JPH07202400A - Method and apparatus of feeding spherical elements - Google Patents

Abstract

PURPOSE:To form a solder coating with a uniform solder quantity very easily by a method wherein solder balls are attracted by attracting nozzles which are provided at positions corresponding to the positions of the conductor patterns of a board and are conveyed and fed. CONSTITUTION:Solder balls 14 are attracted and held by the respective attracting nozzles 31 of a spherical element attracting unit 30 and the solder balls 14 are put onto patterns formed on a board to put a plurality of the solder balls 14 attracted and held by the attracting nozzles 31 onto the respective patterns simultaneously. If the arrangement pitches of the respective attracting nozzles 31 provided on the spherical element attracting unit 30 are the same as the pitches of the patterns formed on the board, the solder balls 14 attracted by the respective nozzles 31 are put onto the patterns on the board with the arrangement precision of the respective nozzles 31 provided on the spherical element attracting unit 30. With this constitution, the solder coating with significantly higher precision than the cream solder coating applied by screen printing can be realized.

Description

Detailed Description of the Invention

[0001]

[Table of Contents] The present invention will be described in the following order. Field of Industrial Application Conventional Technology Problems to be Solved by the Invention Means for Solving the Problems (FIGS. 1 to 13) Actions (FIGS. 1 and 2) Embodiments (FIGS. 1 to 13) Effects of the Invention

[0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sphere supplying method and an apparatus thereof, and is suitable for application to, for example, a sphere supplying method and an apparatus thereof for supplying a solder ball onto a substrate.

[0003]

2. Description of the Related Art Conventionally, a method such as plating or vapor deposition has been used as a method for forming a trace amount of solder on a conductor pattern formed on a substrate. On the other hand, there is a method of printing cream solder on a substrate by using a screen printing method.

[0004]

However, when the solder is formed on the substrate by the plating method, it is difficult to finely adjust the amount of solder, and there is a problem that the amount of solder varies. Further, in the method of applying the cream solder by screen printing, there is a problem that defects such as conduction are likely to occur when the narrow pitch IC is soldered on the substrate.

The present invention has been made in view of the above points, and an object thereof is to propose a method and apparatus for supplying fine spheres capable of supplying a uniform amount of solder onto a substrate in a simpler manner.

[0006]

In order to solve such a problem, according to the present invention, a spherical body supplying method for supplying the spherical solder 14 to a conductor pattern formed on a predetermined substrate 19 is formed on the substrate 19. Adsorption means 31 arranged corresponding to the supply position of the spherical solder 14 of the conductor pattern
Spherical solder 14 is adsorbed onto
The spherical solder 1 with respect to the conductor pattern by transferring the solder onto the conductor pattern and positioning it on the conductor pattern.
4 will be supplied.

Further, according to the present invention, in the sphere supplying device 10 for supplying the spherical solder 14 to the conductor pattern formed on the predetermined substrate 19, the spherical solder 14 is supplied to the conductor pattern formed on the substrate 19 at the supplying position. Correspondingly arranged suction means 31 and a transport means 20 for transporting the spherical solder 14 attracted by the suction means 31 onto the conductor pattern and positioning it on the conductor pattern.

Further, in the present invention, the sphere supplying device 10
Is a through hole 41A of a size that allows one spherical solder to pass through.
The screen 41 having the above is provided, and the suction nozzle 31 sucks the spherical solder 14 through the through hole 41A of the screen 41 and sucks the spherical solder 14 in the suction nozzle 31.
The spherical solder 14 adsorbed on is passed through the through hole 41A and then conveyed.

Further, in the present invention, the sphere supplying device 10
Is equipped with a large-diameter nozzle 51 having a size to accommodate one spherical solder 14, the suction nozzle 31 is housed in the large-diameter nozzle 51, and the large-diameter nozzle 51 is moved relative to the suction nozzle 31. To expose the suction opening 31A of the suction nozzle 31, and the spherical solder 1 is attached to the exposed suction opening 31A.
4, the large-diameter nozzle 51 is moved relative to the suction nozzle 31 in the state where the spherical solder 14 is sucked and the spherical solder 14 sucked by the suction nozzle 31 is stored in the large-diameter nozzle 51. The spherical solder 14 is conveyed.

Further, in the present invention, the sphere supplying device 10
Comprises a compressed air supply means 62 for blowing compressed air onto the spherical solder 14 adsorbed by the adsorption nozzle 31.
The extra spherical solder 14 adsorbed by the adsorption nozzle 31 is blown off by compressed air.

Further, in the present invention, the sphere supplying device 10
Is provided with a heating means 71 for heating the suction nozzle 31, and the spherical solder 14 sucked and held by the suction nozzle 31 is attached to the substrate
The sphere solder 14 is melted by heating the suction nozzle 31 while being in contact with the conductor pattern 9 of FIG.

Further, in the present invention, the sphere supplying device 10
Is a through hole 4 sized to allow one spherical solder 14 to pass through.
A screen 41 having 1A, a large-diameter nozzle 51 having a size for accommodating one spherical solder 14, a compressed air supply means 62 for blowing compressed air to the spherical solder 14 absorbed by the suction nozzle 31, and suction A suction means 31 for heating the nozzle 31 is provided, the suction nozzle 31 is housed in the large-diameter nozzle 51, and the large-diameter nozzle 51 is moved relative to the suction nozzle 31 so that the suction opening 31A of the suction nozzle 31. Is exposed, the exposed suction nozzle 31 sucks the spherical solder 14 through the through hole 41A of the screen 41, and the excess spherical solder sucked by the suction nozzle 31 is blown off by compressed air and is sucked by the suction nozzle 31. Pass the spherical solder 14 through the through-hole 41A to obtain the spherical solder 1
The large-diameter nozzle 51 is moved relative to the suction nozzle 31 that has sucked 4 to store the spherical solder 14 sucked by the suction nozzle 31 in the large-diameter nozzle 51, and then sucked and held by the suction nozzle 31. The spherical solder 14 is melted by heating the suction nozzle 31 while the spherical solder 14 is in contact with the conductor pattern of the substrate.

In the present invention, the method for supplying spheres is as follows.
Large-diameter nozzle 51 sized to accommodate one spherical solder 14
The suction nozzle 51 is housed inside, and the large-diameter nozzle 51 is moved relative to the suction nozzle 31 to expose the suction opening 31A of the suction nozzle 31, and the exposed suction nozzle 31 is replaced with one spherical solder 14. The spherical solder 14 is adsorbed through the through hole 41A of the screen 41 having the through hole 41A of a size to be passed, and the extra spherical solder adsorbed by the adsorption nozzle 31 is blown by the compressed air from the predetermined compressed air supply means 62. Inside the large-diameter nozzle 51, the large-diameter nozzle 51 is dropped, and the spherical solder 14 adsorbed to the adsorption nozzle 31 is passed through the through hole 41A of the screen 41, and the large-diameter nozzle 51 is moved relative to the adsorption nozzle 31 that adsorbs the spherical solder 14. Spherical solder 14 adsorbed by the adsorption nozzle 31 on the
And the spherical solder 14 sucked and held by the suction nozzle 31 is melted by being heated by the heating means 71 provided in the suction nozzle 31 while being in contact with the conductor pattern of the substrate. To do so.

[0014]

Function: The suction nozzle 31 arranged in accordance with the position of the conductor pattern of the substrate 19 to which the spherical solder 14 is supplied.
Spherical solder 14 is adsorbed on and is transported and supplied to make it even easier to obtain a uniform amount of solder coat 14A.
Can be formed.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

In FIG. 1, reference numeral 10 indicates a solder supply device as a sphere supply device as a whole, and a pillar 9 is provided on a base 11.
The guide member 12 is fixed via the guide member 12, and the fine spherical carrier 20 is supported along the guide member 12 so as to be movable in the direction indicated by the arrow x or in the opposite direction.

The microsphere carrier 20 has a movable body 21 which can move up and down in the direction indicated by arrow z or in the opposite direction, and can rotate in the direction indicated by arrow r or in the opposite direction. A suction head 22 is provided at the lower end of the movable body 21, and a negative pressure is applied to the suction head 22 by a predetermined vacuum source (not shown).

A sphere suction member 30 is inserted and fixed in the suction head 22, and the negative pressure applied to the suction head 22 is applied to the sphere suction member 3 via the sphere suction member 30.
It is designed to be applied to the sphere suction portion provided at 0.

Further, the substrate 19 as a mounting object on which the ball solder sucked and held by the suction nozzle of the sphere suction member 30 is mounted is held on the stage 15 which can move in the direction indicated by the arrow y or in the opposite direction. .

Therefore, the fine sphere carrier device 20 holds the ball solder 14 of the ball solder supply section 16 by suction and picks up an image of the ball solder 14 by the camera 17 to recognize the suction state of the ball solder 14 on the sphere suction member 30. After that, the pattern of the substrate 19 is recognized by the camera 13 provided in the fine sphere transport device 20, and thus the substrate 1
The ball solder supply position (pattern) on 9 is confirmed, and the ball solder 14 is placed at the supply position.

FIG. 2 shows the structure of the sphere suction member 30. The sphere suction member 30 is fixed to a suction head 22 provided at the lower end of the movable body 21 of the fine sphere carrier device 20. The spherical suction member 30 has a rectangular bottom surface 30A, and a plurality of suction nozzles 31 are provided on the bottom surface 30A.

Each of the suction nozzles 31 has a cylindrical shape having an inner diameter smaller than the diameter of the ball solder 14, and communicates with the inside and outside of the spherical suction member 30 via the inner diameter portion of the suction nozzle 31. Therefore, adsorption head 2
External air is sucked into the opening 31A of the suction nozzle 31 by the negative pressure applied to the spherical suction member 30 via the negative pressure in the arrow z direction.

In this state, the movable body 21 (suction head 22) of the fine sphere carrier 20 is lowered, and each suction nozzle 31 of the sphere suction member 30 is connected to the ball solder 14 in the ball solder supply section 16 as shown in FIG. When approaching
The ball solder 14 is adsorbed to the opening 31A of the adsorption nozzle 31.

Further, in this state, the sphere attracting member 30
As shown in FIG. 4, the ball solder 14 can be held in a state where the ball solder 14 is sucked by each suction nozzle 31 as shown in FIG.

The arrangement pitch of each suction nozzle 31 is a conductor formed of a conductive layer (for example, a copper foil layer) formed on the substrate 19 on which the ball solder 14 suction-held by the suction nozzle 31 is to be mounted (supplied). The balls have the same pitch or multiple pitches as the pattern, and as shown in FIG.
6 is positioned with respect to the substrate 19, and the ball suction member 30 is lowered in this state to simultaneously mount the plurality of ball solders 14 on the plurality of patterns 19A on the substrate 19 as shown in FIG. You can

For the alignment of the suction nozzle 31 and the pattern 19A of the substrate 19, the surface of the substrate 19 is imaged by the camera 13 integrated with the fine sphere transport device 20,
Pattern 19A obtained by subjecting this to image processing
It is carried out precisely by moving the microsphere carrier device 20 and the substrate 19 on the basis of the position information.

Here, the surface of each pattern 19A of the substrate 19 is coated beforehand with a flux, and each suction nozzle 3
After the ball solder 14 adsorbed and held on No. 1 is brought into contact with the pattern 19A of the substrate 19 (FIG. 6), the negative pressure applied to the adsorption nozzle 31 is shut off by a negative pressure shutoff means such as a solenoid valve. By doing so, the ball solder 14 sucked and held by each suction nozzle 31 is released from the suction nozzle 31, and each ball solder 14 is attached to the substrate 1 as shown in FIG.
9 patterns 19A are placed. At this time, since the surface of each pattern 19A is previously coated with a flux, each ball solder 14 is held on the surface of the pattern 19A.

In this state, the substrate 19 is heated together with the ball solder 14 by a reflow furnace or a laser heating means, so that each pattern 19A as shown in FIG.
The ball solder 14 held on the top of the pattern melts and the pattern 19
Solder coat 14A is formed on the surface of A.

In the above structure, the ball solder 14 is sucked and held by each of the suction nozzles 31 of the sphere suction member 30, and is placed on the pattern 19A formed on the substrate 19, so that the suction nozzle 31 is held by suction. The plurality of ball solders 14 thus formed can be simultaneously placed on each pattern 19A.

In this case, the arrangement pitch of the suction nozzles 31 provided on the spherical suction member 30 is arranged at the same pitch as the pitch of the pattern 19A formed on the substrate 19, so that the suction nozzles 31 are sucked. The ball solder 14 is attached to each of the suction nozzles 31 provided on the sphere suction member 30.
It is mounted on the pattern 19A of the substrate 19 with the mounting accuracy of

Therefore, the solder coat 14A can be formed with higher accuracy as compared with the conventional case where cream solder is applied to each pattern by screen printing.

The thickness of the solder coat 14A formed on the pattern 19A is determined by the diameter of the ball solder 14 which is the material of the solder coat 14A. Therefore, the thickness of the solder coat 14A can be easily changed by changing the diameter of the ball solder 14, and
By making the accuracy of the size (diameter) of the ball solder 14 constant, the thickness of the solder coat 14A can be made more uniform.

In this case, in the method of increasing the accuracy of forming the ball solder 14 and making the thickness of the solder coat 14A uniform, this can be realized more easily than the conventional method of forming the solder coat by the plating method. You can

According to the above structure, the ball solder 14 is sucked and held by the suction nozzle 31 of the sphere suction member 30, and the ball solder 14 is placed on the pattern 19A of the substrate 19 and then heat-treated to form a solder coat. By forming 14A, the thickness of the solder coat 14A can be made uniform to a desired thickness.

In the above-described embodiment, the case where the ball solder 14 is directly sucked by the suction nozzle 31 of the sphere suction member 30 has been described, but the present invention is not limited to this and, for example, as shown in FIG. The ball solder 14 may be adsorbed via the screen 41.

That is, in FIG. 9, the screen 41 is formed with through holes 41A having a size through which only one ball solder 14 passes corresponding to each suction nozzle 31, and this screen 41 has a ball solder supply portion 16 and a sphere suction. It is interposed between the members 30.

Therefore, when the ball solder 14 of the ball solder supply section 16 is sucked by the suction nozzle 31, the spherical suction member 30 is lowered in the direction opposite to the arrow z, and each suction nozzle 31 penetrates the screen 41. It is lowered to the ball solder supply part 16 through the hole 41A.

In this state, the ball solder 14 is sucked by each suction nozzle 31. At this time, a plurality of ball solders 14 may be sucked by one suction nozzle 31. Even if the plurality of ball solders 14 are adsorbed by one suction nozzle 31 by moving up in the direction of the arrow z, when the suction nozzles 31 and the ball solder 14 adsorbed by the suction nozzles 31 pass through the through hole 41A of the screen 41. One suction nozzle 3
Only one ball solder 14 is adsorbed with respect to one. Thus, one ball solder 14 can be sucked and held by each suction nozzle 31, and it can be reliably transported onto the substrate 19.

In the above embodiment, the case where the ball solder 14 is directly sucked by the suction nozzle 31 of the sphere suction member 30 has been described, but the present invention is not limited to this and, for example, as shown in FIG. A large diameter nozzle 51 is provided for each suction nozzle 31 so that the ball solder 14
May be surely adsorbed one by one.

That is, in FIG. 10, each suction nozzle 31
On the other hand, a large-diameter nozzle 51 is provided so as to fit it in the inner diameter portion. The inner diameter of each large-diameter nozzle 51 is large enough to accommodate only one ball solder 14, and each large-diameter nozzle 51 is connected by a connecting portion 52A. 52 is provided.

The support member 52 includes an actuator 53.
A screw 53A provided on the output rotary shaft of is screwed. Accordingly, by rotationally driving the actuator 53, all the large diameter nozzles 51 connected via the connecting portion 52A move up and down.

Therefore, when the ball solder 14 of the ball solder supply section 16 is sucked by the suction nozzle 31, the large diameter nozzle 51 is raised by the actuator 53 in the direction of arrow z and the suction hole (opening portion) of the suction nozzle 31. 31A) is exposed, the sphere suction member 30 is lowered in the direction opposite to the arrow z, and is lowered to the ball solder supply section 16.

In this state, the ball solder 14 is sucked by each suction nozzle 31. At this time, a plurality of ball solders 14 may be sucked by one suction nozzle 31. In this state, as shown in FIG. The spherical suction member 30 is raised in the direction of arrow z, and the large diameter nozzle 5
1 is lowered by the actuator 53 in the direction opposite to the arrow z, even if a plurality of ball solders 14 are sucked by one suction nozzle 31, the suction nozzle 31 and the ball solders sucked by the suction nozzle 31 are attracted. Only one ball solder 14 is adsorbed to one adsorption nozzle 31 by the large diameter nozzle 51. Thus, one ball solder 14 can be sucked and held by each suction nozzle 31, and it can be reliably transported onto the substrate 19.

Further, in the above-mentioned embodiment, the case where the ball solder 14 is sucked by the suction nozzle 31 of the sphere suction member 30 and then directly conveyed is described.
The present invention is not limited to this, and when a plurality of ball solders 14 are adsorbed by one suction nozzle 31, for example, air may be blown to each suction nozzle 31 to blow off the excess ball solder 14. .

In this case, as shown in FIG. 12, an air supply section 62 is provided on the base 11 via a support column 61, and a pipe 63 is connected to the air supply section 62 from a compressed air supply section (not shown). By injecting the compressed air supplied via the nozzle 62A from the nozzle 62A, the compressed air is applied to the suction nozzles 31 of the spherical suction member 30 positioned on the ball solder supply section 16, and thereby a plurality of suction nozzles 31 are provided. Even if the ball solder 14 is absorbed, the excess ball solder 14 can be blown off.

Further, in the above-described embodiment, the solder coat 14A is formed by supplying the ball solder 14 onto the substrate 19 and then heating the substrate 19 together with the ball solder 14 by a reflow furnace or a laser heating means. Although the case has been described, the present invention is not limited to this, and the sphere suction member 30 may be directly heated by the heater 71 as shown in FIG. 13, for example. According to this configuration, the ball solder 14 is easily adsorbed by the suction nozzle 31 of the sphere suction member 30 and is brought into contact with the substrate 19 and heated by the heater 71 to easily melt the ball solder 14. You can do it.

Further, in the above-mentioned embodiments, the case where the ball solder 14 is used as the supply target is described, but the present invention is not limited to this, and can be widely applied to supply various other spherical parts. .

[0048]

As described above, according to the present invention, the spherical solder is adsorbed by the plurality of adsorption nozzles arranged in accordance with the conductor pattern of the substrate, and the spherical solder is simultaneously conveyed to the supply target. A sphere supply method and apparatus capable of easily supplying a uniform amount of solder onto a substrate can be realized.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a solder supply device according to the present invention.

FIG. 2 is a cross-sectional view showing a suction state of ball solder by a suction nozzle.

FIG. 3 is a cross-sectional view showing a suction state of ball solder by a suction nozzle.

FIG. 4 is a cross-sectional view showing a suction state of ball solder by a suction nozzle.

FIG. 5 is a cross-sectional view showing an alignment state of ball solder and a board pattern.

FIG. 6 is a cross-sectional view showing a supply state of ball solder onto a board pattern.

FIG. 7 is a cross-sectional view showing ball solder supplied on a substrate pattern.

FIG. 8 is a cross-sectional view showing a formation state of a solder coat by heat treatment.

FIG. 9 is a cross-sectional view showing a ball solder adsorption state according to another embodiment.

FIG. 10 is a cross-sectional view showing a ball solder adsorption state according to another embodiment.

FIG. 11 is a cross-sectional view showing a ball solder adsorption state according to another embodiment.

FIG. 12 is a perspective view showing a solder supply device according to another embodiment.

FIG. 13 is a cross-sectional view showing a heated state of ball solder according to another embodiment.

[Explanation of symbols]

10 ... Solder supply device, 14 ... Ball solder, 16
...... Ball solder supply section, 19 ...... Substrate, 30 ...... Spherical adsorption member, 31 ...... Suction nozzle, 41 ...... Screen,
41A ... Through hole, 51 ... Large diameter nozzle, 62 ... Air supply section, 71 ... Heater.

Continuation of front page (51) Int.Cl. ⁶ Identification number Office reference number FI technology display location B65G 59/04 (72) Inventor Tomoya Kiga 6-735 Kitashinagawa, Shinagawa-ku, Tokyo Sony Corporation

Claims (8)

[Claims] 1. A sphere supply method for supplying spherical solder to a conductor pattern formed on a predetermined substrate, wherein the sphere solder is arranged at a position corresponding to the spherical solder supply position of the conductor pattern formed on the substrate. The spherical solder is sucked onto the suction means, and the spherical solder is supplied to the conductor pattern by transporting the sucked spherical solder onto the conductor pattern and positioning it on the conductor pattern. Characteristic sphere supply method. 2. A sphere supply device for supplying spherical solder to a conductor pattern formed on a predetermined substrate, the sphere supplying device being arranged corresponding to the supply position of the spherical solder of the conductor pattern formed on the substrate. A sphere supply device comprising: a suction means and a transportation means for transporting the spherical solder attracted by the suction means onto the conductor pattern and positioning the solder on the conductor pattern. 3. The sphere supply device comprises a screen having a through hole sized to allow one of the spherical solder to pass through, and the suction nozzle sucks the spherical solder through the through hole of the screen to obtain the spherical solder. The sphere supply device according to claim 2, wherein the spherical solder adsorbed by the adsorption nozzle in a state of adsorbing the solder is conveyed after passing through the through hole. 4. The sphere supply device includes a large-diameter nozzle having a size to accommodate one of the spherical solder, the large-diameter nozzle accommodates the suction nozzle, and the large-diameter nozzle serves as the suction nozzle. The suction opening of the suction nozzle is exposed by moving relative to the suction nozzle, the spherical solder is sucked to the exposed suction opening, and the large-diameter nozzle with respect to the suction nozzle in the state of sucking the spherical solder. The spherical solder adsorbed by the adsorption nozzle is stored in the large-diameter nozzle by relatively moving
The sphere supply device according to claim 2, wherein the spherical solder is conveyed. 5. The sphere supply device comprises compressed air supply means for blowing compressed air to the spherical solder adsorbed by the suction nozzle, and extra spherical solder adsorbed by the suction nozzle is supplied by the compressed air. The sphere supply device according to claim 2, wherein the sphere supply device is blown off. 6. The sphere supply device comprises heating means for heating the suction nozzle, wherein the suction nozzle is held in a state where the spherical solder suction-held by the suction nozzle is in contact with a conductor pattern of the substrate. The sphere supply device according to claim 2, wherein the sphere solder is melted by heating. 7. The sphere supply device includes a screen having a through hole having a size for passing one spherical solder, a large-diameter nozzle having a size for accommodating one spherical solder, and an absorption nozzle for absorbing the spherical solder. It comprises a compressed air supply means for blowing compressed air to the formed spherical solder, and a heating means for heating the suction nozzle, and the suction nozzle is housed in the large diameter nozzle, and the large diameter nozzle is sucked by the suction nozzle. The suction opening of the suction nozzle is exposed by moving relative to the nozzle, the exposed suction nozzle sucks the spherical solder through the through hole of the screen, and the extra suction sucked by the suction nozzle. The spherical solder is blown off by the compressed air, the spherical solder adsorbed by the suction nozzle is passed through the through hole, and the suction sucking the spherical solder is performed. After storing the spherical solder adsorbed by the adsorption nozzle in the large-diameter nozzle by moving the large-diameter nozzle relative to the deposition nozzle, the spherical solder adsorbed and held by the adsorption nozzle. The sphere supply device according to claim 2, wherein the spherical solder is melted by heating the suction nozzle in a state of being in contact with the conductor pattern of the substrate. 8. The sphere supply method according to claim 1, wherein the suction nozzle is housed in a large-diameter nozzle having a size to accommodate one spherical solder, and the large-diameter nozzle is moved relative to the suction nozzle. To expose the suction opening of the suction nozzle, and suck the spherical solder through the through hole of the screen having a through hole of a size that allows one spherical solder to pass through the exposed suction nozzle. The excess spherical solder adsorbed on is blown off by compressed air from a predetermined compressed air supply means, the spherical solder adsorbed on the adsorption nozzle is passed through the through hole of the screen, and the spherical solder is adsorbed By moving the large-diameter nozzle relative to the suction nozzle, the spherical solder adsorbed by the suction nozzle is stored in the large-diameter nozzle. Then, the spherical solder sucked and held by the suction nozzle is heated by a heating means provided in the suction nozzle in a state of being in contact with the conductor pattern of the substrate so that the spherical solder is melted. The sphere supply method according to claim 1, wherein