2 to be terminals.
When a uniform layer having the above is formed, the surface of each layer is flat without unevenness, so that it is possible to stably manufacture a multilayered substrate (FIG. 6C).

The metal-containing organic gas 32 in the present invention may be of any kind.
Cr (CO) ₆ , Mo (CO) ₆ , W (CO) ₆ , (C
₅ H ₅ ) Fe, (C ₅ H ₅ ) Ni, Al (CH ₃ ) ₃ ,
_{Zn (CH 3) 3, Cd} (CH 3) 2, the like is used, each Cr, Mo, W, Fe, Ni, Al, Z
n, Cd, etc. can be attached. Further, TiCl ₄ or the like may be used as long as the metal component can be dissociated even if it is not an organic gas. Further, the metal component 4A to be attached may be different from the conductor 3.

Example 7. An embodiment of the inventions of claims 2 and 8 will be described with reference to the drawings. 7A to 7D are cross-sectional views showing a method of manufacturing a circuit board according to a sixth embodiment in the order of steps,
In the figure, 34 is an insulating material containing metal particles.
7A is a step of applying the insulating material 6 not containing the metal particles 4B onto the insulating material 34 mixed with the metal particles 4B, and FIG. 7B is a process of passing the mask 8 through the mask 8 and applying an ultraviolet laser to the insulating material 6. Insulating material 6 that does not mix metal particles 4B by irradiating 7
7 is a cross-sectional view showing a step of removing the insulating material 34 mixed with the metal particles 4B and processing the concave pattern 1 and simultaneously exposing the metal particles 4B in the insulating material 34 to the processed portion.
(C) is a cross-sectional view showing a step of forming a conductor pattern 1A by growing a metal serving as a conductor to the surface of the insulating material 6 by electroless plating using the metal exposed in the processed portion as a plating nucleus.
FIG. 7 is a cross-sectional view in which formation of the conductor pattern 1A of the second layer is completed.
(D) is a cross-sectional view showing a step of forming a multilayer, and the second layer is a layer in which holes are formed in the same step as described above and the holes are filled with conductors 3 to form conductive holes 2. The fourth layer is a layer in which the conductor pattern 1A is formed in the same process as described above, and the fourth layer is a layer in which the conductive holes 2 to be terminals are formed in the same process as described above.

Next, the operation will be described. Metal particle 4B
The insulating material 6 in which the metal particles 4B are not mixed is applied to the insulating material 34 in which the metal particles 4B are mixed (FIG. 7A). Insulating material 6 and mask 8
When the ultraviolet laser 7 is irradiated therethrough, the insulating material 6 and the insulating material 34 are removed and the concave pattern 1 is formed. At this time, the metal particles 4B in the insulating material 34 are exposed on the processed portion (FIG. 7B). Using this metal component 4B as a plating nucleus,
Perform electroless plating. Here, the metal component 4B serves as a plating nucleus, which enables electroless plating, thereby simplifying the plating process. Furthermore, since the metal component 4B projects only in the processed portion of the concave pattern 1, the conductor 3 can be selectively grown only in the concave portion of the concave pattern 1.
When the conductor 3 is formed up to the vicinity of the surface of the insulating material 6, a uniform layer having the conductor pattern 1A and no unevenness is formed (FIG. 7C). Next, the insulating material 34 and the insulating material 6 are applied by the same process as described above to connect the layers to each other to form the conduction hole 2.
A uniform layer having the concave pattern 1 is formed again by applying the insulating material 34 and the insulating material 6 by the same process as described above. When the insulating material 34 and the insulating material 6 are applied by the step of (1) to form a uniform layer having the conduction holes 2 to be terminals, the surface of each layer is flat without unevenness, so that a stable multilayered substrate can be obtained. It can be manufactured (FIG. 7 (d)).

The metal particles 4B in the present invention may be of any kind, for example, Cr, Ni, A
l, Cu, or the like may be used. Mixed metal particles 4B
May be different from the conductor 3. The insulating material 34 in which the metal particles 4B are mixed is not particularly limited, but polyimide or epoxy resin may be used.

Example 8. An embodiment of the invention of claim 9 will be described with reference to the drawings. 8A to 8D are cross-sectional views showing a method of manufacturing a circuit board according to the eighth embodiment in the order of steps. FIG. 8A is a cross-sectional view showing a step of applying a solvent-soluble resin 12 onto the insulating material 6, and FIG. 8B is a diagram showing the resin 12 irradiated with an ultraviolet laser 7 through a mask 8. 12 and insulating material 6 are removed,
Sectional drawing which shows the process of processing the concave pattern 1, FIG.
8C is a cross-sectional view showing a step of forming the conductor pattern 1A by growing the deposited metal 4 to the surface of the insulating material 6 by electroless plating by using the charge 5 accumulated in the processed portion.
(D) is a cross-sectional view showing a step of dissolving the resin 12 with a solvent and removing the decomposed material 13 (unnecessary material) generated during the processing of the concave pattern 1 and adhering to the resin. The completed cross-sectional view, FIG. 8E is a cross-sectional view showing the step of forming the multilayer structure, and the second layer is formed with a hole in the same step as described above and the hole is filled with the conductor 3 to form the conduction hole 2. The third layer is a layer in which the conductor pattern 1A is formed in the same step as described above, and the fourth layer is a layer in which the conductive hole 2 serving as a terminal is formed in the same step as described above.

Next, the operation will be described. The insulating material 6 is applied on the substrate 9, and the resin 12 soluble in the solvent is further applied thereon.
Is applied (FIG. 8A). The resin 12 is irradiated with the ultraviolet laser 7 through the mask 8. The ultraviolet laser 7, which is partially shielded by the mask 8 and irradiated, removes the resin 12 and the insulating material 6 to process the concave pattern 1, and at the same time, the electric charge 5 is accumulated in the processed portion by high photon energy. This time,
Decomposition products 13 such as soot generated during processing by the ultraviolet laser 7 adhere to the resin 12 (FIG. 8B). The metal 4 is adsorbed to the processed portion by using the electric charge 5, and the conductor 3 can be grown only in the concave portion of the concave pattern 1 by using the metal 4 as a plating nucleus. In addition, the conductor 3 up to the surface of the insulating material 6
When it is formed, a uniform layer having no conductor pattern and having the conductor pattern 1A is formed (FIG. 8C). After that, if the resin 12 is dissolved and removed with a solvent, the decomposed product 13 and the adhered metal or plating solution can be completely removed from the insulating material 6. Therefore, the decomposition product 13 does not adhere to the insulating material 6 and a layer having a flat surface is formed (FIG. 8D). The insulating material 6 and the resin 12 are applied by the same process as the above to form a uniform layer having the conduction hole 2 connecting the layers, and then the insulating material 6 and the resin 12 are applied by the same process as the above. Forming a uniform layer again having the conductor pattern 1A,
Then, the insulating material 6 and the resin 1 are processed by the same steps as described above.
When 2 is applied to form a uniform layer having the conductive holes 2 that serve as terminals, the surface of each layer is flat without unevenness, so that a multilayer substrate can be stably manufactured (FIG. 8).
(E)).

Since the plating nuclei in the present invention may be formed on the resin 12, they may be formed by the conventional method shown in FIG. Therefore, when the desired charges 5 are not accumulated by the ultraviolet laser 7, the plating nuclei may be formed by the conventional method shown in FIG. Therefore, the material is not limited.

Example 9. An embodiment of the invention of claim 10 will be described with reference to the drawings. FIG. 9 is a cross-sectional view showing the method of manufacturing a circuit board according to the ninth embodiment in the order of steps. FIG. 10 shows the characteristics of the insulating material 6 and the resin 12 in relation to the laser energy density used for processing and the removal depth per pulse. It is a graph showing. In FIG. 9, 12 is an insulating material 6 in advance.
It has a high absorption coefficient and is soluble in solvents.
9A is a cross-sectional view showing a step of applying a resin 12 having a high absorption coefficient and soluble in a solvent onto the insulating material 6, and FIG. 9B is a mask 8 through the mask 8 and the resin 12 has an energy density in FIG. FIG. 9C is a sectional view showing a step of removing the resin 12 by irradiating the ultraviolet laser 7 at A, and FIG.
A sectional view showing a step of irradiating the insulating material 6 with the ultraviolet laser 7 at the energy density B in FIG. 10 to remove the insulating material 6 to form the concave pattern 1, FIG. 9D is accumulated in the processed portion. 9E is a cross-sectional view showing a step of growing the metal 4 attached using the electric charge 5 to the surface of the insulating material 6 by electroless plating to form the conductor pattern 1A. FIG. FIG. 1 is a cross-sectional view showing a step of removing a decomposed product 13 generated during processing of the concave pattern 1 and attached to the resin 12.
FIG. 9 is a cross-sectional view in which formation of the conductor pattern 1A of the second layer is completed.
(F) is a cross-sectional view showing a step of forming a multilayer, the second layer is a layer in which holes are formed in the same step as described above and the holes are filled with conductors 3 to form conduction holes 2. The fourth layer is a layer in which the conductor pattern 1A is formed in the same process as described above, and the fourth layer is a layer in which the conductive holes 2 to be terminals are formed in the same process as described above.

Next, the operation will be described. The insulating material 6 is applied on the substrate 9, and the resin 12 is further applied thereon (FIG. 9A). First, the resin 12 is irradiated with the ultraviolet laser 7 through the mask 8 at an energy density A at which the insulating material 6 cannot be processed. Since this ultraviolet laser 7 cannot process the insulating material 6, only the resin 12 is removed. During this processing, decomposition products 13 such as soot are generated and adhere to the resin 12 (FIG. 9B). After that, the ultraviolet laser 7 is passed through the mask 8.
Is irradiated with an energy density B capable of processing the insulating material 6.
Since this ultraviolet laser 7 can process the insulating material 6, the insulating material 6 is removed and the concave pattern 1 is processed. Therefore,
The insulating material 6 was previously formed by the ultraviolet laser 7 transmitted through the resin 12.
Is processed, and the resin 12 is not swollen by the decomposition gas and the decomposition product 13 is not embedded in the interface between the resin 12 and the insulating material 6, and the resin 12 can be completely removed, and the desired concave pattern 1 is formed. Can be processed. At the same time, the charge 5 is accumulated due to the high photon energy (FIG. 9C).
By utilizing this electric charge 5, the metal 4 is adsorbed to the processed portion, and the conductor 3 can be grown only in the concave portion of the concave pattern by using this as the plating nucleus. When the conductor 3 is formed up to the vicinity of the surface of the insulating material 6, a uniform layer having the conductor pattern 1A and no unevenness is formed (FIG. 9D). Further, after that, if the resin 12 is dissolved in a solvent and removed, the decomposed product 13 and the adhered metal or plating solution can be completely removed from the insulating material 13. Therefore, the decomposition product 13 does not adhere to the insulating material 6, and a layer having a flat surface is formed (FIG. 9).
(E)). The insulating material 6 and the resin 12 are subjected to the same steps as described above.
Is applied to form a uniform layer having a conduction hole 2 connecting the layers, and then the insulating material 6 and the resin 12 are applied by the same steps as described above to form a uniform layer having the conductor pattern 1A again. Then, when the insulating material 6 and the resin 12 are applied by the same process as described above to form a uniform layer having the conductive holes 2 to serve as terminals, the surface of each layer is flat without unevenness, and thus stable. Thus, a multi-layered substrate can be manufactured (FIG. 9F).

In the present invention, polystyrene 12 is used as the resin 12 having a high absorption coefficient when polyimide is used as the insulating material 6, and tetrahydrofuran, ketones, toluene, benzene or the like is used as the solvent. it can. A polystyrene solution dissolved in tetrahydrofuran is applied on a polyimide with a thickness of about several thousand angstroms to several microns by a spin coater, and the ultraviolet laser 4 is irradiated with an energy density A of energy density 0.02 to 0.3 J / cm ^2. Completely remove the resin 12, and after that, the energy density is 0.4 to 1 J / c.
When the polyimide was removed with an energy density B of about m ² , the desired concave pattern 1 could be processed, and when the resin 12 was removed after embedding the conductor 3 in this, a circuit board completely free of decomposed products 13 was obtained. Further, in addition to these, for example, when various resins such as styrene, urethane, amide, terephthalate, phenylene sulfide, and sulfone resin 12 dissolved in an appropriate solvent are used for various insulating materials 6, the absorption coefficient of the ultraviolet laser 7 is particularly high. Therefore, the ultraviolet laser 7 that has passed through the resin 12 can remove the resin 12 without removing the insulating material 6. Further, the energy density for removing the resin 12 is preferably lower than the threshold energy density of the insulating material 6, but since the resin 12 having a high absorption coefficient has a small energy permeating through the resin 12 even if it is equal to or higher than the threshold energy density, The resin 12 may be processed with an energy density equal to or higher than the threshold value of the insulating material 6, and the energy density A and the energy density B may be the same.

Example 10. An embodiment of the invention of claim 11 will be described with reference to the drawings. FIG. 11 is a cross-sectional view showing a method of manufacturing a circuit board according to Example 10 in the order of steps. In the figure, 15 is a needle electrode, 16 is a gas inlet, 17 is a charged gas, and 18 is a charged gas. Is the charge accumulated by. FIG. 11A is a sectional view showing a step of applying a solvent-soluble resin 12 onto the insulating material 6, and FIG.
An ultraviolet laser 7 is radiated onto the resin 12 through the mask 8 while flowing the negatively charged gas 17 introduced between the needle electrodes 15 onto the resin 12 to remove the resin 12 and the insulating material 6. FIG. 11C is a cross-sectional view showing the step of processing the concave pattern 1 and at the same time, accumulating the negative charges 18 in the processed part.
Uses the negative charge 18 accumulated in the processed portion to reduce the metal ion M ⁺ of the metal catalyst solution or the electroless plating solution to adhere the metal to the processed portion, and to bring this to the surface of the insulating material 6. FIG. 11D is a cross-sectional view showing a step of growing the conductive pattern 1A, and FIG. 11D shows a decomposed product 13 generated during the processing of the concave pattern 1 by dissolving the resin 12 with a solvent and adhering to the resin 12.
Is a cross-sectional view showing a step of removing the conductive pattern 1A of the first layer is completed, FIG. 11 (e) is a cross-sectional view showing a step of multilayering, and the second layer is A layer in which a hole is formed in the same process and the conductive hole 3 is filled with the conductor 3 to form the conduction hole 2, a third layer is a layer in which the conductor pattern 1A is formed in the same process as described above, and a fourth layer is This is a layer in which the conductive holes 2 to be terminals are formed in the same process as described above.

Next, the operation will be described. The insulating material 6 is applied on the substrate 9, and the resin 12 soluble in the solvent is further applied thereon.
Is applied (FIG. 11A). Gas is flowed from the gas inlet 16 between the needle-shaped electrodes 15 to which a DC voltage is applied, and the gas is negatively charged by causing discharge, and while the charged gas 17 is fed to the surface of the resin 12, ultraviolet rays are passed through the mask 8. When the resin 7 is irradiated with the laser 7, the resin 1
2 and the insulating material 6 are removed, and the concave pattern 1 is processed. At the same time, the negative charge 18 of the gas 17 causes the processed portion and the resin 1
2 Accumulates on the surface and becomes negatively charged. At this time, the ultraviolet laser 7
Decomposition products 13 such as soot generated by the above process adhere to the resin 12 (FIG. 11B). When this is brought into contact with a solution containing the metal ion M ⁺ , the metal ion M ⁺ is pulled by the negative ion and reduced at a high plating rate to become a metal, enabling electroless plating. Therefore, the conductor 3 can be grown in the concave portion of the concave pattern 1. Insulation 6
When the conductor 3 is formed up to near the surface of the
A uniform layer having no irregularities is formed (FIG. 11).
(C)). After that, if the resin 12 is dissolved in a solvent and removed, the decomposed material 13 and excess metal attached to the insulating material 6
Can be removed from above. Therefore, the decomposition product 13 does not adhere to the insulating material 6, and a layer having a flat surface is formed (FIG. 11).
(D)). The insulating material 6 and the resin 12 are subjected to the same steps as described above.
Is applied to form a uniform layer having a conduction hole 2 connecting the layers, and then the insulating material 6 and the resin 12 are applied by the same steps as described above to form a uniform layer having the conductor pattern 1A again. Then, when the insulating material 6 and the resin 12 are applied by the same process as described above to form a uniform layer having the conductive holes 2 to serve as terminals, the surface of each layer is flat without unevenness, and thus stable. Thus, a multi-layered substrate can be manufactured (FIG. 11E).

In the present invention, the voltage applied to the needle electrode 15 or the like may be alternating current, and only the negatively charged gas 17 may be taken out. Further, if the processed part is stably charged and the metal ions in the electroless plating solution can be adhered as they are, it may be immersed in the electroless plating solution without using a metal catalyst. When the plating can be selectively performed only on the processed portion by charging with the ultraviolet laser 7, the resin 12
Does not need. Further, the pattern shape is not limited to the concave shape, and it can be used for the plating nucleus forming step of the processed portion without using the ultraviolet laser 7. Further, the discharging method may be another method, and the electrode shape is not limited to the needle. Further, the gas is more preferable if it can easily attach electrons, for example, N ₂ or O.
₂ , gases such as SF ₆ and gases containing these are preferable.

Example 11. An embodiment of the invention of claim 12 will be described with reference to the drawings. FIG. 12 is a cross-sectional view showing a method of manufacturing a circuit board according to the eleventh embodiment in the order of steps, in which 19 is a negative electrode, 20 is a positive electrode, 21 is a pulse generator, and 22 is an electron. FIG. 12A is a sectional view showing a step of applying a solvent-soluble resin 12 onto the insulating material 6, FIG.
2B is a cross-sectional view showing a step of irradiating the resin 12 with an ultraviolet laser 7 to remove the resin 12 and the insulating material 6 and process the concave pattern 1, and FIG. 12C is an upper portion of the resin 12. A DC pulse voltage is applied by the pulse generator 21 to the negative electrode 19 and the positive electrode 20, which are respectively installed under the insulating material 6 to discharge between the electrodes 19 and 20 to cause the negative electrode 19 to discharge.
FIG. 12D is a cross-sectional view showing a process of discharging electrons 22 from the substrate to negatively charge the surface of the resin 12 and the processed portion. FIG. 12D shows a metal catalyst solution or an electroless plating solution utilizing the accumulated negative charge. Of the metal pattern of the conductor pattern 1 is reduced and adhered to the processed portion, and this is grown to the surface of the insulating material 6.
12E is a cross-sectional view showing the step of forming A, and FIG.
12 is a cross-sectional view showing a step of dissolving 2 in a solvent and removing the conductor 3 formed on the resin 12 that occurs during processing of the concave pattern 1; FIG. (F) is a cross-sectional view showing a step of forming a multilayer, the second layer is a layer in which holes are formed in the same step as described above and the holes are filled with conductors 3 to form conduction holes 2. The fourth layer is a layer in which the conductor pattern 1A is formed in the same process as described above, and the fourth layer is a layer in which the conductive holes 2 to be terminals are formed in the same process as described above.

Next, the operation will be described. The insulating material 6 is applied on the substrate 9, and the resin 12 soluble in the solvent is further applied thereon.
Is applied (FIG. 12A). When the resin 12 is irradiated with the ultraviolet laser 7 through the mask 8, the resin 12 and the insulating material 6 are removed and the concave pattern 1 is formed. At the same time, the electric charge 5 is accumulated in the processed portion. Further, decomposition products 13 such as soot adhere to the resin 12 (FIG. 12 (b)). Next, resin 1
2 When the negative electrode 19 and the positive electrode 20 are installed on the upper part and the lower part of the insulating material 6, respectively, and when a pulse voltage of DC is applied by the pulse generator 21, the electrodes 19 and 20 are discharged, and the electron 22 is emitted from the negative electrode 19. Then, the surface of the resin 12 and the processed portion are negatively charged (FIG. 12C). By bringing this into contact with a metal ion, the metal can be stably reduced, and at the same time, the metal can be attached at a high speed. When immersed in electroless plating solution,
The conductor 3 can be formed (FIG. 12 (d)). Further, after forming the conductor 3, by immersing in the solvent,
The plating 3 formed on a portion other than the desired pattern can be removed together with the resin 12 to form a layer having no unevenness (FIG. 12 (e)). The insulating material 6 and the resin 12 are applied by the same process as the above to form a uniform layer having the conduction hole 2 connecting the layers, and then the insulating material 6 and the resin 12 are applied by the same process as the above. Conductor pattern 1A again
When a uniform layer having a conductive hole 2 to be a terminal is formed by applying the insulating material 6 and the resin 12 by the same process as described above to form a uniform layer having a conductive hole 2 as a terminal, the surface of each layer becomes uneven. Since it is not flat, it is possible to stably manufacture a multilayered substrate (FIG. 12F).

In the present invention, the pulse voltage between the electrodes 19 and 20 is not particularly limited as long as dielectric breakdown does not occur and desired charge can be obtained, but is preferably about several volts to several kilovolts. Moreover, the voltage applied between the electrodes 19 and 20 does not need to be a pulse. Furthermore, when the electric charge accumulated in the processed portion is stable and sufficiently large, the metal ions in the electroless plating solution may be grown as they are. Further, the pattern shape is not limited to the concave shape, and it can be used for the plating nucleus forming step of the processed portion without using the ultraviolet laser 7.
The shape of the electrodes 19 and 20 may be flat or patterned.

Example 12 An embodiment of the invention of claim 13 will be described with reference to the drawings. FIG. 13 is a cross-sectional view showing the order of steps in a plating method for preventing bubble growth according to Example 12, in which 23 is a bar for removing gas,
24 is a bubble such as hydrogen generated along with the reduction reaction of the metal ion in the plating solution. FIG. 13A shows the insulating material 3 during immersion in the plating solution when plating the concave portion of the insulating material 6.
13B is a cross-sectional view showing vibration or movement of the upper bar 23, and FIG. 13B is a cross-sectional view showing a process in which plating grows up to the surface of the insulating material 3.

Next, the operation will be described. The insulating material 6 is applied on the substrate 9 to form a recess in the insulating material 6. The plating nuclei are attached to the recesses and immersed in the plating solution. During the plating process, gas such as hydrogen is generated by the reduction and becomes bubbles 24 and rises along the side wall of the recess. However, by vibrating or moving the bar 23 installed above the insulating material 6, the upper edge is mechanically increased. The bubbles 24 gathered in the portion can be removed so that they can always escape from the surface of the insulating material 6. Therefore, it is possible to prevent the bubbles from growing up to cover the recesses, and since the plating solution can flow around the recesses, it is possible to stably grow the plating even in a fine portion (FIG. 13).
(A)). By growing the conductor 3 up to the surface of the insulating material 6, it is possible to form a uniform layer having no irregularities in which the conductor 3 is embedded in the recess (FIG. 13B).

In the present invention, the plating may be electroless plating or electrolytic plating. Further, when the plating grows excessively on the insulation, it may be removed by polishing or the like. Bar 23
May be used as a grindstone so that polishing can be performed. The recess may be a hole or a pattern.

Example 13. An embodiment of the invention of claim 14 will be described with reference to the drawings. FIG. 14 is a cross-sectional view showing a plating method for preventing excessive growth according to Example 13 in the order of steps, in which 25 is a bar which serves as an anode for removing gas provided on an insulating material, and 26 is a bar. Power. FIG. 14 (a) shows a recess 1 formed in the insulating material 6 and having different depths.
02a, 102b is a cross-sectional view when performing electrolytic plating, in which the anode bar 25 on the insulating material 6 is vibrated while being immersed in the plating solution,
Alternatively, a cross-sectional view of the substrate showing that it is moved, 14
14B is a cross-sectional view showing that the plating has grown to the surface of the insulating material 6 in the recess 102a, and FIG. 14C is the recess 102.
FIG. 7B is a cross-sectional view showing that plating has grown to the surface of the insulating material also in b.

Next, the operation will be described. The insulating material 6 is applied on the substrate 9. Recesses 102 having different depths in the insulating material 6
a and 102b are formed. In the recesses 102a and 102b,
When electroless plating is performed in advance and electrolytic plating is performed using the recessed portion as a cathode and the bar 25 provided above the insulating material 6 as an anode, a gas such as hydrogen is generated due to a reduction reaction occurring in the plating solution and bubbles are generated. 24. However, by vibrating or moving the bar 25 made of an anode, the bubbles 24 can be always escaped from the surface of the insulating material 6. Therefore, it is possible to prevent the bubbles 24 from growing until they cover the recesses 102a and 102b, and the plating solution. Can go around the recess. Therefore, the plating can be stably performed even on a fine portion (FIG. 14 (a)).
Furthermore, when the metal 3 grown on the concave portions 102a and 102b serving as the cathode collides with the bar 25 serving as the anode, a current flows without passing through the plating solution, and the plating does not grow any more, so that it protrudes from the surface of the insulating material. It is possible to prevent excessive plating growth. Further, as shown in this figure, the recess 102
When the depths of a and 102b are different from each other, if the wiring is divided for each depth and connected in parallel, even if the shallow recess 102a is short-circuited (FIG. 14 (b)), the metal 3 is still present in the deep recess 102b. Grows and finally all the recesses 102a, 102
In b, the conductor 3 can be formed up to the vicinity of the surface of the insulating material 6, and a uniform layer without unevenness can be formed (FIG. 14).
(C)).

In the present invention, the recess may be a hole or a pattern. The bar 25 made of an anode may be a flat plate or a comb.

[0095]

As described above, according to the first aspect of the present invention, since the concave pattern or hole is formed in the insulating material and the concave portion is filled with the conductor, a layer without unevenness can be formed and the circuit can be formed. Since the layers can be flattened, the layers can be easily formed and the reliability of the circuit board can be improved.

According to the second aspect of the present invention, the insulating material containing the metal particles is irradiated with an ultraviolet laser to process the concave pattern or the holes to expose the metal particles on the surface of the concave portion, and thereby the metal particles are further electrolyzed. Since the conductor is deposited by the combined use of plating, selective plating is possible and the plating process can be simplified.

According to the third aspect of the invention, since the concave pattern or hole is formed in the insulating material by plasma etching and the concave portion is filled with the conductor, a layer without unevenness can be formed and the circuit layer is flattened. By doing so, it is possible to easily form a multilayer structure and to improve the reliability of the circuit board.

According to the fourth aspect of the present invention, the insulating material is removed by the ultraviolet laser irradiation to form the concave pattern or the hole, and at the same time, the positive or negative electric charge is accumulated in the concave portion. Since the metal is adhered only to the concave portion by being immersed in the metal catalyst solution, and the conductor is grown by the electroless plating or the combined use of the electrolytic plating, the plating process can be simplified.

According to the fifth aspect of the present invention, the first mask and the second mask having different patterns are used to irradiate with an ultraviolet laser to form concave patterns or holes having different depths. , The conductor pattern and the conduction hole can be processed at the same time, and the process can be simplified, and the conductor pattern having different electric resistances can be manufactured by changing the depth without changing the pattern width, which has the effect of miniaturization. .

According to the sixth aspect of the present invention, an ultraviolet laser is irradiated at a desired energy density using a mask having a pattern width or a hole diameter size designed so that a desired depth can be obtained. Since it was configured to form a concave pattern or hole to a desired depth with different depth in the insulating material, the conductor pattern and the conduction hole can be produced by a simple process of irradiating once, and the process can be simplified. Since the conductor patterns having different electric resistances can be produced by changing the depth without largely changing the width, there is an effect that miniaturization is possible.

According to the invention of claim 7, the insulating material is irradiated with an ultraviolet laser while the gas containing the metal is introduced to process the concave pattern or the hole, and at the same time, the metal of the gas is adhered to the concave portion. Since the conductor is deposited by the electroless plating or the combined use of the electrolytic plating, selective plating is possible and the plating process can be simplified.

According to the invention of claim 8, when the insulating material containing metal particles is irradiated with an ultraviolet laser to form a concave pattern or a hole, the metal particles are exposed on the surface of the concave portion, whereby electroless plating or Furthermore, since the conductor is deposited by the combined use of electrolytic plating, selective plating is possible and the plating process can be simplified.

According to the invention of claim 9, a resin soluble in a solvent is applied to the insulating material, and an ultraviolet laser is irradiated to remove the concave pattern or holes in the resin and the insulating material to accumulate in the concave portion. Since a conductor is deposited by electroless plating or a combination of further electroplating by using the electric charge to attach a metal, and the resin is dissolved in a solvent to remove unnecessary substances, the plating process is simplified, There is an effect that unnecessary substances can be removed and reliability is improved.

According to the tenth aspect of the present invention, a resin that is soluble in a solvent and has an absorption coefficient similar to or higher than that of the insulating material is applied to the insulating material, and an ultraviolet laser is irradiated to the resin and the insulating material to form a concave pattern or Since the holes are removed and processed, the ultraviolet laser has an effect that the resin is removed and then the insulating material is removed to prevent the decomposed material from entering the interface between the resin and the insulating material.

According to the eleventh aspect of the present invention, while the charged gas is fed, the ultraviolet laser is irradiated to remove and process the concave pattern or the hole, and at the same time, the electric charge is accumulated in the concave portion, and the metal is attached by utilizing the electric charge. Since the conductor is deposited by electroless plating or combined use of electrolytic plating, the plating process can be simplified and the plating rate can be improved.

According to the twelfth aspect of the present invention, a concave pattern or a hole is formed in the insulating material coated with the resin by an ultraviolet laser, and a direct current voltage is applied to this circuit board to discharge between the electrodes, thereby insulating the resin and the insulating material. Since the surface is charged to deposit a metal, and the conductor is deposited by electroless plating or combined use of electrolytic plating, the plating process can be simplified and the plating rate can be improved.

According to the thirteenth aspect of the present invention, in the plating step of filling the recess formed in the insulating material with a conductor, a bar is installed above the insulating material and the bar is vibrated or moved to remove bubbles generated. Since it is configured so that it is possible to prevent the growth of bubbles to cover the recessed portion, it is possible to circulate the plating solution into the recessed portion,
There is an effect that plating can be stably performed even in a fine portion.

According to the fourteenth aspect of the present invention, in the plating step of filling the recess formed in the insulating material with the conductor, the bar is installed on the upper portion of the insulating material, and the bar is vibrated or moved to remove bubbles. Since it was configured to use the anode and the concave portion as the cathode, the conductor grown in the concave portion that becomes the cathode is
If it hits the bar that is the anode, the current will flow without passing through the plating solution and the plating will not grow any more, preventing excessive plating growth protruding from the surface of the insulating material, and even in the case of recesses with different depths The effect is that plating can be grown up to the surface.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a method of manufacturing a circuit board according to a first embodiment of the present invention in the order of steps.

FIG. 2 is a cross-sectional view showing a method of manufacturing a circuit board according to a second embodiment of the present invention in the order of steps.

FIG. 3 is a cross-sectional view showing a method of manufacturing a circuit board according to a third embodiment of the present invention in the order of steps.

FIG. 4 is a cross-sectional view showing a method of manufacturing a circuit board according to a fourth embodiment of the present invention in the order of steps.

FIG. 5 is a cross-sectional view showing a method of manufacturing a circuit board according to a fifth embodiment of the present invention in the order of steps.

FIG. 6 is a sectional view showing a method of manufacturing a circuit board according to a sixth embodiment of the present invention in the order of steps.

FIG. 7 is a cross-sectional view showing a method of manufacturing a circuit board according to a seventh embodiment of the present invention in the order of steps.

FIG. 8 is a cross-sectional view showing a method of manufacturing a circuit board according to an eighth embodiment of the present invention in the order of steps.

FIG. 9 is a cross-sectional view showing a method of manufacturing a circuit board according to a ninth embodiment of the present invention in the order of steps.

FIG. 10 is a graph chart for explaining the operation of Embodiment 9 of the present invention.

FIG. 11 is a cross-sectional view showing a method of manufacturing a circuit board according to a tenth embodiment of the present invention in the order of steps.

FIG. 12 is a sectional view showing a method of manufacturing a circuit board according to an eleventh embodiment of the present invention in the order of steps.

FIG. 13 is a sectional view showing a plating method according to the twelfth embodiment of the present invention in the order of steps.

FIG. 14 is a cross-sectional view showing a plating method according to a thirteenth embodiment of the present invention in the order of steps.

FIG. 15 is a cross-sectional view showing a method of manufacturing a conventional circuit board in the order of steps.

FIG. 16 is a flowchart showing a conventional electroless plating method.

FIG. 17 is a cross-sectional view showing a conventional plating process for recesses affected by bubbles.

FIG. 18 is a cross-sectional view showing a conventional plating process for recesses having different depths.

FIG. 19 is a cross-sectional view showing another conventional method of manufacturing a circuit board in the order of steps.

[Explanation of symbols]

1 concave pattern 2 conduction hole 3 conductor 4 plating nucleus (metal) 5 electric charge accumulated by ultraviolet laser 6 insulating material 7 ultraviolet laser 10 first mask 11 second mask 12 resin 13 decomposed material (unwanted material) 17 charged Gas 18 Charge accumulated by charged gas 19 Negative electrode (electrode) 20 Positive electrode (electrode) 23 Bar 25 Bar that is an anode 32 Organic gas containing metal (gas containing metal) 34 Containing metal particles Insulating material 35 Mask having desired pattern width or hole diameter 102a Shallow recess (recess) 102b Deep recess (recess)

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁶ Identification number Internal reference number FI Technical indication location H05K 3/46 E 6921-4E X 6921-4E (72) Inventor Masaharu Moriyasu 8 Tsukaguchihonmachi, Amagasaki 1-1 Mitsubishi Electric Co., Ltd. Production Technology Research Laboratory (72) Inventor Masaaki Tanaka 8-1-1 Tsukaguchi Honcho, Amagasaki City Mitsubishi Electric Co., Ltd. Production Technology Research Laboratory (72) Inventor Masao Izumo 8 Tsukaguchi Honcho, Amagasaki City No. 1 No. 1 Itami Works of Mitsubishi Electric Corporation

Claims (14)

[Claims] 1. A circuit board, characterized in that a concave pattern or hole is formed in an insulating material, and a concave portion of the concave pattern or hole is filled with a conductor. 2. The circuit board according to claim 1, wherein the insulating material is formed on an insulating material containing metal particles, and the concave patterns or holes are formed in the insulating material. 3. A method of removing a concave pattern or a hole in an insulating material by using plasma etching, depositing a metal on the concave portion of the concave pattern or the hole, and using electroless plating or further electroplating together to form a conductor in the concave portion. A method for manufacturing a circuit board, comprising: 4. An ultraviolet laser is used to remove a concave pattern or a hole in an insulating material, and a metal accumulated on the concave pattern or the hole using the electric charge accumulated in the concave of the concave pattern or the electroless plating or A method of manufacturing a circuit board, further comprising the step of embedding a conductor in the recess using electroplating together. 5. A second mask having a second pattern different from the first pattern is formed by irradiating the ultraviolet laser with the first mask having the first pattern to remove the insulating material. The method for manufacturing a circuit board according to claim 4, wherein concave patterns or holes having different depths are formed by further removing the insulating material by using the insulating material. 6. The depth of one-time irradiation is obtained by irradiating the insulating material with the ultraviolet laser at an energy density capable of obtaining a desired depth through a mask having a pattern size or a hole diameter of a desired size. 5. The method of manufacturing a circuit board according to claim 4, wherein different concave patterns or holes are formed. 7. The method of removing the concave pattern or hole by the ultraviolet laser in a state where a gas containing a metal is introduced, and depositing the metal of the gas on the concave. 6. The method for manufacturing a circuit board according to item 6. 8. The concave portion is formed by forming the insulating material on an insulating material containing metal particles, and processing the insulating pattern containing the metal particles with the ultraviolet laser to remove the concave pattern or holes. 7. The method for manufacturing a circuit board according to claim 4, 5 or 6, wherein the metal particles are exposed. 9. A resin soluble in a solvent is applied on the insulating material, and the ultraviolet laser is irradiated to remove the resin and the insulating material to form the concave pattern or holes, and electroless plating is performed. Alternatively, the conductor is embedded in the recess by additionally using electroplating, and then the resin is dissolved in a solvent to remove unnecessary substances adhering to the surface of the resin. A method for manufacturing the circuit board described. 10. The method of manufacturing a circuit board according to claim 9, wherein the resin has an absorption coefficient of ultraviolet light equal to or higher than that of the insulating material. 11. The method of removing the concave pattern or holes by the ultraviolet laser while feeding a charged gas to accumulate electric charges in the concave portions. Or the method for manufacturing a circuit board as described in 10 above. 12. A resin is applied on the insulating material, and the ultraviolet laser is irradiated to remove the resin and the insulating material to form the concave pattern or holes, and a DC voltage is applied to the circuit board. The method for manufacturing a circuit board according to claim 9 or 10, wherein the surfaces of the resin and the insulating material are charged by discharging between the electrodes. 13. In a plating step of filling a recess formed in an insulating material with a conductor, the conductor is deposited while removing bubbles generated by moving or vibrating a bar installed on the insulating material. And a method for manufacturing a circuit board. 14. The method of manufacturing a circuit board according to claim 13, wherein the bar is an anode and the recess is a cathode.