JPH07202522A - Mounting structure for electronic parts - Google Patents

Abstract

PURPOSE:To provide the mounting structure for electronic parts where the inductance component of a connection member is eliminated. CONSTITUTION:Transmission lines 12 and 13 and a first earth electrode 14 are formed on the front face of an insulating substrate 11 and a second earth electrode 16 is formed on the rear face of the insulating substrate 11 to constitute a circuit board 16, and electronic parts 1 which have input/output electrodes 2 ana 3 and a ground electrode 4 formed on the rear face are mounted on the front face of the circuit board 16, and a minute space 18 is formed between transmission lines 12 and 13 as well as the earth electrode 14 on the circuit board 16 and input/output electrodes 2 and 3 as well as the ground electrode 4 of electronic parts 1, and transmission lines 12 and 13 of the circuit board 16 and input/output electrodes 2 and 3 of electronic parts are electromagnetically coupled with the space 18 between them, and the earth electrode 14 of the circuit board 16 and the ground electrode 4 of electronic parts 1 are electromagnetically coupled with the space 18 between them.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for a chip type electronic component used in a microwave band.

[0002]

2. Description of the Related Art As shown in FIG. 8, a conventional electronic component mounting structure has a chip type electronic component 52 having an external electrode 51 formed on a side surface thereof, and a transmission line 54 having an electrode pattern formed on an insulating substrate 53. The external electrode 51 of the electronic component 52 and the transmission line 54 were joined with the solder 56 and surface-mounted on the circuit board 55. in this case,
The solder 56 mechanically bonds the electronic component 52 and the circuit board 55, and the external electrode 51 of the electronic component 52 and the circuit board 55.
The transmission line 54 is electrically connected.

[0003]

However, in the electronic component mounting structure of the above-mentioned conventional example, since the external electrode 51 of the electronic component 52 and the transmission line 54 of the circuit board 55 are connected by the solder 56, a high frequency is required. In the band, the inductance component of the solder 56 is generated in the transmission line, the electric characteristics of the electronic component 52 are changed, and the original performance cannot be exhibited. In particular, in the microwave band of 5 GHz or higher, the change in the electrical characteristics of the electronic component 52 was remarkable.

The present invention has been made in order to solve the above problems, and an electronic component in which the external component of the electronic component and the transmission line of the circuit board are electromagnetically coupled to each other to eliminate the inductance component of the connecting member. The purpose is to provide a mounting structure.

[0005]

In order to achieve the above object, in the present invention, a transmission line and a ground electrode are formed on the surface of an insulating substrate to form a circuit board, and the surface of the circuit board is formed by: Equipped with electronic components with external electrodes formed on the back side,
A minute gap is formed between the transmission line and the ground electrode of the circuit board and the external electrode of the electronic component, and the transmission line and the ground electrode of the circuit board are connected to the outside of the electronic component through the gap. It is characterized in that the electrodes are electromagnetically coupled.

Further, a transmission line and a ground electrode are formed on the surface of the insulating substrate to form a circuit board, and an electronic component having an external electrode formed on the back surface thereof is fixed to the surface of the circuit board by a resin having adhesiveness. However, the transmission line and the ground electrode of the circuit board and the external electrode of the electronic component are electromagnetically coupled via the resin.

Further, a transmission line is formed outside the insulating substrate, and a ground electrode having a coupling window is formed on the surface of the insulating substrate at a position facing the transmission line to form a circuit substrate. An electronic component having an input / output electrode and a ground electrode as external electrodes formed on the front surface is mounted on the front surface of the substrate, and a minute gap is formed between the ground electrode of the circuit board and the ground electrode of the electronic component. Through the coupling electrode, the ground electrode of the circuit board and the ground electrode of the electronic component are electromagnetically coupled, and the transmission line of the circuit substrate and the input / output electrode of the electronic component are electromagnetically coupled through the coupling window. It is a feature.

Further, the present invention is characterized in that the input / output electrodes of the electronic component are formed in a slot line shape and the transmission line of the circuit board is formed in a line shape.

Further, the present invention is characterized in that the input / output electrodes of the electronic component are formed in a line shape, and the transmission line of the circuit board is formed in a slot line shape.

[0010]

According to the above construction, a minute gap or a resin layer or an insulating substrate layer is interposed between the transmission line and the ground electrode of the circuit board and the external electrode of the electronic component, so that the transmission line and the electronic component are separated from each other. A high-pass filter based on LC is constructed. Then, the transmission line of the circuit board and the input / output electrode of the electronic component are electromagnetically coupled via C, and a signal is transmitted at a cutoff frequency or higher.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a mounting structure for electronic parts according to the present invention will be described below with reference to FIGS. In FIG.
Reference numeral 1 denotes a rectangular chip-type electronic component having external electrodes formed on its back surface. As external electrodes, patch-shaped or line-shaped (not shown) input and output electrodes 2 and output electrodes are provided at both ends of the back surface of the electronic component 1. 3 are formed to face each other, and the ground electrode 4 and the plurality of holding electrodes 5 are formed between the input electrode 2 and the output electrode 3.

Further, in FIG. 2, reference numeral 11 denotes an insulating substrate made of ceramic or resin.
Two line-shaped transmission lines 12 and 13 are formed so as to face each other on a straight line, and a first ground electrode 14 is formed so as to be insulated from the transmission lines 12 and 13 at a certain distance.
On the other hand, the second ground electrode 15 is formed on substantially the entire back surface of the insulating substrate 11 to form the circuit board 16.

Then, the holding electrode 5 of the electronic component 1 and the ground electrode 14 between the transmission lines 12 and 13 are connected by solder 17.
The electronic component 1 is mounted on the circuit board 16. According to this configuration, the input / output electrodes 2 and 3 of the electronic component 1 and the circuit board 1
6 between the transmission lines 12 and 13, and between the ground electrode 4 of the electronic component 1 and the ground electrode 14 of the circuit board 16,
A minute gap 18 is created.

Further, as shown in FIG. 3, a resin 19 having adhesiveness is applied to the surface of the circuit board 16 to form the electronic component 1
Is mounted on the circuit board 16 by being laid across the transmission lines 12 and 13 and fixed via the resin 19. According to this configuration, between the input / output electrodes 2 and 3 of the electronic component 1 and the transmission lines 12 and 13 of the circuit board 16, and between the ground electrode 4 of the electronic component 1 and the ground electrode 14 of the circuit board 16, Resin 19
Intervenes.

Further, in FIG. 4, reference numeral 21 denotes a multi-layered insulating substrate made of ceramic or resin, and two line-shaped transmission lines 22 and 23 are formed inside the insulating substrate 21 so as to face each other in a straight line. A first ground electrode 24 is formed on the surface of the insulating substrate 21. The ground electrode 24 is provided with coupling windows 24a and 24a where no electrodes are present at positions facing the ends of the transmission lines 22 and 23. On the other hand, on the back surface of the insulating substrate 21, a second ground electrode 25 is formed on almost the entire surface to form a circuit board 26.

Input / output electrodes 2 and 3 of the electronic component 1
However, the electronic component 1 is placed on the circuit board 26 so as to be located above the coupling windows 24a, 24a, and the ground electrode 24 between the holding electrode 5 of the electronic component 1 and the coupling windows 24a, 24a is soldered 27. The electronic components 1 are connected and mounted on the circuit board 26. According to this configuration, between the input / output electrodes 2 and 3 of the electronic component 1 and the transmission lines 22 and 23 of the circuit board 26,
A small gap 28 due to the solder 27 is formed between the ground electrode 4 of the electronic component 1 and the ground electrode 24 of the circuit board 26 while a part of the insulating substrate 21 is interposed.

Further, as shown in FIG. 5, as the electronic component 35, slot line type input electrodes 31 and output electrodes 32 having slots 31a and 32a having no conductor portions in the center are arranged in parallel at both ends of the back surface. Input electrode 3
The ground electrode 33 and the plurality of holding electrodes 34 may be formed between the output electrode 32 and the output electrode 32.

FIG. 6 shows a mounting structure of the electronic component 1a having the line-shaped input electrode 2a and output electrode 3a.
In FIG. 6, reference numeral 41 is an insulating substrate made of ceramic or resin, and slot line type transmission lines 42, 43 having slots 42a, 43a having no conductor portion at the center are arranged on the surface of the insulating substrate 41 in a straight line. In addition to the above, the first ground electrode 44 is formed so as to be insulated from the transmission lines 42 and 43 at a certain distance. On the other hand, on the back surface of the insulating substrate 41, the second ground electrode 45 is formed on almost the entire surface to form the circuit board 6. With this configuration, the input / output electrodes 2a and 3a of the electronic component 1a and the circuit board 4 are
6 between the transmission lines 42 and 43 and the electronic component 1a
A minute gap 48 due to the solder 47 is formed between the ground electrode 4 and the ground electrode 44 of the circuit board 46.

Here, in the case of mounting the electronic component 1a on the circuit board 46, the electronic component 1a is provided with adhesiveness in the same manner as the mounting structure shown in FIGS. 3 and 4 except the mounting structure shown in FIG. A mounting structure in which the circuit board 46 is fixed to the circuit board 46 through a resin that is included, or a circuit board is configured by forming the transmission lines 42 and 43 inside the insulating board 41, and the electronic component 1a is mounted on the surface of the circuit board. Structures can be used.

The mounting structure for the electronic components 1a and 35 is as follows.
The input electrodes 2a, 31 and the output electrodes 3a, 32 and the transmission lines 12, 13, 22, 2 of the circuit boards 16, 26, 46.
It is preferable to mount 3, 42 and 43 so as to be orthogonal to each other. Further, in the mounting structure of the electronic components shown in FIGS. 2, 4 and 6, the electronic components 1, 1a and 35 and the circuit board 1 are
For joining with 6, 26, 46, an adhesive can be used in addition to the solders 17, 27, 47. Furthermore, the circuit board 1
6, 26, 46 can be used even if they do not have the ground electrodes 15, 25, 45 on the back surface.

The shapes of the input / output electrode and the ground electrode of the electronic component, and the transmission line and the ground electrode of the circuit board are not limited to those shown in FIGS. Between the input / output electrodes and the transmission line of the circuit board, and between the ground electrode of the electronic component and the first ground electrode of the circuit board, or a shape such that a minute gap or resin or an insulating board is present. Any structure will do.

According to the mounting structure of the electronic component thus configured, between the input / output electrode of the electronic component and the transmission line of the circuit board, and between the ground electrode of the electronic component and the first ground electrode of the circuit board. Since a minute gap or a minute gap such as a resin or an insulating substrate is present between the two, the equivalent circuit is shown in FIG.
, L1, L2, L3, L4, L5 and C
It has 1, C2 and C3.

Of these, L1, L2, L3, L4, L5
Is a parasitic inductance component on the ground side of the circuit board, and C1, C2, C3 are capacitance components between the input / output electrodes and the ground electrode of the electronic component and the transmission line of the circuit board and the first ground electrode. . And C1, C
2, C3 electromagnetically couple the input / output electrodes and the ground electrode of the electronic component to the transmission line of the circuit board and the first ground electrode, and L1, L2, C1 and L3, L4, C
Since No. 2 constitutes a high pass filter, it transmits a signal at its cutoff frequency or higher.

In addition, L5 is a ground electrode of the electronic component,
It is formed between the ground electrodes of the circuit board, but its inductance value is so small that it does not affect the signal. Therefore, the inductance component that affects the signal does not occur in the transmission line, and the characteristics of the electronic component do not change.

In the mounting structure of the electronic component shown in FIGS. 3 and 4, between the input / output electrodes of the electronic component and the transmission line of the circuit board, and between the ground electrode of the electronic component and the first circuit board of the circuit board. A dielectric such as resin or an insulating substrate is interposed between the ground electrode and the ground electrode. Therefore, depending on the dielectric constant of the resin or insulating substrate,
Since C1, C2 and C3 of the equivalent circuit shown in 2 increase and the cutoff frequency decreases, electromagnetic coupling can be performed at a lower frequency.

Further, the cutoff frequency can be changed by changing the dielectric constant and thickness of the resin and the insulating substrate,
It is possible to adjust the lower limit value of the transmission frequency and adjust the input impedance to achieve impedance matching with the circuit side.

[0027]

As described above, according to the mounting structure of the electronic component of the present invention, a minute gap is formed between the external electrode of the electronic component and the transmission line of the circuit board and the first ground electrode. Alternatively, a resin or an insulating substrate intervenes and electromagnetically couples with its capacitance component, so a connecting member for electrode connection becomes unnecessary. As a result, since an inductance component is not generated in the transmission line, the electrical characteristics of the electronic component do not change and the original performance can be exhibited. In addition, the lower limit of the transmission frequency can be adjusted by changing the dielectric constant and thickness of the resin or insulating substrate interposed between the external electrode of the electronic component and the transmission line of the circuit board and the first ground electrode. In addition, the impedance matching with the circuit side can be achieved.

[Brief description of drawings]

FIG. 1 (a) of an electronic component according to an embodiment of the present invention.
Is a perspective view and (b) is a bottom view.

2A and 2B show a mounting structure of an electronic component according to an embodiment of the present invention, FIG. 2A is a partial sectional perspective view, and FIG. 2B is a sectional view.

3A and 3B show a mounting structure of an electronic component according to a second embodiment of the present invention, FIG. 3A is a partial sectional perspective view, and FIG. 3B is a sectional view.

4A and 4B show a mounting structure of an electronic component according to a third embodiment of the present invention. FIG. 4A is a partial sectional perspective view, and FIG. 4B is a sectional view.

FIG. 5 is a bottom view of the second embodiment of the electronic component according to the embodiment of the present invention.

6A and 6B show a mounting structure of an electronic component according to a fourth embodiment of the present invention, FIG. 6A is a partial sectional perspective view, and FIG. 6B is a sectional view.

FIG. 7 is an equivalent circuit of a mounting structure for electronic components according to the first to fourth embodiments of the present invention.

FIG. 8 is a sectional view showing a conventional electronic component mounting structure.

[Explanation of symbols]

 1, 1a, 35 Electronic parts 2, 2a, 31 Input electrode 3, 3a, 32 Output electrode 4, 33 Ground electrode 11, 21, 41 Insulating substrate 12, 13, 22, 23 Transmission line 42, 43 Transmission line 14, 15 , 24, 25 Ground electrode 44, 45 Ground electrode 16, 26, 46 Circuit board 18, 28, 48 Gap 19 Resin

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Mitsuhide Kato 2-26-10 Tenjin Tenjin, Nagaokakyo-shi, Kyoto Murata Manufacturing Co., Ltd. (72) Inventor Koji Furuya 2-26-10 Tenjin, Nagaokakyo, Kyoto Murata Manufacturing Co., Ltd.

Claims (5)

[Claims] 1. A circuit board is formed by forming a transmission line and a ground electrode on the surface of an insulating substrate, and an electronic component having an external electrode formed on the back surface is mounted on the surface of the circuit board. A minute gap is formed between the line and the ground electrode and the external electrode of the electronic component, and the transmission line and the ground electrode of the circuit board and the external electrode of the electronic component are electromagnetically coupled through the gap. A mounting structure of electronic parts characterized by the above. 2. A transmission line and a ground electrode are formed on the surface of an insulating substrate to form a circuit board, and an electronic component having an external electrode formed on the back surface is fixed to the surface of the circuit board by a resin having adhesiveness. A mounting structure of an electronic component, wherein the transmission line and the ground electrode of the circuit board and the external electrode of the electronic component are electromagnetically coupled via the resin. 3. A circuit board, wherein a transmission line is formed outside an insulating substrate, and a ground electrode having a coupling window is formed on the surface of the insulating substrate at a position facing the transmission line to form a circuit board. An electronic component having an input / output electrode and a ground electrode as external electrodes formed on the front surface is mounted on the front surface of the substrate, and a minute gap is formed between the ground electrode of the circuit board and the ground electrode of the electronic component. Through the coupling electrode, the ground electrode of the circuit board and the ground electrode of the electronic component are electromagnetically coupled, and the transmission line of the circuit substrate and the input / output electrode of the electronic component are electromagnetically coupled through the coupling window. The characteristic electronic component mounting structure. 4. The mounting of the electronic component according to claim 1, wherein the input / output electrodes of the electronic component are formed in a slot line type, and the transmission line of the circuit board is formed in a line type. Construction. 5. The mounting of the electronic component according to claim 1, wherein the input / output electrodes of the electronic component are formed in a line shape, and the transmission line of the circuit board is formed in a slot line shape. Construction.