JPH0722467A - Electronic component mounting equipment - Google Patents

Abstract

PURPOSE:To provide an electronic component mounting equipment for TAB mounting that automatically changes a large number of types of components and thereby enables multikind continuous production and mounting. CONSTITUTION:In continuously mounting a plurality of types of components on a board 4, a metal mold transport unit 10 returns a previous metal mold from a metal mold unit 7 to a metal mold supply unit 11. The metal mold transport unit 10 transports a metal mold to be used next from the metal mold supply unit 11 to the metal mold unit 7, and the metal mold is set there. Meanwhile, a previous electronic component feeder 9 is returned to an electronic component feeder supply unit 12, and an electronic component feeder 9 to be used next is set on an electronic component feeder stage 8. Subsequently, the new metal mold unit 7 and electronic component feeder 9 perform a series of the same component feed operation as before and feeds electronic components different from ones in the previous operations.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting device.

[0002]

2. Description of the Related Art In recent years, in the field of electronic component mounting, there is a strong demand for a wide variety of products. Hereinafter, an example of the conventional electronic component mounting apparatus described above will be described with reference to FIGS.

FIG. 4 is a block diagram of a conventional electronic component supply apparatus. In FIG. 4, reference numeral 1 denotes a substrate loading unit, to which a substrate stage unit 2 and a substrate unloading unit 3 are connected.
An electronic component recognition unit 6 is provided corresponding to the substrate stage unit 2, and a mold unit 7, an electronic component supply device stage unit 8, and an electronic component supply device 9 are provided. In the figure, 4 is a substrate, 5 is an electronic component, and 14 is a tape-shaped component.

FIG. 5 is a perspective view of a conventional electronic component supply apparatus. As shown in FIG. 5, when the board 4 to be transported is at a predetermined position, an electronic component mounting tool 29 and a board recognition unit 30 are provided above it, and the electronic component mounting tool 29 is provided. The board recognition unit 30 and the board recognition unit 30 correspond to each other.
The board recognition unit 30 is movable back and forth and right and left by the robot unit 33. Reference numeral 31 in the drawing denotes an electronic component mounting tool exchange section.

Next, the operation of the conventional electronic component supply apparatus will be described with reference to FIGS. 4 and 5. First, a case where a tape-shaped component is usually mounted on a substrate will be described with reference to FIG.

[0006] From the tape-shaped component 14 supplied from the electronic component supply device 9, the necessary component part is punched out by the mold part 7 and molded into the required shape. Molded electronic component 5
Is adsorbed by the electronic component mounting tool 29 (see FIG. 5) attached to the robot unit 33 that can move back and forth and right and left. The picked-up electronic component 5 is picked up by the electronic part recognizing unit 6 and the displacement is recognized, and then mounted on the substrate 4 based on the data.

Further, in the structure described in this conventional example, since the die unit 7 is equipped with three types of dies,
It can be used for various types of tape-shaped parts and can be equipped with three types of parts.

Next, the operation when a plurality of types of electronic components are continuously mounted will be described with reference to FIG. After the above-described normal series of component mounting operations are completed, the robot unit 33
The electronic component mounting tool 29 attached to is moved to the component mounting tool exchanging unit 31 and is exchanged for a mounting tool corresponding to the next component to be mounted.

Thereafter, the mold part 7 and the component supplying device 9 to which the component to be mounted next is supplied perform the same series of component supplying operation as described above, and mount the component different from the first component on the substrate 4. .

[0010]

However, in the above-mentioned configuration, when a plurality of types of electronic components are to be mounted, the same number of electronic component supply devices as the types of electronic components to be mounted (a pair). Since the stage section 8, the electronic component supply device 9, and the mold section 7 are required, the equipment becomes very large if it is incorporated into the equipment as in the conventional case. Further, there is a limit to the number of a pair of electronic component supply device stage unit 8, electronic component supply device 9, and mold unit 7 incorporated in the facility, and therefore the number of types of electronic components that can be accommodated is limited to a small number. Was occurring.

In view of the above problems, the present invention is capable of continuously supplying various kinds of electronic parts, and continuously,
An object of the present invention is to provide an electronic component mounting apparatus capable of adsorbing and mounting various types of electronic components.

[0012]

In order to solve the above-mentioned problems, an electronic component mounting apparatus of the present invention comprises an electronic component supply unit capable of mounting a plurality of electronic component supply devices, and an electronic component required by the electronic component supply unit. An electronic component supply device selecting and supplying unit capable of selecting a component supply device and transferring it to the electronic component supplying device stage section is provided.

[0013] Alternatively, a mold supply unit is provided, which is capable of supplying and exchanging a plurality of other molds from outside the equipment to a mold unit composed of a plurality of molds.

[0014]

According to the present invention, with the above-described configuration, in the component supply device stage section, a plurality of component supply devices are mounted more than ever by automatically supplying and replacing the electronic component supply device from the electronic component supply device supply unit. Therefore, even in the case of high-mix low-volume production, the models can be automatically switched without stopping the equipment, and continuous production can be performed.

Further, in the die unit, a plurality of dies can be mounted more than before by automatically supplying and exchanging the dies from the die supply unit, and the facility can be stopped even in the production of a wide variety of products in small quantities. Instead, the dies can be changed automatically, and production can be performed continuously.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component mounting apparatus according to an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows an electronic component mounting apparatus according to a first embodiment of the present invention. The same components as those shown in the conventional example are designated by the same reference numerals. In FIG. 1, 1 is a substrate loading unit, 2 is a substrate stage unit, and 3 is a component.
Is a substrate unloading unit, 4 is a substrate, 5 is an electronic component, 6 is an electronic component recognition unit, 7 is a mold unit, and the mold feeding unit 11 is used to move the mold conveying unit
It is possible to supply and replace the mold through 0. Reference numeral 8 denotes an electronic component supply stage unit, and the electronic component supply device 9 is set by being extruded from the electronic component supply device supply unit 12 by the component supply unit selection supply unit 15. 14 is a tape-shaped component. On the other hand, 33 is a head part (schematic diagram) to which a component mounting tool set in a robot part which can be moved forward, backward, leftward and rightward is detachable, and 31 is a component mounting tool exchange part.

Here, the electronic component supply device 9 and the mold supply unit 11 will be described in advance. First, the electronic component supply device 9 will be described with reference to FIG. 16 and 17 are cover frames, 18 is reels, 19 is tape-shaped parts, 2
Reference numeral 0 is a roller, and 21 and 22 are mounting pins.

When the tape-shaped component 19 is supplied, the reel 18 rotates in the direction of the arrow, and the tape-shaped component 19 is sequentially sent out through the roller 20. Next, the mold supply unit will be described with reference to FIG. A mold 26 is stored in the mold supply unit 11, and is carried by the mold take-out unit 27 to the mold conveying unit 25. The molds 24-1 to 24-3 carried into the equipment main body by the mold carrying unit 25 are
Mold, mold by setting section 28-1 to 28-3,
It is set on the lifter parts 23-1 to 23-3, and the mold lifter parts 23-1 to 23-3 are raised to be set to a predetermined position.

Next, the operation of the entire apparatus of this embodiment will be described with reference to FIG. First, the case where the tape-shaped component 14 is mounted on the substrate 4 is usually the same as the conventional example. Next, an operation when a plurality of types of electronic components are continuously mounted will be described. After completion of the normal series of component mounting operations, the electronic component mounting tool 29 mounted on the robot unit 33 moves to the component mounting tool exchanging unit 31 and becomes a mounting tool corresponding to the next component to be mounted. It is replaced (see FIG. 5).

After that, the mold part 7 and the electronic component supply device 9 to which the electronic components to be mounted next are supplied perform the same series of component supplying operation as described above, and the electronic components different from the first one are mounted on the substrate 4. To do.

Further, the operation when a plurality of kinds of electronic components are continuously mounted as compared with the conventional case will be described. After completion of the normal series of component mounting operations, the electronic component mounting tool 29 mounted on the robot 33 is replaced in the same manner as described above.

In parallel with this, the die conveying section 1 is moved from the die section 7 to the die conveying section 1.
The old mold is returned to the mold supply unit 11 through 0. After that, the mold to be used next is sent from the mold supply unit 11 to the mold unit 7 through the mold conveying unit 10 and set.

On the other hand, the old electronic component supply device 9 is returned to the electronic component supply device supply unit 12, and the electronic component supply device 9 to be used next is the electronic component supply device stage unit 8.
Is set to.

After that, the replaced mold part 7 and electronic component supply device 9 perform the same series of component supply operation as described above, and mount different electronic components on the substrate 4 from the previous time. As described above, by providing the electronic component supply device supply unit 12, the electronic component supply device selection supply unit 15, and the mold supply unit 11 and the mold transfer unit 10, it is possible to continuously supply and mount various types of electronic components. It becomes possible to do.

[0026]

As is apparent from the above description of the embodiments, the present invention is provided with an electronic component supply device supply unit, an electronic component supply device selection unit, a mold supply unit and a mold transfer unit, so that continuous operation can be achieved. As a result, it becomes possible to supply and mount various types of electronic components, and it is not necessary to stop the equipment to switch the models, which can improve productivity and reduce costs.

[Brief description of drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is an exploded perspective view of a main part of the electronic component supply device.

FIG. 3 (a) is a plan view of a mold supply part in the electronic component supply device, and FIG. 3 (b) is a sectional view taken along line AA of FIG. 3 (a).

FIG. 4 is a plan view of a conventional electronic component mounting device.

FIG. 5 is a perspective view of a conventional electronic component mounting device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 board | substrate carry-in part 2 board | substrate stage part 3 board | substrate carry-out part 4 board | substrate 5 electronic component 6 electronic component recognition part 7 metallic mold part 8 electronic component supply device stage part 9 electronic component supply device 10 metallic mold transfer part 11 metallic mold supply part 12 electronic Component supply device supply unit 14 Tape-shaped component 15 Electronic component supply device selection supply unit

Claims (2)

[Claims] 1. An electronic component supply unit that can move left and right and can mount a plurality of electronic component supply devices equipped with tapes for supplying electronic components, and an electronic component for supplying tape-shaped components to the die unit. A stage unit for installing a component supply device, an electronic component supply device selection supply unit for supplying the electronic component supply device mounting the necessary electronic components from the electronic component supply unit to the stage unit, and the electronic component supply device A die part having a plurality of dies capable of punching out a necessary part from a tape-shaped part supplied from the mold and a desired shape, and an electronic part formed in the necessary shape by the mold part. An electronic component mounting apparatus having a mounting portion that can be transferred and mounted on a substrate. 2. The electronic component mounting apparatus according to claim 1, wherein the mold part composed of a plurality of molds has a mechanism in which each mold can be supplied from a different position and can be replaced.