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JPH071804B2 - 発光素子アレイ光源 - Google Patents

発光素子アレイ光源

Info

Publication number
JPH071804B2
JPH071804B2 JP3727989A JP3727989A JPH071804B2 JP H071804 B2 JPH071804 B2 JP H071804B2 JP 3727989 A JP3727989 A JP 3727989A JP 3727989 A JP3727989 A JP 3727989A JP H071804 B2 JPH071804 B2 JP H071804B2
Authority
JP
Japan
Prior art keywords
light source
lens
led
emitting element
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP3727989A
Other languages
English (en)
Other versions
JPH02215171A (ja
Inventor
正明 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP3727989A priority Critical patent/JPH071804B2/ja
Priority to KR1019900001779A priority patent/KR930010988B1/ko
Priority to US07/480,141 priority patent/US5032960A/en
Publication of JPH02215171A publication Critical patent/JPH02215171A/ja
Publication of JPH071804B2 publication Critical patent/JPH071804B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/68—Details of reflectors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/69—Details of refractors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F21V15/013—Housings, e.g. material or assembling of housing parts the housing being an extrusion
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0045—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by tongue and groove connections, e.g. dovetail interlocking means fixed by sliding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Facsimile Scanning Arrangements (AREA)
  • Facsimile Heads (AREA)

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明は発光素子アレイ光源に関するもので、特に密着
型イメージセンサーや光学的イメージリーダや縮小型イ
メージセンサー用等の光源として使用されるものであ
る。
（従来の技術） 光学的イメージリーダ、ファクシミリ、複写機、各種の
光学的検査装置等において、画像情報を読取る場合、光
源からの光を原稿や被検査物の表面に照射し、その反射
光を密着型イメージセンサー、リニアイメージセンサ
ー、CCD等を用いて光電交換を行い、それを情報入力と
することが行われる。この光源としては信頼性や寿命の
点で優れている発光ダイオード素子（以下、LEDとい
う）が多く使用されるようになって来ている。
LED単体では発光光量が少なく、局所的な照明しか出来
ないため、LEDを複数個直線状に配設した発光素子アレ
イ（以下、LEDアレイという）を構成して用いられるこ
とが多い。
第５図はLEDチップを使用した従来用いられているLEDア
レイの構造を示す斜視図、第６図は横方向の断面図、第
７図は縦方向の断面図であって、基板９（PWB、プリン
ト基板）上に複数個のLEDチップ10が直接ダイボンドさ
れ列をなすように直線状に配設されている。
このLEDチップ10の配列間隔は、設計上の諸条件を満足
させるため、或間隔で配設されており、かつ照射面の光
の均一性を良くし、LEDチップ総数を少なくするため、
内側のLEDチップ間には反射板11が配設されている。反
射板11は白色樹脂等で作られている。
LEDチップ10の列に隣接して平行に設けられた棒状レン
ズ13は、反射ケース12とレンズ13の両端面を支持する保
持具14とでしっかりと保持固着され、LEDチップの列か
ら出る光束14を所定の照射面15の範囲内に線状に収束さ
せる役割をはたしている。また、この棒状レンズ13は透
明なアクリル樹脂等で作られる。
LEDアレイの光束はLEDチップからの直接光および反射板
11や反射ケース12等からの間接光からなるため、棒状レ
ンズ13により収束光は原稿面で完全に集光されているも
のではなく、原稿面からかなり離れた位置でも焦点が合
うような構成になっている。
第８図はLEDアレイ光源を用いた光学的イメージリーダ
の一例を示すものである。基板９上のLEDチップ10から
出た光束は原稿の照射面15に収束される。このLEDアレ
イ光源全体は固定治具16で保持されている。原稿からの
反射光はセルホックレンズ17で再び収束され、ラインイ
メージセンサー18に入射し、情報は光電変換されて電気
信号となる。
（発明が解決しようとする問題点） ところで、第５図、第６図および第７図に示される従来
のLEDアレイ光源は、LEDチップ10を装着したプリント基
板９と反射板11と反射ケース12と保持具14と棒状レンズ
13とを一体として組み立て、かつLEDチップ10のアレイ
と棒状レンズ13とを光学的に整合させ、これら間の光軸
ずれを防止する必要があり、このLEDアレイ光源の組み
立て工程は多大の組み立て時間と高精度の作業内容とを
必要としていた。
このようにLEDアレイ光源の製造には、多くの部品点数
を用いる必要があり、LEDアレイ光源の低価格化、高精
度化、小形化、軽量化のための大きな妨げになってい
た。
本発明は、このような問題点を解決するためになされた
ものであり、全く新規なLEDアレイ光源の構造を提案す
ることによりこれらの問題点を解決することを目的とす
る。
（問題点を解決するための手段） 本発明にかかる発光素子アレイ光源は、複数個の発光素
子を列状に配列した基板を、レンズおよび反射ケースの
２色連続押出し成形によって成形されたトンネル状のレ
ンズケースと組み合わせて一体になしたことを特徴とし
ている。
（作用） 上記構成により、LEDの光源と基板、反射ケースとレン
ズとがそれぞれ一体化され精度良く配設されるため、LE
Dアレイ光源の組立てが容易であり、LEDアレイの光軸と
レンズとの光軸の整合が容易である。これにより、組立
て時間の短縮、作業内容の容易化、高精度化、小形化、
軽量化の面において大幅な改善が出来る。
（実施例） 以下第１図乃至第４図に従って本発明の一実施例を説明
する。
第１図は本発明にかかる発光素子アレイ光源の一実施例
を示す組立て構成図であり、第２図はトンネル状のレン
ズケース４の詳細図である。プリント基板１の上には、
複数のあらかじめ透光性樹脂によりモールドされた超小
型LEDランプ２が直線状に配設されており、LED付きプリ
ント基板３を構成している。４は２色連続押出し成形に
よって形成された一体型トンネル状のレンズケースであ
り、これにLED付きプリント基板３を挿入し組み合わせ
ることにより、レンズケース４トLED付きプリント基板
３とを一体化した発光素子アレイ光源が作られる。
第２図（ａ）はトンネル状のレンズケース４の構造図で
あり、外側の反射ケース５は反射性の白色等の不透明樹
脂の材質（例えば白色ノリル）がもちいられ、半円形棒
状のレンズ６はアクリル樹脂等の透明な樹脂の材質（例
えば透明耐圧アクリル）が用いられる。これらの反射ケ
ース５とレンズ６はいわゆる２色連続押出し成形により
作られる。この実施例の場合、反射ケース５の外形寸法
は縦3.0mm×幅8.0mm×長さ227mm、半円形棒状のレンズ
６の外形寸法は半径2.25mm×厚味2.25mm×長さ227mm
で、具体的にはA4サイズの読み取り用光源に対応してい
る。
第２図（ｂ）はこのトンネル状のレンズケース４にLED
付きプリント基板３を挿入し構造図であり、超小型LED
ランプ２から出た光束７はレンズ６により収束され、原
稿面８の近傍に焦点を結ぶ。
第３図はレンズ６の別の構造を示す図であり、この場合
半円形棒状のレンズ６は図に示されるように内側に凸の
光学曲面6aを持っている。この光学設計により、光の集
光性能を向上させることが出来る。
第４図（ａ）はあらかじめ透光性樹脂によりモールドさ
れた超小型LEDランプ２の一実施例を示し、第４図
（ｂ），（ｃ）はモールド成型時同時にレンズ2aを形成
したレンズ付き超小型LEDランプの一実施例を示してい
る。外形寸法は、例えば縦2.9mm、横1.5mm、厚味1.1mm
である。
このような超小型LEDランプ２を使用することにより、
プリント基板に直接LEDチップを配設した場合に比較し
て、LEDアレイ光源の光強度の効率は、第４図（ａ）の
超小型LEDランプの場合は約1.7倍〜2.5倍となり、第４
図（ｂ），（ｃ）のレンズ付き超小型LEDランプの場合
は約３倍以上を実現することが出来る。
また、LEDチップを用いる場合は、プリント基板にLEDチ
ップをダイレクトボンディングするため、プリント基板
のボンディング領域は金などの貴金属メッキを施す必要
があった。これはプリント基板の材料コストが高くつく
ことを意味しているが、超小型LEDランプ２を使用する
場合は、銅パターンのみの安価な基板１を使用出来る利
点もある。
以上、超小型LEDランプの例は上述したような利点があ
るものであるが、従来と同様のLEDチップを搭載したプ
リント基板（第５図乃至第７図の基板9,LEDチップ10参
照）と、先の実施例で説明した２色連続押出し成形によ
って作られたレンズケース４とを組み合わせて、発光素
子アレイ光源を作れることは勿論である。
本発明のポイントは一体化された光源アレイと一体化さ
れたレンズケースとを組み合わせて、発光素子アレイ光
源を構成することであり、発光素子の搭載はLEDチッ
プ，超小型LEDランプ等のいずれの形態であっても何等
差し支えない。
（発明の効果） 以上本発明によれば、LEDの光源アレイ付き基板と、２
色連続押出し成形により一体化されたトンネル状のレン
ズケースとを組み合わせて一体化することにより、発光
素子アレイ光源を得るものであり、その結果、光軸の整
合等が容易になり、組立て時間の短縮、組立て内容の容
易化、高精度化、小形化、軽量化などの面において特徴
のある有用な発光素子アレイ光源を提供することが出来
る。
【図面の簡単な説明】
第１図は本発明の一実施例を示す組立て構成図、第２図
（ａ）はトンネル状のレンズケース例を示す構造図、第
２図（ｂ）はこのトンネル状のレンズケースにLED付き
プリント基板を挿入したときを示す構造図、第３図は内
側に凸の光学曲面を持っている他のレンズ例を示す構造
図、第４図（ａ）は超小型LEDランプ例を示す構造図、
第４図（ｂ），（ｃ）は他のレンズ付き超小型LEDラン
プ例を示す構造図、第５図は従来のLEDアレイ光源を示
す構造図、第６図は同横方向の断面構造図、第７図は同
縦方向の断面図、第８図はLEDアレイ光源を用いた光学
的イメージリーダの一例を示す構造図である。 １……プリント基板、２……超小型LEDランプ、４……
トンネル状レンズケース、５……反射ケース、６……レ
ンズ。

Claims (1)

    【特許請求の範囲】
  1. 【請求項１】複数個の発光素子が列状に配設された基板
    と、該発光素子列にこれと平行に設けられた棒状の集光
    レンズと、これを保持する反射ケースとを備えた発光素
    子アレイ光源において、前記集光レンズと前記反射ケー
    スとを２色連続押出し成形によりトンネル状のレンズケ
    ースとして、該レンズケースと前記発光素子列を配設し
    た基板とを組み合わせて一体となしたことを特徴とする
    発光素子アレイ光源。
JP3727989A 1989-02-15 1989-02-15 発光素子アレイ光源 Expired - Lifetime JPH071804B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP3727989A JPH071804B2 (ja) 1989-02-15 1989-02-15 発光素子アレイ光源
KR1019900001779A KR930010988B1 (ko) 1989-02-15 1990-02-14 발광소자 어레이광원 및 그의 제조방법
US07/480,141 US5032960A (en) 1989-02-15 1990-02-14 Light source device with arrayed light emitting elements and manufacturing therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3727989A JPH071804B2 (ja) 1989-02-15 1989-02-15 発光素子アレイ光源

Publications (2)

Publication Number Publication Date
JPH02215171A JPH02215171A (ja) 1990-08-28
JPH071804B2 true JPH071804B2 (ja) 1995-01-11

Family

ID=12493251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3727989A Expired - Lifetime JPH071804B2 (ja) 1989-02-15 1989-02-15 発光素子アレイ光源

Country Status (3)

Country Link
US (1) US5032960A (ja)
JP (1) JPH071804B2 (ja)
KR (1) KR930010988B1 (ja)

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Also Published As

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JPH02215171A (ja) 1990-08-28
KR930010988B1 (ko) 1993-11-18
US5032960A (en) 1991-07-16
KR900013813A (ko) 1990-09-06

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